ECSS-Q-ST-70-11C 15 November 2008 Space product assurance
Procurement of printed circuit boards ECSS Secretariat ESA-ESTEC
Requirements & Standards Division Noordwijk, The Netherlands
ECSSQST7011C15November2008Foreword This Standard is one of the
series of ECSS Standards intended to be applied together for
themanagement, engineering and product assurance in space projects
and applications. ECSS is acooperative effort of the European Space
Agency, national space agencies and European
industryassociationsforthepurposeofdevelopingandmaintainingcommonstandards.RequirementsinthisStandardaredefinedintermsofwhatshallbeaccomplished,ratherthanintermsofhowtoorganizeand
perform the necessary work. This allows existing organizational
structures and methods to beapplied where they are effective, and
for the structures and methods to evolve as necessary
withoutrewritingthestandards.This Standard has been prepared by the
ECSS Executive Secretariat, endorsed by the Document
andDisciplineFocalPoints,andapprovedbytheECSSTechnicalAuthority.Disclaimer
ECSSdoesnotprovideanywarrantywhatsoever,whetherexpressed,implied,orstatutory,including,butnotlimitedto,anywarrantyofmerchantabilityorfitnessforaparticularpurposeoranywarrantythat
the contents of the item are errorfree. In no respect shall ECSS
incur any liability for
anydamages,including,butnotlimitedto,direct,indirect,special,orconsequentialdamagesarisingoutof,
resulting from, or in any way connected to the use of this
Standard, whether or not based uponwarranty, business agreement,
tort, or otherwise; whether or not injury was sustained by persons
orpropertyorotherwise;andwhetherornotlosswassustainedfrom,oraroseoutof,theresultsof,theitem,oranyservicesthatmaybeprovidedbyECSS.Publishedby:
ESARequirementsandStandardsDivisionESTEC, P.O. Box 299, 2200 AG
Noordwijk The Netherlands Copyright: 2008 by the European Space
Agency for the members of ECSS2ECSSQST7011C15November2008Change log
ECSSQ7011A23November2001FirstissueECSSQ7011B
NeverissuedECSSQST7011C15November2008SecondissueRedraftingofECSSQ7011AaccordingtoECSSdraftingrulesandtemplate.ReorganizationofthecontenttoseparatedescriptivetextandrequirementsandcreationofDRD.3ECSSQST7011C15November2008Table
of contents Change log
.................................................................................................................3
1
Scope.......................................................................................................................6
2 Normative references
.............................................................................................7
3 Terms, definitions and abbreviated
terms............................................................8
3.1Terms from other
standards.......................................................................................8
3.2Terms specific to the present
standard......................................................................8
3.3Abbreviated terms
....................................................................................................11
4 Principles
..............................................................................................................12
5
Requirements........................................................................................................13
5.1Procurement of
PCBs...............................................................................................13
5.1.1General.......................................................................................................13
5.1.2Design and
layout.......................................................................................13
5.2Base
materials..........................................................................................................14
5.2.1Base laminate materials
.............................................................................14
5.2.2Basic metallic
layer.....................................................................................15
5.2.3Plated metallic layers and finishes
.............................................................15
5.2.4Special materials
........................................................................................16
5.3PCB
delivery.............................................................................................................17
5.3.1Marking.......................................................................................................17
5.3.2Associated test
coupons.............................................................................17
5.3.3Outgoing inspection and PCB manufacturer data
package........................18
