15
RF Power Field Effect Transistor N - Channel Enhancement - Mode Lateral MOSFET Designed for broadband commercial and industrial applications with fre- quencies up to 1000 MHz. The high gain and broadband performance of this device makes it ideal for large - signal, common - source amplifier applications in 28 volt base station equipment. Typical Single - Carrier N - CDMA Performance @ 880 MHz, V DD = 28 Volts, I DQ = 350 mA, P out = 10 Watts Avg., IS-95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. PAR = 9.8 dB @ 0.01% Probability on CCDF. Power Gain 22.1 dB Drain Efficiency 32% ACPR @ 750 kHz Offset - 46 dBc in 30 kHz Channel Bandwidth Capable of Handling 5:1 VSWR, @ 32 Vdc, 880 MHz, 3 dB Overdrive, Designed for Enhanced Ruggedness GSM EDGE Application Typical GSM EDGE Performance: V DD = 28 Volts, I DQ = 350 mA, P out = 16 Watts Avg., Full Frequency Band (920-960 MHz) Power Gain 20 dB Drain Efficiency 46% Spectral Regrowth @ 400 kHz Offset = - 62 dBc Spectral Regrowth @ 600 kHz Offset = - 78 dBc EVM 1.5% rms GSM Application Typical GSM Performance: V DD = 28 Volts, I DQ = 350 mA, P out = 45 Watts, Full Frequency Band (920 - 960 MHz) Power Gain 20 dB Drain Efficiency 68% Features Characterized with Series Equivalent Large - Signal Impedance Parameters Integrated ESD Protection 225°C Capable Plastic Package RoHS Compliant In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel. Table 1. Maximum Ratings Rating Symbol Value Unit Drain-Source Voltage V DSS - 0.5, +66 Vdc Gate-Source Voltage V GS - 0.5, + 12 Vdc Maximum Operation Voltage V DD 32, +0 Vdc Storage Temperature Range T stg - 65 to +150 °C Case Operating Temperature T C 150 °C Operating Junction Temperature (1,2) T J 225 °C Table 2. Thermal Characteristics Characteristic Symbol Value (2,3) Unit Thermal Resistance, Junction to Case Case Temperature 81°C, 45 W CW Case Temperature 79°C, 10 W CW R θJC 1.0 1.1 °C/W 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at http://www.freescale.com/rf . Select Tools (Software & Tools)/Calculators to access MTTF calculators by product. 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf . Select Documentation/Application Notes - AN1955. Document Number: MRFE6S9045N Rev. 0, 10/2007 Freescale Semiconductor Technical Data 880 MHz, 10 W AVG., 28 V SINGLE N - CDMA LATERAL N-CHANNEL BROADBAND RF POWER MOSFET CASE 1265 - 09, STYLE 1 TO-270-2 PLASTIC MRFE6S9045NR1 © Freescale Semiconductor, Inc., 2007. All rights reserved.

Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

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Page 1: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

1RF Device DataFreescale Semiconductor

RF Power Field Effect TransistorN-Channel Enhancement-Mode Lateral MOSFET

Designed for broadband commercial and industrial applications with fre-quencies up to 1000 MHz. The high gain and broadband performance of thisdevice makes it ideal for large-signal, common-source amplifier applicationsin 28 volt base station equipment.

• Typical Single-Carrier N-CDMA Performance @ 880 MHz, VDD = 28 Volts,IDQ = 350 mA, Pout = 10 Watts Avg., IS-95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. PAR = 9.8 dB @ 0.01% Probability on CCDF.

