EE 434 Lecture 2 - class.ece.iastate.educlass.ece.iastate.edu/ee330/lectures/EE 330 Lect 2 Spring 2012.pdf · 2010 sales: $43.6B 2010 income: $11.5B Average annual sales/employee:

EE 330

Lecture 2

Basic Concepts

Review from Last Time

• Semiconductor Industry is One of the Largest Sectors in the World Economy and Growing

• Rapidly Growing Device Count and Rapidly Shrinking Feature Sizes (Moore’s Law?)

• Designers Must Handle Incredible Complexity Yet Work in Large Teams and Make Almost No Mistakes

Challenges for Electronic Circuit

Designers

• Managing increasing device count

• Short lead time from conception to marketplace

• Process technology advances

• Device Performance Degradation

• Increasing variability

• Increasing pressure for cost reduction

• Power Dissipation

Creation of Integrated Circuits

Most integrated circuits are comprised of transistors along with a

small number of passive components and maybe a few diodes

This course will focus on understanding how transistors operate and

on how they can be interconnected and possibly combined with a small

number of passive components to form useful integrated circuits

Texas Instruments:

World’s largest producer of analog semiconductors, 2nd in DSP

Number of employees: 28,400

Ranks 3rd in World in semiconductor sales

2010 sales: $14.0B

2010 income: $3.2B

Average annual sales/employee: $490K

Average annual earnings/employee: $113K

Selected Semiconductror Company Profiles

Intel:

World’s largest producer of semiconductors

Number of employees: 82,500

2010 sales: $43.6B

2010 income: $11.5B



Cofounders: Robert Noyce and Gordon Moore

Robert Noyce

BA Grinnell 1949


http://upload.wikimedia.org/wikipedia/commons/8/89/Noyce1.jpg

Marvell:

Number of employees: 5890

2010 sales: $3.6B

2010 income: $904M



Cofounders: Sehat Sutardja (CEO), Welli Dai and Pantas Sutardja

BSEE IASTATE

(approx 1985)


Sehat Sutardja

Fabless Semiconductor Company

Considerable Cash Flow Inherent in the Semiconductor Industry

Essentially All Activities Driven by Economic Considerations

• Many Designs Cost Tens of Millions of Dollars

• Mask Set and Production of New Circuit Approaching $2 Million

• New Foundries Costs Approaching $10 Billion (few players in World can compete)

• Many Companies Now Contract Fabrication (Fabless Semiconductor Companies)

• Time to Market is Usually Critical

• Single Design Error Often Causes Months of Delay and Requires New Mask Set

• Potential Rewards in Semiconductor Industry are Very High

Will emphasize economic considerations throughout this course

Understanding of the Big Picture is Critical

Solving Design Problems can be Challenging

Be sure to solve the right problem !

How can complex circuits with a very large

number of transistors be efficiently designed

with low probability of error?

• Many designers often work on a single design

• Single error in reasoning, in circuit design, or in implementing circuit on silicon generally results in failure

• Design costs and fabrication costs for test circuits are very high – Design costs for even rather routine circuits often a few million dollars and some

much more

– Masks and processing for state of the art processes often between $1M and $2M

• Although much re-use is common on many designs, considerable new circuits that have never been designed or tested are often required

• Time to market critical – missing a deadline by even a week or 2 may kill the market potential

How can complex circuits with a very large

number of transistors be efficiently designed

with low probability of error?

• CAD tools and CAD-tool environment critical for

success today

• Small number of VLSI CAD toolset vendors

• CAD toolset helps the engineer and it is highly

unlikely the CAD tools will replace the design

engineer

• An emphasis in this course is placed on using

toolset to support the design process

CAD Environment for Integrated

Circuit Design

• Typical Tool Flow

– (See Chapter 14 of Text)

• Laboratory Experiments in Course

Analog Flow System Description

Circuit Design (Schematic)

SPICE Simulation

LVS

DRC Error

Report LVS Error Report

Layout/DRC…

Parasitic Extraction

Post-Layout Simulation

Simulation Results

Fabrication

VLSI Design Flow Summary

Back annotated Schematic

Analog Flow System Description


SPICE Simulation

LVS

DRC Error

Report LVS Error Report

Layout/DRC…

Parasitic Extraction


Simulation Results

Fabrication


Back annotated Schematic

Cadence

Virtuoso

Spectre (or HSPICE)

Schematic Editor

Assura DRC

Assura LVS Assura RCX

Spectre (or HSPICE)

VLSI Design Flow Summary Digital Flow

System Description

Verilog Description

Verilog Simulation

Synthesis (Synopsys)

Place and Route (SoC Encounter)

--- --- DEF or GDS2 File --------

Simulate (Gate Level)

Circuit Schematic (Cadence)

DRC Extraction

LVS

VHDL Simulation Results and

And Comparison with System Specs.