5.4Packaging.................................................................................................................18
5.4.1Handling and
storage.................................................................................18
5.4.2Packaging...................................................................................................18
5.5Supplier acceptance of
PCBs...................................................................................19
5.5.1Supplier acceptance
inspection..................................................................19
5.5.2Electrical
test..............................................................................................19
4ECSSQST7011C15November20086 Inspection of
PCBs...............................................................................................20
6.1General.....................................................................................................................20
6.2Visual inspection and non-destructive
test...............................................................20
6.2.1Verification of
marking................................................................................20
6.2.2Visual aspects
............................................................................................20
6.2.3External dimensions
...................................................................................23
6.2.4Warp...........................................................................................................24
6.2.5Twist...........................................................................................................24
6.3Microsection inspection
criteria................................................................................25
6.3.1General.......................................................................................................25
6.3.2Thickness of
metal-plating..........................................................................26
6.3.3Aspect of plated-through
holes...................................................................28
7 Requirements for PCBs
.......................................................................................31
7.1Rigid single-sided and double-sided PCBs
..............................................................31
7.2Rigid single-sided and double-sided PCBs for high frequency
application..............33 7.3Flexible
PCBs...........................................................................................................36
7.4Rigid-flex PCBs
........................................................................................................37
7.5Rigid multilayer
PCBs...............................................................................................38
7.6Sequential rigid multilayer
PCBs..............................................................................40
Annex A (normative) PCB Certificate of conformance (CoC) DRD
..................44
Bibliography.............................................................................................................46
Figures Figure 6-1: Arbitrary defects on conductors
...........................................................................23
Figure 6-2: Arbitrary defects on spacing between conductors
...............................................23 Figure 6-3:
Misalignment of cover layer (for flexible PCBs)
...................................................23 Figure 6-4:
Warp....................................................................................................................24
Figure 6-5:
Twist.....................................................................................................................25
Figure 6-6: Dimensional parameters to be
measured............................................................25
Figure 6-7: Microsection of a
PTH..........................................................................................27
Figure 6-8: Undercut for PCBs with fused SnPb
finish...........................................................28
Figure 6-9: Undercut for PCBs with Au/Ni or Au
finish...........................................................28
Figure 6-10: Overhang for PCBs with Au/Ni or Au
finish........................................................28
Figure 6-11: Microsection in PTH: Possible
defects...............................................................29
Figure 6-12: Microsection of PTH: Possible defects
..............................................................30
Figure 6-13: Voids in resin inside buried
vias.........................................................................30
Figure A-1 : Example of a PCB
