DYNALOY, INC

TelecommunicationsAvionicsInjection MoldingComputersAutomotiveElectronic ComponentsAerospaceAudio/VideoPlastics ProcessingMedicalFiber OpticsConverting/Laminating

INDUSTRIAL

SOLVENT SELECTION GUIDE

PROPYLENE GLYCOL ETHER BASE

DYNASOLVE MP-710

DYNASOLVE MP-750

ETHYLENE GLYCOL ETHER BASE

DYNASOLVE MP-AL-GR

DYNASOLVE MP-500

METHYLENE CHLORIDE BASE

DYNASOLVE 165

DYNASOLVE 200

DYNASOLVE 210

N-METHYL PYRROLIDONE BASE

NMP

DYNASOLVE 180

DYNASOLVE 185

HYDROCARBON BASE

DYNASOLVE 220

DYNASOLVE 225

DYNASOLVE 230

DYNASOLVE M-10

SPECIAL SOLVENTS

DECAP

DYNASOLVE 100

DYNASOLVE 699

DYNASOLVE M-30

DYNAFLUSH

DYNASOLVE CU-5

DYNASOLVE CU-6

DYNASOLVE CU-9

URESOLVE

P9

P9

P10

P9

P9

P9

P9

P9, P11

P7, P9,P11

P7, P9,P11

P7, P9,P11

P9

P9

P9

P10

P1,P2, P3,P7,P9

PI, P2, P3,P7,P9

PI, P2, P3,P7,P9

P1,P2,P3,P7,P9

P9

P1,P2,P3,

PI, P2,P3,

P1,P2

P10

P1,P2,P3.P4

P1,P2,P3,P4

P1,P2,P3,P4

P5,P9

P5,P9

P5,P9

P5,P9

P9

P5. P9

P5.P9

P5.P9

P5 P9

P10

P7, P9

P7, P9

P7,P9

P7,P9

P8

P7,P9

P7,P9

P7,P9

P9

P9

P6

P6

P6

P6

P9

P9

P4

P1,P2,P3,P4

P1.P2,P3, P4

P4

P1.P2,P3, P4

P1.P2,P3, P4

P5

P5

P5

P5

P5

P5

P5

P5

P5

P11

Pll

P11

P11

P11

P11

P11

P11

FREE LAB SERVICEIf uncertain of the correct solvent for your application,we offer free analysis in our laboratory. Our highlyqualified technical staff will then recommend theproper solvent for your application.

MATERIAL EVALUATION KITSSeveral standard material evaluation kits are availablefor your own in-house testing; or, you may make up akit of your own by selecting any 6 of our solvents(1 pint of each).

MATERIAL TYPE

ELECTRONIC

El

E2

E3

E4

E5

E6

E7

E8

E9

E10

P1

P2

P3

P4

P5

P6

P7

P8

P9P10Pll

SOLVENTAPPLICATIONS

TABLE

ELECTRONIC

Conformal Coating Removal

Cable Assembly Repair

Electrical Connector Repair

Depotting

Deflashing

Decapsulation

Removal of RTV's from CRT Tubes

De-inking

Surface Preparation

Photo Resist Stripping

INDUSTRIAL

Cleaning Residues from Mixing &Metering EquipmentCleaning Residues from Nozzles,Spray Guns, etc.Cleaning Residues from Injection &RIM MoldsFlushing of Feed Lines, Mixing Heads,Molds, & PumpsRemoval of Mold Releases andParting AgentsRemoval of Buffer Coatings fromOptical FibersRemoval of Adhesives & Inks fromLaminating & Engraved RollersPolysulfide Removal from AircraftFuel TanksGeneral Adhesive & Polymer RemovalGeneral Cleaning & DegreasingPaint Stripping

HOW TO USE THE SOLVENTSELECTION GUIDES1• Locate your application & its appropriate

code in the Solvent Applications Table, (eg -Conformal Coating Removal - E1)

2« Refer to the appropriate Selection Guide(Industrial or Electronic).

