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Ecol Biotech Instruction / Business Vision &Technology

Principle of Ecolgreen Bio-Polymer (PLA_Poly Lactic Acid)

TotalBio-Polymer

Solution

CyclicProcess

PlantIngredients

PlantIngredients→Lactic Acid

Lactic Acid → High Molecules

HighMolecules → Resin

Resin → Products

Products → Degraded

Bio degradable

Non-soot(smoke toxicity)

Compostable

Crystalline

Natural circulation

Biocompatibility(Biomaterial)

Origin Plants

NO Phthalate(Nerve disturb matter)

Decrease CO2(Greenhouse gas)

※ Functional quality

Ecolbiotech Co., Ltd high quality, productivity and competitiveness in the world with expertise in dealing with similar eco-friendly material experts in the field developed into the best is unique. Based on the accumulated 17-year-old history, as well as eco-friendly infrastructure, environment, development of materials with love beyond the release gakbunya finished, the next generation to lead the LED thermal conductivity of aluminum products from alternative technologies, new materials with superior technologies will lead the future of green technology challenges It is my best intentions.

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Bio-Polymer (PLA) Grade and Application

Grade Supply field

EGN100 (970)

Grade for fibersPhysical properties applicable to nylon and polyestersApplicable to short staple, filaments

EGN200 (515S)

Grade for sheetsPhysical properties applicable to PVC, PS and PPApplicable to cards, trays and decoration sheets, etc

EGP112Grade for injectionPhysical properties applicable to ABS, PP and PSApplicable to Kitchen/baby/bathroom supplies, etc

EGN515 (516)

Grade for injectionPhysical properties applicable to ABS, PP and PSApplicable to Kitchen/baby/bathroom supplies, etc

Specification of Physical properties

ClassificationEcolGreen Bio-Polymer Other Echo-

friendly resinsSynthetic

resins

EGN970

EGS515S

EGP112

EGN515 PLA PBS PP ABS

Specific gravity 1.24 1.33 1.28 1.29 1.41.2~1.3

1.0 1.0

Tensile strength (Mpa)

63.9 38.4 366 390 47.9 -8.3~10.7

29.4~54.88

Impact strength (J/m)

380069~83

40.2 44.3 38.223450~5978

107.8~4312

39.2~245

Heat resistance ()

53 70 68 81 5475~85

93~122

100~115

Moistureabsorption rate(%)

- 0.46 0.15 0.21 0.5 1~2 0.010.1~0.4

Gradefibers,

filmsheets

Non-heating resistanceinjection

heating resistance injection

PLA synthetic resins

Simplicity of production based on heat resistance up to 100’c and customized capability of physical properties.

Product photo

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Natural Plant Ingredients

Comparison of process of molding

Thermal Conductive Grade and Application

CMPSeries

CMPSeries

Injection mold(Low price) → shooting out (emission) → product 3steps-process

Die casting mold(high-p) → emission → treat surface → spiral drill → antioxidant→ product 6steps-process

· Excellent production line High quality· EMI Shielding Beating phenomenon (amolrphous magnetic substance)· Light weight : CMP 02 : 1.6, Al : 2.8· Increase specific surface area (Air rediant heat)· Light thickness Al substitute thickness 30% Down· Short process stage Resonable price· Special design Injection advantage

Eco Cool Plus Advantage

Naturally Harm-free

Cost-effective than Plastic

May Replace Plastic to Extrude/Mold

Approved Technology

· Mixes 12 eco-friendly materi-als with PLA (Polylactide, corn starch)

* PLA: Patented by Natureworks, U.S.

