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Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE- EPPKA2-SSA-B Deliverable 1.1 – Roadmap

Deliverable 1.1 Roadmap

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Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Deliverable 1.1 – Roadmap

2

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

DELIVERABLE D1.1

Work package 1

Deliverable type

Report

Dissemination level

☒CO (Confidential, only for members of the consortium (including the Commission Services

☐ PU (Public)

Lead Partner SEMI Europe

Responsible SEMI Europe

Authors Stefania Gavra, SEMI Europe

Reviewers Maria Afsar, SEMI Europe

Version 2.0

3

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Version history

Version Date Author Partner

0.1 13/12/2019 Stefania Gavra SEMI

0.2 20/12/2019 Stefania Gavra SEMI

1.0 30/12/2019 Stefania Gavra SEMI

2.0 10/03/2021 Stefania Gavra SEMI

1. Contents Introduction .................................................................................................................................................. 4

Outcomes of Work Package 1 (Preparation) ................................................................................................ 5

Definition of the Internal Project Teams .................................................................................................. 5

Internal communication systems .............................................................................................................. 7

Launching and coordination of the various project plans ........................................................................ 7

Mobilizing associated partners and policy counterparts .......................................................................... 7

METIS Roadmap per Work Package ............................................................................................................ 10

Work Package 2 (EU Sectoral Skills Strategy, Skills Anticipation and Monitoring) ................................. 10

Work Package 3 (Design Innovative METIS Training) ............................................................................. 11

Work Package 4 (METIS Training Delivery: Validation and Fine-Tuning)................................................ 12

Work Package 5 (Quality Assurance and Evaluation) ............................................................................. 13

Work Package 6 (Dissemination & Exploitation) .................................................................................... 14

Work Package 7 (Long Term Action Plan and Microelectronics Observatory & Skills Council) .............. 15

Work Package 8 (Project Management) ................................................................................................. 16

Annex .......................................................................................................................................................... 17

4

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

2. Introduction This Roadmap is the blueprint of the METIS project, consolidating the work that has taken place

throughout the Preparation phase (Work Package 1), including the first METIS meeting. The objective is

to ensure that full and associated partners are on track with the implementation strategy and to

establish the work that will feed into work packages 2-8.

The roadmap is organized by work packages, providing a timeline of the activities for the 4-year cycle of

the project. This document complements existing project documentation:

• the Grant Agreement,

• Partnership Agreements,

• The minutes of the kick-off meeting of 18/19 November 2019 and of the second meeting of

November 2020 (deliverable 8.2).

5

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

3. Outcomes of Work Package 1 (Preparation)

Definition of the Internal Project Teams

The METIS management structure includes a Steering Board, a Project & Financial Management Unit, an

Operational Management Team and 8 Work Package Teams.

The METIS Steering Board, composed of one representative per partner, will provide strategic oversight

and remain updated on the progress of the project by the coordinator. The members of the METIS

Steering Board are:

P1 SEMI Europe Emir Demircan [email protected]

P2 Infineon Technologies Austria AG

Julia Gabriel [email protected]

P3 Robert Bosch GmbH Thomas Fleischmann

[email protected]

P4 X-FAB France Carole Mossant [email protected]

P5 Graphenea Semiconductor

Amaia Zuturuza [email protected]

P6 Summa Semiconductor Ltd

Sami Suihkonen [email protected]

P7 Arcelik Bekir Ozyurt [email protected]

P8 Silicon Saxony Frank Bosenberg [email protected]

P9 Technische Universitat Graz

Bernd Deutschmann

[email protected]

P10 Imec Martin Vranken [email protected]

P11 Dresden Chip Academy Dagmar Bartels [email protected]

P12 University of South-Eastern Norway

Roy Kenneth Skulstad-Hansen

[email protected]

P13 Technical University of Sofia

Slavka Tzanova [email protected]

P14 Budapest University of Technology and Economics

Oliver Krammer [email protected]

P15 IAL-FVG Marianna Muin [email protected]

P17 CIMEA Giovanni Finocchietti

[email protected]

P18 WiTEC Mia Norling [email protected]

P19 European Association of Career Guidance

Gregory Makrides

[email protected]

P20 DECISION Olivier Coulon [email protected]

Table 1: Members of METIS Steering Board

6

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

The Steering Board will decide on

• major amendments in the planning, tasks and budget,

• consortium management (associated partners)

• delays and contingency plans.

The coordinator will keep the members of the Steering Board updated via email, and through the

CIRCABC document repository, in which all members will have access. Other than the two physical

meetings a year, the coordinator will also organize monthly calls with the members of the Steering

Board, to update them on the progress of the project.

SEMI Europe, the coordinator and lead of WP8, will assume the functions of Project & Financial

Management. The team consists of:

Stefania Gavra, Public Affairs Manager – [email protected]

Maria Afsar, Manager, Government Projects – [email protected]

The coordinating team is responsible for project management and reporting to EACEA, people

management and administrative & financial management for METIS.

The Operational Management Team (OMT) will safeguard the technical content-related progress of the

project. It is composed of the WP leaders and the coordinator. The coordinator will organize ad hoc

physical or virtual meetings with the WP leaders depending on the needs of the project.

WP1 SEMI

WP2 DECISION

WP3 Technical University of Sofia

WP4 BME

WP5 CIMEA

WP6 SEMI

WP7 Silicon Saxony/ SEMI

WP8 SEMI

Table 2: Lead partners per WP

The Work Package Teams (WPT) are assigned with the implementation of the project.

The Work Package Teams are to be agreed internally by each partner and communicated to the

coordinator. The complete list of WP teams will be uploaded in CIRCABC and will be included in D8.3

Project Management Plan. In case of staff changes, the partners will inform the coordinator as soon as

possible.

7

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Internal communication systems The partners will meet physically every 6 months, with the exact date of the meetings depending on the

needs and the progress of the project. The indicative months when the meetings will take place are: M1,

M8, M15, M23, M32, M41 and M48.

An online document repository is established on CIRCABC. All Steering Board members have access to

the project’s materials that will be uploaded there. SB members can also grant access to CIRCABC to

their colleagues, after informing the coordinator.

Moreover, the coordinator will update the METIS Steering Board via email and monthly Skype calls. The

Skype calls will take place indicatively in the last 10 days of each month (to be defined on a case-by-case

basis) and the WP leaders will update the respective WP teams via email and calls as they see fit.

Launching and coordination of the various project plans By the end of M3 (January 2020), three project plans will be delivered: The Quality Control Plan (WP5,

lead partner CIMEA), the Dissemination & Exploitation Plan (WP6, lead partner SEMI) and the Project

Management Plan (WP8, lead partner SEMI).

The lead partners of the above-mentioned WPs will circulate the first draft version of the Plans to the

WP team by 10th January 2020. The plans will have the form of a report, following the METIS deliverable

template. The second draft of the Plans will be circulated to the WP teams and the METIS Steering Board

by 20th January 2020. The three Plans will be finalized by 31st January 2020.

CIMEA will also take the lead in establishing the External Quality Committee composed of associated

partners.

Mobilizing associated partners and policy counterparts Currently, there are 28 associated partners in METIS. Partners are invited to mobilize associated

partners that would be suited to participate in the project (associations, umbrella organisations, civil

society, industry, VET systems representatives, etc.) and alert the coordinator. Discussion on prospective

associated partners will take place in the calls and meetings of the METIS Steering Board (the first

discussion will be part of the January 2020 Steering Board call).

Associated Partners will stay informed about the public outcomes of the project (i.e. events, press

releases), which they will be free and encouraged to disseminate through their online and offline

channels. Moreover, the associated partners, as members of the External Advisory Group, will provide

specific feedback on the implementation of the project (WP5). Associated partners will also be involved

in the Test & Validation phase of the METIS training (WP4) and as stakeholders in the Microelectronics

Observatory and Skills Council (WP8).

8

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Partner Organisation Country Type of Organisation

1 Fraunhofer IPMS Germany R&D

2 ST Microelectronics France Business

3 ASML Netherlands Business

4 ASM International Netherlands Business

5 AENEAS: Association for European NanoElectronics ActivitieS

France Industrial Association

6 CEA Tech France R&D

7 Soitec France Business

8 SPTS UK Business

9 Edwards UK Business

10 Fabmatics Germany Business

11 Recif Technologies France Business

12 Evatec Advanced Technologies Switzerland Business

13 VAT Switzerland Business

14 Siltronic Germany Business

15 VDMA – EMINT (German Engineering Association: Electronics, Micro and Nano Technologies Division)

Germany Industry Association

16 Trade Union: Comitato Sindicale Interregionale FVG

Italy EPLUS-SOCIAL

17 National Institute for Public Policy Analysis (INAPP)

Italy Research body of Ministry of Labour, responsible for analysis, monitoring and evaluation of labour market, education and training, social policies impacting the labour market

