DDR2 Tech Details

8/11/2019 DDR2 Tech Details

1/18


2/18

PDF: 09005a ef80e5e752/Source : 09005a ef80e5e626 Micron Technolog y, Inc., reserves t he rig ht to cha ng e pro ducts or specif ica t ions w ithout no t ice.

HTF18C64_128_256x72.fm - Rev. E 3/07 EN 2 2003 Micron Technolo gy, Inc. All rights reserved.

512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMFeatures

Notes : 1. Da ta sheets for the base dev ices can be found on Micron s Web site .

2. All part numbers end w ith a tw o-place code (not show n), designat ing compon ent and PCB

revisions. Con sult fa cto ry fo r curren t re vision cod es. Exa mp le: MT18HTF6472Y-667D2.

Table 2: Addressing

512MB 1GB 2GB

Refresh count 8K 8K 8K

Row add ress 8K (A0A12) 16K (A0A13) 16K (A0A13)

Device ban k add ress 4 (BA0, BA1) 4 (BA0, BA1) 8 (BA0, BA1, BA2)

Device pag e size per ba nk 1KB 1KB 1KB

Device configura tion 256Mb (64 Me g x 4) 512Mb (128 Me g x 4) 1G b (256 Me g x 4)

Column a ddress 2K (A0A9, A11) 2K (A0A9, A11) 2K (A0A9, A11)

Module rank add ress 1 (S0#) 1 (S0#) 1 (S0#)

Table 3: Part Numbe rs and Timing Parame ters 512MB Modu les

Ba se d evice: M T47H64M4,1256Mb DDR2 SDRAM

Part Number2 ModuleDensity

Configuration ModuleBandwidth

Memory Clock/Data Rate

Latency(CL-tRCD-tRP)

MT18HTF6472Y-53E__ 512MB 64 Meg x 72 4.3 GB/s 3.75ns/533 MT/s 4-4-4

MT18HTF6472Y-40E__ 512MB 64 Meg x 72 3.2 GB/s 5.0ns/400 MT/s 3-3-3

Table 4: Part Num bers and Timing Param ete rs 1GB Modu les

Ba se d evice: M T47H128M4,1512Mb DDR2 SDRAM

Part Number2 ModuleDensity

Configuration ModuleBandwidth



MT18HTF12872(P)Y-80E__ 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5

MT18HTF12872(P)Y-800__ 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6




Table 5: Part Numbe rs and Timing Param ters 2GB Modu les

Ba se d evice: M T47H256M4,11Gb DDR2 SDRAM

Part Numbe r2 ModuleDensity

Configuration ModuleBandwith





MT18HTF25672(P)Y-667__ 2GB 256 Meg x 72 5.3 GB/s 3.0ns/667 MT/s 5-5-5MT18HTF25672(P)Y-53E__ 2GB 256 Meg x 72 4.3 G B/s 3.75ns/533 MT/s 4-4-4



3/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMPin Assignments and Descriptions

Pin Assignm ents and Descriptions

Notes : 1. P in 54 is NC for 512MB and 1GB or BA2 for 2GB.

2. Pin 55 is NC for non-parity and ERR_OUTfo r parity.

3. Pin 68 is NC for non-parity and P AR_INfo r parity.

4. Pin 196 is NC for 512MB or A13 fo r 1GB and 2GB.

Table 6: Pin Assignm ent s

240-Pin RDIMM Front 240-Pin RDIMM Back

Pin Sym bol Pin Sym bol Pin Sym bol Pin Sym bol Pin Sym bol Pin Sym bol Pin Sym bol Pin Sym bol