CoC......................................................................................45
5ECSSQST7011C15November20081 Scope
ThisStandarddefinestherequirementsimposedonthecustomer,thesupplierandthequalifiedPCBmanufacturerforPCBprocurement.The
requirements of clause 7 apply to both qualification and
procurement
offinishedPCBsanddonotincludethemanufacturingtolerances.ThisStandardisapplicableforthefollowingtypeofboards:RigidPCBs(singlesided,doublesided,multilayer,sequentialmultilayerandPCBswithmetalcore)FlexiblePCBs(singlesidedanddoublesided)RigidflexPCBs(multilayerandsequentialmultilayer)HighfrequencyPCBsSpecialPCBs.PCBs
are used for the mounting of components in order to produce
PCBassemblies performing complex electrical functions. The PCBs are
subjected tothermomechanical stresses during their assembly such as
mounting ofcomponents by soldering, rework and repair under normal
terrestrialconditions. In addition the assembled PCB is subjected
to the environmentimposed by launch and space flights. Therefore
the qualification of a PCBsupplier to ECSSQST7010 is of extreme
importance before the
procurementofPCBforspaceusage.ThisstandardmaybetailoredforthespecificcharacteristicsandconstraintsofaspaceprojectinconformancewithECSSSST00.6ECSSQST7011C15November20082
Normative references The following normative documents contain
provisions which, throughreference in this text, constitute
provisions of this ECSS Standard. For
datedreferences,subsequentamendmentsto,orrevisionofanyofthesepublicationsdonotapply.However,partiestoagreementsbasedonthisECSSStandardareencouragedtoinvestigatethepossibilityofapplyingthemorerecenteditionsofthe
normative documents indicated below. For undated references, the
latesteditionofthepublicationreferredtoapplies.ECSSSST0001
ECSSsystemGlossaryoftermsECSSQST70
SpaceproductassuranceMaterial,mechanicalpartsandprocessesECSSQST7002
SpaceproductassuranceThermalvacuumoutgassingtestforthescreeningofspacematerialsECSSQST7007
SpaceproductassuranceVerificationandapprovalofautomaticmachinewavesolderingECSSQST7008
SpaceproductassuranceManualsolderingofhighreliabilityelectricalconnectionsECSSQST7010
SpaceproductassuranceQualificationofprintedcircuitboardsECSSQST7028
SpaceproductassuranceRepairandmodificationofprintedcircuitboardassembliesforspaceuseECSSQST7038
SpaceproductassuranceHighreliabilitysolderingforsurfacemountandmixedtechnologyprintedcircuitboardsIEC60249(199305)
BasematerialsforprintedcircuitsIEC603262am1(199206)
Printedboards.Part2:TestmethodsIPC4101
SpecificationforbasematerialsforrigidandmulitlayerprintedboardsIPCMF150F
MetalfoilforprintedwiringapplicationsIPCCF152B
Compositemetallicmaterialspecificationforprintedwiringboard7ECSSQST7011C15November20083
Terms, definitions and abbreviated terms 3.1Terms from other
standards
ForthepurposeofthisStandard,thetermsanddefinitionsfromECSSSST0001apply.3.2Terms
specific to the present standard 3.2.1associated test coupon
smallpieceofPCBdesignatedtohavealimitedspecificsetoftestsperformedNOTEThe
associated test coupon is manufactured aspart of a PCB and at the
final manufacturingstageitisseparatedfromit.Theassociatedtestcoupon
is thus associated with the PCB,
withwhichitwassimultaneouslymanufactured.3.2.2blister
delaminationintheformofalocalizedswellingandseparationbetweenanyofthe
layers of a lamination base material, or between base material
andconductivefoilorprotectivecoating[IEC60194(199904)]3.2.3cover
layer (flexible circuit) layer of insulating material that is
applied covering totally or partially over
aconductivepatternontheoutersurfacesofaPCB[IEC60194(199904)]3.2.4crazing
internal condition that occurs in reinforced base material whereby
glass fibresareseparatedfromtheresinattheweaveintersectionsNOTE1
This condition manifests itself in the form
ofconnectedwhitespotsorcrossesthatarebelowthe surface of the base
material. It is usuallyrelatedtomechanicallyinducedstress.NOTE2
Seealsomeasling.[IEC60194(199904)]8ECSSQST7011C15November20083.2.5delamination
separation between plies within a base material, between base
material and
aconductivefoil,oranyotherplanarseparationwithaPCBNOTESeealsoblister.[IEC60194(199904)]3.2.6dewetting
condition that results when molten solder coats a surface and then
recedes toleave irregularlyshapedmounds of solder that are
separated by areas that
arecoveredwithathinfilmofsolderandwiththebasismetalnotexposed[IEC60194(199904)]3.2.7flexible
PCB PCB either single, double sided or multilayer consisting of a
printed circuit
orprintedwiringusingflexiblebasematerialsonly[IEC60194(199904)]3.2.8haloing
mechanicallyinduced fracturing or delamination, on or below the
surface of abase material, that is usually exhibited by a light
