Detector Development with Industry Jan Visschers Nationaal Instituut voor Kernfysica en Hoge-Energie Fysica NIKHEF Amsterdam, The Netherlands email: [email protected]

Detector DevelopmentDetector Developmentwith Industrywith Industry

Jan VisschersJan VisschersNationaal Instituut voor Kernfysica Nationaal Instituut voor Kernfysica

en Hoge-Energie Fysicaen Hoge-Energie Fysica

NIKHEFNIKHEFAmsterdam, The NetherlandsAmsterdam, The Netherlands

email: [email protected]: [email protected]

© NIKHEF 2005 SAC NIKHEF 21 May 2005© NIKHEF 2005 SAC NIKHEF 21 May 2005 22

Silicon Detector R&D at NIKHEFSilicon Detector R&D at NIKHEF

ATLAS Silicon TrackerATLAS Silicon TrackerLHCb Vertex trackerLHCb Vertex trackerMedipix2Medipix2

1.20 m


Hybrid PixelsHybrid Pixels Direct Conversion (no scintillator)Direct Conversion (no scintillator) no CCDsno CCDs no CMOS imagersno CMOS imagers but: Hybrid Pixel detectorsbut: Hybrid Pixel detectors

Schematic of a hybrid pixel detector

Au

Sensor Substrate

InGaAs

UBM

Insulator

CMOS ROIC

AuUBM

Al

bump

Au

Sensor Substrate

InGaAs

UBM

Insulator

CMOS ROIC

AuUBM

Al

Au

Sensor Substrate

Al

UBM

Insulator

CMOS ROIC

UBM

Al

MediPix chipMediPix chip14 x 14 mm14 x 14 mm22

sensitive areasensitive area

peripheryperiphery


Medipix2 @ NIKHEFMedipix2 @ NIKHEFMedipix2 X-ray ImagerMedipix2 X-ray Imager

Photon CountingPhoton Counting

VVththminmin ~1000 e- ( ~4 keV)~1000 e- ( ~4 keV)

noise-freenoise-free

high dynamic rangehigh dynamic range

14 x 14 mm14 x 14 mm22

256 x 256 pixels256 x 256 pixels

55 x 55 55 x 55 μμmm2 2 pixel sizepixel size

~ 1 Mhz per pixel~ 1 Mhz per pixel

~ 100 frames per second~ 100 frames per second


Medipix CollaborationMedipix Collaboration

- Univ + INFN CagliariUniv + INFN Cagliari- CEA-LIST SaclayCEA-LIST Saclay

- CERN Genève- CERN Genève- Univ d'Auvergne Univ d'Auvergne

- Univ Erlangen- Univ Erlangen

- ESRF Grenoble- ESRF Grenoble

- Univ Freiburg- Univ Freiburg

- Univ Glasgow- Univ Glasgow

- IFAE Barcelona- IFAE Barcelona

- Mitthoegskolan Sundsvall - Mitthoegskolan Sundsvall

- MRC-LMB Cambridge - MRC-LMB Cambridge

- Univ + INFN Napoli- Univ + INFN Napoli

- - NIKHEF AmsterdamNIKHEF Amsterdam

- Univ + INFN Pisa- Univ + INFN Pisa

- FZU CAS Prague - FZU CAS Prague - IEAP CTU Prague IEAP CTU Prague - SSL Berkeley SSL Berkeley

Spokespersons: Spokespersons: Michael CAMPBELL CERNMichael CAMPBELL CERNJan VISSCHERS Jan VISSCHERS NIKHEFNIKHEF


Plug and PlayPlug and Play

9090Sr electron source Sr electron source 20 frames / second 20 frames / second (software limited)(software limited)


Tests at ESRF synchrotron Tests at ESRF synchrotron

Michaela Mitschke

anti-scatter slit anti-scatter slit badly adjustedbadly adjusted

X-ray pencil beamX-ray pencil beam10 x 10 10 x 10 μμm, steps 5 m, steps 5 μμmmperfect PSFperfect PSF

Spectroscopy: Spectroscopy: 33rdrd 4 4thth 5 5thth Harmonics Harmonics


Some ImagesSome Images

28 mmmm

Flies @ 10 keV Leaf @ 5.9 keVFlies @ 10 keV Leaf @ 5.9 keVTungsten source Tungsten source 5555Fe sourceFe source