Power Gain � 22.1 dBDrain Efficiency � 32% ACPR @ 750 kHz Offset � -46 dBc in 30 kHz Channel Bandwidth

• Capable of Handling 5:1 VSWR, @ 32 Vdc, 880 MHz, 3 dB Overdrive,Designed for Enhanced Ruggedness

GSM EDGE Application• Typical GSM EDGE Performance: VDD = 28 Volts, IDQ = 350 mA,

Pout = 16 Watts Avg., Full Frequency Band (920-960 MHz)Power Gain � 20 dBDrain Efficiency � 46%Spectral Regrowth @ 400 kHz Offset = -62 dBcSpectral Regrowth @ 600 kHz Offset = -78 dBcEVM � 1.5% rms

GSM Application

• Typical GSM Performance: VDD = 28 Volts, IDQ = 350 mA, Pout = 45 Watts,Full Frequency Band (920-960 MHz)

Power Gain � 20 dBDrain Efficiency � 68%

Features• Characterized with Series Equivalent Large-Signal Impedance Parameters• Integrated ESD Protection• 225°C Capable Plastic Package• RoHS Compliant• In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel.

Table 1. Maximum Ratings

Rating Symbol Value Unit

Drain-Source Voltage VDSS - 0.5, +66 Vdc

Gate-Source Voltage VGS - 0.5, +12 Vdc

Maximum Operation Voltage VDD 32, +0 Vdc

Storage Temperature Range Tstg - 65 to +150 °C

Case Operating Temperature TC 150 °C

Operating Junction Temperature (1,2) TJ 225 °C

Table 2. Thermal Characteristics

Characteristic Symbol Value (2,3) Unit

Thermal Resistance, Junction to CaseCase Temperature 81°C, 45 W CWCase Temperature 79°C, 10 W CW

RθJC1.01.1

°C/W

1. Continuous use at maximum temperature will affect MTTF.2. MTTF calculator available at http://www.freescale.com/rf. Select Tools (Software & Tools)/Calculators to access MTTF calculators

by product.3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.

Select Documentation/Application Notes - AN1955.

Document Number: MRFE6S9045NRev. 0, 10/2007

Freescale SemiconductorTechnical Data

880 MHz, 10 W AVG., 28 VSINGLE N-CDMA

LATERAL N-CHANNELBROADBAND

RF POWER MOSFET

CASE 1265-09, STYLE 1TO-270-2PLASTIC

MRFE6S9045NR1

© Freescale Semiconductor, Inc., 2007. All rights reserved.

Page 2: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

2RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

Table 3. ESD Protection Characteristics

Test Methodology Class

Human Body Model (per JESD22-A114) 3A (Minimum)

Machine Model (per EIA/JESD22-A115) A (Minimum)

Charge Device Model (per JESD22-C101) IV (Minimum)

Table 4. Moisture Sensitivity Level

Test Methodology Rating Package Peak Temperature Unit

Per JESD 22-A113, IPC/JEDEC J-STD-020 3 260 °C

Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Off Characteristics

Zero Gate Voltage Drain Leakage Current(VDS = 66 Vdc, VGS = 0 Vdc)

IDSS � � 10 μAdc

Zero Gate Voltage Drain Leakage Current(VDS = 28 Vdc, VGS = 0 Vdc)

IDSS � � 1 μAdc

Gate-Source Leakage Current(VGS = 5 Vdc, VDS = 0 Vdc)

IGSS � � 10 μAdc

On Characteristics

Gate Threshold Voltage(VDS = 10 Vdc, ID = 200 μA)

VGS(th) 1 2 3 Vdc

Gate Quiescent Voltage(VDD = 28 Vdc, ID = 350 mAdc, Measured in Functional Test)

VGS(Q) 2.3 3.1 3.8 Vdc

Drain-Source On-Voltage(VGS = 10 Vdc, ID = 1.0 Adc)

VDS(on) 0.05 0.23 0.3 Vdc

Dynamic Characteristics

Reverse Transfer Capacitance(VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)

Crss � 1.02 � pF

Output Capacitance(VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)

Coss � 27 � pF

Input Capacitance(VDS = 28 Vdc, VGS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)

Ciss � 81 � pF

Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 350 mA, Pout = 10 W Avg., f = 880 MHz, Single-CarrierN-CDMA, 1.2288 MHz Channel Bandwidth Carrier. ACPR measured in 30 kHz Channel Bandwidth @ ±750 kHz Offset. PAR = 9.8 dB @ 0.01% Probability on CCDF