1 VREF 31 DQ19 61 A4 91 VSS 121 VSS 151 VSS 181 VDD Q 211 DQS14

2 VSS 32 VSS 62 VDD Q 92 DQS5# 122 DQ4 152 DQ28 182 A3 212 DQS14#

3 DQ0 33 DQ24 63 A2 93 DQS5 123 DQ5 153 DQ29 183 A1 213 VSS

4 DQ1 34 DQ25 64 VDD 94 VSS 124 VSS 154 VSS 184 VDD 214 DQ46

5 VSS 35 VSS 65 VSS 95 DQ42 125 DQS9 155 DQS12 185 CK0 215 DQ47

6 DQS0# 36 DQS3# 66 VSS 96 DQ43 126 DQS9# 156 DQS12# 186 CK0# 216 VSS

7 DQS0 37 DQS3 67 VDD 97 VSS 127 VSS 157 VSS 187 VDD 217 DQ52

8 VSS 38 VSS 683 NC/

PAR_IN

98 DQ48 128 DQ6 158 DQ30 188 A0 218 DQ53

9 DQ2 39 DQ26 69 VDD 99 DQ49 129 DQ7 159 DQ31 189 VDD 219 VSS

10 DQ3 40 DQ27 70 A10 100 VSS 130 VSS 160 VSS 190 BA1 220 RFU

11 VSS 41 VSS 71 BA0 101 SA2 131 DQ12 161 CB4 191 VDD Q 221 RFU12 DQ8 42 CB0 72 VDD Q 102 NC 132 DQ13 162 CB5 192 RAS# 222 VSS

13 DQ9 43 CB1 73 WE# 103 VSS 133 VSS 163 VSS 193 S0# 223 DQS15

14 VSS 44 VSS 74 CAS# 104 DQS6# 134 DQS10 164 DQS17 194 VDD Q 224 DQS15#

15 DQS1# 45 DQS8# 75 VDD Q 105 DQS6 135 DQS10# 165 DQS17# 195 ODT0 225 VSS

16 DQS1 46 DQS8 76 S1# 106 VSS 136 VSS 166 VSS 1964 NC/A13 226 DQ54

17 VSS 47 VSS 77 ODT1 107 DQ50 137 RFU 167 CB6 197 VDD 227 DQ55

18 RESET# 48 CB2 78 VDD Q 108 DQ51 138 RFU 168 CB7 198 VSS 228 VSS

19 NC 49 CB3 79 VSS 109 VSS 139 VSS 169 VSS 199 DQ36 229 DQ60

20 Vss 50 VSS 80 DQ32 110 DQ56 140 DQ14 170 VDDQ 200 DQ37 230 DQ61

21 DQ10 51 VDD Q 81 DQ33 111 DQ57 141 DQ15 171 CKE1 201 VSS 231 VSS

22 DQ11 52 CKE0 82 VSS 112 VSS 142 VSS 172 VDD 202 DQS13 232 DQS16

23 VSS 53 VDD 83 DQS4# 113 DQS7# 143 DQ20 173 NC 203 DQS13# 233 DQS16#

24 DQ16 541 NC/BA2 84 DQS4 114 DQS7 144 DQ21 174 NC 204 VSS 234 VSS

25 DQ17 552 NC/

ERR_OUT

85 VSS 115 VSS 145 VSS 175 VDDQ 205 DQ38 235 DQ62

26 VSS 56 VDD Q 86 DQ34 116 DQ58 146 DQS11 176 A12 206 DQ39 236 DQ63

27 DQS2# 57 A11 87 DQ35 117 DQ59 147 DQS11# 177 A9 207 VSS 237 VSS

28 DQS2 58 A7 88 VSS 118 VSS 148 VSS 178 VDD 208 DQ44 238 VDDSPD

29 VSS 59 VDD 89 DQ40 119 SDA 149 DQ22 179 A8 209 DQ45 239 SA0

30 DQ18 60 A5 90 DQ41 120 SCL 150 DQ23 180 A6 210 VSS 240 SA1


4/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMPin Assignments and Descriptions

Table 7: Pin Descriptions

Symbol Type Description

ODT0 Input

(SSTL_18)

On-die te rmination : ODT(registered HIGH) enab les termina tion resista nce interna l to th eDDR2 SDRAM. When ena bled, ODTis only a pplied to the fo llow ing pins: DQ, DQS, DQS#,

an d CB. The ODTinput w ill be igno red if d isab led via the LOAD MODE comma nd.

