ECE5917SoC Architecture: System

Tae Hee Han: than@skku.edu

Semiconductor Systems Engineering

Sungkyunkwan University

What is ‘System’? (from Wiki)

The term system has multiple meanings:1. A collection of organized things; as, a solar system.

2. A way of organizing or planning.

3. A whole composed of relationships among the members.

Most systems share the same common characteristics. These common characteristics include the following:

1. Systems have a structure that is defined by its parts and processes.

2. Systems are generalizations of reality.

3. Systems tend to function in the same way. This involves the inputs and outputs of material (energy and/or matter) that is then processed causing it to change in some way.

4. The various parts of a system have functional as well as structural relationships between each other.

The characteristics of systems have been studied in general systems theory.

2

What is ‘System’?

n Electronic System Design Perspective n The concept of “system” has evolved over the twenty years in IT.

One can conclude upfront that there are perhaps as many definitions of an electronic system as there are engineers designing them. A famous quote states that a system is the level of abstraction just above what you are currently working on.

n One of the main challenges is that the phrase system level means different things to different people. For some, it stands for co-development of hardware and software; for others, it means heterogeneous integration of many IP components or complexity management.

3

Typical System Development Flow

n Product Concept

n Market Analysis

n Determination of System Specification

n Cost Estimation à Price

n Development Schedule & Work Partition

n Component Supplying & Outsourcing Plan

n Risk Management (Contingency) Plan

n System Design

n Supplementary Workn Marketing, Sales, Mass Production Plan, After-service...

4

IteratedFeedbackLoops

Semiconductor Demand Drivers in 2012

Data Processing34%

Wired Communications

6%

Wireless Communications

24%

Consumer18%

Automotive8%

Industrial10%

$ 300 B (USD)

Source: SIA (Semiconductor Industry Association)

5

Smart Connected Devices Lead the Market Growth

n Tablet sales grew 78.4% YoY in 2012 — Expected to pass desktop sales in 2013, portable PCs in 2014n Global smartphone applications processor revenues showed a robust 60 %

YoY growth to reach $12.9 billion in 2012

n Global tablet processor market experienced an 83% year-on-year growth compared with 2012, reaching $2.7 billion

Product Category 2012 Unit Shipments 2012 Market Share 2017 Unit

Shipments* 2017 Market Share* 2012 - 2017 Growth*

Desktop PC 148.4 12.4% 141.0 6.0% -5.0%

Portable PC 202.0 16.8% 240.9 11.0% 19.3%

Tablet 128.3 10.7% 352.3 16% 174.5%

Smartphone 722.4 60.1% 1,516 67% 109.9%

Total 1,201.1 100.0% 2,250.3 100.0% 87.3%

(Units in million)

Source: IDC (2013)

Source: Strategic Analytics (2013)

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Smart Device Key Players in Market

7

QuantaAsus

Pegatronetc…

AmazonGoogle

Microsoft

ODM

FoxconnPegatron Apple

SamsungHTC

OEM

OBM

System vendor with core chip

owner

Chip supplier

Service

System SW

System HW

Service SW

Package SW

Demand SW

Manufacturer Brand Owner

Peripherals

ø ODM: Original Design Manufacturerø OEM: Original Equipment Manufacturerø OBM: Original Brand Manufacturer

Apple Google Samsung Microsoft Amazon

Service iCloud Google+ Azure Cloud AWS Cloud

OS iOS Android, Chrome Bada à Tizen Windows Linux based

Tablet (PAD) iPad (Nexus series) Galaxy Note Surface Kindle Fire

Phone iPhone (Nexus series) Galaxy (Nokia)

PC iMac (Chrome NB) Notebook (HP, Dell, …)

Music Player iPod MP3/DC

Etc. iTV, iWatch Google TV, Google Glass Smart TV Xbox

Windows 8

Windows 8 RT

Windows Phone 8

Mobile Market Ecosystem: OS Perspective

8

Evolution to Revolution

n Create a new class of lifestyle PCsn Device-like, desirable, affordable

n A full-power, full-fidelity digital companion

n Enable new scenarios for the PCn More mobile, more natural interaction for on-the-go use,

more natural fit into people’s lives and activities

n New software and peripheral opportunities

9

Smartphone

Pocket PCNotebook PC

Tablet PC

Ultra-Mobile PC

Desktop

portable and watered down

Netbook w/ Atom CPU

Smartbook & Tabletw/ ARM CPU

Expanded and more powerful

Smartphone10

Mobile vs. PC Architecture

(Optional Graphics Card)ARM CPU core

GPU core

LPDDR3

High-end Discrete GPU

DDR3

GDDR5

MobilePC

AP

Memory Controller

CPU SoC

x86 CPU core

GPU core

Memory Controller

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• Intel Ivy Bridge• AMD Fusion

