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Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc. [email protected] 770.698.1900 & 770.722.8172

Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

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Page 1: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components

Art Ogg, Global Director of QualityWorld Micro, Inc. [email protected] & 770.722.8172

Page 2: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

PRESENTATION OUTLINE:

• How to idnetify parts•Travel from source to customer•How often change hands, how paid for•Parts disposition •Shenzen trip details• Resistance to Solvents

Page 3: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

4

PRE- AS5553: “ Items that are produced or distributed in violation of intellectual property rights, copyrights or trademarks”.

AS 5553 Definition (July-2009):

• Parts that do not contain the proper internal construction• Used parts, refurbished parts or reclaimed but sold as new• Parts with different package style or surface plating• Parts which have not successfully completed the OCM testing• Parts sold as being up screened which have not been up screened• Parts with modified labeling or markings intended to misrepresent

DEFINITION OF A COUNTERFEIT COMPONENT

Page 4: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc
Page 5: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc
Page 6: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

OPEN COUNTERFEIT ACTIVITIES

OBSERVED COUNTERFEITING PRACTICES IN CHINA, DECEMBER, 2010

Page 7: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

INTERNET VENDORS OF C/F PARTS MULTI-STORY BUILDING OF VENDORS

FACILITY IN SHENZHEN CHINA FOR INTERNET SALE OF PARTS

Page 8: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

PACKAGE INSPECTIONS

• Confirm the external package labels with a bar code reader

• Examine the shipping bag for cuts, tears, vacuum seal, labels

• Are parts in a proper bag; ESD type, MBB type, non-ESD type

• For MSD; is there a HIC, desiccant and is the bag sealed

Page 9: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

INSPECTING A FACTORY SEALED BOX

Page 10: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE BAG IS MISSING THE HIC & DESICCANTAND THERE IS NO ESD OR MBB LOGOS

Page 11: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE BAR CODES DO NOT MATCH THE LABEL

Page 12: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE CRACK SHOWS THE FALSE TOP COATING

Page 13: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

INK DEFECTS DEMONSTRATES FAKE MARKINGS

Page 14: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Check for Multiple D/C’s

Page 15: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

RESISTANCE TO SOLVENTS

• Marker Permanency Test (used to test for uncured ink)

• Acetone Wash Test (used to test for false top coats)

Page 16: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

A MIXTURE OF 3 PARTS MINERAL SPIRITS AND 1PART ALCOHOL IS USED FOR TESTING FOR A

RE-MARKED COMPONENT.

MIL-STD-883 (METHOD 2015.13) REQUIRES MARKINGSTO WITHSTAND A SWAB WASH WITHOUT FADING.

MIL-STD-202 (METHOD 215) PROVIDES FOR A SIMILAR TEST.

THE “MARKER PERMANENCY TEST”(NOTE: THIS TEST IS NOT FOR LASER MARKED PARTS)

Page 17: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THIS INK WAS NOT APPLIED BY THE OCM

Page 18: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

FALSE TOP COATS

Page 19: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

ACETONE REMOVES THE FALSE TOP COATING

Page 20: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE RESULTS OF USING ACETONE ON A FALSETOP COATING. A GOOD COMPONENT WILL NOT

BE AFFECTED BY ACETONE..

Page 21: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

REJECT A PART THAT HAS A SHINY OR GRAINY TOP

Page 22: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

False Top Coating Removed

Page 23: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

CORRECT MOLD INCORRECT MOLD

Page 24: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Check Mold Cavity for Coatings

Page 25: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Pin-1 Dimple is Coated

Page 26: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE SUFFIX OF THE P/N WHEN VIEWED FROM ONE ANGLE IS

SHOWN AS “EEAI”

THIS SAME PART WHEN VIEWEDFROM A DIFFERENT ANGLE SHOWS

THE P/N USED TO BE “EGAI”

“EEAI” IS A FAST VERSION “EGAI” IS A SLOWER VERSION

REMARKED COMPONENT TO MAKE IT APPEAR TO BE A MILITARYGRADE COMPONENT INSTEAD OF THE ORIGINAL COMMERCIAL.