Power Gain Gps 21 22.1 25 dB

Drain Efficiency ηD 30.5 32 � %

Adjacent Channel Power Ratio ACPR � -46 -44 dBc

Input Return Loss IRL � -19 -9 dB

(continued)

Page 3: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

3RF Device DataFreescale Semiconductor

Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued)

Characteristic Symbol Min Typ Max Unit

Typical GSM EDGE Performances (In Freescale GSM EDGE Test Fixture Optimized for 920-960 MHz, 50 ohm system) VDD = 28 Vdc,IDQ = 350 mA, Pout = 16 W Avg., f = 920-960 MHz, GSM EDGE Signal

Power Gain Gps � 20 � dB

Drain Efficiency ηD � 46 � %

Error Vector Magnitude EVM � 1.5 � %

Spectral Regrowth at 400 kHz Offset SR1 � -62 � dBc

Spectral Regrowth at 600 kHz Offset SR2 � -78 � dBc

Typical CW Performances (In Freescale GSM Test Fixture Optimized for 920-960 MHz, 50 ohm system) VDD = 28 Vdc, IDQ = 350 mA,Pout = 45 W, f = 920-960 MHz

Power Gain Gps � 20 � dB

Drain Efficiency ηD � 68 � %

Input Return Loss IRL � -12 � dB

Pout @ 1 dB Compression Point(f = 940 MHz)

P1dB � 52 � W

Typical Performances (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 350 mA, 865-900 MHz Bandwidth

Video Bandwidth @ 48 W PEP Pout where IM3 = -30 dBc(Tone Spacing from 100 kHz to VBW)ΔIMD3 = IMD3 @ VBW frequency - IMD3 @ 100 kHz <1 dBc (bothsidebands)

VBW� 10 �

MHz

Gain Flatness in 35 MHz Bandwidth @ Pout = 10 W Avg. GF � 0.72 � dB

Gain Variation over Temperature(-30°C to +85°C)

ΔG � 0.011 � dB/°C

Output Power Variation over Temperature(-30°C to +85°C)

ΔP1dB � 0.006 � dBm/°C

Page 4: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

4RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

Figure 1. MRFE6S9045NR1 Test Circuit Schematic

Z10 0.360″ x 0.270″ MicrostripZ11 0.063″ x 0.270″ MicrostripZ12 0.360″ x 0.065″ MicrostripZ13 0.095″ x 0.065″ MicrostripZ14 0.800″ x 0.065″ MicrostripZ15 0.260″ x 0.065″ MicrostripZ16 0.325″ x 0.065″ MicrostripPCB Taconic RF-35 0.030″, εr = 3.5

Z1 0.215″ x 0.065″ MicrostripZ2 0.221″ x 0.065″ MicrostripZ3 0.500″ x 0.100″ MicrostripZ4 0.460″ x 0.270″ MicrostripZ5 0.040″ x 0.270″ MicrostripZ6 0.280″ x 0.270″ x 0.530″ TaperZ7 0.087″ x 0.525″ MicrostripZ8 0.435″ x 0.525″ MicrostripZ9 0.057″ x 0.525″ Microstrip

R2

VBIAS

VSUPPLY

RF

OUTPUTRF

INPUT

DUTC3

L1

Z1

C2

Z2 Z3

C1

Z4 Z5 Z6 Z7

C4

Z8

C6

Z9

Z10

C14

C12

B1

R3

R1L2

B2

C7

C5

C9

C8

C10 C16 C17 C18

C15

Z11 Z12 Z13 Z15

C11

Z16

+

+ + +

C13

Z14

Table 6. MRFE6S9045NR1 Test Circuit Component Designations and ValuesPart Description Part Number Manufacturer