CK0, CK0# Input

(SSTL_18)

Clock: CK an d CK# are diff erentia l clock inputs. All add ress and control input signa ls aresampled on the crossing of t he posit ive edg e of CK and nega t ive edg e of CK#. Output da ta

(DQs a nd DQS/DQS#) is refe renced to th e crossing s of CK an d CK#.

CKE0 Input

(SSTL_18)

Clock enable : CKE (reg iste red HIGH) activat es an d CKE (reg iste red LOW) de a ctivat esclocking circuitry o n t he DDR2 SDRAM.

S0# Input

(SSTL_18)

Chip select: S# enab les (registered LOW) and disab les (registered HIGH) the comm an ddecoder.

RAS#, CAS#,

WE#

Input

(SSTL_18)

Command inputs: RAS#, CAS#, an d WE# (alon g w ith S#) de fine t he com ma nd beingentered.

BA0, BA1

(512MB, 1GB )

BA0, BA1, BA2

(2GB)

Input

(SSTL_18)

Bank address inputs: BA0BA1/BA2 def ine th e d evice b a nk t o w hich a n ACTIVE, READ,WRITE, o r PRECHARGE com ma nd is be ing a pplie d. BA0BA1/BA2 d ef ine w hich m od e

reg iste r, including MR, EMR, EMR(2), a nd EMR(3), is loa de d during th e LOAD MOD E

command.

A0A12

(512MB)

A0A13

(1GB, 2GB)

Input

(SSTL_18)

Address inputs: Provide the row ad dress fo r ACTIVE comm an ds, and the column a dd ressan d au to precharg e b it (A10) for READ/WRITE com ma nds, to select o ne location out of the

mem ory a rray in th e respective b an k. A10 sam pled d uring a PRECHARGE comm an d

de te rmines w he th er th e PRECHARGE applies to o ne d evice ba nk (A10 LOW, device ba nk

select ed by BA0BA1/BA2) or a ll device b a nks (A10 HIGH). The a d dre ss inpu ts a lso pro vide

the op-cod e during a LOAD MODE comma nd.

PAR_IN Input

(SSTL_18)

Parity bit fo r the a ddress and control bus.

SCL Input Serial clock f or presence-detect: SCL is used to synchronize t he presence-det ect d at atransfer to an d from the module.

SA0SA2 Input Presence-detect address inputs: These pins are used t o con figure the presence-de tectdevice.

RESET# Input

(LVCMOS)

Asynchron ou sly f orces a ll reg iste red ou tpu ts LOW w hen RESET# is LOW. This sig na l can be

used d uring pow er-up t o ensure tha t CKE is LOW and DQs are High-Z.

DQS0DQS17,

DQS0#DQS17#

I/O

(SSTL_18)

Data strobe : Output with read da ta , input w ith w rite d at a f or source synchrono usoperat ion. Edg e-aligne d w ith read d ata , center-aligned w ith w rite d at a . DQS# is only used

w hen d if ferent ia l da ta strobe m ode is enab led via t he LOAD MODE command .

DQ0DQ63 I/O

(SSTL_18)

Data inpu t/out put: Bidirectional data bus.

CB0CB7 I/O

(SSTL_18)

Check bits.

SDA I/O Serial presence-detect data : SDA is a b idirectiona l pin used to tra nsfer ad dresses andda ta into a nd out o f the presence-dete ct port ion of the mo dule.

ERR_OUT Output

(open drain)

Parity error found o n the ad dress and control bus.

VDD /VDDQ Supply Pow er supply: 1.8V 0.1V.

VREF Supply SSTL_18 ref ere nce vo lta g e.

VSS Supply Ground.

VDDSPD Supply Serial EEPROM positive pow er supply: + 1.7V to + 3.6V.

NC No connect: These pins should be left unconne cted.

DNU Do not use.