area around holes or
othermachinedfeatures[IEC60194(199904)]3.2.9high frequency PCB
PCBusedforhighfrequencyapplications,thathasspecificrequirementstothedielectric
properties of the base laminates as well as special
dimensionalrequirementstothelayoutforelectricalpurposes3.2.10inclusions
foreign particles, metallic or nonmetallic, that may be entrapped
in aninsulating material, conductive layer, plating, base material
or solderconnection[IEC60194(199904)]3.2.11key personnel personnel
with specialist knowledge responsible for defined production
orproductassuranceareas3.2.12measling condition that occurs in
laminated base material in which internal glass
fibresareseparatedfromtheresinattheweaveintersectionNOTE1 This
condition manifests itself in the form
ofdiscretewhitespotsorcrossesthatarebelowthe surface of the base
material. It is usuallyrelatedtothermallyinducedstress.NOTE2
Seealsocrazing.[IEC60194(199904)]9ECSSQST7011C15November20083.2.13metal
core PCB
PCBusingametalcorebasematerial[IEC60194(199904)]3.2.14multilayer
PCB PCB that consist of rigid or flexible insulation materials and
three or morealternate printed wiring and/or printed circuit layers
that have been
bondedtogetherandelectricallyinterconnected[IEC60194(199904)]3.2.15prepreg
sheet of material that has been impregnated with a resin and cured
to
anintermediatestageNOTEBstagedresin.[IEC60194(199904)]3.2.16printed
circuit board (PCB) printed board that provides both pointtopoint
connections and
printedcomponentsinapredeterminedarrangementonacommonbaseNOTEThis
includes singlesided, double sided andmultilayer PCBs with rigid,
flexible, andrigidflexbasematerials.[IEC60194(199904)]3.2.17rigid
double-sided PCB doublesided PCB, either printed circuit or printed
wiring, using rigid
basematerialsonly[IEC60194(199904)]3.2.18rigid-flex PCB
PCBwithbothrigidandflexiblebasematerials[IEC60194(199904)]3.2.19rigid-flex
double-sided PCB doublesidedPCB,eitherprintedcircuitorprinted
wiring,usingcombinationsofrigidandflexiblebasematerials[IEC60194(199904)]3.2.20rigid-flex
multilayer PCB multilayerPCB, either printed circuit or printed
wiring, using combinations
ofrigidmultilayerandflexiblesingleanddoublesidedbasematerials3.2.21rigid
PCB
PCBusingrigidbasematerialsonly[IEC60194(199904)]10ECSSQST7011C15November20083.2.22rigid
single-sided PCB singlesided PCB, either printed circuit or printed
wiring, using rigid basematerialsonly[IEC60194(199904)]3.2.23rigid
multilayer PCB multilayer PCB, either printed circuit or printed
wiring, using rigid
basematerialsonly[IEC60194(199904)]3.2.24scratch
narrowfurroworgroveinasurfaceNOTEItisusuallyshallowandcausedbythemarkingor
rasping of the surface with a pointed
orsharpobject.[IEC60194(199904)]3.2.25sequentially laminated
multilayer PCB multilayer PCB that is formed by laminating together
through hole plateddoublesidedormultilayerPCBsNOTEThus, some of its
conductive layers
areinterconnectedwithblindorburiedvias.[IEC60194(199904)]3.2.26test
pattern part of the PCB that refers to the copper pattern on and
within the PCBsubstrateforaspecifictest3.3Abbreviated terms For the
purpose of this Standard, the abbreviated terms from
ECSSSST0001andthefollowingapply:Abbreviation
MeaningCoCcertificateofconformanceDMLdeclaredmateriallistn.a.notapplicablePCBprintedcircuitboardPTHplatedthroughholePTFEpolytetrafluoroethylener.m.s.rootmeansquareTBDtobedefined11ECSSQST7011C15November20084
Principles For the need of this Standard the role PCB manufacturer
as lowest levelsupplier has been explicitly introduced to allow
proper allocation ofrequirements.12ECSSQST7011C15November20085
Requirements 5.1Procurement of PCBs 5.1.1General a.The supplier
shall procure PCBs from a PCB manufacturer with aqualification
approval for an identified technology in conformance
withECSSQST7010.NOTEThe supplier can procure space quality PCBsfrom
a PCB manufacturer with qualificationapproval according to
ECSSSTQ7010 duringthevalidperiodoftheapproval.b.The supplier shall
perform the incoming inspection and control of
thedeliveredPCBs.5.1.2Design and layout
a.ThesupplierandPCBmanufacturershallagreeonthefollowingissues:1.The
transfer of the plotting, drilling and routing data from
thesuppliertothePCBmanufacturer;2.Thenumberingsystemforthedifferentissues;NOTEThisisdonetoavoidmistakes.3.Construction
data, such as hole sizes, contours and thicknessdimensions, as well
as specific requirements regarding
electricalrequirementsanddielectricproperties.NOTEThe agreement
between the supplier and thePCB manufacturer can be described in
thespecificprocurementdocument.b.The supplier shall provide the PCB
manufacturer with the net
listdocumentationwithasuitableformat.NOTEThe net list is used to
