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Development of Au-coated THGEM for Single Photon, Charged Particle, and Neutron Detection Yuguang Xie a *, Junguang Lv a , Aiwu Zhang a , Boxiang Yu a , Tao Hu a , Li Zhou a , Xiao Cai a , Jian Fang a , Zhigang Wang a , Xilei Sun a a) State Key Laboratory of Particle Detection and Electronics (Institute of High Energy Physics, CAS and University of Science and Technology of China) , Beijing 100049, China *e-mail: [email protected] 3 rd International Conference on Micro Pattern Gaseous Detectors THGEM Performance Introduction The THGEM has been studied and promoted continually since it was reported for the first time[1]. The study of THGEMs in China has been active in recent years[2,3]. We report the development of Au-coated THGEMs produced totally from homemade industrial PCB technology in China. This development aims at producing THGEMs with high performance for a wide range of structure parameters, and feasibility of mass production with a high rate of finished products. More than 100 THGEM samples have been produced and tested. The test results using X- rays,VUV&UV lights, cosmic ray muons, and alpha particles are presented and verify that these kinds of THGEM can be used for single photon, charged particle and neutron detection. THGEM Production [4] VUV&UV Cosmic ray muon and α test Conclusion and outlook Totally based on homemade industrial PCB technology in China, all in factory. Sensitive area: ≤ 500 × 1000 mm 2 Minimum total thickness: 150 μm Minimum hole diameter: 200 μm Rim size: 20 – 120 μm Substrates: FR-4, Ceramic, PTFE, Kapton Cost: ≤ 40% of that by CERN Feasibility of mass production High rate of finished products: >70% Custom material Solder resist ink Ink stripping Drilli ng “rim” etching Au coating Typical material Galvanic Sn Sn stripping Drilli ng “rim” etching Nickel Gold Plating Electroless Nickel/Immersion Gold Plating Typical technique Improved technique Fig. 1 THGEM production procedures. Fig. 2 THGEM samples made and tested. Characteristics Reference Gas Vthgem range / V Maximum gain Single layer Single layer Double layer Gener al Improv ed Gener al Improv ed Gener al Improve d Ne+CH4=95: 5 100 >150 5×10 4 1×10 5 2×10 5 3×10 5 Ar+ISO=97: 3 100 >150 2×10 4 3×10 4 7×10 4 1×10 5 Ar+CH4=95: 5 150 200 2×10 4 3×10 4 5×10 4 8×10 4 Ar+CO2=80: 20 120 200 5×10 3 2×10 4 2×10 4 5×10 4 Ar+CO2=70: 30 60 200 1×10 3 1×10 4 1×10 4 3×10 4 This work is supported by National Natural Science Foundation of China (11205173, 11205240). We acknowledge the support and cooperation of Huizhou King Brother circuit technology Co., LTD (KBC). Gain curves Test setup Gain stability Gain uniformity 3 2 2 -HV (~ -2.5kV) 0V Amp ORTEC 450/672 55 Fe Charge preAmp ORTEC 142AH MCA Eind 2 kV/cm Etrans1 kV/cm Edrift 1 kV/cm High energy range Online tracking THGEM-TPC Low energy range Offline positioning THGEM+ICCD Energy resolution Fig. 3 VUV test and results (at BSRF). Typical technique Improved technique 200×200mm 2 10%(σ) 23.6%, single layer Ar+Iso=97:3 gain=2.4 × 10 3 . 1) φ38 mm, double layer, Ne+CH4 = 95:5 @ 1.25 × 10 4 . 