• Nvidia GeForce• AMD Radeon

• Apple A6• Samsung Exynos• Qualcomm Snapdragon• Nvidia Tegra

• Imagination PowerVR• ARM Mali• Qualcomm Adreno• Nvidia ULP GeForce

Cortex-A8 single

Cortex-A8 single Cortex-A9 DualCortex-A9 Dual Cortex-A9 Dual

@1.5GHzCortex-A9 Dual

@1.5GHz

Cortex-A9 Quad

Cortex-A9 Quad

Cortex-A15 Dual

Cortex-A15 Dual

Cortex-A15/A7 Quad/Octa(big.LITTLE)

Cortex-A15/A7 Quad/Octa(big.LITTLE)

40M Polys/sec40M Polys/sec 80M Polys/sec

80M Polys/sec 120M Polys/sec120M Polys/sec

256MB256MB 512MB512MB 1GB1GB 2GB LPDDR22GB LPDDR2

854×480854×480 960×540960×540 1,280×7201,280×720 1,920×1,0801,920×1,080

4”4” 4.2”4.2” 4.5”4.5” 5”5”

HSPSA/HSUPA(~7.2Mbps)

HSPSA/HSUPA(~7.2Mbps)

HSPSA/HSUPA(~14.4Mbps)

HSPSA/HSUPA(~14.4Mbps)

HSPA+(~21Mbps)

HSPA+(~21Mbps)

DC-HSPA(~42Mbps)DC-HSPA

(~42Mbps)

LTE(~75Mbps)

LTE(~75Mbps)

LTE-A(~150bps)

LTE-A(~150bps)

IEEE802.11b/g

IEEE802.11b/g

IEEE802.11a/b/g/n

IEEE802.11a/b/g/n

IEEE802.11a/b/g/n/ac/ad

IEEE802.11a/b/g/n/ac/ad

2010 2011 2012 2013 2014 2010 2011 2012 2013 2014

CPU

Technology Evolution driven by Mobile Device (1/2)

GPU

DRAM

Pixel

Display

Cellular

WiFi

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Cortex-A53/A57 Heterogeneous Multi-

core (big.LITTLE)

Cortex-A53/A57 Heterogeneous Multi-

core (big.LITTLE)

2GB LPDDR32GB LPDDR3 4GB LPDDR3 / DRAM stacking - Wide IO?

4GB LPDDR3 / DRAM stacking - Wide IO?

4.8”4.8”

266M Polys/sec266M Polys/sec

2010 Increase 2020

Cellular ~70 X

WiFi ~47 X

Display(Resolution) 17 X

Video(Resolution) 34 X

Battery 2.2 X

~7 Mbps ~500 Mbps

~150 Mbps ~7 Gbps

720p 4Kp

720P H.264 4Kp H.265

5.76Whr 13Whr

Technology Evolution driven by Mobile Device (2/2)

13

Tick-Tock Strategy of Apple

14

iPhone 3G iPhone 3GS iPhone 4 iPhone 4S iPhone 5

Display 3.5”, 165ppi 3.5”, 165ppi 3.5”, 330ppi 3.5”, 330ppi 3.5”, 330ppi

CPU ARM1176@620MHz Cortex-A8@600MHz Cortex-A8@1GHz (A4) Cortex-A8@800MHzDual (A5)

Swift(Cortex-A15)@1.2GHz Dual (A6)

GPU - PowerVR SGX535 PowerVR SGX535 PowerVR SGX543MP2 PowerVR SGX543MP3

RAM 128MB 256MB 512MB 512MB 1GB

Camera 2MP 3.15MP 5MP 8MP 8MP

Release TIme 2008. 6 2009. 6 2010. 6 2011. 10 2012. 9

Design Perspective

Performance Perspective

Smartphone Comparison

15

SamsungGalaxy S4 HTC One Apple iPhone5 LG Optimus G Pro BlackBerry Z10

Release Date Apr, 2013 Apr, 2013 Sep, 2012 Apr, 2013 Jan, 2013

OS Android 4.2.2(Jelly Bean)

Android 4.1.2(Jelly Bean) iOS 6.1.4 Android 4.1.2

(Jelly Bean) BlackBerry 10

Technology 28nm 28nm 32nm 28nm 28nm

ApplicationProcessor

Exynos 5 Octa@ (1.6/1.2GHz) /

Octacore (Cortex-A7 Quad + Cortex-

A15 Quad) or Snapdragon

600@1.9GHz / Quad

Snapdragon600@1.7GHz

/ Krait(ARMv7) Quad

Apple A6@1.3GHz/ Swift(ARMv7)