verify that the suppliersdata files are correctly transferred to
the PCBmanufacturer and to set up the
electricalfunctionaltestingofthefinishedPCBs.13ECSSQST7011C15November2008c.The
supplier shall include the manufacturing tolerances given by
thePCBmanufacturerwhendesigningthePCBlayout.NOTEThetolerancesandrequirementsforthevariousfinishedPCBsarespecifiedinclause7.d.Multilayer
PCBs shall have a layout and be built as symmetrical
aspossibletoavoidexcessivewrapageandtwist.e.Thesuppliershalluseaminimumoftwoprepregs,betweenlayers.f.Thenumberofelectricallayersshallbeanevennumber.g.For
rigidflex PCBs the customer shall order the PCB with its
frameattached.NOTE1 This is done in order not to stress the
flexibleparts during handling and mounting ofcomponents.NOTE2 The
frame can be detached after the
assemblyofthePCBs.h.ThePCBmaybeprocuredwithouttheframeprovidingthatstressingoftheflexibleconnectionisavoided.i.The
PCB manufacturer shall define during the design together with
thesuppliertheamountofcopperanditsdistribution.NOTEAnevendistributionispreferred.j.For
surface mount technology and circuits to be wave soldered,
onlypadsontheexternallayershouldbeused.NOTEThis is done because
high density circuitry onexternallayersisnotreliable.k.The supplier
shall use teardrop design for fine lines and small
annularrings.l.The PCB manufacturer shall not use hot air solder
levelling (HAL orHASL)andinfraredreflow.NOTEThese techniques can be
destructive because
ofoverheatingofthePCB.Alsoitdoesnotappearpossible to fulfil the
requirement for the
tinleadsurfacefinishwithregardtodimensions.m.Before any
installation of components or soldering or
desolderingoperationsabakeoutshallbeperformedasspecifiedinECSSQST7008.5.2Base
materials 5.2.1Base laminate materials
a.ThePCBmanufacturershallusematerialswhichconformtoECSSQST70,IEC60249(199305)andIPC4101Standards.NOTEAllbasematerialsarementionedinclause7.14ECSSQST7011C15November20085.2.2Basic
metallic layer
a.Thesuppliershalldesigntheexternallayerusingbasiccopperthicknessof70m,35m,17,5mand9m.b.Thesuppliershalldesigntheinternallayersusingbasiccopperthicknessof70m,35mand17,5m.c.For
Cufoil the PCB manufacturer shall use copper quality HTE
(IPCMF150F).5.2.3Plated metallic layers and finishes 5.2.3.1Copper
(electrolytic)
a.ThePCBshallbemanufacturedwithcopperofpurityofatleast99,5%.b.Thecopperductilityshallbeatleast12%.NOTEAductilityof18%isrecommended.c.The
PCB manufacturer shall plate the platedthrough holes with
thefollowingcopperthickness:1.Forsolderingholesatleast25m2.Viaholesatleast20m.d.The
total basic and plated copper on surface layers for soldering
padsshallhaveathicknessofatleast40m.e.The total basic and plated
copper for internal layers shall have
athicknessofatleast17,5m.5.2.3.2Electroplated tin-lead thickness
over copper
a.Thefusedtinleadshallhaveaminimumthicknessof8minthehighestpartofthepadandtracks.NOTEBefore
reflow the thickness of (157)m
isrecommended.b.Thefusedtinleadshallhaveaminimumthicknessof2monthecornerofthePTH.NOTEAfusedtinleadthicknessof1monthecornerof
the PTH can be tolerated provided that
thesolderabilityisacceptable.c.Thefusedtinleadshallhaveathicknessof8monhalfoftheheightoftheholewall.d.The
fused tinlead shall have a thickness of 2m on the remaining
twoquartersoftheholewall.e.The fused tinlead should reflow over the
edges of the copper pads
andtracks.15ECSSQST7011C15November20085.2.3.3Nickel electrolytic
plating (optional) over copper plating a.The electrolytic nickel
plating over copper shall have a thickness from2mto10m.5.2.3.4Gold
(electrolytic)
a.ThePCBmanufacturershallusegoldforhighfrequencycircuitsorotherassemblymethodswhenspecifiedbythesupplier.b.WhengoldfinishisneededthePCBshallbemanufacturedwithgoldofapurityofatleast99,8%.c.WhengoldfinishisneededthePCBshallbemanufacturedwithgoldthatdoesnotcontainmorethan0,2%ofsilver.NOTEAlternative
types of gold (e.g. for highfrequency circuits) can be used,
provided thatthe gold is proven to be satisfactory
duringexecutionofthequalificationprogramme.d.Thethicknessofgoldoverbarecoppershallbebetween3mand7m.e.The
thickness of gold over nickel plating shall be between 1m
and7m.f.IftinleadplatingisappliedtogetherwithgoldplatingonthesamePCB,a
tinlead overlap on gold of minimum 200m shall be used on
thesurfaceofthePCB.NOTEThisisdoneinordertoensureprotectionoftheplatedcopperlayer.g.Thetinleadoverlapareashallbeaminimumof200mdistancefromthetermination
pad designated for soldering as given in
ECSSQST7008clause8.4.5.2.4Special materials 5.2.4.1Metal core a.The
PCB manufacturer shall use copper invar copper or copper
molybdenumcopperinconformancewithIPCCF152B.5.2.4.2Heat-sinks:
material and surface treatment
