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Deadly Condensation –Reliability Tests of Electronic Components by Micro Sensors
Tödliche Kondensation–Zuverlässigkeitstests mit Mikrosensoren
A.Steinke*, B.March*
2
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Summary
0 Introduction
1 Dangerous of Condensation
2 Reliability relevant Challenges
3 Micro Condensation Sensor
4 Field Tests and Results
Deadly Condensation –Reliability Tests of Electronic Components by Micro Sensors
3
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
CiS Forschungsinstitut für Mikrosensorik und Photovoltaik Erfurt
0 Introduction
4
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
0
0.1
0.2
0.3
0.4
0.5
0.6
300 400 500 600 700 800 900
Res
pons
ivity
in A
/W
wavelenght in nm
rev. bias=10mV - blue
rev. bias=5V - green
rev. bias=20V - red
Simulation and design
Design
Silicon-Waferprocessing
Device characterizationand Calibration
Assembly
ASIC
ASIC
ASIC
Modulare Components
Batch process based technological platforms - solution for product innovation
0 Introduction
5
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
SiMonitor diodeLEDsGlass ceramicmedium
Messobjekt
pin-diode
Example for microoptoelectronical Sensor-Platform
Pulse Oximetry
Microfluidic Lab-on-ChipFluorescence
Si-Chip
Heptan-Füllung
Gasblase
Libellen-Glas
Inclination
Turbidity
0 Introduction
6
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
0
0.1
0.2
0.3
0.4
0.5
0.6
300 400 500 600 700 800 900
Res
pons
ivity
in A
/W
wavelenght in nm
rev. bias=10mV - blue
rev. bias=5V - green
rev. bias=20V - red
Simulation and design
Design
Silicon-Waferprocessing
Device characterizationand Calibration
Assembly
ASIC
ASIC
ASIC
Modulare Components
Batch process based technological platforms - - solution for product innovation
0 Introduction
7
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
0.000
200.0
[µm]
495.0
[µm]
-275.00
-293.75
-312.50
-331.25
-350.00
[µm]
SiO2+Passivierung
n-- Epitaxie-Layer
Silizium n- Substrat
n+
AlSi
p+ n+
AlSi
p+
ExampleExample forfor PiezoresistivePiezoresistive PlatformPlatform
PressurePressure HumidityHumidity
bimorphbimorph
pHpH
HydrogeleHydrogele
MembraneMembrane CantileverCantilever
0 Introduction
8
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
0
0.1
0.2
0.3
0.4
0.5
0.6
300 400 500 600 700 800 900
Res
pons
ivity
in A
/W
wavelenght in nm
rev. bias=10mV - blue
rev. bias=5V - green
rev. bias=20V - red
Simulation and design
Design
Silicon-Waferprocessing
Device characterizationand Calibration
Assembly
ASIC
ASIC
ASIC
Modulare Components
Batch process based technological platforms - - solution for product innovation
0 Introduction
9
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Product Developments based on CCC*-Sensor
ApplicationMeasurement of Dew Point of Concrete and Masonry/Brickwork
ApplicationMeasuring System forhigh Humidity Range (>95%)
ApplicationEnergy optimized HumidityControl in Air Conditioners byDew Point Measurement
ApplicationMeasuring System forRelative Humidity <5% and Mixing Ratio of 2...4g/kg
ApplicationMeasurement of Conden-sation on Electronic PrintedBoards
ApplicationAvoiding of Condensationon Chilled Beam, Glas,...
Example for Impedimetric Platform
0 Introduction
10
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
1 Dangerous of Condensation
Complexity of sensors and electronics Trends in assembly and packaging
New riskfor long term stability of electronic components
Source: SIEMENS, SENSOR 2005, I&M Workshop
Miniaturization of lines and spacesMiniaturization of pitch widthIncreasing complexity of devicesMultilayer and microvia technologyAlternative solder paste alloys and substrate materialsNon-protection of PCB ???!!!!
Trends in electronic circuits
High resistivityHigh density on electronic devices……
11
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
1 Dangerous of Condensation
Source:ADACmotorwelt 5/2008
Source: ADAC motorwelt 5/2009
Pannenstatistik 2008
12
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
1 Dangerous of Condensation
Courtesy: ESPEC Corp.