3» Locate the column containing the MaterialType you want to remove, (eg - Acrylics,Epoxies, Urethanes, etc.)

4« Follow that column down to whicheverbox(es) contain your applications code.Follow this row(s) to the far left column to findthe recommended solvent(s).

MATERIAL TYPE

SOLVENT SELECTION GUIDE

METHANOL BASE

URESOLVE BLUE

DYNASOLVE190

URESOLVE 411

EI.E2,E3,E4

El, E2,E3,E4

E1.E2,E3.E4

E1.B4

E1.B4

El

El

El

PROPYLENE GLYCOL ETHER BASE j

DYNASOLVE 700

DYNASOLVE710

DYNASOLVE 711

DYNASOLVE 750

E4, E6,E8

E4, E6,E8

E4, E6,E8

E4,E6

E4, E6,E8,E9

E4, E6,E8,E9

E4, E6,E8,E9

E4,E6

E4,E6

E4,E6

E9.E10

ETHYLENE GLYCOL ETHER BASE

URESOLVE HF

URESOLVE PLUS

URESOLVE PLUS SG

URESOLVE PLUS 500

DYNASOLVE 611

E4, E6,E8

E4, E6,E8

E4, E6,E8

E4,E6

E4, E6,E8,E9

E4, E6,E8,E9

E4, E6,E8,E9

E4,E6

E4,E6

E4.E6

E9,E10

E9,E10

METHYLENE CHLORIDE BASE

DYNASOLVE 165

DYNASOLVE 210

E1.E4,E5,E6

E1,E4,E6, E7

El

El

N-METHYL PYRROLIDONE BASE

NMP

DYNASOLVE 180

DYNASOLVE 185

DYNASOLVE 185-SG

E4, E5,E6, E8

E4, E5,E6, E8

E4, E5,E6, E8

E4, E5,E6, E8

E9,E10

E9.E10

E9,ElO

E9.E10

HYDROCARBON BASE

DYNASOLVE 220

DYNASOLVE 225

DYNASOLVE 230

E1.E4,E6,E7

E1.E4,E6,E7

E1.E4,E6,E7

El

El

El

SPECIAL SOLVENTS

DECAP

DYNASOLVE 100

DYNASOLVE 150

DYNASOLVE 699

E4,E6

B1.E4

E4, E5,E6

E4, E6

El

E4,E6

El El

El

BEFORE AFTER

INDUSTRIALRemoval of acompression-molded siliconefrom an aluminumcore usingDynasolve 210.

Removal of acured urethanefrom a dispensingequipment mixerusing DynasolveMP-AL Grade.

Removal of anepoxy powdercoating from amotor armatureusing DynasolveMP-750.

ELECTRONIC

Removal of asilicone conformalcoating from a PCboard usingDynasolve 225.

Decapsulation ofepoxy-moldedceramic capa-citors usingDynasolve 180.

Removal ofresidual photo-resist from aceramic substrateusing UresolvePlus SG.

SOLVENT DESCRIPTIONSDynasolve 100 Dimethylformamide-based. Not selective.

Dynasolve 150

Dynasolve 165

Dynasolve 180

Dynasolve 185

Dynasolve 1 85 SG

Dynasolve 190

Dynasolve 200

Dynasolve 210

Flammable. Tetrahydrofuran-based. Room temperature use only.

Corrosive. Room temperature use only. Very powerful but not selective.

Use hot (105-175°C). Not selective.

Modified version of Dynasolve 1 80. Use hot (1 05°C).

Electronic grade.

Flammable. Room temperature use only. Stronger than Uresolve Blue but less selective.

Effective at room temperature. Selective.

Corrosive. Room temperature use only. Fastest solvent for silicone removal.

Individual data sheets and material safetydata sheets (MSDS's) for all of the Dynaloysolvents listed in this guide are availableupon request.