2) 50 × 50 mm 2 , single layer, Ar+CH4 = 95:5 @ 5.66 × 10 3 . 3) 50 × 50 mm2, single layer, Ar+CO2 = 70:30 @ 3.34 × 10 3 . 4) 100 × 100 mm2, double layer, Ar+IsoB = 97:3 @4.2 × 10 3 . 5) 200 × 200 mm2, single layer, Ar+ISO = 97:3 @ 3.39 × 10 3 . 23.3%, double layer Ar+Iso=97:3 gain=1.12 × 10 4 . 34%, single layer Ar+CH4=95:5 gain=8.3 × 10 3 . 34%, single layer Ar+CO2=80:20 gain=3.4 × 10 3 . 5-day continues test(>100 hours) Works ongoing CsI-THGEM-based GPM B10-THGEM-based n beam monitoring ( Ref: Oral report by Jianrong Zhou, et.al., CSNS) THGEM for e beam monitoring [1] R. Chechik et al., NIM A 535 (2004) 303 [2] ZHANG Ai-Wu et al., CPC(HEP & NP), 2012, 36(2) [3] H.B. Liu et al., NIM A 659(2011) 237 [4] Elena Rocco, Development of a gaseous photon detector for Cherenkov imaging applications, Ph.D. Thesis, CERN-THESIS-2010-053, Feb. 16, 2010 Au-coated THGEMs with good performances were successfully developed by an improved industrial PCB technology in China. THGEMs with a wide range of structure parameters and large sensitive areas can be produced. Effective gain: 1.0×10 5 (single) and 3.0×10 5 (double) in Ne+CH 4 / 95:5. 1.0×10 4 (single) and 4.0×10 4 (double) in Ar-based gas mixtures. Good gain stability (no continuous degradation) and uniformity. Moderate energy resolution. Application potentials: photon, charged particle and neutron detection. New THGEMs of different substrates and new high efficiency production technology are also under development. We are now pushing the development of CsI-THGEM-based GPM, Boron10-THGEM-based neutron beam monitor system, THGEM-based DHCAL and TPC-THGEM-based electron beam tracking detector. VUV UV Gain for single photon Cosmic ray muon α ↑50 100V ↑2 10 times Fig. 4 UV test and results (DC mode). Fig. 5 Gain for single photon detection (triple THGEM ). CsI: 300 nm Much higher QE by CsI + Au-THGEM! Max electron transfer efficiency (ETE) at Ed=0! D2 lamp, 200~380nm, quartz window Ne+CH4 95:5 CsI photocathode: 500nm Ed contributes to gain; Max ETE required Ed = 0; High gain is necessary for single photon detection (such as gaseous photonmultiplier (GPM) ); It is shown that both high ETE and high gain(>1×10 5 ) can be obtain when Ed = 0 kV/cm. Plateau efficiency: 94.5%; Deposited charge: 22.4fC at a gain of 2200 in Ar+IsoB/97:3; For neutron detection Substrate: ceramic Total thickness: 150μm Rim: 60~100μm d: 0.2mm pitch:1.0m m Vthgem:800~1000V (α@Ar+CO2=70:30) High n/gamma separation 2’ GPM prototype Ceramic VS FR-4 Detection object 1. Electron 0.1 50MeV energy dispersion <1% 2. Work modes Quasi-particle A. CW 1-10 6 Hz 0.1-4MeV B. PL 100Hz 3-50MeV Requirements 3. High detection efficiency + online trigger 4. 100×100mm 2 sensitive area High E σ xz <0.2mm Low E σ xz <0.75mm 3. Online single /double particles separation 1 space<0.5mm 2 time <1ps 4. Counting rate :online 10 4 offline 10 6 Operation conditions 1. Pressure 10 -3 10 -5 Pa (vacuum) 2. Temperature -20±15℃ 3. Beam size 1) Small : 0.5mm 2) Big 100×100mm 2 For LAr, LXe scintillation lights detection THGEM-based digital hadron calorimeter (DHCAL) (Preliminary study: A.-W. Zhang et al., NIM A 722 (2013) 43–48) FWHM

Development of Au-coated THGEM for Single Photon, Charged Particle, and Neutron Detection

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3 rd International Conference on Micro Pattern Gaseous Detectors. Typical technique. Improved technique. Development of Au-coated THGEM for Single Photon, Charged Particle, and Neutron Detection Yuguang Xie a *, Junguang Lv a , Aiwu Zhang a , Boxiang Yu a , Tao Hu a , Li Zhou a , - PowerPoint PPT Presentation

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Page 1: Development of Au-coated THGEM for Single Photon, Charged Particle, and Neutron Detection

Development of Au-coated THGEM for Single Photon, Charged Particle, and Neutron Detection

Yuguang Xiea*, Junguang Lva, Aiwu Zhanga, Boxiang Yua, Tao Hua, Li Zhoua, Xiao Caia, Jian Fanga, Zhigang Wanga, Xilei Suna

a) State Key Laboratory of Particle Detection and Electronics (Institute of High Energy Physics, CAS and University of Science and Technology of China) , Beijing 100049, China

*e-mail: [email protected]

3rd International Conference on Micro Pattern Gaseous Detectors

THGEM Performance

IntroductionThe THGEM has been studied and promoted continually since it was reported for the first time[1]. The study of THGEMs in China has been active in recent years[2,3]. We report the development of Au-coated THGEMs produced totally from homemade industrial PCB technology in China. This development aims at producing THGEMs with high performance for a wide range of structure parameters, and feasibility of mass production with a high rate of finished products. More than 100 THGEM samples have been produced and tested. The test results using X-rays,VUV&UV lights, cosmic ray muons, and alpha particles are presented and verify that these kinds of THGEM can be used for single photon, charged particle and neutron detection.

THGEM Production [4] VUV&UV 、 Cosmic ray muon and α test

Conclusion and outlook

Totally based on homemade industrial PCB technology in China, all in factory. Sensitive area: ≤ 500 × 1000 mm2

Minimum total thickness: 150 μmMinimum hole diameter: 200 μmRim size: 20 – 120 μmSubstrates: FR-4, Ceramic, PTFE, KaptonCost: ≤ 40% of that by CERNFeasibility of mass production High rate of finished products: >70%

Custom material

Solder resist ink

Ink stripping

Drilling

“rim” etching

Au coating

Typical material

Galvanic Sn

Sn stripping

Drilling

“rim” etching

Nickel Gold PlatingElectroless Nickel/Immersion

Gold Plating

Typical technique Improved technique

√ Fig. 1 THGEM production procedures. Fig. 2 THGEM samples made and tested.

Characteristics

Reference

Gas Vthgem range / V Maximum gainSingle layer Single layer Double layer

General Improved General Improved General Improved

Ne+CH4=95:5 ~ 100 >150 5×104 1×105 2×105 3×105

Ar+ISO=97:3 ~ 100 >150 2×104 3×104 7×104 1×105

Ar+CH4=95:5 ~ 150 ~ 200 2×104 3×104 5×104 8×104

Ar+CO2=80:20 ~ 120 ~ 200 5×103 2×104 2×104 5×104

Ar+CO2=70:30 ~ 60 ~ 200 1×103 1×104 1×104 3×104

This work is supported by National Natural Science Foundation of China (11205173, 11205240). We acknowledge the support and cooperation of Huizhou King Brother circuit technology Co., LTD (KBC).

Gain curves

Test setup

Gain stability

Gain uniformity

32

2

-HV (~ -2.5kV)

0V

AmpORTEC 450/672

55Fe

Charge preAmpORTEC 142AH

MCA

Eind 2 kV/cm

Etrans1 kV/cm

Edrift 1 kV/cm

High energy rangeOnline tracking

THGEM-TPC

Low energy range Offline positioning

THGEM+ICCD

Energy resolution

Fig. 3 VUV test and results (at BSRF).

Typical technique

Improved technique

200×200mm2

< 10%(σ)

23.6%, single layer Ar+Iso=97:3gain=2.4 × 103.