B1 Ferrite Bead 2743019447 Fair Rite

B2 Ferrite Bead 2743021447 Fair Rite

C1, C7, C10, C14 47 pF Chip Capacitors ATC100B470JT500XT ATC

C2, C4, C12 0.8-8.0 pF Variable Capacitors, Gigatrim 27291SL Johanson

C3 15 pF Chip Capacitor ATC100B150JT500XT ATC

C5, C6 12 pF Chip Capacitors ATC100B120JT500XT ATC

C8, C9 13 pF Chip Capacitors ATC100B130JT500XT ATC

C11 7.5 pF Chip Capacitor ATC100B7R5JT500XT ATC

C13 0.6-4.5 pF Variable Capacitor, Gigatrim 27271SL Johanson

C15, C16, C17 10 μF, 35 V Tantalum Capacitors T491D106K035AT Kemet

C18 220 μF, 50 V Electrolytic Capacitor EMVY500ADA221MJA0G Nippon Chemi-con

L1, L2 12.5 nH Inductors A04T-5 Coilcraft

R1 1 kΩ, 1/4 W Chip Resistor CRCW12061001FKEA Vishay

R2 560 kΩ, 1/4 W Chip Resistor CRCW120656001FKEA Vishay

R3 12 Ω, 1/4 W Chip Resistor CRCW120612R0FKEA Vishay

Page 5: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

5RF Device DataFreescale Semiconductor

Figure 2. MRFE6S9045NR1 Test Circuit Component Layout

C15

TO−270/272

Surface /

Bolt down

R2

R1B1

R3

C7

L1

C1 C2

C3

C4

C6

C5

C8

L2

C10

C9C11

C12

C13

C14

B2

C18

C16 C17VGG

VDD

CU

T O

UT

AR

EA

Page 6: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

6RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

TYPICAL CHARACTERISTICS

960

15

23

800

−70

50

IRL

Gps

ALT1

ACPR

22 40

21 30

19 −30

18 −40

17 −50

16 −60

940920900880860840820

Gps

, PO

WE

R G

AIN

(dB

)

IRL,

IN

PU

T R

ET

UR

N L

OS

S (

dB)

AC

PR

(dB

c), A

LT1

(dB

c)

−15

−10η D

, D

RA

IN

EF

FIC

IEN

CY

(%

)

0

−5

ηD

960

16

23

800

−70

34

IRL

Gps

ALT1

ACPR

22 32

21 30

20 −30

19 −40

18 −50

17 −60

940920900880860840820

Gps

, PO

WE

R G

AIN

(dB

)

IRL,

IN

PU

T R

ET

UR

N L

OS

S (

dB)

AC

PR

(dB

c), A

LT1

(dB

c)

−20

−15

f, FREQUENCY (MHz)

Figure 3. Single-Carrier N-CDMA Broadband Performance @ Pout = 10 Watts Avg.

η D,

DR

AIN

EF

FIC

IEN

CY

(%

)

−10

0

−5

f, FREQUENCY (MHz)

Figure 4. Single-Carrier N-CDMA Broadband Performance @ Pout = 20 Watts Avg.

Figure 5. Two-Tone Power Gain versusOutput Power

200

17

24

IDQ = 525 mA

Pout, OUTPUT POWER (WATTS) PEP

22

20

10

Gps

, PO

WE

R G

AIN

(dB

)

23

21

350 mA

1

VDD = 28 Vdc, f1 = 880 MHz, f2 = 880.1 MHz

Two−Tone Measurements

175 mA

Figure 6. Third Order Intermodulation Distortionversus Output Power

−30

−10

1

Pout, OUTPUT POWER (WATTS) PEP

10

−20

200

−60

−40

INT

ER

MO

DU

LAT

ION

DIS

TO

RT

ION

(dB

c)

IMD

, T

HIR

D O

RD

ER

−50

VDD = 28 Vdc, f1 = 880 MHz, f2 = 880.1 MHz

Two−Tone Measurements

20 −20

ηD

VDD = 28 Vdc, Pout = 20 W (Avg.)IDQ = 350 mA, N−CDMA IS−95 PilotSync, Paging, Traffic Codes 8Through 13

262.5 mA

437.5 mA

19

18

100

IDQ = 175 mA

350 mA

525 mA

262.5 mA

437.5 mA

100

VDD = 28 VdcPout = 10 W (Avg.) IDQ = 350 mAN−CDMA IS−95 Pilot Sync, PagingTraffic Codes 8 Through 13