All ingredients used in Dynaloy products arelisted in the TSCA Chemical SubstancesInventory (Public Law 94-469).

Dynaloy, Inc. takes every precaution in the manufacture ofits products. The information in this sheet is based upon ourown research and is considered accurate. However, no war-ranty is expressed or implied regarding accuracy and resultsto be obtained, since operating conditions in your plant arebeyond our control. Review material safety data sheets(MSDS's) before use.

Dynasolve 220 Corrosive. Alternative to methylene chloride-based Dynasolve 210. Most selective.

Dynasolve 225 Flammable and corrosive. Room temperature use only. Stronger than Dynasolve 220, but has lower flash point and is less selective.

Dynasolve 230 Flammable and corrosive. Room temperature use only. Stronger than Dynasolve 225, but has lower flash point and is less selective.

Dynasolve 699 Butyrolactone-based. Use at room temperature for thin acrylic coatings. Use hot (120-150°C) for acrylic adhesives and epoxy powder coatings.

Dynasolve 700 Flammable. Room temperature use only. Similar in strength to Uresolve HF.

Dynasolve 710 Stronger than Dynasolve 700, but less selective. Similar in strength to Uresolve Plus. Slow at room temperature. More effective at 65-110°C.

Dynasolve 711 Similar to Uresolve Plus SG. Can be used in contact with aluminum.

Dynasolve 750 Stronger than Dynasolve 710, but less selective. Similar in strength to Uresolve Plus 500. Slow at room temperature. More effective at 65-110°C.

Dynasolve M-10 Effective on silicone oils and parting agents at room temperature. For quicker removal, heat to 65°C.

Dynasolve M-30 Low toxicity. Non-flammable. Non-corrosive. Effective at room temperature for general cleaning of uncured polymers. For quicker removal,can be used hot (60-75°C).

Dynasolve MP-AL GR Slow at room temperature. More effective at 65-110°C. Can be used in contact with aluminum.

Dynasolve MP-500 Stronger than Dynasolve MP-AL GR, but less selective. Slow at room temperature. More effective at 65-110°C.

Dynasolve MP-710 Similar in strength to Dynasolve MP-AL GR. Slow at room temperature. More effective at 65-110°C.

Dynasolve MP-750 Stronger than Dynasolve MP-710, but less selective. Similar in strength to Dynasolve MP-500. Slow at room temperature.More effective at 65-110°C.

Dynasolve CU-5 Similar to Dynaflush, but more effective for cleaning urethane residues and crystallized isocyanates.

Dynasolve CU-6 Higher flash point version of CU-5. Non-gelling in the presence of fluid isocyanates.

Dynasolve CU-9 Very high flash point (129°C) solvent system designed to remove cured silicone release agents from molds and pans. Also removes RTV silicones.

Uresolve Blue Flammable. Room temperature use only. Most selective.

Uresolve 411 Flammable. Room temperature use only. Stronger than Dynasolve 190 but less selective.

Uresolve HF Stronger than Uresolve 411, but less selective. Can be heated (to 37°C) for faster action.

Uresolve Plus Stronger than Uresolve 411, but less selective. Slow at room temperature. More effective at 65-110°C.

Uresolve Plus SG Semiconductor grade. Can be used in contact with aluminum.

Uresolve Plus 500 Stronger than Uresolve Plus, but less selective. Slow at room temperature. More effective at 65-110°C.

Decap DMSO-based. Use hot (150°C). Not selective.

Dynaflush Non-flammable. Non-corrosive. Non-carcinogenic. Non-ozone depleting. Very effective for flushing and cleaning residues from urethane.processing equipment at room temperature. Can be used hot (95°C) for faster results.

NMP Electronic grade. Use hot (105-175°C). Not selective. Available filtered through 0.2 micron filter.

Uresolve Glycol-base. Use hot (175-205°C) for removing heavily encrusted urethanes.