Dual

Snapdragon600@1.7GHz

/ Krait(ARMv7) Quad

Snapdragon S4 plus @1.5GHz/ Krait(ARMv7)

Dual

GPUTriple corePowerVR

SGX 544MP3Adreno 320

Triple corePowerVR

SGX 543MP3Adreno 320 Adreno 320

DRAM LPDDR3 2GB LPDDR2 2GB LPDDR2 1GB LPDDR2 2GB LPDDR2 2GB

Chipset Integration Trend (1/3)

n Mobile : AP/BB, PMIC based integration

n TV : AP/Graphics/Gesture Processor based integration

(Source : Gartner - modified)

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2012 2013 2014 2015 2016Application processor 32/28nm

Dual/Quad28/20nm

Quad/Octa 20/14nmOcta/Many 14nm

Many Core14/10nm

Many Core

Baseband processor WiFi

40nmDual CoreBT/FM

GPS NFC controller 65nm 40nm RF/Transceiver 40nm 28nm 20nm Audio/Video Codec

130nm 130nm

90nm 65nm 45nm

Power management IC Noise cancellation IC 180nm Touch-screen controller 90nm 90nm

Gesture recognition 90nm 65nm

DRAM 32nm 28nm 25nm 23nm 21nm NAND flash 19nm 15nm 13nm 10nm 7nm e-compass/e-gyroscope 180nm 180nm 180nm 180nm 180nm

2012 2013 2014 2015 2016Application processor

45nm Dual Core

28nmDual Core 28nm

Quad Core 22/20nmQuad Core 20/14nm

Many Core

Graphics & Video Processor

Connectivity(Ethernet & USB)

HDMI / MHL Input 90nm 65nmAudio/Video I/O 65nm Frame Rate Controller 65nm 40nm Timing Controller 65nm 40nm Gesture/Image Processor 90nm 65nm 40nm Touchpad Processor 90nm 65nm Voice Processor 90nm 65nm WiFi 65nm

65nm65nm 40nm Bluetooth 65nm

NFC 90nmLCD Driver 130nm 90nm 65nmAudio Codec 130nm 90nm 65nm

Chipset Integration Trend (2/3)

n Mobile : AP/BB, PMIC based integration

n TV : AP/Graphics/Gesture Processor based integration

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(Source : Gartner - modified)

Chipset Integration Trend (3/3)

18(Source : Gartner)

Smartphone Sensors

19

More than Moore

20

2013 2016?

PoP3D IC

Package size

PoP

3D IC

Power Consumption

PoP

3D IC

Bandwidth

x 8

50%35%

Design Objectives

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Performance

Cost

Quality

Thresholds

Better

Better

Improvingquality beyond

threshold isdesired

Improvingperformance

beyond thresholdIs a waste

Improvingcost is desired

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Project Management

ProjectRisk

Management

General Management

Scope Communication

Quality Human Resource

Cost

Schedule Contract/Supply

Life CycleEnvironment variable

Instruction, Information/Data sharing

Availability

Productivity

Service, Outcome

Target CostConstraint

Target ScheduleConstraint

Requirement

Standard

Expectation, Feasibility

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Cast Study:Mobile

24

Start Symbol Search Receiving individual bits

Start Symbol Detection

Synchronization

Radio Samples

MAC Delay Transmitting encoded bits

Start Symbol Transmission

Bit Modulations

Transmission

ReceptionEncoded data received

Data Received

Encoded data to be Transmitted

Data to be Transmitted

Encode processing

Decode processing

Transmit command provides data and starts

MAC protocol.

Wireless Communication Phases

CPU

DSP

ABB

RF

PROTOCOLSTACK

L1 DBB HARDWARE

MMI (Man- Machine Interface)

ApplicationTasks

DATA I/OLCD,

Camera,Etc

L1 SW

Handset Top Level

25

26

A Wireless System – Typical SoC Design

AD FSM

Control

RTOS

ARQ

MAC

Coders

FFT Filters

Hardwired Algorithms(word level)

digitalanalog

Logic (bit level)

Analog Basebandand RF Circuits

CommunicationAlgorithms

Protocols

HardwiredLogic

Analog

DSP Core mP CoreA wide mix of components –how do we optimize this???

