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Editorial*
By Ben Parsons, Editor in Chief
As Issue 5 goes to press for the year 2000, I re¯ecton how quickly the year has raced away, and howmany people from all over the world havesupported the journal so well. As autumn arrivesin Europe and North America, so starts anotherConference season. Let us hope that we reap aharvest of interesting papers. The editor willshortly be visiting the Polish Packaging ResearchInstitute and Development Centre (COBRO), hostto the next IAPRI Conference in June 2001.
Information on this event can be obtained fromCOBRO, (Email: [email protected]). We continueto search the world for papers of note, andappreciate the efforts of our contributors. In Issue5, besides the papers we are printing a short articleon global developments in packaging education,an item which we feel will be of interest to many ofyou. Keep the papers coming, and enjoy thecoming months.
PACKAGING TECHNOLOGY AND SCIENCEPackag. Technol. Sci. 2000; 13: 181
Copyright 2000 John Wiley & Sons, Ltd.
* Correspondence to: Ben Parsons, 35 Wellesley Drive, Crowthorne, Berkshire RG45 6AL, U.K.Email: [email protected]