Distributed By:

THE CHEMICAL SOLUTIONS

DYNALOY, INC.AVI PRECISION ENGINEERING PTE LTD1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810Email: avipre@pacific.net.sg Internet: http://www.avipre.com.sg

DYNALOY. INC.

CONFORMALCOATINGREMOVALT

hroughout the electronics industry, most elec-tronic devices are protected by a plastic or

resin. In many cases, ease of removal of theseplastics will determine the best system to be used.

Dynaloy has 25 years of experience in the safeand efficient chemical removal of plastic com-pounds, coatings, and adhesives from electronicproducts for rework, repair, or failure analysis. Thisbulletin will address one aspect of this specialty,the chemical removal of conformal coatings.

Conformal coatings are thin layers of syntheticresins or plastics that are applied to electronicdevices for protection against avariety of environmental, mechani-cal, electrical and chemical problemssuch as:

humidity and moisturefungus and mildewdust and dirtalpha particlesstressmechanical shock and vibrationthermal cyclingcorrosionprocess solvents, fuels, andhydraulic fluids

While the majority of conformalcoatings are used on printed circuitboards (RGBs), they are also usedto protect discrete components, suchas transistors, diodes, rectifiers, re-sistors, and LED's; integrated circuits(ICs); and hybrid circuits, includingmulti-chip modules (MCM) and chip-on board (COB).

DYNALOY, INC.

Originally developed for military, aerospace,and marine applications, conformal coatings arenow finding widespread use in telecommunica-tions, industrial controls and instrumentation, con-sumer electronics, and the automotive industries,all applications in which product reliability is ofprimary importance.

Currently, there exists 6 major types of confor-mal coating chemistries: epoxies, acrylics, ure-thanes, silicones, parylenes, and UV-curedmaterials. The military specification for coatingprinted circuit assemblies, MIL-l-46058, recog-nizes 5 types of conformal coatings: Type AR(acrylics), Type ER (epoxies), Type SR (silicones),Type UR(urethanes), and Type XY(paraxylylenesor parylenes). UV-cured materials are also recog-nized, but are not listed as a separate group; theyare included within the above 5 categories. Whileeach of these coating types exhibits propertiesthat makes it the best choice for a particularapplication, special attention should be paid to thetechniques used for removal of the conformalcoating. These techniques include mechanical,thermal, and chemical methods.

Before and after removal of conformal coating from a partiallycoated circuit board.

AVI PRECISION ENGINEERING PTE LTD1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810Email: avipre@pacific.net.sg Internet: http://www.avipre.com.sg

Mechanical removal methods include cutting,abrading, sanding, or blasting the area of coatingto be removed. However, most of the conformalcoatings are very tough and abrasion-resistant,making the probability of damage to the boardhigh.

Thermal removal methods (including burn-through techniques) are somewhat more effectivethan mechanical methods, but in many casesrequire very high temperatures and/or long expo-sure times. These, in turn, can cause discoloration,leave residues, and adversely affect solders and/

or other materials used in the construction of theboard or its components. Also, temperature-sensitive components or devices may be damaged.

Chemical removal methods offer the highestprobability for complete coating removal withoutadversely affecting the board or its components.However, there is no one perfect solvent for allapplications, and in some cases no chemical sol-vent will be suitable.

The following sections discuss the removalmethods for each of the above mentioned confor-mal coating types.

Offering good dielectric properties, with excel-lent humidity, abrasion, and chemical resistance,polyurethane conformal coatings are the mostcost-effective and widely used coatings. Currentlyavailable for removal of polyurethane coatings areseveral solvents which provide a wide range ofspeed and selectivity that can be matched to aspecific application. These solvents include:Uresolve Blue, which is the slowest and mostselective; Dynasolve 190 and Uresolve 411, themost popular; Uresolve HF; and Uresolve Plus, thefastest and least selective.