a.Forcopper,aluminiumandbrassheatsinks,thePCBmanufacturershallusethematerialasspecifiedbythesuppliersDML.16ECSSQST7011C15November20085.3PCB
delivery 5.3.1Marking
a.ThePCBmanufacturershallmarkthePCBsasfollows:1.PCBmanufacturerslogo2.PCBreferencecodeandserialnumberNOTEIntheeventthatthereisnotsufficientspaceonthe
PCBs for the marking, the PCBmanufacturer can ensure traceability
by
othermeansorrequestforwaiver.3.Numberoflayers.b.Markinginksshallbeasfollows:1.Permanentpolymerinks2.Specifiedintheprocurementdocumentation3.Capable
of withstanding fluxes, cleaning solvents,
soldering,cleaningandcoatingprocessesencounteredinlatermanufacturingprocesses
according to ECSSQST7007, ECSSQST7008,
ECSSQST7028,ECSSQST70384.ConformtotheoutgassingrequirementsofECSSQST7002.c.If
a conductive marking is used, the marking shall be treated as
aconductiveelementonthePCB.5.3.2Associated test coupons a.The PCB
manufacturer shall produce one associated test coupon
perpaneltobedeliveredtothesupplier.b.The design of the associated
test coupon shall be representative of
thePCBstobedeliveredtothesupplier.c.The supplierand the
PCBmanufacturer shallagree on the designof
theassociatedtestcoupon.d.Theassociatedtestcouponshallenable:1.Testingasdefinedinclause62.Testing
of insulation resistance as defined in
ECSSQST7010clause7.2.83.ContinuitytestingasdefinedinECSSQST7010clause7.2.84.Dielectric
withstanding voltage as defined in
ECSSQST7010clause7.2.8.17ECSSQST7011C15November20085.3.3Outgoing
inspection and PCB manufacturer data package a.The PCB manufacturer
shall test an in house associated test coupon
todemonstratethecompliancetotheinspectioncriteriaofmicrosectionsasdescribedinclause6.3.b.The
PCB manufacturer shall not deliver a PCB for which the results
onthe associated test coupon present any major nonconformance as
perclauses6and7.c.ThePCBmanufacturershalldeliverthedatapackagetothesupplier.d.Thedatapackageshallcontainthefollowingitems:1.TheCertificateofconformance(CoC)inconformancewithAnnexA;2.Supplierspecification.5.4Packaging
5.4.1Handling and storage
a.PCBsshallbestoredinadryenvironmentuntiltheyaresoldered.b.Ifassemblyinvolvestwoormoresteps,thesuppliershallstorethePCBsin
between the assembly steps in containers either with desiccant or
indrynitrogenenvironment.c.ThePCBsshallbehandledonlywithcleanlintfreegloves.5.4.2Packaging
a.The PCBs and their associated test coupons shall be packed in
order toprevent any degradation due to corrosion, deterioration or
physicaldamage.b.ThePCBsshallbeindividuallypackedinanoncorrosivematerial.c.ThePCBmanufacturershallensuresafedeliverytothesupplier.d.Thepackagingshallconsistofindividual,airtightplasticcontainers.e.PVCpackagingshallnotbeused.f.Desiccantordrynitrogenfillingshallbeusedinthepackaging.g.ThePCBshallnotbeindirectcontactwiththedesiccant.h.If
a desiccant is used, means for indication of moisture content shall
beprovided.i.The PCBs and their associated test coupon shall be
packed in order
toavoidpressureon,orfrictionbetweenthePCBs.j.ThecontainersusedtoshipthePCBsandtheassociatedtestcouponshallbeoftypeandsizethatensureacceptancebycommoncarrier.18ECSSQST7011C15November2008k.Each
shipment shall include for every delivered PCB the Certificate
ofconformance(CoC)establishedinconformancewithAnnexA.l.Each
shipping container shall be marked according to
supplierrequirements.5.5Supplier acceptance of PCBs 5.5.1Supplier
acceptance inspection a.The supplier shall inspect each of the
delivered PCBs according to PCBdeliveryclause5.3.b.The supplier
shall visually inspect each of the delivered PCBs
inconformancewiththeprocedureshowninclause6.c.ThesuppliershallrejectaPCBincaseofamajornonconformance.d.Thesuppliershallretaintheassociatedtestcouponforatleast10yearsorasotherwisespecifiedintheprojectrequirements.NOTEThe
associated test coupon can be used
forsupplementarytesting.5.5.2Electrical test a.The supplier and the
PCB manufacturer shall agree on the electrical
testtobeperformedbythePCBmanufacturer.b.ThePCBmanufacturershalluseeitherthetestbedelectricaltesterortheflyingprobetestertomeasurethecontinuityandtheinsulationaspartoffunctionaltesting.19ECSSQST7011C15November20086
Inspection of PCBs 6.1General The tests specified in this clause
are a subset of the tests in ECSSQST7010clause7.6.2Visual
inspection and non-destructive test 6.2.1Verification of marking
a.Eachboardshallbeinspectedwiththenakedeyeforcorrectmarking.b.Themarkingshallbelegibleandresistanttoteststresses.c.Thenonconformancecriteriashallbeasfollows:1.Identificationimpossible..............................................................M2.Markingnotconformingtosuppliersspecification................M3.Defectsnotaffectingidentifications.
