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www.elsevier.com/locate/tsf
Thin Solid Films 506–5
Effect of surface roughness on splat shapes
in the plasma spray coating process
M. Raessi, J. Mostaghimi *, M. Bussmann
Centre for Advanced Coating Technologies, Department of Mechanical and Industrial Engineering, University of Toronto, Canada
Available online 19 September 2005
Abstract
We used a three-dimensional model of droplet impact and solidification to simulate the effect of surface roughness on the impact
dynamics and the splat shape of an alumina droplet impinging onto a substrate. The substrate surface was patterned by a regular array of
cubes spaced at an interval twice their size. Three different cube sizes were considered, and the results were compared to the case of droplet
impact onto a smooth substrate. To understand the effect of solidification on the droplet impact dynamics and splat morphology, the
simulations were run with and without considering solidification. Comparing the results, we have concluded that solidification plays a major
role in determining splat shape on a rough surface. We also present results of the distribution of voids between the splat and the substrate.
D 2005 Elsevier B.V. All rights reserved.
Keywords: Surface roughness; Droplet impact; Numerical model; Solidification
1. Introduction
Thermal-sprayed coatings are applied to protect sub-
strates against wear, corrosion, and thermal shock. In
thermal spray processes, a hot gaseous jet is used to melt
and accelerate the powder of a metallic or ceramic coating
material. The hot jet draws energy from either a plasma or a
combustion source. During these processes, a spray of
molten (or partially molten) droplets, or particles is directed
at a substrate. As the droplets impact the substrate, they
spread and solidify, each forming a so-called splat. A
coating forms as a result of the accumulation of many such
splats.
Among many experimental and numerical studies that
have been done on droplet impact and solidification, only a
few have considered the effect of surface roughness. For
instance, Ahmed and Rangel [1] numerically studied the
impingement and solidification of an aluminum droplet on
uneven substrates, using a two-dimensional axi-symmetric
model. Their results show that droplet impact onto an
0040-6090/$ - see front matter D 2005 Elsevier B.V. All rights reserved.
doi:10.1016/j.tsf.2005.08.140
* Corresponding author.
E-mail address: [email protected] (J. Mostaghimi).
uneven substrate is almost always accompanied by splash-
ing. However, the degree of splashing decreases with the
increase in surface roughness height. Fukanuma [2]
presented a formula which describes the flattening process
of a droplet onto a rough surface, and concluded that the
flattening ratio and the flattening time decreases with
increasing roughness. Liu et al. [3] numerically studied
the impact of a droplet onto substrates with wavy surfaces;
however, their two-dimensional axi-symmetric model did
not include solidification. They found that for wavelengths
of the surface larger than the droplet diameter, droplet
spreading ended with breakup.
This paper then, presents the results of three-dimensional
numerical simulations of droplet impact and solidification
onto substrates with rough surfaces. The effect of surface
roughness on splat morphology and the bonding between
the splat and the substrate are studied.
2. Numerical method
The three-dimensional numerical model of droplet
impact and solidification which is used in this study was
developed by Bussmann et al. [4] and Pasandideh-Fard et al.
07 (2006) 133 – 135
Fig. 1. Computer-generated images of 40 Am diameter alumina droplets at 2055 -C impacting with a velocity of 65 m/s onto alumina substrates initially at 25
-C, characterized by different values of surface roughness.
M. Raessi et al. / Thin Solid Films 506–507 (2006) 133–135134
[5]. Detailed discussion of the model is in [4,5] and is not
repeated here.
Equations of conservation of mass and momentum
governing the liquid phase in the presence of a solid phase
are
lYI HV
Y� �
¼ 0
fl HVY
� �
fltþ HV
YIlY
� �VY ¼ �H
qlYpþHyl2V
Y þ Hq
Fb
Y
where VYrepresents the velocity vector, p the pressure, q the
density, t the kinematic viscosity, and Fb
Yany body forces
acting on the fluid. In these equations, H denotes the
liquid–solid fraction, and it is equal to one within the liquid
phase and zero within the solid phase. The free surface of
Fig. 2. (a) Comparison of alumina splats on different surface conditions in the prese
roughness with and without solidification.
the liquid is defined by using the ‘‘Volume of Fluid’’ (VOF)
method, in which a scalar function f is defined equal to one
within the droplet material (liquid or solid) and equal to zero
without. Since f is passively advected with the flow, it
satisfies the advection equation which in the presence of the
solid phase is
flf
fltþ HV
YIlY
� �f ¼ 0:
The energy equation which is solved for heat transfer and
phase change is [5]
qflh
fltþ q V
YIlY
� �h ¼l
YI kl
YT
� �
where h represents the enthalpy, k the conductivity, and T
the temperature. To solve the energy equation, the enthalpy
nce of solidification. (b) Comparison of splat shape on a substrate with 3 Am
Fig. 3. Cross section of an alumina splat on a substrate with 3 Am roughness in the directions shown in Fig. 2(b). The cubes on the substrate and the splat are
shown in black and gray, respectively.