Three of these solvents are recognized by U.S.military designations:

Uresolve 411

Uresolve HF

Uresolve Plus

NSN (National Supply Number)4935-LL-M01-1009Bureau of Naval WeaponsSpecification 2621905NSN 6850-01-311-1180

Complete removal of the coating is accomplishedby immersion of the board into the solvent at roomtemperature. The amount of time required forcoating removal will vary with the solvent beingused, the particular coating used, and coatingthickness. Typically, most polyurethane coatingsof .004" thickness can be removed in 1 to 3 hours.

The use of ultrasonics or any agitation of thesolvent will help to reduce the time required. Theboard should be removed from the solvent peri-odically; if it has a milky-white appearance, coatingremoval is not yet complete, and it should bereturned to the solvent. Occasionally, light brush-ing or wiping may be required to remove any lasttraces of coating. To be certain that no residueremains from either the coating or the solvent, it isextremely important that the board be thoroughlywashed in alcohol (isopropanol or methanol) im-mediately after coating removal is complete. Theboard may then be rinsed with Dl water and dried.Since all of the above-mentioned solvents containsmall amounts of ionic materials, it is advisable totest the rinse water for ionic contamination with aconductivity meter. Spot removal of polyurethaneconformal coatings may be accomplished byapplication of the solvents with a brush, cotton pad,or a Q-tip. All of the above solvents are alsoavailable in a gel (higher viscosity) form for spotremoval.

A P.C. Board Report, "Evaluation On MarineInstrumentation Printed Wire Assemblies" done byGould Ocean Systems (Lab Report No. L-78-344),is available and provides a detailed study andprocedure for the removal of Conap CE-1155using Dynasolve 190.

Silicone conformal coatings exhibit high hu-midity, corrosion, and thermal resistance, whichmake them the preferred choice for high tempera-ture applications. Over the past several years,Dynaloy has developed several solvents that havehad excellent success in removing silicone con-formal coatings. Of these, the fastest and mostpopular is Dynasolve 210, a methylene chloride-

based system. Dynasolve 220,225, and 230, allhydrocarbon-based, are alternatives to the meth-ylene chloride-based Dynasolve 210.

While not quite as fast as the 210, Dynasolve220,225, and 230 are more selective, and whennot contaminated by water, will not attack epoxy-glass PCB's, their components, metals, and mostplastics. As in the case of the polyurethanes, the

coated board is immersed in the solvent at roomtemperature and allowed to stand until the siliconehas dissolved or can be easily brushed off. Thetime required will vary with the solvent used, thetype of silicone coating, the coating thickness, andthe amount of surface area exposed. Typically,most coatings of .010" or less will be removed in 15minutes to 1 hour. Certain chemically-resistantsilicones may require extended immersion for sev-eral hours. The use of agitation or ultrasonics willreduce dissolving time. After coating removal iscomplete, it is very important that the board bethoroughly washed in alcohol (isopropanol ormethanol), then rinsed in Dl water and dried. Asaturated cloth or Q-tip may be used for spotremoval. Repeated applications, and the use of abrush may be necessary.

Acrylic conformal coatings have good humidityresistance, long pot life, and are relatively easy toapply. However, they have poor abrasion andchemical resistance. In the past, chemical removalof acrylic coatings was done with highly volatile orflammable solvents such as methylene chloride,trichloroethane, aromatics, or ketones. As many ofthese chemicals are no longer acceptable due to

Before (top) and after removal of CONAP CE-1181 from PCBusing DYNASOLVE 225 for 30 minutes.

physical hazards, toxicity, or environmental regu-lations, Dynaloy has developed a relatively safealternative, Dynasolve 699, for removal of acrylicconformal coatings. Most typical acrylic coatingswill be removed within one hour after soaking inDynasolve 699. After removal is complete, thePCB should be rinsed with alcohol or Dl water andthen dried.

Epoxy conformal coatings provide good hu-midity, chemical, and abrasive resistance. Com-pletecoating removal for repair is nearly impossibleby chemical means (except in the case of hermeti-cally sealed hybrids), as the solvent cannotdiscriminate between the epoxy coating, the

epoxy-glass printed circuit board, and any epoxy-coated or potted components. However, if donecarefully, spot removal of the coating may beaccomplished by the application of Dynasolve 165with a Q-tip.