· Not including synthetic resin (PC, ABS, etc)· 100% naturally biodegradable· No harmful materials (dioxin) and other pollutants

Not related to oil price- Use natural plant ingredients

· Innovative eco-friendly resins with

· universal properties· Overcomes limits of PLA and · replaces all kinds of plastics

· Overcomes heat resistance & shrinkage of PLA & PBS· Physical properties applicable to heat resistant,· injection and IT products· Applicable to sheets, air permeable film · blow containers, etc

The first biodegradable resin to obtain Eco-mark and international certificates

Ecol Biotech Instruction / Business Vision &Technology

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Eco Cool Plus Principle

Heat transmission

Air-Latent heat

heat transfer of free electron

Free electron conditions(same metal) - * CNT * Orgarno-metal Polymer * Semi-Graphene * Carbon

Crystal lattice(composition atom) – Crystalline Polymer Orgarno- Polymer molecular kinetic energy(pulse wave) ⇒ heat transmission medium molecular structure ⇒ high-density, hyperbaric-Polymer compress emission

Phase transition(PCM) Microcapsul – thermal diffusion UP – thermal transfer UP – convection current UP

Floodlighting type(factorylight)-120W,2.3Kg

Bulb type - 4.5W Bulb type - 8W Bulb type - 15W

Downlight type - 12W-120W,2.3Kg

Bulb type - 15W

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Eco Cool Plus Principle /Patent technology

Eco Cool Plus material(2)/Patent _ PCM (Phase Change Material)

Phase change material : Solid → Melting fusion → Heat energy absorption → Liquid Liquid → congelation → Heat energy emission → Solid

radiant base laminate board(dispersibility, diffusivility)

Aqueous Permanent

An anion repellence

Thermal diffusivity/dispersion (Capsul)

Size 5/1000mm (5)

Physical reaction

An anion resin

Phase charge material

Latent Heat

Nuclear(PCM) 70%Wall constituents(Repeating resin laminate) 30%

Paraffin, Gelatin, Melamine Stearate, acrylic

Micro-capsul Powder

PCM CapsulPowder?

Air temperature changes

Convention Current

Hybrid Storage Unit(Hybrid heat storaging system)

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Eco Cool Plus introduceEco Cool Plus material(3) _ Organo-metallic Polymerization /

High polymer chemical reaction

Interaction principle : Electromagnetic absorptive CNT and Organic-metal compound polymer are converted into thermal energy through resistance (Ω) which generate micro-waves from the solid material with and organo-mettallic carbon nanotubes in the pore surface take the frequency of the wave interference This phenomenon is caused by the beat and polymer(PLA,PBT) crystal structure of solid materials that are not (Amorphous) arising from resistance (Ω) as the thermal energy is converted into electromag-netic radiation by offsetting

Free electron move UPion & atom

Melt Index adjustability

Chemical - resistance & moisture permeability

Crystal latticeUP

Conductive PolymersCoherence UP

Rapid swelling

PLA Crystallization(Nucleophilic-Agent)

Rapid reactionPAMPOrganic-

metal compound

Pressure rising

Explosive Substance

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Origin-plants PLA & Aromatic Engineering PBT_Test Data

Field articleTesting meth-

odCMP 05(Bio) CMP 02 (PLA) MP10(Bio)

SCMP 89 (PBT)

Specific gravity (23/23)

ASTM D 79 1.4 1.6 1.6 1.8

Hardness (HRR)

ASTM D 785 45 89 92 -

Tensile strength

(Mpa)ASTM D 638 29.2 24.6 21.7 570Kg/cm2

Flexible rate (%)

ASTM D 638 0.5 0.2 2%

Impact strength (Izod)

ASTM D 256 37.7J/m 24.3J/m 8.9J/m 2.3Kgf cm/cm

Absorption rate (%)

ASTM D 5700.14 0.14 0.33 -

HDT 0.455 Mpa 147 96 97 210

Heat-resisting property

deface: Afer 1h 150

No change No change No change No change

Thermal con-ducivity (w/

mk)KSL 1604 1.0~2.0 3.0 ~ 5.0 1.0~2.0 8.9 (In-Plane)

Specific heat (J/g)

KSM 3016 1.34 1.11 - -

Thermal diffu-sion (mm2/s)

KSL 1604 0.41 1.64 - -

Surface resist-ance (Ω/ㅁ)

MCP-T610 - 3 X 10E-1 ~ 5 - 40

Combustibility UL94 Vo(1/8) Vo(1/8) Vo(1/8) Vo(1/8)