1414 mm


Quad-chip moduleQuad-chip module

2x4 chip carrier2x4 chip carrier2x2 sensor2x2 sensor

Swatch movie Swatch movie 19 keV Mb source19 keV Mb source5 fps5 fps


Photon/electron Imaging IndustriesPhoton/electron Imaging Industries


PANalytical, AlmeloPANalytical, Almelo

XRFXRF XRDXRD SAXSAX

X-ray X-ray DetectorsDetectors

2005:2005: market market

introduction introduction


Advantages of Hybrid DetectorsAdvantages of Hybrid DetectorsMainstream CMOSMainstream CMOS

Follow semiconductor technology innovationFollow semiconductor technology innovation Yield, Price/Performance, turn-aroundYield, Price/Performance, turn-around Radiation ResistanceRadiation Resistance

Increasing pixel functionalityIncreasing pixel functionality 0.25 0.25 μμm 33 x 10m 33 x 1066 transistors/chip transistors/chip 130 nm, 90 nm > 10130 nm, 90 nm > 1099 transistors/chip transistors/chip

Freedom of choice for the sensorFreedom of choice for the sensor Higher-Z materials GaAs, CdTe, CZT > 20 keVHigher-Z materials GaAs, CdTe, CZT > 20 keV Gas-avalanche chambers Gas-avalanche chambers Micro Channel Plate in vacuo Micro Channel Plate in vacuo } } < 4 keV< 4 keV


The FutureThe Future

through-via etchingand wafer thinning

courtesy IMEC Leuven


Fully tiled X-ray imagerFully tiled X-ray imager

pitch redistributionpitch redistribution3D-stacking3D-stackingGbit/s serial readoutGbit/s serial readout


4-Side Tiling: Through the Wafer4-Side Tiling: Through the Wafer

2 μm

courtesy IMEC Leuven

2 µm wide trench with polySi filling, 2 µm wide trench with polySi filling,

insulated with Oxide, 20 µm deepinsulated with Oxide, 20 µm deep


Gbit/s ReadoutGbit/s Readout

Mpix2MXR20:simulations 500 MHz (?)2 ms readout time (?)250 frames/sec @ 50%


TLK3101 TRANSCEIVER TLK3101 TRANSCEIVER 2.5 Gbps to 3.125 Gbps2.5 Gbps to 3.125 GbpsOn-Chip 8-Bit/10-Bit On-Chip 8-Bit/10-Bit Encoding/DecodingEncoding/DecodingComma Alignment Comma Alignment and Link Syncand Link SyncOn-Chip PLL On-Chip PLL Clock SynthesisClock Synthesis


Next step: 130 nm TechnologyNext step: 130 nm Technology1 mm1 mm22 chip chipSerial Transmitter in 130 nmSerial Transmitter in 130 nmMulti-Project Wafer submitMulti-Project Wafer submit

J.R. Schrader NIKHEF

J.R. Schrader NIKHEF


Next step: 130 nm TechnologyNext step: 130 nm Technology

ChipPseudo random

generator(at 3.2 Gbps)

Eye diagramTXRX

Pre-emphasisPre-emphasis

Transmitter:Transmitter:

now runs at 5 Gb/snow runs at 5 Gb/s

BER < 10BER < 10-12-12

~ 40 mW

J.R. Schrader NIKHEF / UTwente

30 m RG58U30 m RG58U


FundingFunding

FOM: Projectruimte (2002, with MESA)

STW: Project with FEI and Leiden

EU-FP5+6: TMR 1999/ M.Curie2001/

IP (IdePhix) / STREP

EZ: Senter/IWT/Eureka (with IMEC)

FOM: Industrial Partnership Program (IPP)

Industry: Technology Transfer (PANalytical)

green: succesful yellow:failed red: targeted


ConclusionsConclusions

Hybrid Pixels Detectors are Mature Hybrid Pixels Detectors are Mature

Tiling 2 x N chips is solvedTiling 2 x N chips is solved

Tiling N x N chips will come soonTiling N x N chips will come soon

Gbit/s IO will offer > kHz frame ratesGbit/s IO will offer > kHz frame rates

Next IC-Technology Nodes (130, 90 nm):Next IC-Technology Nodes (130, 90 nm):

more functionality per pixel …more functionality per pixel … a Spectroscopic Imager ?a Spectroscopic Imager ?

Documents

Detector Development with Industry Jan Visschers Nationaal Instituut voor Kernfysica en Hoge-Energie Fysica NIKHEF Amsterdam, The Netherlands email: [email protected]