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Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Deliverable 1.1 – Roadmap
2
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
DELIVERABLE D1.1
Work package 1
Deliverable type
Report
Dissemination level
☒CO (Confidential, only for members of the consortium (including the Commission Services
☐ PU (Public)
Lead Partner SEMI Europe
Responsible SEMI Europe
Authors Stefania Gavra, SEMI Europe
Reviewers Maria Afsar, SEMI Europe
Version 2.0
3
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Version history
Version Date Author Partner
0.1 13/12/2019 Stefania Gavra SEMI
0.2 20/12/2019 Stefania Gavra SEMI
1.0 30/12/2019 Stefania Gavra SEMI
2.0 10/03/2021 Stefania Gavra SEMI
1. Contents Introduction .................................................................................................................................................. 4
Outcomes of Work Package 1 (Preparation) ................................................................................................ 5
Definition of the Internal Project Teams .................................................................................................. 5
Internal communication systems .............................................................................................................. 7
Launching and coordination of the various project plans ........................................................................ 7
Mobilizing associated partners and policy counterparts .......................................................................... 7
METIS Roadmap per Work Package ............................................................................................................ 10
Work Package 2 (EU Sectoral Skills Strategy, Skills Anticipation and Monitoring) ................................. 10
Work Package 3 (Design Innovative METIS Training) ............................................................................. 11
Work Package 4 (METIS Training Delivery: Validation and Fine-Tuning)................................................ 12
Work Package 5 (Quality Assurance and Evaluation) ............................................................................. 13
Work Package 6 (Dissemination & Exploitation) .................................................................................... 14
Work Package 7 (Long Term Action Plan and Microelectronics Observatory & Skills Council) .............. 15
Work Package 8 (Project Management) ................................................................................................. 16
Annex .......................................................................................................................................................... 17
4
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
2. Introduction This Roadmap is the blueprint of the METIS project, consolidating the work that has taken place
throughout the Preparation phase (Work Package 1), including the first METIS meeting. The objective is
to ensure that full and associated partners are on track with the implementation strategy and to
establish the work that will feed into work packages 2-8.
The roadmap is organized by work packages, providing a timeline of the activities for the 4-year cycle of
the project. This document complements existing project documentation:
• the Grant Agreement,
• Partnership Agreements,
• The minutes of the kick-off meeting of 18/19 November 2019 and of the second meeting of
November 2020 (deliverable 8.2).
5
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
3. Outcomes of Work Package 1 (Preparation)
Definition of the Internal Project Teams
The METIS management structure includes a Steering Board, a Project & Financial Management Unit, an
Operational Management Team and 8 Work Package Teams.
The METIS Steering Board, composed of one representative per partner, will provide strategic oversight
and remain updated on the progress of the project by the coordinator. The members of the METIS
Steering Board are:
P1 SEMI Europe Emir Demircan [email protected]
P2 Infineon Technologies Austria AG
Julia Gabriel [email protected]
P3 Robert Bosch GmbH Thomas Fleischmann
P4 X-FAB France Carole Mossant [email protected]
P5 Graphenea Semiconductor
Amaia Zuturuza [email protected]
P6 Summa Semiconductor Ltd
Sami Suihkonen [email protected]
P7 Arcelik Bekir Ozyurt [email protected]
P8 Silicon Saxony Frank Bosenberg [email protected]
P9 Technische Universitat Graz
Bernd Deutschmann
P10 Imec Martin Vranken [email protected]
P11 Dresden Chip Academy Dagmar Bartels [email protected]
P12 University of South-Eastern Norway
Roy Kenneth Skulstad-Hansen
P13 Technical University of Sofia
Slavka Tzanova [email protected]
P14 Budapest University of Technology and Economics
Oliver Krammer [email protected]
P15 IAL-FVG Marianna Muin [email protected]
P17 CIMEA Giovanni Finocchietti
P18 WiTEC Mia Norling [email protected]
P19 European Association of Career Guidance
Gregory Makrides
P20 DECISION Olivier Coulon [email protected]
Table 1: Members of METIS Steering Board
6
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
The Steering Board will decide on
• major amendments in the planning, tasks and budget,
• consortium management (associated partners)
• delays and contingency plans.
The coordinator will keep the members of the Steering Board updated via email, and through the
CIRCABC document repository, in which all members will have access. Other than the two physical
meetings a year, the coordinator will also organize monthly calls with the members of the Steering
Board, to update them on the progress of the project.
SEMI Europe, the coordinator and lead of WP8, will assume the functions of Project & Financial
Management. The team consists of:
Stefania Gavra, Public Affairs Manager – [email protected]
Maria Afsar, Manager, Government Projects – [email protected]
The coordinating team is responsible for project management and reporting to EACEA, people
management and administrative & financial management for METIS.
The Operational Management Team (OMT) will safeguard the technical content-related progress of the
project. It is composed of the WP leaders and the coordinator. The coordinator will organize ad hoc
physical or virtual meetings with the WP leaders depending on the needs of the project.
WP1 SEMI
WP2 DECISION
WP3 Technical University of Sofia
WP4 BME
WP5 CIMEA
WP6 SEMI
WP7 Silicon Saxony/ SEMI
WP8 SEMI
Table 2: Lead partners per WP
The Work Package Teams (WPT) are assigned with the implementation of the project.
The Work Package Teams are to be agreed internally by each partner and communicated to the
coordinator. The complete list of WP teams will be uploaded in CIRCABC and will be included in D8.3
Project Management Plan. In case of staff changes, the partners will inform the coordinator as soon as
possible.
7
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Internal communication systems The partners will meet physically every 6 months, with the exact date of the meetings depending on the
needs and the progress of the project. The indicative months when the meetings will take place are: M1,
M8, M15, M23, M32, M41 and M48.
An online document repository is established on CIRCABC. All Steering Board members have access to
the project’s materials that will be uploaded there. SB members can also grant access to CIRCABC to
their colleagues, after informing the coordinator.
Moreover, the coordinator will update the METIS Steering Board via email and monthly Skype calls. The
Skype calls will take place indicatively in the last 10 days of each month (to be defined on a case-by-case
basis) and the WP leaders will update the respective WP teams via email and calls as they see fit.
Launching and coordination of the various project plans By the end of M3 (January 2020), three project plans will be delivered: The Quality Control Plan (WP5,
lead partner CIMEA), the Dissemination & Exploitation Plan (WP6, lead partner SEMI) and the Project
Management Plan (WP8, lead partner SEMI).
The lead partners of the above-mentioned WPs will circulate the first draft version of the Plans to the
WP team by 10th January 2020. The plans will have the form of a report, following the METIS deliverable
template. The second draft of the Plans will be circulated to the WP teams and the METIS Steering Board
by 20th January 2020. The three Plans will be finalized by 31st January 2020.
CIMEA will also take the lead in establishing the External Quality Committee composed of associated
partners.
Mobilizing associated partners and policy counterparts Currently, there are 28 associated partners in METIS. Partners are invited to mobilize associated
partners that would be suited to participate in the project (associations, umbrella organisations, civil
society, industry, VET systems representatives, etc.) and alert the coordinator. Discussion on prospective
associated partners will take place in the calls and meetings of the METIS Steering Board (the first
discussion will be part of the January 2020 Steering Board call).
Associated Partners will stay informed about the public outcomes of the project (i.e. events, press
releases), which they will be free and encouraged to disseminate through their online and offline
channels. Moreover, the associated partners, as members of the External Advisory Group, will provide
specific feedback on the implementation of the project (WP5). Associated partners will also be involved
in the Test & Validation phase of the METIS training (WP4) and as stakeholders in the Microelectronics
Observatory and Skills Council (WP8).