Gate-level Simulation

Connectivity Report and

Show Routing to TA

DRC Report LVS Output File

Print Circuit Schematic

Fabrication

Back-Annotated

Extraction

Post-Layout Simulation Post-Layout Simulation

VLSI Design Flow Summary Digital Flow

System Description

Verilog Description

Verilog Simulation

Synthesis

Place and Route (SoC Encounter)

--- --- DEF or GDS2 File --------



DRC Extraction

LVS





Show Routing to TA



Fabrication

Back-Annotated

Extraction

Post-Layout Simulation Post-Layout Simulation

Cadence SoC Encounter

Verilog XL

Verilog XL

Synopsis


System Description

VHDL Description

VHDL Simulation

Synthesis (Synopsys)

Place and Route (Silicon Ensemble)

--- --- DEF or GDS2 File --------



DRC Extraction

LVS





Show Routing to TA



Back-Annotated

Extraction



Mixed Signal Flow (Digital Part)

A B

Mixed-Signal Flow (Analog Part)

System Description


SPICE Simulation

Extraction LVS



C D

Layout/DRC

Back-Annotated

Extraction



Simulation Results


A B

Schematic Merge Layout Merge

Extraction

LVS/DRC


C D

Show Layout to TA

LVS/DRC Output Files

Simulation Results


Mixed-Signal Flow (Analog-Digital Merger)

Fabrication

Comments

• The Analog Design Flow is often used for

small digital blocks or when particular

structure or logic styles are used in digital

systems

• Variants of these flows are widely used

and often personalized by a given

company or for specific classes of circuits

Wafer

• 6 inches to 12 inches in diameter

• All complete cells ideally identical

• flat edge

• very large number of die if die size is small

die

Feature Size

Feature size is the minimum lateral feature

size that can be reliably manufactured

Often given as either

feature size or pitch

Minimum feature size often

identical for different features

What is meant by “reliably”

Yield is acceptable if circuit performs as

designed even when a very large number

of these features are made

If P is the probability that a feature is good

n is the number of features on an IC

Y is the yield

nPY

n

Yloge

eP

Example: How reliable must a

feature be? n=5E3

Y=0.9

5E3

0.9log

n

Ylog ee

eeP =0.999979

ee log 0.9log Y

5E9nP e e =0.999999999979

But is n=5000 large enough ?

More realistically n=5E9

Extremely high reliability must be achieved in all processing steps to

obtain acceptable yields in state of the art processes

Feature Size

• Typically minimum length of a transistor

• Often minimum width or spacing of a metal

interconnect (wire)

• Point of “bragging” by foundries

– Drawn length and actual length differ

• Often specified in terms of pitch

– Pitch approximately equal to twice minimum

feature size

Feature Size Evolution

Mid 70’s 25µ

2005 90nm

2010 20nm

2020 10nm

o463 A1010101 mnm

MOS Transistor

Active

Poly

MOS Transistor

Region of Interest

(Channel)

Gate

Source Drain

W L

Drawn Length and Width Shown

MOS Transistor

Gate

Source Drain

W L

Actual Drain and Source at Edges of Channel

MOS Transistor

Gate

Source Drain

Weff Leff

Effective Width and Length Generally

Smaller than Drawn Width and Length

Technology Nomenclature

• SSI Small Scale Integration 1-100

• MSI Medium Scale Integration 100-103

• LSI Large Scale Integration 103-105

• VLSI Very Large Scale Integration 105-106

Any design in a process capable of incorporating

a large number of devices is generally termed a

VLSI design

Device and Die Costs

112.525.0

42

2

Ein

A

An

trans

wafer

trans

Characterize the high-volume incremental costs of manufacturing integrated circuits

Example: Assume manufacturing cost of an 8” wafer in a 0.25µ process is $800

Determine the number of minimum-sized transistors that can be

fabricated on this wafer and the cost per transistor. Neglect spacing and

interconnect.

Solution:

94.15$112.5

800$ E

En

CC

trans

wafer

trans

Note: the device count may be decreased by a factor of 10 or more if

Interconnect and spacing is included but even with this decrease, the

cost per transistor is still very low!

Device and Die Costs 2/5.2$ cmC areaunitper

Actual integrated op amp will be dramatically less if bonding pads are not needed

Example: If the die area of the 741 op amp is 1.8mm2, determine the cost of the

silicon needed to fabricate this op amp

05$.8.1/5.2$ 22

741 mmcmC

Size of Atoms and Molecules in

Semiconductor Processes o

A7.2o

A4.5

o

A5.3

Silicon: Average Atom Spacing

Lattice Constant

SiO2 Average Atom Spacing

Breakdown Voltage

20KV/cmAir

0

A10mV/to510MV/cmto5

Physical size of atoms and molecules place fundamental

limit on conventional scaling approaches

Documents

EE 434 Lecture 2 - class.ece.iastate.educlass.ece.iastate.edu/ee330/lectures/EE 330 Lect 2 Spring 2012.pdf · 2010 sales: $43.6B 2010 income: $11.5B Average annual sales/employee: