Design for Real-Life Manufacturingipc-rtp.org/past_files/AsteelFlash_IPC_Presentation.pdf · TH Component Placement TH Component Placement TH Component Soldering TH Component

Version 2012

Design for Real-Life

ManufacturingMarch 22, 2012

YOUR EMS PARTNER

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Asteelflash Locations

YOUR EMS PARTNER

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Asteelflash Excellence System

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Quality HR Lea n Technology Supply Chain

« It’s a Quality label »

The Asteelflash Excellence System (AES) aims at con tinuously improving Customer Satisfaction in order to become an Industr ial Standard of excellence embodying the values of the Group.

YOUR EMS PARTNER

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Design for Manufacturability

� Defined as a design methodology intended to

ease the manufacturing process of a given

product.

� Often aided by the use of specific DFM software

(Mentor, Valor, etc) to check for signals, planes,

solder mask, silk screen, and drill.

(Width, Spacing, Registration, Clearance, etc.)

Design for Real-Life Manufacturing

YOUR EMS PARTNER Design for Real-Life Manufacturing

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Design for Real-Life Manufacturability

� An addendum to traditional DFM.

� Issues often noticed during prototype/NPI

preparation phase or during NPI build.

� Fab shops generally contact regarding traditional

DFM issues. Contract Manufacturers contact for

the Real-Life Manufacturing issues.

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Procure PCBProcure PCBInspect/Kit

Materials

Inspect/Kit

Materials

Solder Paste

Application

Solder Paste

ApplicationGlue ApplicationGlue Application

SMT Component

Placement

SMT Component

PlacementReflow

Soldering

Reflow

Soldering

DepanelDepanelTH Component

Placement

TH Component

PlacementTH Component

Soldering

TH Component

SolderingManual

Assembly

Manual

Assembly

TestTest

PCA Assembly Flow


Inspection *Inspection *

* ** *

* ** *


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Procure PCB

� Gerber data (CAD data)

� Fabrication drawing with proper notes

� Define RoHS vs. Leaded

� Define RoHS vs. Pb-Free Capable (not the same thing)

� Define Surface Finish

� Define Material (use “or equivalent”)

� Define Class (2 or 3)

� Define solder mask (color and matte/glossy)

� Define silkscreen color


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Procure PCB

� Provide Drill Chart and File


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� Provide Dimensions

� Provide Netlist (IPC File)

� Do NOT provide array/side rails unless

absolutely necessary

Procure PCB

YOUR EMS PARTNER

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� If the customer/designer decides to procure

the PCB, it is advised to discuss

manufacturing needs with contract

manufacturer before fabrication of board.

Procure PCB



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Inspect/Kit Materials

� PCB: Fab drawing with notes, dimensions and

drill chart

� Bill of Material: Include Your Own Part Numbers.

Do NOT use Manufacturer’s PN as your own.

Example: 1 µF Capacitor, 0603, X5R, 10%

• Panasonic: ECJ1VB1A105K

• Kemet: C0603C105K8PACTU

• NIC: NMC0603X5R105K10TRPF


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Customer BOM

Cust PN: ECJ1VB1A105K

AVL: ECJ1VB1A105K

AFG BOM

AFG PN: ECJ1VB1A105K

AVL: ECJ1VB1A105K

Customer BOM

Cust PN: ECJ1VB1A105K

AVL:

C0603C105K8PACTU

AVL: ECJ1VB1A105K

AFG BOM

AFG PN: ECJ1VB1A105K

AVL: C0603C105K8PACTU

AVL: ECJ1VB1A105K

AFG requests to add Kemet cap as primary part

number to AVL. Customer approves. Kemet PN

is added to AVL.


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Customer BOM

Cust PN: CAP0001

AVL: ECJ1VB1A105K

AFG BOM

AFG PN: CAP0001

AVL: ECJ1VB1A105K

AFG requests to add Kemet cap as primary part

number to AVL. Customer approves. Kemet PN

is added to AVL.

Customer BOM

Cust PN: CAP0001

AVL:

C0603C105K8PACTU

AVL: ECJ1VB1A105K

AFG BOM

AFG PN: CAP0001

AVL: C0603C105K8PACTU

AVL: ECJ1VB1A105K


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� Bill of Material: Ensure your part size/type.

� Bill of Material: Understand the packaging (T/R,

strips, tray, bulk).

� AFG prefers reels… this not only speeds the NPI,

but also improves quality. If you want a proto

build fast and with high quality, build it on a

machine!

� Bill of Material: Understand Leaded vs. Pb-Free

vs. RoHS

Inspect/Kit Materials


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Solder Paste Application

� Documentation Requirements:

� Gerber Data for stencils

� Assembly drawing for paste-type call-out


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Solder Paste Application

� Considerations:

� Leaded versus Pb-Free

� Global Fiducials

� Pad spacing from board edge

� Paste Layer should equal Artwork Dimensions

� Many CMs have their own stencil design

guidelines or contract design to stencil shop

� Solder Damming between pad and via


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Blue = ArtworkPink = Provided Paste

Solder Paste ApplicationPaste Layer vs. Artwork

Blue = ArtworkPink = AFG Paste


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Solder Paste ApplicationMinimal or No Damming to Via

Less than .001” of solder

mask between pad and via. If

broken in process, could

allow solder flow to via and

result in insufficient solder


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Glue Application

� Needed for surface mount components (passives)

exposed to wave on bottom side.