Paraxylylene conformal coatings, or parylenes,are applied by a vacuum deposition process. Theyoffer excellent resistance to humidity, moisture,abrasion, high temperatures, and chemicals. How-ever, while they cannot be dissolved, they can be

removed. The coated board should be immersedin Dynasolve 150 for a period of 2 to 4 hours. Theparylene coating will then separate from the board.Rinse the board in alcohol and let dry; then physi-cally remove the coating with tweezers.

The passage of strict environmental laws dras-tically reducing volatile organic compound (VOC)emission levels created a widespread need for asolventless conformal coating. Consequently, theearly 1980's saw the development of ultravioletlight (UV) curable conformal coatings as a way toeliminate air pollution, significantly reduce pro-cessing time, and reduce energy costs as comparedto solvent-based, thermally cured coatings. Thesecoatings were successfully developed by creatingacrylated oligomers: epoxy acrylates, urethaneacrylates, polyester acrylates, or combinations ofseveral of them. Epoxy acrylates provide improvedchemical resistance. Acrylated urethanes exhibitflexibility and toughness. However, due to the"hybrid" chemical structure of these UV curedconformal coatings, chemical removal can be alittle more complicated. While two differentmanufacturer's coatings can be of the same type ofoligomer, ie. acrylated urethanes, two completely

different solvents may be required to remove them.In some cases, a combination of two solvents usedin succession may be required; in some cases,such as Loctite's Shadowcure 361, no solvent wasfound to be suitable. Table #2 provides a guide forproper solvent selection for removal of UV curedconformal coatings. Generally, the removal proce-dure is the same as that for other coating types: thePCB should be immersed in the appropriate sol-vent; when coating removal is complete, the boardshould be thoroughly washed in alcohol, rinsed inDl water, and dried. Removal times can vary any-where from 15 minutes to 24 hours, depending onthe coating, coating thickness, and the solventused. Agitation or the use of ultrasonics will speedup the procedure. Spot removal may be done byapplication of the solvent with a brush, cotton pad,or Q-tip; alternatively, some of the solvents may beavailable in a gel form.

When choosing a solvent for the removal of aparticular conformal coating, one should examinethe following criteria:

• does it quickly and completely remove thecoating?

• does it selectively remove the coatingwhile not damaging or adversely affectingthe substrate and/or other componentsor devices?

• is it safe to work with? and• is it environmentally acceptable?

Since regulations vary not only from state tostate, but also from company to company, theanswer to some of these questions can only bedetermined by the individual company. However,to aid in your selection of a solvent for any of thestandard (non-UV) type conformal coatings, wehave prepared a solvent selection guide for re-moval of conformal coatings (see Table #1). Anumber of coatings are listed in this guide; it isexpected that the recommended solvents willeffectively remove similar coatings from the sameor from different manufacturers."

Dynaloy would like to thank the following con-formal coating manufacturers for their assistancein the preparation of this bulletin:

Chemtronics, Inc.Conap, Inc.Dow Corning Corp.DuPont ElectronicsDymax Corp.GE SiliconesLoctite Corp.Novatran Corp.Para Tech Coating Co.W.R. Grace & Co.

Solvent Selection GuideFor Removal of Conformal Coatings

NOTE: • means solvent is recommended but time data is not available.