Source : Prof. Bob Brodersen at UCB

The Design Goal: System on a Chip CMOS Radio

A / D

Analog RF

Timingrecovery

phonebook

Control

Java VM

ARQ

User Interface

FiltersAdaptive Antenna

Algorithms

Equalizers MUD

Accelerators(bit level)

digitalanalog

DSP cores

mP core(ARM)

Four Basic Components

Logic

Dedicated Logicand Memory

27

The Design Environment

Analog RF, Passives, Mixed Signal

(Matlab)

Communications Engineering/DSP

Protocols/Control

(SDL,SMV)

Amplifiers, Filters, A/D, PA, Inductors

(SPICE, AVHDL,Schem.)

Dedicated Logic, Pleiades, VHDL, Schematics

Embedded mP, Programmable DSP

(C, Assembly)

Matlab,Simulink

Matlab,Simulink

Telelogic,Stateflow

HSPICE Synopsys, Unicad

ARMulator,ARM Compiler

Specification(UML)

Analog Component Libraries

(Layout, SKILL)

Func. Modules (RAM, ROM, Mult)Standard Cell

Place and Route

HP EESoft ASITIC

Cadence

Programmable Cores DSP, ARM, FPGA

(C, VHDL, Assembly

ARMFPGA

Express

Rational ROSE,Visual Modeler

UnicadCadence,

Power& TimeMill

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ø SDL: Specification and Description Languageø SMV: Symbolic Model Verification

Typical Mobile Phone: Chip Perspective

LNALNA

PAPA

RxSynth

Tx

RxSynth

Tx

RadioCODECRadioCODEC

DigitalBaseband

Logic

DigitalBaseband

Logic

MemoryMemory

UserInterface

UserInterface

PassivesPassives Power ManagementPower Management

Audio

Display

SiGe BiCMOS

Discrete Passive(SAW, etc)

High Voltage

Analog CMOS

DSM Digital

Flash EEPROM

High-Power (typically GaAs)

29

30

The Direction of RF SoC Integration Local optimization of each sub-systemBaseband & mixed-signal / RF integration à 2.5G GSM New functions require redundant RF/Analog, digital processing, memory

BluetoothTM

GPS3G Radio2.5Radio

A/D Baseband

WLAN

Software/AppsDigital Camera

Memory

MP3

LCD controller

Leveraging of technology strengths for lowest cost systemBaseband / memory / processor integration 130nm à90nmà 65nm Analog / RF / power integration à Modular processes per application Packaging – flipped / stacked / passives à Overcome integration barriers

Power Amplifiers RF Subsystem Baseband

Power Amplifiers

RF Subsystem Baseband

BluetoothTM

GPS3G Radio2.5Radio

A/D Baseband

WLAN

Software/AppsDigital Camera

Memory

MP3

LCD controller

Source : Jazz Semiconductor

Ubiquitous Electronics

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0.0001

0.001

0.01

0.1

1

10

100

1000

1950 1960 1970 1980 1990 2000 2010 2020

Historical

LargeScale

Office/Middle

WS

PC

AmbientElectronics

UbiquitousComputing

Embedded

Vac. tube

Transistor

IC

LSI

VLSI

SoC

3D SiP

Ubiquitous device

Everybody

Everywhere

UnawareElectronics is part of environments enhancing convenience and security of daily life

People use electronics consciously.

ø Source: T. Kuroda in Keio Univ. (`07)

Ambient Intelligence

Position &ForceSensors

BloodComposition(e.g. lactate)

ECG,BloodPressure

MultipleHopBAN

WearableDigitalAssistant Wireless

Link to Coachand Med Team

WearableDigitalAssistant

ø Source: IMEC Electronics è Background, People è Foreground

32

RF

BANBody Transducers

1m

C T

SoC-SiPWearable Assistant

End-User Equipment for Ambient Intelligence?

www

1000 m

GSM/GPRS/UMTSBasestations

C: base-bandRF: radio linkT: transducerIF: interface

• multimedia, games • QoS• global positioning• global connectivity• biometric input• health...