5/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMFunctional Block Diagram

Functiona l Block DiagramFigure 2: Functiona l Block Diagram

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ 0

DQ 1

DQ 2

DQ 3

U1

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ 4

DQ 5

DQ 6

DQ 7

U2 2

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ 8

DQ 9

DQ10

DQ11

U2

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ12

DQ13

DQ14

DQ15

U2 1

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ16

DQ17

DQ18

DQ19

U3

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ20

DQ21

DQ22

DQ23

U2 0

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ24

DQ25

DQ26

DQ27

U4

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ28

DQ29

DQ30

DQ31

U1 9

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ32

DQ33

DQ34

DQ35

U9

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ36

DQ37

DQ38

DQ39

U1 6

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ40

DQ41

DQ42

DQ43

U1 0

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ4 4

DQ4 5

DQ4 6

DQ4 7

U1 5

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ48

DQ49

DQ50

DQ51

U1 1

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ52

DQ53

DQ54

DQ55

U1 4

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ56

DQ57

DQ58

DQ59

U1 2

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

DQ60

DQ61

DQ62

DQ63

U1 3

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

CB4

CB5

CB6

CB7

U1 8

DM CS# DQS DQS#

DQ

DQ

DQ

DQ

CB0

CB1

CB2

CB3

U5

A0

SPD EEPROM

A1 A2

SA0 SA1 SA2

SDASCL

WP

PLLCK0

CK0#

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

DDR2 SDRAM x 2

Register x 2

RESET#

U8

VREF

VSS

DDR2 SDRAM

DDR2 SDRAM

VDD /VDD Q

VDDSPD SPD EEPROM

DDR2 SDRAMU 7

U6, U17

VSS

RS0# DQS0DQS0#

DQS1DQS1#

DQS2DQS2#

DQS3DQS3#

DQS4DQS4#

DQS5DQS5#

DQS6DQS6#

DQS7DQS7#

DQS8DQS8#

DQS9DQS9#

DQS10DQS10#

DQS11DQS11#

DQS12DQS12#

DQS13DQS13#

DQS14DQS14#

DQS15DQS15#

DQS16DQS16#

DQS17DQS17#

Re

g

is

te

r

PAR_IN

S0#

BA0B A1/BA2

A0A12/A13

RAS#

CAS#

WE#

CKE0

ODT0

RESET#

ERR_OUT

RS0#: DDR2 SDRAM

RBA0RBA1/RBA2: DD R2 SDRAM

RA0RA12/RA13: DD R2 SDRAM

RRAS#: DDR2 SDRAM

RCAS#: DDR2 SDRAM

RWE#: DDR2 SDRAM

RCKE0: DDR2 SDRAM

RODT0: DDR2 SDRAM

VSS


6/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMGeneral Description

General DescriptionThe MT18HTF6472, MT18HTF12872(P), and MT18HTF25672(P) DDR2 SDRAM modulesare high-speed, CMOS, dynamic random-access 512MB, 1GB, and 2GB memorymodules organized in a x72 configuration. These DDR2 SDRAM modules use internally

configured 4-bank (256Mb, 512Mb) or 8-bank (1Gb) DDR2 SDRAM devices.

DDR2 SDRAM modules use double data rate architecture to achieve high-speed opera-tion. The double data rate architecture is essentially a 4n-prefetch architecture with aninterface designed to transfer two data words per clock cycle at the I/O pins. A singleread or write access for the DDR2 SDRAM module effectively consists of a single 4n-bit-

wide, one-clock-cycle data transfer at the internal DRAM core and four correspondingn-bit-wide, one-half-clock-cycle data transfers at the I/O pins.

A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, foruse in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAMdevice during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs.

DDR2 SDRAM modules operate from a differential clock (CK and CK#); the crossing ofCK going HIGH and CK# going LOW will be referred to as the positive edge of CK.Commands are registered at every positive edge of CK. Input data is registered on bothedges of DQS, and output data is referenced to both edges of DQS, as well as to bothedges of CK.