DYNALOY, INC.AVI PRECISION ENGINEERING PTE LTD1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810Email: avipre@pacific.net.sg Internet: http://www.avipre.com.sg

EPOXYAll Types

ACRYLICConapCE-1170ConapCE-1171Furane Acrylane 5730HumiseaMB31HumiseaMB31-66Humiseal1B31-FRHumiseal 1 B73Hysol PC20MHysol PC20-35M

POLYURETHANEConap CE-1155Conap CE-1155-35Conap CE-1164Conap CE-1165Conap CE-1166Conap CE-1175Furane 5750-A/B(LV)Furane 5751 -A/BHumiseal 1A20Humiseal 1A33Humiseal 1A34Humiseal 2A64Hysol PC18MHysol PC29MProducts Research PR1568

SILICONEChemtronics KonformConap CE-1181Dow Corning 31 40 RTVDow Corning 31 45 RTVDow Corning 1-2577Dow Corning 1 -2577 UVIDow Corning Hipec 3-6550Dow Corning Hipec 648Dow Corning Hipec Q1-4939Dow Coming Q1-2620Dow Corning Q1 -2620 UVIDow Corning Q3-6614Dow Corning Q3-661 4 UVIDow Corning R4-31 17GE SR900GE ECC 440GE ECC 450McGhan Nusil R-1075SWS T-81W.R. Grace & Co.

AmiconSC-120-4W.R. Grace & Co.Amicon SC-3613

W.R. Grace & Co.Amicon SC-930

PARYLENENovatran Parylene CPara Tech Parylene C

.007"

.007"

.004"

.004"

.004"

.004"

.003"

.006"

.008"

.005",002".005"

.004"

.001"

.001"2-4 hrs.2-4 hrs.

For SpotRemovalOnly

2.5 hrs.2.5 hrs.2.5 hrs.

2 hrs.

15min.15 min.

••

15 min.•

15 min.15 min.15 min.

30 min.

•

•

•

30 min.30 min.

•

1.5 hrs.•

30 min.24 hrs.15 min.

30 min.

•

•

•

15 min.30 min.

••

1 hour•

45 min.5 hrs.15 min.

30 min.

•

•

•

15 min.30 min.

•*1 hour*15 min.

3 hrs.15 min.

30 min.

•

•

•

1 hour1 hour

1.5 hrs.1.5 hrs.1.75 hrs.

1 hour

CONFORMALCOATINGTYPE

THICKNESS

RECOMMENDED SOLVENTS AND APPROXIMATE TIME FOR REMOVAL

The C h e m i c a l S o l u t i o n

Electrically Conductive AdhesivesDynaloy's conductive adhesives are all two component epoxy-based systems that, when combined, producea manageable product ideal for many applications. All of Dynaloy's adhesives are silver filled or silver coatedbecause silver is a highly conductive metal imparting excellent corrosion resistance. These adhesives arerecommended for connecting heat sensitive components to printed circuit boards and connecting groundwires to components.

Dynaloy adhesives are excellent replacements for metallic solder where lead usage is prohibited ortemperature constraints are present. These products are also recommended for shielding, bonding waveguide plumbing in hybrid circuit assembly, and as a plating base. These adhesives are used extensively in therepair of printed circuits.

Electrically Conductive Coatings

Recent advancements in the plastics industry include several types of engineering plastics that have replacedcertain metals in the manufacture of enclosures, cabinets and housings. These materials along with structuralfoam are all transparent to radio frequency and need to be treated to make them conductive. Uncontrolledinterference can cause memory erasure, navigational errors in marine and aircraft equipment, jammed radioreception and failures in medical equipment. There is a greater need now for conductive paints and coatingsfor EMI/RFI shielding than in the past, and use should increase in the future.

Most of Dynaloy's coatings are silver-filled. Silver is a highly conductive metal with excellent corrosionresistance. While the cost is high, EMI/RFI shielding attenuation is outstanding. Silver coatings are specifiedfor military applications where electromagnetic protection and radio frequency interference protection isrequired.

Realizing the need for lower cost shielding products, Dynaloy is now developing conductive coatings basedon copper and nickel. Dynaloy is researching ways to overcome copper's tendency to oxidize in coatings,which limits its effectiveness as a reliable conductor. Nickel, although not quite as good a conductor ascopper or silver, absorbs more electromagnetic interference because of its magnetic permeability. Nickelconductive paints would offer the most economic shielding for the majority of plastics.