10…100 Gops 0.1-2W

IF

SeeHearFeel

SpeakShow

Stimulate

IF

RF

100mW - (k)bps

RF

>100/person aura

C T

WAN + WLANBasestations

<1W,10Gops > 100 Mbps

10mC RF

Satellite

10mAd-hocnetwork

33

ø Source: IMEC

Ambient Intelligence Architecture

n Transducer nodes

n Ultra low energy (100Mops/mW)

n Low flexibility

n Ultra low cost (1€)

n 1..10 Mtr (small size)

n Low clock frequency

n Chip-package co-design

n Assistant nodes/basestations

n Low energy (10-50Mops/mW)

n High Flexibility

n Low cost (100 €)

n 10..100 Gops, >100 Mtr

n High (not GHz) frequency

n Dynamic task management

Need global system optimizationGHz RF and mixed signal everywhere

@100..1000 times Power efficiency of today’s mP...ø Source: IMEC

34

Digital Contents + IPs : “Liquid” Contents

ANY DIGITAL CONTENT(Variety of “store & play” devices of

fully digitalized “liquid” content)

ANY PHYSICAL NETWORK

(Variety of wired/wireless access to fully IP networks)

WEB-BASED SERVICES

Full IPNetwork of Networks

35

New Business Opportunities

36

lensvideo chip and lamp

Micro-actuatorPower and data antenna

SoC

Microfluidics & drug delivery

New Killer Applications

37

More than Moore – Optical Digital Camera

=+Sensor

+Optics

VSC DENC

DAC

DAC

EMI

JPEG

ST20-C1

COMMS

TransportServicesPLL

BlockMove

FMI DC-Core

DCU

SmartMedia

CCD i/f

Camerai/f

Image ProcessingInterfaces

Cache & RAM

Video subsystem

YC

JIF

RZY

R1 W1

R2

W2

Perip

h

RZC

LPY LPC

1394SSCPIOIIC

JPEG 3 x SSC2 x ASC

VSCDENCDACs

SmartMedia &

Compact Flash

Interface

32kHz

ST20-C1 CPU

CacheSubsystem

ImageProcessing

External SDRAM & Flash

Interface

SensorInterface

IP in red supplied by our partner

SystemTimers

8kSRAM

Diagnosticcontroller

Watchdog/LPC

Int.Cont.

IEEE1394Interface

CameraH/W

Interface

Processor

4.5 ´ 4.5 ´ 3.6mm

38

More than Moore – Mechanical Gyro/Accelerometers

39

+

More than Moore – Sensors and MEMS

Pressure

Gas

RF MEMS

Silicon Microphone

Cantilever

40

Standalone DevicesStandalone Devices Feature Phone/Smart PhoneFeature Phone/Smart Phone Emerging DevicesEmerging Devices

ü Dedicated function devicesü E.g) traditional PDAü Platform concept is not

important (Linux is themainstream)

ü Dedicated function devicesü E.g) traditional PDAü Platform concept is not

important (Linux is themainstream)

ü Single Network Mobile Deviceü 2G or 3G mobile phoneü Wi-Fi is becoming more

importantü Platform concept is very

important

ü Single Network Mobile Deviceü 2G or 3G mobile phoneü Wi-Fi is becoming more

importantü Platform concept is very

important

ü Standalone device + Wi-Fi and/or 3G Network à Connected

ü Spreads to CE devicesü Powerful multimedia function is

becoming more importantü “Web Platform” concept

ü Standalone device + Wi-Fi and/or 3G Network à Connected

ü Spreads to CE devicesü Powerful multimedia function is

becoming more importantü “Web Platform” concept

Emerging Devices

n Standalone device + Networking

41

Window Mobile AllianceWindow Mobile AllianceAndroid AllianceAndroid Alliance

• Platform expansion due to the spread of Android into emerging devices (eBook, CE)• Platform expansion due to the spread of Android into emerging devices (eBook, CE)

• Microsoft’s efforts on innovation of Window Mobile and CE Platform• Pink Project (PC-based Platform à Web-based Platform)

• Microsoft’s efforts on innovation of Window Mobile and CE Platform• Pink Project (PC-based Platform à Web-based Platform)

Symbian AllianceSymbian AllianceAppleApple

• iPad – new media devices• iPod and iPhone are becoming media devices• iPad – new media devices• iPod and iPhone are becoming media devices

• Nokia enters the netbook (Booklet 3G) market• Expanding Internet Tablet PC line-ups and Maemo Platform• CE Focus trend of Symbian Foundation OS

• Nokia enters the netbook (Booklet 3G) market• Expanding Internet Tablet PC line-ups and Maemo Platform• CE Focus trend of Symbian Foundation OS

Emerging Devices

Smart Phones

Strategy Change of Platform Enablers

n Smartphones are evolving to emerging devices

42

ProjectorVideo Player Digital TV Game

Console Audio Player

Digital Signage

Car

Kiosk

MID/PMP

Digital Camcorder

Digital Camera

HandsetNotebook/ Netbook

Mobile Game

Earphone/ Headset

Desktop

Printer

Media Server

MP3P

WPAN/WLAN

Cognitive Radio

Network-oriented Emerging Devices

43