� Prefer to mask with wave solder pallet.

� Require minimum spacing from TH leads to

allow pallet to mask (.130” preferred).

� Exposed components require additional

processing and risk.


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D3 and C123 are within .130” from TH.(U10 and C112 are acceptable)

D3 and C123 are exposed to wave solder.(U10 and C112 are masked by pallet)

D3 and C123 require removable mask prior to wave (if not glued).


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SMT Placement

� Documentation Required:

� Assembly Drawing

� CAD Data

� Component XY File

� BOM with reference designators


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SMT Placement

� Placement method (chipshooter, multi, hand)

� Global fiducials required (3 per board...top and

bottom…opposing corners).

� Board/Panel size:

� Minimum width = 3.5” (less requires side rails/array)

� Maximum width/length = 20”

� Optimum size = Letter size paper (8” x 10”)


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SMT Placement

� Components/Fiducials must be .150” from board/

panel edge on top side due to conveyor and clamping.

(Remember, parts/fiducials on the bottom)


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SMT Placement





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SMT Placement





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Reflow Soldering


panel edge on bottom side due to reflow conveyor.



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Reflow Soldering


panel edge on bottom side due to reflow conveyor.



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Reflow Soldering0402 Pad Spacing

25 mils

25 mils

37 mils

12 mils

MAX


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Depaneling

� Consider fabrication panel utilization:

1-up: 8 boards 2-up: 8 boards 3-up: 9 boards


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Depaneling

� Consider chamfered/rounded corners:

Round drill bit can’t cut tight spaces

Router bit

V-S

CO

RE

Before Depanel After Depanel

PCB PCB PCB PCB


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Depaneling

� Consider chamfered/rounded corners:

Use double V-SCORE

Router bit

Double V-SCORE

Before DepanelAfter Depanel

PCBPCB PCB PCBScr

ap

Scr

ap


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Depaneling

� Consider SMT components overhanging board edge.

Cannot cut V-score with overhanging components

Overhangs!VERY close


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TH Component

Placement/Soldering

� Pin to Hole Ratio L

D

.006” < D - L < .020” (leaded)

.012” < D – L < .020” (Pb-Free)


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TH Soldering

� Limit bottom side component height to 0.200” MAX.

� Orient TH components for best yields (most critical

for Pb-free):

Axial Leaded

Sockets

Headers

Board Flow Over

Wave


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Manual Assembly

� Define clearly in Assembly Drawing

Torque, Epoxies, Rev Control, Etc.

� Press-fit connectors vs. solder tail (Press-fit

involves additional tooling charge, but results in

faster process)

� Clearly define labeling


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Test

� Types: Flying Probe Test, ICT, Functional Test

� Requirements:

� Schematic (PDF Searchable)

� BOM with Reference Designators

� ICT File/Netlist

� Function test procedure/equipment


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Test

� Expose Vias for Test Accessibilty

Ensure no masking/plug in via


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InspectionGeneral

� Provide Assembly Drawing with notes and clear

notation regarding orientation and population.

� An assembly drawing in NOT just a silkscreen

layer overlapping a paste/mask layer.


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InspectionVisual Inspection/AOI

� Ensure no silkscreen beneath part.

� Could add stand-off to low-profile parts (DFN, QFN)

� Cannot determine polarity if mark under part


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InspectionVisual Inspection/AOI

� Do not directly connect adjacent pads. Traces

appear as solder shorts to inspectors.

Not Preferred Preferred


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InspectionX-Ray

� Do not extend QFN pads under package beyond

termination.

QFN

PCB

Pad/paste extends beneath part


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InspectionX-Ray


termination.

QFN

PCB

Solder ball forms beneath part


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InspectionX-Ray


termination.

QFN

PCB

Preferred pad extension


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� Bill of Material with Ref. Des.

� Assembly Drawing with notes

� Fabrication Drawing with notes

� Gerber Data

� CAD Data

Summary:

Required Documentation


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Required DocumentationBill of Material

� Define unique customer part numbers

� Include AML/AVL (even if single-source)

� Include reference designators


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Required DocumentationAssembly Drawing

� Define RoHS vs. Leaded

� Define Class (2 vs. 3)

� Define all polarities

� Include proper notes on manual assembly

and labels

� “Not just silkscreen and paste/mask layers”

YOUR EMS PARTNER

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Receive DocumentationFabrication Drawing

� RoHS vs. Pb-free (NOT the same thing)

� Define Material (use “or equivalent”)

� Provide Dimensions

� Provide Drill Chart that matches Drill file

� Let AFG define arrays, side rails or single up

� Include full fabrication notes!


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Receive DocumentationGerber Data

� Used for tooling as well as PCB

procurement

� Provide in RS-274X format if possible

� Provide FULL gerber package to include drill

files.

� Provide Drill File

� Provide IPC File


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Receive DocumentationCAD Data

� Provide full ASCII CAD export.

� Provide Component XY


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Thank You!

Future Questions please call:

(919) 882-5400

Documents

Design for Real-Life Manufacturingipc-rtp.org/past_files/AsteelFlash_IPC_Presentation.pdf · TH Component Placement TH Component Placement TH Component Soldering TH Component