Eco-Technology: Delivering Efficiency & Innovation...Door to Innovation 32nm 300mm 45nm transition decreased CPU switching power 20% Nehalem microarchitecture enables efficient system

Lorie Wigle Lorie Wigle GM EcoGM Eco--Technology, Intel CorporationTechnology, Intel Corporation

President, Climate Savers Computing InitiativePresident, Climate Savers Computing Initiative

EcoEco--Technology: Technology: Delivering Efficiency & InnovationDelivering Efficiency & Innovation

2

Drive ComputingDrive Computingto Be More to Be More

Energy EfficientEnergy Efficient

Use Computing to Improve Use Computing to Improve Energy Savings Outside Energy Savings Outside

Information and Information and Communications Communications

TechnologyTechnology98%98%The Big OpportunityThe Big Opportunity

~2%~2%**OpportunityOpportunity

EcoEco--Technology: Two Sides of the CoinTechnology: Two Sides of the Coin

Source: Gartner, 2007Source: Gartner, 2007

3

1KwH IT Technology

= 10X Energy Savings

Source: “Information and Communication Technologies: The Power of Productivity” February 2008, commissioned by American Council for an Energy-Efficient Economy.

4

Leverage Computing to Drive Energy Leverage Computing to Drive Energy SavingsSavings

Industrial RobotsIndustrial Robots

Logistics for Logistics for TransportationTransportation

LEED Certified LEED Certified BuildingsBuildings

Smart Power DeliverySmart Power Delivery

Video ConferencingVideo Conferencing

OnOn--line line EntertainmentEntertainment

EE--commercecommerce

Converting Atoms Converting Atoms to Bitsto Bits

OnOn--line Bankingline Banking

Digital MusicDigital Music

AutomationAutomation SubstitutionSubstitution DeDe--materializationmaterialization

5

Transformation in BankingTransformation in Banking

ConvenienceConvenienceFaster ResponseFaster Response

Productivity ImprovementProductivity ImprovementPositive Impact On Positive Impact On

EnvironmentEnvironment

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Increasing Energy EfficiencyIncreasing Energy Efficiency

Source: “A Smarter Shade of Green,” ACEEE Report for the Technology CEO Council, 2008.

ICT Leads All Sectors in Creating More Energy-efficient Products

Automobiles

Passenger Airlines

Agriculture

Steel Manufacturin

g

Lighting

Computer Systems

40 percent

121 percent

132 percent

167 percent

339 percent

2,857000 percent

1978 2008Energy-

efficiency Improvement

Design for theDesign for theEnvironmentEnvironment

IntelIntel’’s Approach to Ecos Approach to Eco--TechnologyTechnology

Energy Efficient Energy Efficient PerformancePerformance

SustainableSustainableManufacturingManufacturing

Policy &Policy &IndustryIndustry

Energy Efficient Energy Efficient PerformancePerformance

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90nm300mm

130nm200mm

180nm200mm

250nm200mm

65nm300mm

Dual-core

45nm300mm

Relentless Pursuit of MooreRelentless Pursuit of Moore’’s Law Opens the s Law Opens the Door to InnovationDoor to Innovation

32nm300mm

45nm transition decreased CPU switching power 20% Nehalem microarchitecture enables efficient system design

The Bottom Line

Process technology innovation drives decreased power consumptionThe Tick

New microarchitecture design enables performance and efficiency advancesThe Tock

Intel Tick-Tock Accelerates Efficiency Innovation

Source: Intel.

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Benefits of MooreBenefits of Moore’’s Laws Law

Source: Intel Corporate Technology Group

Core Integer Performance Over Time*Core Integer Performance Over Time*Power reduction Over Time*Power reduction Over Time*

~ 1 Million Reduction In Energy/Transistor Over 30+ Years Delive~ 1 Million Reduction In Energy/Transistor Over 30+ Years Delivering ring Great Performance Within Power EnvelopeGreat Performance Within Power Envelope

Compute Energy Efficiency Compute Energy Efficiency Positive Impact On EnvironmentPositive Impact On Environment