Page 7: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

7RF Device DataFreescale Semiconductor

TYPICAL CHARACTERISTICS

Figure 7. Intermodulation Distortion Productsversus Output Power

10

−80

−10

7th Order

Pout, OUTPUT POWER (WATTS) PEP

5th Order

3rd Order

−20

−30

−40

1 200

IMD

, IN

TE

RM

OD

ULA

TIO

N D

IST

OR

TIO

N (

dBc)

−50

−60

VDD = 28 Vdc, IDQ = 350 mA, f1 = 880 MHz

f2 = 880.1 MHz, Two−Tone Measurements

Figure 8. Intermodulation Distortion Productsversus Tone Spacing

10

0

IM7−L

TWO−TONE SPACING (MHz)

−10

−20

−30

−40

−50

−60

1 100

IMD

, IN

TE

RM

OD

ULA

TIO

N D

IST

OR

TIO

N (

dBc) VDD = 28 Vdc, Pout = 48 W (PEP), IDQ = 350 mA

Two−Tone Measurements

(f1 + f2)/2 = Center Frequency of 880 MHz

Figure 9. Pulsed CW Output Power versusInput Power

33

56

P6dB = 49.21 dBm (83.36 W)

Pin, INPUT POWER (dBm)

VDD = 28 Vdc, IDQ = 350 mA, Pulsed CW

12 μsec(on), 1% Duty Cycle, f = 880 MHz

54

52

50

46

24 2625 2827 3129

Actual

Ideal55

51

53

49

30 32

Pou

t, O

UT

PU

T P

OW

ER

(dB

m)

48

47

Figure 10. Single-Carrier N-CDMA ACPR, ALT1, PowerGain and Drain Efficiency versus Output Power

0 −75

Pout, OUTPUT POWER (WATTS) AVG.

70 −5

50 −25

40

−4530

−55

10

1 10

−65

20

ALT1

ηD

Gps TC = −30�C

ACPR

η D, D

RA

IN E

FF

ICIE

NC

Y (

%),

Gps

, PO

WE

R G

AIN

(dB

)

VDD = 28 Vdc, IDQ = 350 mA

f = 880 MHz, N−CDMA IS−95 Pilot

Sync, Paging, Traffic Codes 8

Through 13

ALT

1, C

HA

NN

EL

PO

WE

R (

dBc)

AC

PR

, A

DJA

CE

NT

CH

AN

NE

L P

OW

ER

RA

TIO

(dB

c)

25�C

100

−70

100

IM5−L

IM5−U

IM3−UIM3−L

−70

IM7−U

34

P3dB = 48.40 dBm (69.18 W)

P1dB = 47.38 dBm

(54.7 W)

65

60

55

45

35

25

15

5

−20

−30

−35

−40

−50

−60

−70

−30�C

85�C

25�C

−15

−10

85�C

25�C

−30�C

−30�C85�C

25�C

85�C

Page 8: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

8RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

TYPICAL CHARACTERISTICS

This above graph displays calculated MTTF in hours when the device is

operated at VDD = 28 Vdc, Pout = 10 W Avg., and ηD = 32%.

MTTF calculator available at http:/www.freescale.com/rf. Select Tools

(Software & Tools)/Calculators to access MTTF calculators by product.

100

23

1

0

80

Pout, OUTPUT POWER (WATTS) CW

Figure 11. Power Gain and Drain Efficiencyversus CW Output Power

VDD = 28 Vdc

IDQ = 350 mA

f = 880 MHz

TC = −30�C

85�C

10

22

21

19

17

70

60

50

40

30

20

η D, D

RA

IN E

FF

ICIE

NC

Y (

%)Gps

ηD

Gps

, PO

WE

R G

AIN

(dB

)

Figure 12. Power Gain versus Output Power

Pout, OUTPUT POWER (WATTS) CW

VDD = 24 V

Gps

, PO

WE

R G

AIN

(dB

)