Register and PLL Operation

DDR2 SDRAM modules operate in registered mode, where the command/address inputsignals are latched in the registers on the rising clock edge and sent to the DDR2 SDRAMdevices on the following rising clock edge (data access is delayed by one clock cycle). Aphase-lock loop (PLL) on the module receives and redrives the differential clock signals(CK, CK#) to the DDR2 SDRAM devices. The register(s) and PLL reduce address,

command, control, and clock signal loading by isolating DRAM from the systemcontroller. PLL clock timing is defined by JEDEC specifications and ensured by use of theJEDEC clock reference board. Registered mode will add one clock cycle to CL.

Serial Presence-Detect Operation

DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function isimplemented using a 2,048-bit EEPROM. This nonvolatile storage device contains256 bytes. The first 128 bytes can be programmed by Micron to identify the module typeand various SDRAM organizations and timing parameters. The remaining 128 bytes ofstorage are available for use by the customer. System READ/WRITE operations betweenthe master (system logic) and the slave EEPROM device occur via a standard I2C bususing the DIMMs SCL (clock) and SDA (data) signals, together with SA (2:0), which

provide eight unique DIMM/EEPROM addresses. Write protect (WP) is tied to VSSon themodule, permanently disabling hardware write protect.


7/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMElectrical Specifications

Electrical SpecificationsStresses greater than those listed in Table 8may cause permanent damage to themodule. This is a stress rating only, and functional operation of the module at these orany other conditions above those indicated in the operational sections of this specifica-

tion is not implied. Exposure to absolute maximum rating conditions for extendedperiods may affect reliability.

Notes : 1. The ref resh ra te is required to doub le when 85C < TC 95C.

2. For fu rther info rmat ion, refer t o t echnical no te TN-00-08: Therma l Applications, ava ilab le

on Micron s Web site .

Input Capacitance

Micron encourages designers to simulate the performance of the module to achieveoptimum values. Simulations are significantly more accurate and realistic than a grossestimation of module capacitance when inductance and delay parameters associated

with trace lengths are used in simulations. JEDEC modules are currently designed usingsimulations to close timing budgets.

Com ponen t AC Timing and Operating Conditions

Recommended AC operating conditions are given in the DDR2 component data sheets.Component specifications are available on Microns Web site. Module speed gradescorrelate with component speed grades as shown in Table 9.

Table 8: Absolut e Maxim um Ratings

Symbol Parameter Min Max Units

VDD /VDD Q VDD supply volta g e relative to VSS 0.5 + 2.3 V

VIN, VOUT Voltag e on any pin rela t ive to VSS 0.5 + 2.3 V

II Input leakag e current; Any input 0V VINVDD ;

VREFinput 0V VIN 0.95V; (All oth er pins no t und er

test = 0V)

Comm a nd /a dd ress,

RAS#, CAS#, WE#, S#,

CKE, ODT, BA

5 + 5A

CK, CK# 250 + 250

IOZ Output lea kag e current ; 0V VOU TVDDQ; DQs and

ODTare disabled

DQ, DQS, DQS#5 + 5 A

IVREF VREFleakag e current ; VREF= Valid VREFlevel 36 + 36 A

TA Mo dule a mb ient o pera t ing t empera t ure Co mmercia l 0 + 70 C

Indust ria l 40 + 85 C

TC1 DDR2 SDRAM compo nent case opera ting

temperature 2Commercial 0 + 85 C

Indust ria l 40 + 85 C

Table 9: Module and Compo nent Speed GradesModule Speed Grade Component Speed Grade

-80E -25E

-800 -25

-667 -3

-53E -37E

-40E -5E
http://-/?-http://-/?-


8/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMIDDSpecifications

IDDSpecification s

Tab le 10: DDR2 IDDSpecifications an d Con dition s 512MBVa lues sho w n fo r MT47H64M4 DDR2 SDRAM on ly and a re comp ute d f rom va lues specified in the