Pentium® Pro Processor

Pentium® -II ProcessorPentium® -IIi Processor

Pentium® 4 Processor

Pentium® 4 Processor EE

Pentium® -D Processor

Core™ 2 Duo Processor X6800

Core™ 2 Duo Extreme QX6700

i486DX2

i486

386

Pentium® Processor

1986 20081988 1990 1992 1994 1996 1998 2000 2002 2004 20061

10

100

1000

10000

Single Core Moore’s Law1970 1980 1990 2000 2005 2010

1.E-07

1.E-06

1.E-05

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Ene

rgy/

Tran

sist

or (R

elat

ive)

10

Comparing Power Consumption of Computer Comparing Power Consumption of Computer PlatformsPlatforms

Managed / MobileManaged / MobileIntelIntel®® CoreCore™™2 Duo Processor 2 Duo Processor

T7700T7700

UnmanagedUnmanagedIntelIntel®® PentiumPentium®® D Processor D Processor 945 with a CRT, then LCD 945 with a CRT, then LCD

displaydisplay

Unmanaged then Unmanaged then ManagedManaged

IntelIntel®® CoreCore™™2 Duo 2 Duo Processor E6550Processor E6550

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Estimated Annual Energy ConsumptionEstimated Annual Energy Consumption

Unmanaged PentiumUnmanaged Pentium®® D D Processor 945 with CRT Processor 945 with CRT

displaydisplay

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(low

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(low

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1015 1015

Potential System Level Energy SavingsPotential System Level Energy Savings

For system configuration details, please see Appendix on page 45For system configuration details, please see Appendix on page 45..Performance tests/ratings are provided assuming specific computePerformance tests/ratings are provided assuming specific computer systems and/or components and reflect the approximate performar systems and/or components and reflect the approximate performance of Intel nce of Intel products as measured by those tests. Any difference in system haproducts as measured by those tests. Any difference in system hardware or software design or configuration may affect actual perrdware or software design or configuration may affect actual performance. This formance. This

data may vary from other material generated for specific marketidata may vary from other material generated for specific marketing requests. ng requests.

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displaydisplay

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Unmanaged PentiumUnmanaged Pentium®® D D Processor 945 with LCD Processor 945 with LCD

displaydisplay

1015 1015 938938


For system configuration details, please see Appendix on page 45For system configuration details, please see Appendix on page 45Performance tests/ratings are provided assuming specific computePerformance tests/ratings are provided assuming specific computer systems and/or components and reflect the approximate performar systems and/or components and reflect the approximate performance of Intel nce of Intel products as measured by those tests. Any difference in system haproducts as measured by those tests. Any difference in system hardware or software design or configuration may affect actual perrdware or software design or configuration may affect actual performance. This formance. This


Switch from CRT to Switch from CRT to LCD DisplayLCD Display


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1015 1015 938938



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Unmanaged CoreUnmanaged Core™™2 Duo 2 Duo Processor E6550 with Processor E6550 with

LCD displayLCD display

1015 1015 938938

655655




IntelIntel®® CoreCore™™2 2 micromicro--arch Advantagearch Advantage

14


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Managed CoreManaged Core™™2 Duo 2 Duo Processor E6550 with Processor E6550 with


229229




PowerPower--Managed Managed PlatformPlatform

655655

15


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Managed CoreManaged Core™™2 Duo 2 Duo Processor T7700 mobile Processor T7700 mobile

platformplatform

5959

GoingGoingMobileMobile

>17x Reduction>17x Reduction




16

20045.1M bops6 racks126 Servers240 sq ft48 kW

MooreMoore’’s Law Delivers s Law Delivers Data Center OptimizationData Center Optimization

20075.1M bops1 rack17 Blades40 sq ft6 kW

THE BOTTOM LINE

Energy Savings

$53KSAVINGS

AnnualEnergy Costs

87%REDUCTION

Floor Space

83%REDUCTION

Source: Intel January 16, 2008. Performance comparison using SPECjbb2005 bops (business operations per second) between (2004) 2 socket single core Intel Xeon processor (3.6GHz) and (2008) 2 socket Quad-Core Intel Xeon processor E5450 (3.0GHz, 80W, 1333MHz) measured

8/22/07. 1 Floor space based foot on sq ft reduction. 2 Energy costs based on total solution rack power. 3 Energy Savings based on an electric rate of $0.10/kWh assuming 33% average server load. 4 ROI is calculated based on cost of new servers ($6,264 per server pricing based on HP DL 380G5 (32GB RAM) as of Nov 17, 2007, source www.hp.com) divided by energy savings per year. Actual performance results and savings

may vary depending on configuration.