..........................................m6.2.2Visual aspects
a.Each board shall be inspected by magnification 10 with
suitablelightingconditionstoverifythatconstructionandworkmanshipmeettherequirements.b.In
case of any irregularity, the area shall be examined under
2040magnification.c.The nonconformance criteria for the general
cleanliness
andcontaminationshallbeasfollows:1.ContaminationvisibletothenakedeyeandnotremovablebycleaningaccordingtoECSSQST7008............M2.ContaminationvisibletothenakedeyeandremovablebycleaningaccordingtoECSSQST7008
...............................md.Thenonconformancecriteriaforthesubstrateshallbeasfollows:1.NotinconformancewithPCBmanufacturerstrademarkandrequiredquality..................................................M20ECSSQST7011C15November20082.Scratchescuttingglassfibreorleavingmarksinthedielectriclaminatethatareaffectingreliability.........................M3.Scratchesnotaffectingreliability
................................................m4.Dents,crazingandhaloing:(a)Visibletothenakedeye
....................................................
M(b)Onlyvisiblewithmagnificationaids ..............................
m5.Nonhomogeneityregardingcolouringandopacity ...............
m/M6.Discolouredcopperoxidelayeroninternallayerisacceptable7.Inclusionofforeignmatter,blisteringorairbubbles:(a)Visibletothenakedeye
....................................................
M(b)Onlyvisiblewithmagnificationaids ..............................
m8.Delamination..................................................................................
M9.Measling:(a)GeneralmeaslingspreadoverthewholePCBsurface..................................................................................
M(b)Localmeaslingthatcausesreductionoftheinsulationdistanceintheouterlayertobelowtherequirement
..................................................................
M(c)Localmeaslingthatdoesnotcausereductionoftheinsulationdistanceintheouterlayertobelowtherequirement
......................................................
m10.Fungusgrowth;
.............................................................................
M11.Delaminationofcoverlayer(onlyforflexiblePCB).................
m/Me.Thenonconformancecriteriafornonplatedthroughholesshallbeasfollows:1.Holesplatedunintentionally.......................................................
m/M2.Incompletelydrilledholes,missingoradditionalholes..........
m/Mf.Thenonconformancecriteriafortheroutingshallbeasfollows:1.Incompleteroutingofboard,suchthatdimensionalormechanicalrequirementsarenotmet
........................................
M2.Arbitrarycuttingdefectsthatremainacceptablewithinthedimensionalrequirements
........................................ mg.The nonconformance
criteria for the surface metallization shall be
asfollows:1.Conductorsorpadsnotconformingtosuppliersspecification.................................................................
M2.Terminalpadsorconductorspartiallyorcompletelymissing............................................................................................
M3.Terminalpadsorconductorsthatarecut
..................................
M4.Terminalpadsorconductorsformingashortcircuit...............
M5.Lifting/delaminationofconductivepatternfromsubstrate....
M21ECSSQST7011C15November20086.ScratchesintheSnPbmetallisationexposingtheunderlayingcopperplating
.........................................................
M7.Copperornickelvisibleontopsurfaceplatedareas ...............
MNOTEExposed copper can be accepted on the side
oftracksoronthesideofsolderingpads.8.Largenumberofsuperficialscratchesnotattributedtoamanufacturingprocessevidencingbadworkmanship............
M9.Dewettingoffusedtinleadfinishonsolderpads....................
M10.Granularsurfacestructureoffusedtinleadfinishonsolderpads
.....................................................................................
m/M11.Corrosionofexposedcopper.......................................................
M12.Migrationofunderlayingcopperthroughgoldcoating..........