18 Eurotech Italy Industry

19 Cluster “Microelectronics & Industrial Electronics Systems”

Bulgaria Cluster of all Bulgarian enterprises in microelectronics

20 INES Solaire – Formation France VET provider in photovoltaics, energy efficiency, renewable energies

21 Grenoble INP with CIME Nanotech France Interuniversity centre for training in nanoelectronics and nano-bio electronics

22 Irish Business and Employers Federation (IBEC)

Ireland National Representation for Irish Industry

23 Technology Ireland Ireland Representing the Technology Sector in Ireland

24 Education and Training Boards Ireland (ETBI)

Ireland Coordinating the national delivery of FET in Ireland

25 Engineers Ireland Ireland Professional Body for Engineers in Ireland

26 Friuli Venezia Giulia Autonomous Regional Government

Italy EPLUS-BODY-PUB-REG

9

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

27 Electronic Coast Norway Industry association and competence cluster

28 Tempus Public Foundation – Higher Education Department for Erasmus Mundus Joint Master Degrees and for Erasmus+ Capacity Building / Knowledge Alliances

Hungary NGO established in 1996 by the Government to manage international cooperation programmes and special projects in education & training

Table 3: Associated Partners as of December 2019

Throughout the course of the project, SEMI with the support of the other partners, will liaise with key

policy counterparts on EU, national, regional and local levels, to make METIS visible and align the project

with other similar initiatives.

10

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

4. METIS Roadmap per Work Package The roadmap includes a short overview of each WP, and a timeline of tasks (in white boxes) and

deliverables (in grey boxes). You can find the corresponding calendar months in the table annexed to

this document.

Work Package 2 (EU Sectoral Skills Strategy, Skills Anticipation and Monitoring)

In WP2 the partners will develop the microelectronics sector skills strategy to support the objectives of

the established growth strategy for the sector. To accomplish this, the partners will identify the major

trends affecting jobs and skills needs in the sector, develop a common methodology to assess the

current situation and anticipate future skills needs, define and/or develop occupational profiles with

corresponding skills and competences and set up continuous and robust monitoring on a yearly basis.

M2-M7

Development of the

common methodology

M6-M17

Identification of trends

for skills development

of the EU

microelectronics sector

M6-M17

Skills anticipation

and definition of

occupational

profiles

M9-M17

Development of METIS

Skills Strategy

M22-3, M34-5, M46-7

Yearly Monitoring

M7

D2.1 Common methodology

M17

D2.2 Skills and Occupational Profiles

for Microelectronics

M17

D2.3 METIS Skills Strategy

including fiches

M22, M35, M47

D2.4 Yearly Monitoring Reports

11

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 3 (Design Innovative METIS Training)

The objective of WP3 is to develop the METIS curriculum and training on a) electronic components

design, b) electronic systems design, c) basics of electronics manufacturing, and d) key competences &

innovative thinking.

M15-M19

Definition of learning objectives

and learning outcomes

M18-M29

Development of

the structure of

the curriculum

M18-M29

Development of

the online and

offline content

M27-32

Development of the

path to certification

and recognition

M27-M32

Development of the

METIS Skills

Passport, Europass

and EURES Suite

M29

D3.1 METIS Curriculum & Training

M32

D3.2 METIS Certification and

Recognition Model

M32

D3.3 METIS Skills Passport,

Europass and EURES Suite

M27-M29

Development of the “trainers’ manual”

12

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 4 (METIS Training Delivery: Validation and Fine-Tuning)

During the WP4, the partners will test and validate in real-life scenarios the METIS Curricula and Training

developed in WP3 in real-life scenarios, to check their effectiveness against the outcomes of WP2

(Occupational profiles and Skills Strategy). The validation will lead to the final version of the METIS

curriculum and training, based on feedback of users in both VET and industry at both trainers’ and

trainees’ levels.

The testing will be carried out by all industry and academia partners, as well as by associated partners –

aiming at least at 900 users.