See slide 46 for details.

Source: Comparison of SPECjbb2005 bops (business operations per second)

Drive ComputingDrive Computingto Be More to Be More

Energy EfficientEnergy Efficient

Use Computing to Improve Use Computing to Improve Energy Savings Outside Energy Savings Outside

Information and Information and Communications Communications

TechnologyTechnology98%98%The Big OpportunityThe Big Opportunity

~2%~2%**OpportunityOpportunity

EcoEco--Technology: Two Sides of the CoinTechnology: Two Sides of the Coin

Source: Gartner, 2007Source: Gartner, 2007

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Legal DisclaimerLegal Disclaimer

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELL®® PRODUCTS. NO LICENSE, EXPRESS PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPEROR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS TY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELDOCUMENT. EXCEPT AS PROVIDED IN INTEL’’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESSASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTSALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A IES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATEPARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER NT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended forINTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining use in medical, life saving, or life sustaining applications.applications.Intel may make changes to specifications and product descriptionIntel may make changes to specifications and product descriptions at any time, without notice. s at any time, without notice. Designers must not rely on the absence or characteristics of anyDesigners must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intefeatures or instructions marked "reserved" or "undefined." Intel l reserves these for future definition and shall have no responsibreserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising fromility whatsoever for conflicts or incompatibilities arising from future future changes to them.changes to them.The IntelThe Intel®® CoreCore™™ MicroarchitectureMicroarchitecture, Intel, Intel®® Pentium, IntelPentium, Intel®® Pentium II, IntelPentium II, Intel®® Pentium III, IntelPentium III, Intel®® Pentium 4, IntelPentium 4, Intel®® Pentium Pro, Pentium Pro, IntelIntel®® Pentium D, IntelPentium D, Intel®® Pentium M , ItaniumPentium M , Itanium®®, Xeon, Xeon®® may contain design defects or errors known as errata which may may contain design defects or errors known as errata which may cause cause the product to deviate from published specifications. Current chthe product to deviate from published specifications. Current characterized errata are available on request.aracterized errata are available on request.Contact your local Intel sales office or your distributor to obtContact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product orain the latest specifications and before placing your product order.der.This document contains information on products in the design phaThis document contains information on products in the design phase of development. Do not finalize a design with this se of development. Do not finalize a design with this information. Revised information will be published when the prodinformation. Revised information will be published when the product is available. Verify with your local sales office that you huct is available. Verify with your local sales office that you have ave the latest datasheet before finalizing a design.the latest datasheet before finalizing a design.All dates specified are target dates, are provided for planning All dates specified are target dates, are provided for planning purposes only and are subject to change.purposes only and are subject to change.All products, dates, and figures specified are preliminary basedAll products, dates, and figures specified are preliminary based on current expectations, provided for planning purposes only, aon current expectations, provided for planning purposes only, and nd are subject to change without notice.are subject to change without notice.Intel and the Intel logo is a trademark or registered trademark Intel and the Intel logo is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States anof Intel Corporation or its subsidiaries in the United States and d other countries.other countries.*Other names and brands are the property of their respective own*Other names and brands are the property of their respective owners.ers.Copyright Copyright ©© 2007, Intel Corporation 2007, Intel Corporation

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Legal Notices and Important InformationLegal Notices and Important InformationRegarding the performance measurements in this presentationRegarding the performance measurements in this presentation

Performance tests and ratings are measured using specific computPerformance tests and ratings are measured using specific computer systems and/or components er systems and/or components and reflect the approximate performance of Intel products as meaand reflect the approximate performance of Intel products as measured by those tests. Any difference sured by those tests. Any difference in system hardware or software design or configuration may affecin system hardware or software design or configuration may affect actual performance. Buyers should t actual performance. Buyers should consult other sources of information to evaluate the performanceconsult other sources of information to evaluate the performance of systems or components they are of systems or components they are considering purchasing. For more information on performance testconsidering purchasing. For more information on performance tests and on the performance of Intel s and on the performance of Intel products, visit products, visit http://http://www.intel.com/performance/resources/limits.htmwww.intel.com/performance/resources/limits.htm..