1) φ38 mm, double layer, Ne+CH4 = 95:5 @ 1.25 × 104. 2) 50 × 50 mm2, single layer, Ar+CH4 = 95:5 @ 5.66 × 103. 3) 50 × 50 mm2, single layer, Ar+CO2 = 70:30 @ 3.34 × 103. 4) 100 × 100 mm2, double layer, Ar+IsoB = 97:3 @4.2 × 103. 5) 200 × 200 mm2, single layer, Ar+ISO = 97:3 @ 3.39 × 103.

23.3%, double layer Ar+Iso=97:3

gain=1.12 × 104.

34%, single layer Ar+CH4=95:5gain=8.3 × 103.

34%, single layer Ar+CO2=80:20gain=3.4 × 103.

5-day continues test(>100 hours)

Works ongoingCsI-THGEM-based GPM

B10-THGEM-based n beam monitoring( Ref: Oral report by Jianrong Zhou, et.al., CSNS)

THGEM for e beam monitoring

[1] R. Chechik et al., NIM A 535 (2004) 303[2] ZHANG Ai-Wu et al., CPC(HEP & NP), 2012, 36(2)[3] H.B. Liu et al., NIM A 659(2011) 237[4] Elena Rocco, Development of a gaseous photon detector for Cherenkov imaging applications, Ph.D. Thesis, CERN-THESIS-2010-053, Feb. 16, 2010

Au-coated THGEMs with good performances were successfully developed by an improved industrial PCB technology in China. THGEMs with a wide range of structure parameters and large sensitive areas can be produced. Effective gain: 1.0×105 (single) and 3.0×105 (double) in Ne+CH4 / 95:5. 1.0×104 (single) and 4.0×104 (double) in Ar-based gas mixtures. Good gain stability (no continuous degradation) and uniformity. Moderate energy resolution.Application potentials: photon, charged particle and neutron detection. New THGEMs of different substrates and new high efficiency production technology are also under development.We are now pushing the development of CsI-THGEM-based GPM, Boron10-THGEM-based neutron beam monitor system, THGEM-based DHCAL and TPC-THGEM-based electron beam tracking detector.

VUV UV Gain for single photon

Cosmic ray muon α

↑50~ 100V ↑2~ 10 times

Fig. 4 UV test and results (DC mode). Fig. 5 Gain for single photon detection (triple THGEM ).

CsI: 300 nmMuch higher QE by

CsI + Au-THGEM!

Max electron transfer efficiency(ETE) at Ed=0!

D2 lamp, 200~380nm, quartz windowNe+CH4 95:5

CsI photocathode: 500nm

Ed contributes to gain; Max ETE required Ed = 0;High gain is necessary for single photon detection (such as gaseous photonmultiplier (GPM) );It is shown that both high ETE and high gain(>1×105) can be obtain when Ed = 0 kV/cm.

Plateau efficiency: 94.5%;

Deposited charge: 22.4fC

at a gain of 2200 in Ar+IsoB/97:3;

For neutron detectionSubstrate: ceramic Total thickness:

150μm Rim: 60~100μm d:

0.2mm , pitch:1.0mm

Vthgem:800~1000V (α@Ar+CO2=70:30) High n/gamma

separation

2’ GPM prototype

Ceramic VS FR-4

壹 Detection object1. Electron : 0.1 ~ 50MeV , energy dispersion : <1% ;2. Work modes ( Quasi-particle )

A. CW : 1-106Hz ( 0.1-4MeVB. PL : 100Hz ( 3-50MeV

Requirements3. High detection efficiency + online trigger4. 100×100mm2 sensitive area

High E , σxz<0.2mm , Low E , σxz<0.75mm3. Online single /double particles separation 1 ) space<0.5mm 2 ) time <1ps4. Counting rate :online 104 , offline 106 。

Operation conditions1. Pressure : 10-3 ~ 10-5Pa (vacuum)2. Temperature : -20±15℃

3. Beam size1) Small : 0.5mm ;2) Big :

100×100mm2 。

For LAr, LXe scintillation lights detection

THGEM-based digital hadron calorimeter (DHCAL)(Preliminary study: A.-W. Zhang et al., NIM A 722 (2013) 43–48)

FWHM