Page 27: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

FAKE LOGO MARKS

Page 28: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

EXAMPLES OF COUNTERFEIT PHILIPS LOGOS

Page 29: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

CHIPPED CORNERSFROM REMOVAL

Page 30: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Check for Cracks on the Bottom

Page 31: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

CHIPS ON CORNER MEANS IT IS A “PULLED PART”WHICH INDICATES THE PARTS ARE USED.

Page 32: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

DAMAGED AND RE-PLATEDCOMPONENT LEADS

Page 33: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

SOLDER DEFECTS (PILLOWING) IS A SIGN THEYHAVE BEEN RETINNED AND ARE MOST LIKELY USED

Page 34: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

TWO EXAMPLES OF LEAD DAMAGE CAUSED FROMBEING IN A CIRCUIT FOR A LONG PERIOD OF TIME.

THIS IS NOT FROM TESTING THE COMPONENT.

Page 35: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

EXAMPLE OF A RETINNED LEAD WITH SOLDERDEFECT. THIS IS A REJECT.

Page 36: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Damaged BGA Spheres

Page 37: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Check the Leads for Coatings

Page 38: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

Look for Tin Whiskers

Page 39: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

CORRECT VIEW OF THESIDES OF LEADS SHOWING

CUTTING MARKS ON THE ENDS

SIDE VIEW OF A U.S. COINSHOWING THE SAME STAMPING

MARKS ON THE SIDE.

Page 40: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

DISSIMILAR COUNTRYOF ORIGIN STAMPS

Page 41: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

SQUARE HOLES ROUND HOLES DIFFERENT COUNTRY OF ORIGIN

TWO PARTS FROM THE SAME TUBE; DIFFERENTCOUNTRY OF ORIGIN, DIFFERENT LEAD HOLES.

THIS LOT NEEDS TO BE REJECTED.

Page 42: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

TANTALUM CAPACITORCOUNTERFEIT TESTING

Page 43: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

TESTING FOR COUNTERFEIT TANTALUM CAPACITORS

GOOD PART REFLECTS LIGHT BAD PART IS DULL

Page 44: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

PASSES THELIGHT TEST

FAILS THELIGHT TEST

TANTALUM COUNTERFEIT LIGHT TEST

Page 45: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

ESD & HANDLING CONSIDERATIONS

Page 46: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF MICROSCOPE SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

CONDUCT THE IDEA-STD-1010 INSPECTION

Page 47: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

X-RAY PHOTO OBSERVATIONS

Page 48: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF X-RAY SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

A lot purchased directly from Maxim had 2 date codes. This x-rayshows 2 different die types. The OCM was asked to verify these 2 had the same

specifications. Maxim responded they were the same, which enabled the lot to be released for shipment to the customer.

Page 49: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF X-RAY SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

TWO DIFFERENT DIES FOUND IN ONE REEL OF PARTSA lot with the same D/C, L/C, P/N, etc. was examined visually. The parts were suspected as being

blacktopped and remarked after visual inspection. A sample was inspected using x-ray. This photo shows two distinctly different internal die’s. The lot was therefore rejected

as a result of this x-ray photo.

Page 50: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF X-RAY SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

TWO DIFFERENT DIES FOUND IN ONE REEL OF PARTS

CORRECT DIE INCORRECT DIEThis lot of components did not come with traceability records, it was given a detailed examination with high powered microscopy. No anomalies were noticed. A (15) piece

sample was examined using x-ray and it was discovered that ~ one in five pieces had a different die as shown in the photo on the right. The entire lot was rejected.

Page 51: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF X-RAY SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

1- Unknown part has the markings upside down.2- Unusual S-shaped bond with a ball at the end.3- Top down looks alright.4- Known good part does not have “S” bond or the ball at the end of the wire.5- Known good part looks OK in the top down view.

1 2 3

4 5

Page 52: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

THE USE OF X-RAY SYSTEMS TO DETECTCOUNTERFEIT AND REWORK COMPONENTS

MISSING DIE IN COUNTERFEIT COMPONENT ON THE RIGHT

The components at left are normal. The two on the right aroused suspicions due to topographical irregularities. They were x-rayed and compared with known good

parts on the left. They were rejected.