Intel processor numbers are not a measure of performance. ProceIntel processor numbers are not a measure of performance. Processor numbers differentiate features ssor numbers differentiate features within each processor family, not across different processor famwithin each processor family, not across different processor families. See ilies. See www.intel.com/products/processor_numberswww.intel.com/products/processor_numbers for details. for details.

Intel may make changes to specifications, release dates and prodIntel may make changes to specifications, release dates and product descriptions at any time, without uct descriptions at any time, without notice. Intel,notice. Intel, Core and the Intel logo are trademarks of Intel CorporationCore and the Intel logo are trademarks of Intel Corporation in the U.S. and other in the U.S. and other countriescountries

Performance estimates are based on specific platform settings. Performance estimates are based on specific platform settings. Estimates may vary +/Estimates may vary +/--7%. Actual 7%. Actual performance may change once measured data is published.performance may change once measured data is published.

©© 2008 Intel Corporation. Intel, Intel logo, Intel Inside logo, C2008 Intel Corporation. Intel, Intel logo, Intel Inside logo, Core, and the Pentium logo are ore, and the Pentium logo are trademarks or registered trademarks of Intel Corporation, or itstrademarks or registered trademarks of Intel Corporation, or its subsidiaries in the United States and subsidiaries in the United States and other countries.other countries.

*Other names and brands may be claimed as the property of others*Other names and brands may be claimed as the property of others

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AppendixAppendix

System information for Slides 15System information for Slides 15--19 19 Intel Core 2 Duo processor E6550 (2.33GHz, 1333MHz FSB, 4MB L2 CIntel Core 2 Duo processor E6550 (2.33GHz, 1333MHz FSB, 4MB L2 Cache), Intelache), Intel®® DQ35JO DQ35JO motherboard with Intelmotherboard with Intel®® Q35 Express chipset; 1333MHz FSB, Intel integrated graphics, 2xQ35 Express chipset; 1333MHz FSB, Intel integrated graphics, 2x1GB 1GB Micron* DDR2Micron* DDR2--667 5667 5--55--55--15, Seagate* 320GB/16MB cache/7200rpm, Windows* Vista* Enterpris15, Seagate* 320GB/16MB cache/7200rpm, Windows* Vista* Enterprise,. e,. Intel Pentium D Processor 945 (3.4GHz, 800MHz FSB, 2x2MB L2 CachIntel Pentium D Processor 945 (3.4GHz, 800MHz FSB, 2x2MB L2 Cache), with Intel 945G Chipset on e), with Intel 945G Chipset on Intel D945GPM board, Intel Chipset Software Installation File 8.Intel D945GPM board, Intel Chipset Software Installation File 8.1.1.1010, Dual Channel Micron* PC21.1.1010, Dual Channel Micron* PC2--5300U 2x1GB of DDR2 667 55300U 2x1GB of DDR2 667 5--55--55--15, Seagate* Barracuda* 320GB15, Seagate* Barracuda* 320GB NCQ SATA2 7200RPM, NCQ SATA2 7200RPM, Windows* Vista* Ultimate RTM Build 6000 NTFS.Windows* Vista* Ultimate RTM Build 6000 NTFS.ACER 5720 Intel Core 2 Duo T7700 (2400MHz/800FSB L2 4MB) with IACER 5720 Intel Core 2 Duo T7700 (2400MHz/800FSB L2 4MB) with Integrated Graphic,2x1GB ntegrated Graphic,2x1GB HynixHynix DDR2DDR2--667, Hitachi 160GB 5400rpm HDD667, Hitachi 160GB 5400rpm HDDDisplay power draw values gathered from spec sheets of 10 modelsDisplay power draw values gathered from spec sheets of 10 models of each type of display (CRT and of each type of display (CRT and LCD).LCD).Energy Cost: 7.705 cents/KWh, which is the U.S. average for induEnergy Cost: 7.705 cents/KWh, which is the U.S. average for industrial and commercial customers as strial and commercial customers as of June, 2007. Source: U.S. Department of Energy, of June, 2007. Source: U.S. Department of Energy, http://www.eia.doe.gov/cneaf/electricity/epm/table5_6_a.html http://www.eia.doe.gov/cneaf/electricity/epm/table5_6_a.html Intel EEP methodology is described here: http://Intel EEP methodology is described here: http://www.intelcapabilitiesforum.netwww.intelcapabilitiesforum.net/EEP//EEP/