256Mb (64 Meg x 4) compo nent da ta sheet

Parameter/Condition Symbol -53E -40E Units

Operating o ne b ank active-precharge current: tCK = tCK (IDD ),tRC = tRC (IDD ), tRAS = tRAS MIN (IDD ); CKE is HIGH, S# is HIGH be tw ee n va lid

comma nds; Add ress bus inputs are switching; Da ta bus inputs are switching

IDD0 1,440 1,350 mA

Operating o ne bank active-read-precharge current:IOU T= 0mA; BL = 4,CL = CL (IDD ), AL = 0; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS MIN (IDD),tRCD = tRCD (IDD); CKE is HIGH, S# is HIGH be tw ee n va lid comm a nd s; Add ress

bus inputs are switching; Da ta pat tern is same a s IDD 4W

IDD1 1,620 1,530 mA

Precharge power-down current: All device ba nks idle; tCK = tCK (IDD ); CKE isLOW; Other cont rol and ad dress bus inputs are stable; Da ta bus inputs are

float ing

IDD2P 90 90 mA

Precharge quiet standby current: All de vice b a nks idle; tCK = tCK (IDD ); CKEis HIGH, S# is HIGH; Other con trol a nd ad dress bus input s are sta ble; Da ta bus

inputs are f loat ing

IDD2Q 630 450 mA

Precharge standby current: All device ba nks idle; tCK = tCK (IDD ); CKE isHIGH, S# is HIGH; Other con trol a nd ad dress bus inputs are sw itching ; Dat a bus

inputs are sw itching

IDD2N 630 540 mA

Active power-down current: All device banks open;tCK = tCK (IDD); CKE is LOW; Oth er con tro l an d a dd ress bus

inputs are s table; Dat a bus inputs are f loa t ing

Fa st PDN exit

MR[12] = 0

IDD3P 450 360 mA

Slow PDN exit

MR[12] = 1

108 108 mA

Active standby current: All device banks open; tCK = tCK (IDD),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH be tw ee n va lid

comma nds; Other cont rol an d ad dress bus input s are switching; Dat a bu s inputs

are sw itching

IDD3N 720 540 mA

Operating burst w rite current: All device b an ks ope n; Cont inuous burstw rite s; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD ), tRAS = tRAS MAX (IDD ),tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n va lid comm an ds; Addre ss bus

inputs are sw itching ; Data bus inputs are switching

IDD 4W 2,880 2,250 mA

Operating b urst read current: All device b an ks ope n; Continuo us burstread s; IOU T= 0mA; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD ), tRAS = tRAS MAX

(IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n va lid com ma nd s; Add ress

bus inputs are sw itching ; Data bus inputs are sw itching

IDD 4R 2,700 2,070 mA

Burst refresh current: tCK = tCK (IDD ); REFRESH command at every tRFC (IDD )interval; CKE is HIGH, S# is HIGH bet w een valid comma nds; Othe r control a nd

ad dress bus inputs are sw itching ; Data bus inputs are sw itching

IDD5 3,060 2,970 mA

Self refresh current: CK an d CK# a t 0V; CKE 0.2V; Othe r control a nd ad dressbus inputs are f loat ing; Data bus inputs are f loat ing

IDD6 90 90 mA

Operating bank interleave read current: All device banks interleavingread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = tRCD (IDD ) - 1 x tCK (IDD);tCK = tCK (IDD), tRC = tRC (IDD ), tRRD = tRRD (IDD ), tRCD = tRCD (IDD); CKE is

HIGH, S# is HIGH be tw een valid comma nd s; Add ress bus inputs are sta ble

during d eselects; Data bus inputs are sw itching

IDD7 4,320 4,140 mA


9/18




Tab le 11: DDR2 IDDSpecifications an d Con dition s 1GBVa lues sho w n fo r MT47H128M4 DDR2 SDRAM on ly and a re comp ute d f rom va lues specified in the