1000 8020

23

21

20

19

40 60

22

IDQ = 350 mA

f = 880 MHz

20

18

16

15

10

−30�C

18

28 V32 V

85�C

25�C

250

108

90

TJ, JUNCTION TEMPERATURE (°C)

Figure 13. MTTF versus Junction Temperature

106

107

105

110 130 150 170 190

MT

TF

(H

OU

RS

)

210 230

25�C

Page 9: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

9RF Device DataFreescale Semiconductor

N-CDMA TEST SIGNAL

10

0.0001

100

0

PEAK−TO−AVERAGE (dB)

Figure 14. Single-Carrier CCDF N-CDMA

10

1

0.1

0.01

0.001

2 4 6 8

IS−95 CDMA (Pilot, Sync, Paging, Traffic Codes 8

Through 13) 1.2288 MHz Channel Bandwidth

Carriers. ACPR Measured in 30 kHz Bandwidth @

±750 kHz Offset. ALT1 Measured in 30 kHz

Bandwidth @ ±1.98 MHz Offset. PAR = 9.8 dB @

0.01% Probability on CCDF.

PR

OB

AB

ILIT

Y (

%)

.................

... ....... ......... ...... .................................

.

.......

...

......... ..... .............. ..... ... ... ..... . .... ..... .. ...

.

............ ..........................................

............... ........... ....... .........................

....... .... ......... ........... ... ... ... .......................

....................... .... .. .................... ..... .... ................... . ... ..... .... .... .. ....... ......... .. ... ... .. . ....... ... .......... .... .. ..

... .................. .. ... .

.............. .... ................................................................................. ... .... .....

... .............. ... ... ... ...................... .. ..... ........................ ....... .............. .

.............................. ...........................................................

.... ....... ............................ ....... ......................... ......... ................... .... .........

.....

......

....

..

..

..

....

....

..... ... ... .............. ...... ... ... .... .. ... .......... .. .... ... ................ ...... .....

.........................

..

..............

.

............

.

. ................. ..... . ...

........

...................................................

...

−60

−110

−10

(dB

)

−20

−30

−40

−50

−70

−80

−90

−100

+ACPR in 30 kHzIntegrated BW

1.2288 MHzChannel BW

2.90.7 2.21.50−0.7−1.5−2.2−2.9−3.6 3.6

f, FREQUENCY (MHz)

Figure 15. Single-Carrier N-CDMA Spectrum

−ACPR in 30 kHzIntegrated BW

−ALT1 in 30 kHzIntegrated BW

+ALT1 in 30 kHzIntegrated BW

Page 10: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

10RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

Figure 16. Series Equivalent Source and Load Impedance

fMHz

ZsourceΩ

ZloadΩ

850

865

880

3.05 + j1.27

3.31 + j1.33

3.16 + j1.33

0.42 + j0.30

0.42 + j0.44

0.45 + j0.60

VDD = 28 Vdc, IDQ = 350 mA, Pout = 10 W Avg.

895

910 3.35 + j1.05

3.43 + j1.200.48 + j0.74

0.50 + j0.85

Zsource = Test circuit impedance as measured from gate to ground.

Zload = Test circuit impedance as measured from drain to ground.

Zsource

Zload

Input

Matching

Network

Device

Under

Test

Output

Matching

Network

Zo = 5 Ω

Zsource

f = 850 MHz

f = 910 MHz

Zloadf = 910 MHz

f = 850 MHz

Page 11: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

MRFE6S9045NR1

11RF Device DataFreescale Semiconductor

PACKAGE DIMENSIONS

Page 12: Document Number: MRFE6S9045N Technical Data RF Power Field Effect Transistor · 2016-11-23 · RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed

12RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

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MRFE6S9045NR1

13RF Device DataFreescale Semiconductor

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14RF Device Data

Freescale Semiconductor

MRFE6S9045NR1

PRODUCT DOCUMENTATION

Refer to the following documents to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document.

Revision Date Description

0 Oct. 2007 • Initial Release of Data Sheet

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MRFE6S9045NR1

15RF Device DataFreescale Semiconductor

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Document Number: MRFE6S9045NRev. 0, 10/2007