Performance tests/ratings are provided assuming specific computePerformance tests/ratings are provided assuming specific computer systems and/or components and r systems and/or components and reflect the approximate performance of Intel products as measurereflect the approximate performance of Intel products as measured by those tests. Any difference in d by those tests. Any difference in system hardware or software design or configuration may affect asystem hardware or software design or configuration may affect actual performance. This data may ctual performance. This data may vary from other material generated for specific marketing requesvary from other material generated for specific marketing requests. ts.

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““DataData Center OptimizationCenter Optimization”” slide #20 slide #20 System configurations and measurement detailsSystem configurations and measurement details

System Configurations and Performance / Power Measurements:System Configurations and Performance / Power Measurements:2 Socket Intel2 Socket Intel®® XeonXeon®® Processor 3.6GHz (Nocona)Processor 3.6GHz (Nocona)8 x 1GB DDR28 x 1GB DDR2--400 400 DIMMsDIMMsSystem Idle Power: System Idle Power: 225W225WSystem Workload Power: System Workload Power: 382W382WSPECjbb2005 bops performance: SPECjbb2005 bops performance: 40487 40487

2 Socket Intel2 Socket Intel®® XeonXeon®® Processor E5450 (3.0GHz 80W HTN)Processor E5450 (3.0GHz 80W HTN)8 x 2GB 667MHz 8 x 2GB 667MHz FBDIMMsFBDIMMsSystem Idle Power: System Idle Power: 237W237WSystem Workload Power: System Workload Power: 353W353WSPECjbb2005 bops performance: SPECjbb2005 bops performance: 297,984297,984

CalculationsCalculationsFloor space: 240sq. Foot to 60 sq. foot (83% reduction)Floor space: 240sq. Foot to 60 sq. foot (83% reduction)Annual energy costs: 48kW to 6kW (87% reduction)Annual energy costs: 48kW to 6kW (87% reduction)Yearly Energy Savings: $53k ($61.4k Yearly Energy Savings: $53k ($61.4k -- $8.29k) = $53.11k$8.29k) = $53.11kQty 126 2S IntelQty 126 2S Intel®® XeonXeon®® Processor 3.6GHz (Processor 3.6GHz (NaconaNacona) servers, at idle power (225W * 16 hours/day), at full load (38) servers, at idle power (225W * 16 hours/day), at full load (382W * 8 2W * 8

hours/day), for one year at 0.10 kWh = $30.69k * 2 (HVAC factor)hours/day), for one year at 0.10 kWh = $30.69k * 2 (HVAC factor) = $61.4k electricity cost per year.= $61.4k electricity cost per year.Compared toCompared toQty 6 2S IntelQty 6 2S Intel®® XeonXeon®® Processor E5450 (HTN 3.0GHz) servers, at idle power (237W * 16 Processor E5450 (HTN 3.0GHz) servers, at idle power (237W * 16 hours/day), at full load (353W * hours/day), at full load (353W *

8 hours/day), for one year at 0.10 kWh = $4.16k * w (HVAC factor8 hours/day), for one year at 0.10 kWh = $4.16k * w (HVAC factor) = $8.29k electricity cost per year.) = $8.29k electricity cost per year.

ROI: ROI: Using HP DL 380G5 with 32GB RAM is $6,264 as of Nov 17, 2007 on Using HP DL 380G5 with 32GB RAM is $6,264 as of Nov 17, 2007 on hp.comhp.comCost of 17 servers is $106.5k divided by $53k/year energy savingCost of 17 servers is $106.5k divided by $53k/year energy savings, this is 2 year ROIs, this is 2 year ROI

Software:Software:BEA BEA JRockitJRockit* (build P27.4.0* (build P27.4.0--33--8664786647--1.6.0_021.6.0_02--2007080120070801--19311931--windowswindows--x86_64, compiled modex86_64, compiled mode

Claims and Calculations Claims and Calculations for

Documents

Eco-Technology: Delivering Efficiency & Innovation...Door to Innovation 32nm 300mm 45nm transition decreased CPU switching power 20% Nehalem microarchitecture enables efficient system