Material factor 2PCB
Material factor 4Solder
Material factor 5Package
Materialfactor 1PlatingDew condensation
Material factor 3Flux
Environmental factor 3
MoistureEnvironmental factor 2
Environmental factor 1 Stress voltage
13
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
With condensation new riskfor long term stability of electronic components
accelerated by
>potential difference>field strength>Insufficient isolation (temporary)
1 Dangerous of Condensation
Corrosion of • surface• conductive tracks• chip metallization
but since
dew condensat in combination with contamination
14
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Corrosion on the top of the PCB
after 5 dewing cycles
after 15 dewing cycles
Failures caused by Dewing Tests
Courtesy:BMW AG
1 Dangerous of Condensation
15
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Failures caused by Dewing Tests
1 Dangerous of Condensation
Courtesy:FABS Erlangen
16
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
22 Reliability relevant Challenges
Environmental climate tests in test chambers e.g.
>temperature and humidity cycle tests>constant high humidity tests>low/high temperature tests>water resistant tests>salt water spray tests
Failure in electronic boards
Typical diagnosis:
KFG „Kein Fehler gefunden“ (now failure found)
Methods are necessary to reduce qualification efforts+
Improve the quality of electronic components by early failure recognition
TCTPCTMCTHHTHTS
17
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
2 Reliability relevant Challenges
JASO D 001JASO D 001--94:94:
TemperatureTemperature chamberchamber --5 5 ±± 22°°CC 2 2 ±± 0,5h0,5h
ClimateClimate test test chamberchamber 35 35 ±± 22°°CC 85 85 ±± 5%rF5%rF 10min10min
Temperaturen Temperaturen rampramp (BMW):(BMW):
ClimateClimate test test chamberchamber 10......7010......70°°CC 98....100%rF98....100%rF 3,5h3,5h
IEC 60068IEC 60068--22--30:30:
ClimateClimate test test chamberchamber 25......8025......80°°CC 95....100%rF95....100%rF 5h5h
ISO/DIS 16750ISO/DIS 16750--3 Test 3:3 Test 3:
Basis: IEC 60068Basis: IEC 60068--22--3030
ClimateClimate-- Simulation Simulation forfor DewingDewing TestTest
18
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
2 Reliability relevant Challenges
Dewing on basisISO/DIS 16750-4
19
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
2 Reliability relevant Challenges
+25
Relative hum
idity%
RH
100
90
80
70
60
Start of temperaturefall
End of temperaturerise
Time
+28
+22
5 h1 cycle
50 ½ h
100
95
DryingCondensation
½ h
3/41 ½
3/42
½ h
3/4
½ h
½ h
+82
*78
Dewing on basisIEC 60068-2-30
Source: FAKRA
coolingelement
Sensor area incl.- detection system- transducer
integrated signal processor
heat sinkmounting plate
sensor- environment
controller
interface
4 - 20 mA
Direct Measurement:Temperature PCBDew Point Temperature
20
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
But the main question is:
• Did or does a dew condensation take place ?
• What quantity of dew condensation has accumulated?
• How long does the state of the dew condensation last?