Mh.Thenonconformancecriteriaforplatedthroughholesshallbeasfollows:1.Incompletelydrilled,additionalormissingholes....................
M2.Partiallyorcompletelymissingmetallization...........................
M3.Componentholes0,6mmfilledorpartiallyfilledwithsolderresultinginadiametersmallerthantherequirement..
m/Mi.The nonconformance criteria for arbitrary defects of
conductors
andterminalpadsshallbeasfollows:1.a20%ofxandminimumconductorwidth>requirement
........................
m2.a>20%ofx....................................................................................
M3.minimumconductorwidthx.................................................................................................
M6.Oppositepeaks:ifz20%ofxandz20%ofyandtheisolationspacingy.................................................................................................
M12.Coverlayer(flexiblePCBs)coveringpartofsolderpad(seeFigure63)...............................................................................
MNOTEIntermittent and irregular metallisation defectson conductors
are edge roughness (peak orvalley), pits, pin holes, voids,
protrusions
orindentations,asshowninFigure61,Figure62andFigure63.22ECSSQST7011C15November2008x:
nominal conductor width Figure61:Arbitrarydefectsonconductorsxy:
nominal spacing between conductors
Figure62:Arbitrarydefectsonspacingbetweenconductorsr : rest of
metale: annular ringcoverlaycomponent holepade r
Figure63:Misalignmentofcoverlayer(forflexiblePCBs)6.2.3External
dimensions a.Each board shall be measured by means of suitable
standard measuringequipment to verify that the physical dimensions,
including
boardthicknessandexternaldimensionsmeetthesuppliersspecification.b.The
nonconformance criteria for the thickness of base laminate
(averageof4measurementsontheboard)shallbeasfollows:1.Thicknessnotconformingtotolerancelimitsofthesuppliersspecification.................................................................
M23ECSSQST7011C15November2008c.Thenonconformancecriteriaforthelengthandwidthofboard(averageof2measurementsontheboard)shallbeasfollows:1.Lengthorwidthnotconformingtotolerancelimitsofthesuppliersspecification.................................................................
M6.2.4Warp
a.ThePCBsshallbeplacedunrestrainedonaplanehorizontalsurfacewiththeconvexsideupward.b.Thewarpshallbeexpressedinpercentageterms.c.The
maximum bow between the plane horizontal surface and the
PCBshallbemeasuredasdefinedinFigure64.d.ThelengthofthePCBshallbemeasured.e.Thewarppercentageshallbecalculatedasdefinedinequation[61]:100)
() ( .(%) =mm PCB the of Lengthmm blow
MaxWarp[61]f.Thenonconformancecriteriashallbeasfollows:1.Warp>requirement......................................................................
Mmax. bow Figure64:Warp6.2.5Twist a.The PCB shall be placed on a
plane horizontal surface so that it rests
onthreecorners.b.Thetwistshallbeexpressedinpercentageterms.c.ThedistancebetweentheplanehorizontalsurfaceandthefourthcornerofthePCBshallbemeasuredasdefinedinFigure65.d.Thelengthofthediagonalshallbemeasured.e.Thetwistpercentageshallbecalculatedasdefinedinequation[62].100)
() ( .(%) =mm diagonal the of Lengthmm twist MaxTwist
[62]f.Thenonconformancecriteriashallbeasfollows:1.Twist>requirement......................................................................
M24ECSSQST7011C15November2008A, B and C are touching basemax. twist
Figure65:Twist6.3Microsection inspection criteria 6.3.1General
a.The test shall be carried out in conformance with tests 1c and
15b
ofIEC603262am1(199206).b.Forhighfrequencyconductorsthecustomershallspecifyatwhichheightoftheconductorthewidthshallbemeasured(seeFigure66).
w widthofconductore minimumannularerringonexternallayere
minimumannularerringoninternallayerd diameterofplatedthroughholeh
heightofconductorFigure66:Dimensionalparameterstobemeasured25ECSSQST7011C15November20086.3.2Thickness
of metal-plating
a.Thetestshallbecarriedoutonamicrosection.b.Observationsshallbemadewithmagnificationgreaterthanorequalto250.c.The
nonconformance criteria for the thickness of copper plating
onexternallayersshallbeasfollows:1.Basiccopper:(a)Thicknessnotconformingtothesuppliersspecification......................................................
M2.Basiccopperpluselectrolyticcopperonnonsolderingareas:(a)Thickness