8
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Partner Organisation Country Type of Organisation
1 Fraunhofer IPMS Germany R&D
2 ST Microelectronics France Business
3 ASML Netherlands Business
4 ASM International Netherlands Business
5 AENEAS: Association for European NanoElectronics ActivitieS
France Industrial Association
6 CEA Tech France R&D
7 Soitec France Business
8 SPTS UK Business
9 Edwards UK Business
10 Fabmatics Germany Business
11 Recif Technologies France Business
12 Evatec Advanced Technologies Switzerland Business
13 VAT Switzerland Business
14 Siltronic Germany Business
15 VDMA – EMINT (German Engineering Association: Electronics, Micro and Nano Technologies Division)
Germany Industry Association
16 Trade Union: Comitato Sindicale Interregionale FVG
Italy EPLUS-SOCIAL
17 National Institute for Public Policy Analysis (INAPP)
Italy Research body of Ministry of Labour, responsible for analysis, monitoring and evaluation of labour market, education and training, social policies impacting the labour market
18 Eurotech Italy Industry
19 Cluster “Microelectronics & Industrial Electronics Systems”
Bulgaria Cluster of all Bulgarian enterprises in microelectronics
20 INES Solaire – Formation France VET provider in photovoltaics, energy efficiency, renewable energies
21 Grenoble INP with CIME Nanotech France Interuniversity centre for training in nanoelectronics and nano-bio electronics
22 Irish Business and Employers Federation (IBEC)
Ireland National Representation for Irish Industry
23 Technology Ireland Ireland Representing the Technology Sector in Ireland
24 Education and Training Boards Ireland (ETBI)
Ireland Coordinating the national delivery of FET in Ireland
25 Engineers Ireland Ireland Professional Body for Engineers in Ireland
26 Friuli Venezia Giulia Autonomous Regional Government
Italy EPLUS-BODY-PUB-REG
9
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
27 Electronic Coast Norway Industry association and competence cluster
28 Tempus Public Foundation – Higher Education Department for Erasmus Mundus Joint Master Degrees and for Erasmus+ Capacity Building / Knowledge Alliances
Hungary NGO established in 1996 by the Government to manage international cooperation programmes and special projects in education & training
Table 3: Associated Partners as of December 2019
Throughout the course of the project, SEMI with the support of the other partners, will liaise with key
policy counterparts on EU, national, regional and local levels, to make METIS visible and align the project
with other similar initiatives.
10
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
4. METIS Roadmap per Work Package The roadmap includes a short overview of each WP, and a timeline of tasks (in white boxes) and
deliverables (in grey boxes). You can find the corresponding calendar months in the table annexed to
this document.
Work Package 2 (EU Sectoral Skills Strategy, Skills Anticipation and Monitoring)
In WP2 the partners will develop the microelectronics sector skills strategy to support the objectives of
the established growth strategy for the sector. To accomplish this, the partners will identify the major
trends affecting jobs and skills needs in the sector, develop a common methodology to assess the
current situation and anticipate future skills needs, define and/or develop occupational profiles with
corresponding skills and competences and set up continuous and robust monitoring on a yearly basis.
M2-M7
Development of the
common methodology
M6-M17
Identification of trends
for skills development
of the EU
microelectronics sector
M6-M17
Skills anticipation
and definition of
occupational
profiles
M9-M17
Development of METIS
Skills Strategy
M22-3, M34-5, M46-7
Yearly Monitoring
M7
D2.1 Common methodology
M17
D2.2 Skills and Occupational Profiles
for Microelectronics
M17
D2.3 METIS Skills Strategy
including fiches
M22, M35, M47
D2.4 Yearly Monitoring Reports
11
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 3 (Design Innovative METIS Training)
The objective of WP3 is to develop the METIS curriculum and training on a) electronic components
design, b) electronic systems design, c) basics of electronics manufacturing, and d) key competences &
innovative thinking.
M15-M19
Definition of learning objectives
and learning outcomes
M18-M29
Development of
the structure of
the curriculum
M18-M29
Development of
the online and
offline content
M27-32
Development of the
path to certification
and recognition
M27-M32
Development of the
METIS Skills
Passport, Europass
and EURES Suite
M29
D3.1 METIS Curriculum & Training
M32
D3.2 METIS Certification and
Recognition Model
M32
D3.3 METIS Skills Passport,
Europass and EURES Suite
M27-M29
Development of the “trainers’ manual”
12
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 4 (METIS Training Delivery: Validation and Fine-Tuning)
During the WP4, the partners will test and validate in real-life scenarios the METIS Curricula and Training
developed in WP3 in real-life scenarios, to check their effectiveness against the outcomes of WP2
(Occupational profiles and Skills Strategy). The validation will lead to the final version of the METIS
curriculum and training, based on feedback of users in both VET and industry at both trainers’ and
trainees’ levels.
The testing will be carried out by all industry and academia partners, as well as by associated partners –
aiming at least at 900 users.