Insulation - Non-isolate Non-isolate isolate isolate

color - Black Black White Black

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Eco Cool Plus-LED lamp, Fluorescent light comparison

Injection Molding Condition of Thermal conductivity

LED lamp, fluorescent light / coefficient of linear stability

Gate Size : over 2mm Injection pressure : 1 stage (step) UP Temperature of screw : CMP 02 (PLA : Originate plants) 170 ~ 190 SCMP 89 (PBT aromatic base) 260 ~ 280 Temperature of Molding : CMP 02 (PLA Originate plants) 35 ~ 40 SCMP 89 (PBT aromatic base) 100 ~ 120 Moisture absorption drying : AL 3step-belt packaging Moisture ratio about 200PPM Molding & Radiating construction

* Al provision Thickness : 30% Down* 1W per CMP02, CMP89, MP10 Radiationg material use Radiating material use : 8g * Outside surface integral : Compare to Al 1.5 ~ 2(twice) expended construction* Pin-connected construction : height, thickness – low and light* Pin’s gap : over 4mm*Minimum Pin’s Thickness : over 2mm*LED PCB Board adherend Thickness size : 5~6mm*Outside housing Thickness : Over 2mm

Al compress radiate heatEco Cool Plus compress radiate

heat

construction Stay space Direct radiant

specificationPCB panel – housing space gapRadiant heat Down

PCB panel-housing direct connectRadiant heat UP

Specific surface Limited Al comparison : 50% UP

Bent condition Windingness Stability

Thermal linear expansion

length 100cm Al stick(linear expan-sion) Each temperature 1 per 0.023mm increase

As pass time, windingness (bent)

CMP 05 & SCMP 89 crystallization T: 100Stable T: below 100

Non-windingness bent

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Eco Cool Plus / Comprihension

Eco Cool Plus /weight comparison low carbonate Heat Sink

Eco Cool Plus material _ each structure material position changeLED Lighting Key Plan for a competitive future in heat dissipation and structural design for ensuring that preemption is the first LED lighting industry and further dangrak determine the weight and volume of a competitive and environmen-tally friendly materials will depend on whether or not to enforce.

Eco Cool Plus / weight comparison_low carbonate Heat Sink

P/name 2010year 2012year 2015year Remarks

LED PKG 30% 25% 15%Trend of cost reduc-tions in semiconduc-

tor models

SMPS 25% 20% 15%

Scrambling and the drive IC unit jikgyeol-hyeong AC power will

change

Thermal conduc-tivity

20% 20% 20%

Accounting for 90% of heat in the metallic case of unavoidable

cost cuts

Total 75% 65% 50% -

P/name Company A Company B Company C Company DEcolbiotech

CMP

Bulb(type 8W) 160g 175g120g(PPS)

160g 90g

Street lamp(150W)

11Kg 8Kg 6Kg 3.5~5Kg 3.5Kg

Flood lamp(650W)

30Kg 50Kg 18Kg 15~18Kg 13Kg

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Eco Cool Plus /Application & testing comparison Eco Cool Plus _ Product functional testing

test R&D : Korea institute ceramic technology and engineering

<Heatsink : Al> <Heatsink : TEC-PLA>

Eco Cool Plus / Application Eco Cool Plus material _ high quality EMI shielding /Electromagnetic Interference

No 1 2 3temperature, 48.8 51.4 50.2

No 1 2 3temperature, 51.6 46.6 45.0

No 1 2temperature, 59.0 51.6

No 1 2temperature, 63.3 53.8

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Patents & Certificates Material

Green Mark

<Factory installation>

EcolbioTech Co.,Ltd

691-1 (121B-2L),Gojan-dong, Namdong-gu, Incheon, KoreaTEL: +82-32-813-5023 FAX : +82-32-813-5025

Printed in Korea _ June 2012

www.ecolbiotech.com/ ecolgreen.com Email: ecolgreenpla@yahoo.com

RoHS &Reach