M32-M35

Developing the METIS

T&V Plan

M44-M48

Finalisation of the

METIS Curriculum and

Training

M35-45

Collection of users’

feedbacks for the

validation report

M35-M45

Delivery of the METIS

Curriculum and

Training

M45

D4.2 Validation

Report

M35

D4.1 Test & Validation

Plan

M45

D4.3 Final METIS

Curriculum & Training

M46-M48

Development of

guidelines for

mainstreaming and

uptake of the METIS

Curriculum

M45

D4.4 METIS Mainstreaming

Guidelines

13

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 5 (Quality Assurance and Evaluation)

The objective of WP5 is to monitor all activities carried out and results produced during the project and

evaluate them against project objectives. The Internal QA Committee is composed of one member per

partner (the WP5 team) and the External METIS Quality Committee will be comprised of Associated

Partners to ensure objective quality control.

M1-M3

Development of the METIS

Quality Assurance Plan

M12, M24, M36, M48

M&E & QA Reporting

M1-M48

M&E & QA Activities

M12, M24, M36

D5.2 Interim internal

quality Reports

M3

D5.1 METIS Quality Plan

M24

D5.3 Mid-term

external quality Report

M48

D5.4 Final external

quality Report

M48

D5.5 Final METIS

quality Report

14

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 6 (Dissemination & Exploitation)

The dissemination and exploitation of the activities and outcomes of the project will reach

approximately 3 million people, inside and outside the consortium (industry, education, learners, policy

makers at local, regional, national and European level). The objective is for the results of METIS to be

communicated both during and after the implementation of the project.

M1-M3

Development of the

Dissemination &

Exploitation Plan

M6, M12, M189, M24,

M30, M36, M42, M48

M&E & QA Reporting

M1-M48

Development and

maintenance of the

METIS Website and

Platform

M12, M24, M36

D6.3 Interim dissemination

& exploitation Reports

M3

D6.1 METIS

Dissemination &

Exploitation Plan

M48

D6.4 Final dissemination &

exploitation Report

M1-M48

Dissemination activities

M1-M48

Exploitation activities

M3

D6.2 METIS Website

and Platform

15

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 7 (Long Term Action Plan and Microelectronics Observatory & Skills

Council)

The WP7 teams will establish sustainable mechanisms to promote the messages of METIS beyond the

end of the project. In this framework, the Microelectronics Observatory & Skills Council will be created,

enabling stakeholders internal and external to the project to come together and shape the future of the

sector.

M32-M48

Development and adoption

of the Long-Term Action Plan

M48

D7.2 Microelectronics Observatory and Skills

Council

M48

D7.1 METIS Long-Term Action

Plan

M32-M48

Development and establishment of the

Microelectronics Observatory and Skills Council

16

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

Work Package 8 (Project Management) WP8 tasks will ensure the correct management and oversight of METIS, establishing coherent methods

and tools so that the implementation of the project runs smoothly. Additional emphasis will be placed

on ensuring the fluid communication between partners and WP teams, as well as with EACEA.

M1-M3

Finalisation of the

Project Management

Plan

M1, M8, M15, M23,

M32, M41 (indicative)

D8.2 Minutes of

Project Meetings

M7, M13, M19, M25, M31, M37, M43

D8.3 Six-Month Internal Reports

M3

D8.1 METIS Project

Management Plan

M48

D8.4 Final METIS Project

Report

M1-M48

Operational & Technical

Coordination

M1-M48

Administrative and

Financial Coordination

17

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

5. Annex Table of calendar months of the METIS project cycle

M1 November 2019

M2 December 2019

M3 January 2020

M4 February 2020

M5 March 2020

M6 April 2020

M7 May 2020

M8 June 2020

M9 July 2020

M10 August 2020

M11 September 2020

M12 October 2020

M13 November 2020

M14 December 2020

M15 January 2021

M16 February 2021

M17 March 2021

M18 April 2021

M19 May 2021

M20 June 2021

M21 July 2021

M22 August 2021

M23 September 2021

M24 October 2021

M25 November 2021

M26 December 2021

M27 January 2022

M28 February 2022

M29 March 2022

M30 April 2022

M31 May 2022

M32 June 2022

M33 July 2022

M34 August 2022

M35 September 2022

M36 October 2022

M37 November 2022

M38 December 2022

M39 January 2023

M40 February 2023

M41 March 2023

M42 April 2023

M43 May 2023

18

Microelectronics Training, Industry and Skills (METIS) project number 612339-EPP-1-2019-1-DE-EPPKA2-SSA-B under the action

Sector Skills Alliances in vocational educational education and training Grant Agreement number 612339-EPP-1-2019-1-DE-

EPPKA2-SSA-B

M44 June 2023

M45 July 2023

M46 August 2023

M47 September 2023

M48 October 2023