Page 53: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

SUMMARY PROCEDURES

• Inspect packaging for damage and verify labels• Always be mindful of handling and ESD concerns• Compare the components to the OCM data sheet• Inspect leads; retinning, bent, co planarity, solder balls, observe the tips• check for false top coating, remarking, surface scratches• Compare top surface to bottom surface• Check pin-1 and mold cavity for foreign material• Check for corrosion anywhere on the part• Check for cracks or chips• Conduct resistance to solvents testing when applicable• Use the IDEA-STD-1010 Inspection Standard

Page 54: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

A CENTRALIZED GOVERNMENT ADMINISTERED REPOSITORYWHERE CONFIRMED COUNTERFEIT COMPONENTS CAN BE SENT

•ALLOWS DISTRIBUTORS TO STOP PAYMENT TO THE SUPPLIER•REQUIRES THE SUPPLIER AGREE TO DISPOSITION WITH THE U.S.•THIS PLAN WOULD REMOVE CONFIRMED C/F FROM SUPPLY CHAIN•THE OCM’S WOULD NEED TO COOPERATE TO CONFIRM DIAGNOSIS

Page 55: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

AN OFFICAL U.S. GOVERNMENT PUBLISHED DEFINITION FORA COUNTERFEIT ELECTRONIC COMPONENT:

•ICE HAS ONE BASED UPON INTELECTUAL PROPERTY RIGHTS•AS 5553 HAS ONE BASED UPON COMPONENT MODIFICATIONS•AS 6081 BEING WORKED ON, WILL HAVE YET ANOTHER

•The distribution market place is not certain which definition applies at any one point in time.

Page 56: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

A GOVERNMENT SPONSORED DATA BASE TRACKINGCONFIRMED COUNTERFEIT ELECTRONIC COMPONENTS

•GIDEP IS ON THE RIGHT TRACK BUT ONLY TRACKS THOSE THAT WERE SOLD TO GOVERNMENT & AEROSPACE SITES

•THE U.S. GOVERNMENT TRACKS EVERY COUNTERFEIT BILL BY S/N, LOCATION FOUND, DENOMINATION, ETC.

•THIS PROGRAM NEEDS TO BE EXPANDED TO COMBAT THE ENTIRE POPULATION OF COUNTERFEITS NOT JUST MILITARY

Page 57: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

INDUSTRY WIDE COOPERATION IS NEEDED TO IMPROVE:

•ORIGINAL COMPONENT MANUFACTURERS (OCM’S) WILL NOT COOPERATE WITH ANY ENTITIY WHO DID NOT PURCHASE PARTS FROM THEM OR THEIR FRANCHISED DISTRIBUTORS

•DISTRIBUTORS MUST SEND SUSPECTED C/F PARTS TO A 3RD PARTY

•WITH OCM COOPERATION, THE SPREAD OF C/F PARTS COULD BE GREATLY REDUCED

Page 58: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

ELIMINATE CONFUSION OVER WHO DECLARES A PARTAS BEING A COUNTERFEIT

•SOME SAY ONLY THE OCM CAN MAKE THE CALL

•OTHERS SAY A 3RD PARTY ANALYSIS HOUSE CAN

•STILL OTHERS RELY ON ANY IDEA-CERTIFIED PROFESSIONAL INSPECTOR

Page 59: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

WHAT IS NEEDED

THERE NEEDS TO BE A GOVERNMENT ENDORSED PROGRAM FOR CERTIFYING INDEPENDENT DISTRIBUTORS:

•THE GOVERNMENT SHOULD ADOPT THE IDEA INSPECTION STANDARD FIRST THEN ENDORSE AN IDEA PROGRAM FOR FOR CERTIFYING INDEPENDENT DISTRIBTORS. ONE SUCH PROGRAM IS BEING WRITTEN.

•ONCE THE PROGRAM IS IN PLACE, THE GOVERNMENT SHOULD PURCHASE ONLY FROM THOSE WHO ARE CERTIFIED.

Page 60: Department of Defense Investigation Into Sources and Effects of Counterfeit Electronic Components Art Ogg, Global Director of Quality World Micro, Inc

World Micro Thanks The Department of Defense for This Opportunity to Present Counterfeit

Detection Techniques and Observations

Dan Ellsworth, President770 698-1900

[email protected]

Art Ogg, Quality [email protected] 698-1900 & 770 722-8172