M32-M35
Developing the METIS
T&V Plan
M44-M48
Finalisation of the
METIS Curriculum and
Training
M35-45
Collection of users’
feedbacks for the
validation report
M35-M45
Delivery of the METIS
Curriculum and
Training
M45
D4.2 Validation
Report
M35
D4.1 Test & Validation
Plan
M45
D4.3 Final METIS
Curriculum & Training
M46-M48
Development of
guidelines for
mainstreaming and
uptake of the METIS
Curriculum
M45
D4.4 METIS Mainstreaming
Guidelines
13
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 5 (Quality Assurance and Evaluation)
The objective of WP5 is to monitor all activities carried out and results produced during the project and
evaluate them against project objectives. The Internal QA Committee is composed of one member per
partner (the WP5 team) and the External METIS Quality Committee will be comprised of Associated
Partners to ensure objective quality control.
M1-M3
Development of the METIS
Quality Assurance Plan
M12, M24, M36, M48
M&E & QA Reporting
M1-M48
M&E & QA Activities
M12, M24, M36
D5.2 Interim internal
quality Reports
M3
D5.1 METIS Quality Plan
M24
D5.3 Mid-term
external quality Report
M48
D5.4 Final external
quality Report
M48
D5.5 Final METIS
quality Report
14
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 6 (Dissemination & Exploitation)
The dissemination and exploitation of the activities and outcomes of the project will reach
approximately 3 million people, inside and outside the consortium (industry, education, learners, policy
makers at local, regional, national and European level). The objective is for the results of METIS to be
communicated both during and after the implementation of the project.
M1-M3
Development of the
Dissemination &
Exploitation Plan
M6, M12, M189, M24,
M30, M36, M42, M48
M&E & QA Reporting
M1-M48
Development and
maintenance of the
METIS Website and
Platform
M12, M24, M36
D6.3 Interim dissemination
& exploitation Reports
M3
D6.1 METIS
Dissemination &
Exploitation Plan
M48
D6.4 Final dissemination &
exploitation Report
M1-M48
Dissemination activities
M1-M48
Exploitation activities
M3
D6.2 METIS Website
and Platform
15
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 7 (Long Term Action Plan and Microelectronics Observatory & Skills
Council)
The WP7 teams will establish sustainable mechanisms to promote the messages of METIS beyond the
end of the project. In this framework, the Microelectronics Observatory & Skills Council will be created,
enabling stakeholders internal and external to the project to come together and shape the future of the
sector.
M32-M48
Development and adoption
of the Long-Term Action Plan
M48
D7.2 Microelectronics Observatory and Skills
Council
M48
D7.1 METIS Long-Term Action
Plan
M32-M48
Development and establishment of the
Microelectronics Observatory and Skills Council
16
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
Work Package 8 (Project Management) WP8 tasks will ensure the correct management and oversight of METIS, establishing coherent methods
and tools so that the implementation of the project runs smoothly. Additional emphasis will be placed
on ensuring the fluid communication between partners and WP teams, as well as with EACEA.
M1-M3
Finalisation of the
Project Management
Plan
M1, M8, M15, M23,
M32, M41 (indicative)
D8.2 Minutes of
Project Meetings
M7, M13, M19, M25, M31, M37, M43
D8.3 Six-Month Internal Reports
M3
D8.1 METIS Project
Management Plan
M48
D8.4 Final METIS Project
Report
M1-M48
Operational & Technical
Coordination
M1-M48
Administrative and
Financial Coordination
17
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
5. Annex Table of calendar months of the METIS project cycle
M1 November 2019
M2 December 2019
M3 January 2020
M4 February 2020
M5 March 2020
M6 April 2020
M7 May 2020
M8 June 2020
M9 July 2020
M10 August 2020
M11 September 2020
M12 October 2020
M13 November 2020
M14 December 2020
M15 January 2021
M16 February 2021
M17 March 2021
M18 April 2021
M19 May 2021
M20 June 2021
M21 July 2021
M22 August 2021
M23 September 2021
M24 October 2021
M25 November 2021
M26 December 2021
M27 January 2022
M28 February 2022
M29 March 2022
M30 April 2022
M31 May 2022
M32 June 2022
M33 July 2022
M34 August 2022
M35 September 2022
M36 October 2022
M37 November 2022
M38 December 2022
M39 January 2023
M40 February 2023
M41 March 2023
M42 April 2023
M43 May 2023
18
Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action
Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-
EPPKA2-SSA-B
M44 June 2023
M45 July 2023
M46 August 2023
M47 September 2023
M48 October 2023