2 Reliability relevant Challenges
To answer these questions you have
> to measure the quantity of water condensation at different positions in a vehicle
>to reproduce dew condensation at the same level in a climate test chamber
21
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
2 Reliability relevant Challenges
Necessary features of the micro sensor:
⇒miniaturized suitable for assembly at different placesin the vehicle
⇒ low thermal mass for short respond
⇒ low power consumption to avoid thermic cross sensitivity
⇒ high reproducibility of the measured parameter
⇒ long term stability e.g. high chemical resistance to acid,alkaline, solvents
⇒ easy to calibrate
⇒ parameter to measure temperature of air and close to the surfacerelative humidity of air, on top of PCBquantity of condensation (water mass)
22
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
CCC-Sensor, Modelling & Design
CCC- condensate controlled capacitance according HEINZE
SPICE model of stray field capacityDesign of IDE with different line to line space
3 Advanced Micro Condensation Sensor
23
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
3 Advanced Micro Condensation Sensor
0 5 10 15 20 25 30 35 40
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
Output signal of the sensor assembly as a function of the amount of water
freq
uenc
y [H
z]
amount of water (average) [µg/mm^2]
24
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
The smart system of the condensation sensor
Detectioncomponents
Transducercomponents
Signal-pre-processing
Signalprocessing
Calibrationprogram
Interface
Condensation IDE C/f-converter Linearization Adjusting Output signal
3 Advanced Micro Condensation Sensor
25
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
4 Field Tests and Results
CourtesyCourtesy: BMW AG: BMW AG
behind the combi instrument
behind the board monitor
within the car climate
under the roof
behind the GPS
within the Audio Box
test result inside the car:max. water mass 12...16µg/mm2
4.14.1 Tests at different Tests at different partsparts of of thethe carcar
26
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 CourtesyCourtesy: OPEL: OPEL
test result inside the car: 15µg/mm2
4 Field Tests and Results
Tests at different Tests at different partsparts of of thethe carcar
27
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 21.07.2006 Quelle: FAKRA/DELPHIQuelle: FAKRA/DELPHI
4 Field Tests and Results
4.24.2 Tests in Tests in thethe climateclimate test test chamberchamber
28
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 21.07.2006 CourtesyCourtesy: FEUTRON: FEUTRON
4 Field Tests and Results
4.24.2 Tests in Tests in thethe climateclimate test test chamberchamber
29
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Challenge: Realization of 0-20µg/mm2 between 10° and 70°C
BMW GS 95011-4
0
20
40
60
80
100
120
Zeit 14h
Tem
pera
tur [
*C] /
rel.
Feuc
hte
[%]
% rel. Feuchte: soll% rel. Feuchte: ist*C Betauen: soll*C Betauen: ist
*C Temperatur: soll*C Temperatur: ist
0
5
10
15
µg/m
m²
IEC 60068-2-30
0
20
40
60
80
100
120
Zeit 10 h
Tem
pera
tur [
*C] /
rel.
Feuc
hte
[%]
rel. Feuchte: sollrel. Feuchte: istTemperatur: sollTemperatur: ist
0
5
10
15
µg/m
m²
SourceSource: FAKRA/BMW: FAKRA/BMW
4 Field Tests and Results
4.24.2 Tests in Tests in thethe climateclimate test test chamberchamber
30
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 Courtesy:FABS Erlangen
4.3 Test Pattern
Design of TestboardComb pattern (line space 0,2 mm,0,3 mm, 0,4 mm)Online data acquisition of current (comb pattern)Ceramic capacitors (optical analysis)Adjustment of thermal behavior by metal plates
Influencing factors Cleaning of boards according toIPC TM-650Surface metallization: pure copper andtin-platedTest voltage: 7 V and 10 VFull factorial design of experiments:2³ = 8 Alternatives and 3 line spaces
4 Field Tests and Results
31
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 Courtesy: FABS Erlangen
0
10
20
30
40
50
60
µA
80
Cur
rent
0 2 4 6 8 10 12 14 16 18 20 h 240
2
4
6
8
10
12
µg/mm²
16
Time
Con
dens
atio
n
Online-Measurement of Comb Pattern
CurrentSignificant increase of current caused by CondensationContinuous raise of standby currentEvaluation criteria: maximum of current during test period
4 Field Tests and Results
32
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009 Courtesy: FABS Erlangen
0
5
10
15
20
25
30
µA
40
Cur
rent
Ste
p
0 2 4 6 8 10 12 14 16 18 20 h 240
2
4
6
8
10
12
µg/mm²
16
Time
Con
dens
atio
n
Online-Measurement of Comb Pattern
Current StepDetection of short-cuts caused by dendritsCorrelation with phases of condensationEvaluation criteria: first step of current > 10 µA
4 Field Tests and Results
4.3 Test Pattern
33
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Conclusion
> first time quantitative measurement of condensat mass
> calibrated output signal of water mass
> suitable for field measurement
> support for R&D and production of high integrated PCBs
34
Workshop Mikrosystemtechnik und Mikroelektronik in Sachsen und Thüringen, Zwickau, 14.Mai 2009
Thanks for your attention!