Dynaloy's conductive coatings can be used for electroplating base, component grounding, printed circuitrepair, capacitor coating and lead termination. The most popular use for these coatings is in EMI/RFI shielding.

Electrically Conductive LubricantsDynaloy has developed high quality, silver alloy filled electrically conductive lubricants for a wide variety ofapplications, including lubricating hinge joint switches and air blast breakers. Dynalubes will eliminate hotspots and help prevent overheating of knife blade switches. In addition, they can be used for makingnon-permanent electrical connections and as a caulking compound for shielding. Dynalubes can be applied inthe same manner as a conventional lubricant.

Dynaloy 325

Dynaloy 336

Dynaloy 536

Dynaloy 1931

Dynaloy 340

Dynaloy 342

Dynaloy 350

Dynaloy 352

Dynaloy 370

Dynaloy 372

Dynaloy 375-1

Dynaloy 377-1

Dynaloy 479

Dynaloy 482

Dynaloy 489

Dynaloy 499

Dynaloy 810

Dynaloy 850

Dynaloy 852

Dynaloy 495

Dynaloy 495-1

Electrically Conductive Adhesives

thermal conductivity of pure silver. Easy 1:1 mixing ratio. Up to two-hour pot life after mixing.This product is approved by NASA, and hasbeen used on Apollo moon missions.

Low-cost two component silver filled epoxy that has strong adhesive properties together with excellent electrical conductivity. Dynaloy336 contains neither copper nor carbon extended conductive epoxies, which can cause drift, migration or galvanic attack when in contactwith electrolytes. Easy 1:1 mixing ratio.

Low-cost two component silver coated copper filled epoxy with excellent adhesive properties and good conductivity. The passivatedcopper is not reactive in the organic vehicle and thereby exhibits good storage stability. It is highly stable in the applied film ensuringthat the good conductivity of the coating is maintained during service.

This product meets the requirements for Federal Specification MMM-A-1931 Type 1 and Type II.

Electrically Conductive Coatings

A pure silver filled electrically conductive acrylic paint. Dynaloy 340 sets by solvent evaporation.

Same as Dynaloy 340, but with a safer solvent system.

Solderable, conductive polymer alloy coating. May be soldered to with tin/lead solders containing 1-2% silver. Provides excellentadhesion, conductivity and heat resistance.

Same as Dynaloy 350, but with a safer solvent system.

A pure silver filled electrically conductive urethane paint, which produces an extremely flexible coating. Dynaloy 370 meets Naval SeaCommand Drawing 5335279.

Same as Dynaloy 370, but with a safer solvent system.

A silver based product formulated using a unique system of polymer alloys. This coating will crosslink at 200° C forming a tough, marresistant film exhibiting excellent adhesion.

Same as Dynaloy 375-1, but with a safer solvent system.

Solderable low-cost conductive silver alloy polymer coating. Dynaloy 479 achieves optimum results when the coating is baked.A lower cost silver alloy is used in place of pure silver.

Same as Dynaloy 479, but with a safer solvent.

An air drying, low-cost silver filled electrically conductive epoxy coating. A lower cost silver alloy is used in place of pure silver.

Same as Dynaloy 489, but with a safer solvent.

Aqueous-based, nickel filled, air drying conductive coating formulated primarily for use in RFI shielding applications and other useswhere a low cost finish with good electrical conductivity is required.

Solvent-based, nickel filled, air drying conductive coating under development. Similar to Dynaloy 852, but formulated with a differentsolvent system.

Solvent-based, nickel filled, air drying conductive coating. When baked at 125° C, the polymer alloy system produces a tough film withgood heat resistance. Similar to Dynaloy 352, but nickel-based.

Electrically Conductive LubricantsA silver alloy silicone lubricant. Non-volatile, non-drying, no mixing required. Stable from -65°C to 225°C.

Similar to 495, but made with a solvent base, creating a thinner version.

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