M. Raessi et al. / Thin Solid Films 506–507 (2006) 133–135 135
transforming model [6] is used to convert the energy
equation to one with a single dependent variable:
the enthalpy. The main advantage of this method is
that it represents the energy equation for both phases
simultaneously.
These governing equations are solved using a finite
volume technique on a three-dimensional Cartesian struc-
tured grid. According to the problem geometry, symmetry
boundaries are utilized to reduce the problem size and
therefore to save computational time. Along symmetry
boundaries, fluid flow obeys free slip and no-penetration
conditions, and an adiabatic thermal boundary condition is
applied. Numerical computations were performed on an
AMD Athlon 1.4 GHz PC; the average CPU time was 36 h.
3. Results and discussion
Fig. 1 shows simulated images of 40 Am diameter
alumina droplets, initially at 2055 -C, impinging with an
impact velocity of 65 m/s onto smooth and rough alumina
substrates. Each column shows a droplet during successive
stages of impact. For the rough substrates, the surface is
patterned by cubes which are regularly spaced at an interval
twice their size. Three different cube sizes of 1, 2, and 3 Amwere considered. In Fig. 1(a) to (d), the fluid flow, heat
transfer and phase change are modeled. The splat shape on
the smooth substrate (Fig. 1(a)) differs little from the shape
on the 1 Am rough substrate (Fig. 1(b)). But as the
roughness size increases further to 2 and 3 Am, the splat
shape changes substantially. In particular, on the 3 Am rough
substrate, the droplet is blocked at t =0.8 As from spreading
along the 45- diagonal and effectively the liquid flow is
channeled in two directions. To understand the effect of
solidification, Fig. 1(e) presents results of fluid flow without
solidification for the case of 3 Am roughness.
In Fig. 2(a), a quarter of the final shape of the alumina
splats is depicted for different substrate surface conditions.
As the size of the surface roughness increases from 0
(smooth) to 1 and 2 Am, the splat radius also increases.
However, on the 3 Am rough substrate, the extent of
spreading along the horizontal and vertical axes is approx-
imately equal to that on the smooth substrate. Fig. 2(a) also
clearly depicts the effect of roughness size on the splat
morphology.
The upper half of Fig. 2(b) shows an alumina splat on the
substrate of 3 Am roughness at t=5 As, for the case when
solidification is modeled. For comparison, the lower half of
Fig. 2(b) shows the droplet shape on the same substrate and
at the same time, but without solidification. Comparing the
two cases, the effect of solidification on the splat shape is
very well seen. It must be mentioned that without solid-
ification, the droplet recoils further until it reaches to its
equilibrium configuration which is not shown here.
Finally, Fig. 3 shows the cross sections of the alumina
splat on the 3 Am rough substrate, along directions A-A
(horizontal) and B-B (45- diagonal) shown in Fig 2(b). The
cubes on the substrate and the splat are shown in black and
gray, respectively. The splat appears to bond more com-
pletely with the substrate along the diagonals, as the voids
beneath the splat are smaller along section B-B than along
section A-A.
4. Conclusion
The effect of substrate roughness on an alumina splat
shape was studied. We concluded that droplet solidification
is the main mechanism responsible for changing the splat
shape. An increase in roughness size up to a certain value
increases the splat diameter. For the case of a splat on a
substrate of 3 Am roughness, voids between the splat and the
substrate are seen to be smaller along the 45- diagonal thanalong the horizontal direction.
References
[1] A.M. Ahmed, R.H. Rangel, Int. J. Heat Mass Transfer 45 (2002) 1077.
[2] H. Fukanuma, in: C.C. Berndt (Ed.), Thermal Spray: Practical Solutions
for Engineering Problems, Cincinnati, U.S.A., October 7–11, 1996, 9th
National Thermal Spray Conference Proceeding, ASM International,
1996, p. 647.
[3] H. Liu, E.J. Lavernia, R.H. Rangel, Acta Metall. Mater. 43 (1995) 2053.
[4] M. Bussmann, J. Mostaghimi, S. Chandra, Phys. Fluids 11 (1999) 1406.
[5] M. Pasandideh-Fard, S. Chandra, J. Mostaghimi, Int. J. Heat Mass
Transfer 45 (2002) 2229.
[6] Y. Cao, A. Faghri, W.S. Chang, Int. J. Heat Mass Transfer 32 (1989)
1289.