512Mb (128 Meg x 4) compo nent da ta sheet

Parameter/Condition Sym bol

-80E/

-800 -667 -53E -40E UnitsOperating o ne b ank active-precharge current: tCK = tCK (IDD ),tRC = tRC (IDD), tRAS = tRAS MIN (IDD); CKE is HIGH, S# is HIGH b et w ee n va lid

comma nds; Add ress bus inputs are switching; Da ta bus inputs are switching

IDD0 1,800 1,620 1,440 1,440 mA

Operating o ne bank active-read-precharge current:IOU T= 0mA;BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD ), tRC = tRC (IDD ), tRAS = tRAS MIN

(IDD ), tRCD = tRCD (IDD); CKE is HIGH, S# is HIGH be tw ee n va lid comm a nd s;

Add ress bus inputs are sw itching ; Data pat tern is same a s IDD4W

IDD1 2,070 1,890 1,710 1,620 mA

Precharge power-down current: All device ba nks idle; tCK = tCK (IDD);CKE is LOW; Othe r control a nd ad dress bus inputs a re stab le; Dat a bus


IDD2P 126 126 126 126 mA

Precharge quiet standby current: All de vice b a nks idle; tCK = tCK (IDD );CKE is HIGH, S# is HIGH; Oth er con tro l and a dd ress bus input s are sta ble;

Data bus inputs are f loat ing

IDD 2Q 900 810 720 630 mA

Precharge standby current: All device ba nks idle; tCK = tCK (IDD ); CKE isHIGH, S# is HIGH; Other cont rol and ad dress bus inputs are sw itching ; Dat a

bus inputs are switching

IDD2N 990 900 810 720 mA

Active power-down current: All device banks open;tCK = tCK (IDD ); CKE is LOW; Oth er con tro l an d ad dre ss bus


Fast PDN exit

MR[12] = 0

IDD3P 720 630 540 450 mA

Slow PDN exit

MR[12] = 1

216 216 216 216 mA

Active standby current: All device banks open; tCK = tCK (IDD), tRAS =tRAS MAX (IDD), tRP = tRP (IDD ); CKE is HIGH, S# is HIGH be tw ee n va lid

command s; Other control and ad dress bus inputs are switching; Data bus

inputs are sw itching

IDD3N 1,260 1,170 990 810 mA

Operating burst w rite current: All device b an ks ope n; Cont inuous burst

w rite s; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD ), tRAS = tRAS MAX (IDD ),tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n va lid comm an ds; Addre ss

bus inputs are sw itching ; Data bus inputs are sw itching

IDD4W 3,510 3,060 2,520 2,070 mA

Operating b urst read current: All device b an ks ope n; Continuo us burstread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD ),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n

valid comm an ds; Add ress bus inputs are sw itching ; Data bus inputs are

switching

IDD 4R 3,690 3,240 2,610 2,070 mA

Burst refresh current: tCK = tCK (IDD ); REFRESH command at everytRFC (IDD ) int erva l; CKE is HIGH, S# is HIGH be tw ee n va lid co mm a nd s; Other

control an d a dd ress bus inputs are switching; Da ta bus inputs are switching

IDD5 4,140 3,240 3,060 2,970 mA

Self refresh current: CK an d CK# at 0V; CKE 0.2V; Othe r contro l andad dress bus inputs are f loa t ing; Dat a bus inputs are f loat ing

IDD6 126 126 126 126 mA

Operating bank interleave read current: All device banks interleavingread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = tRCD (IDD ) - 1 x tCK (IDD);tCK = tCK (IDD), tRC = tRC (IDD ), tRRD = tRRD (IDD ), tRCD = tRCD (IDD); CKE is

HIGH, S# is HIGH be tw een valid comma nd s; Add ress bus inputs are sta ble


IDD7 5,400 4,320 4,050 3,960 mA


10/18




Tab le 12: DDR2 IDDSpecifications an d Con ditions (Die Revision A) 2GBVa lues sho w n fo r MT47H256M4 DDR2 SDRAM on ly and a re comp ute d f rom va lues specified in the

1Gb (256 Meg x 4) compo nent da ta sheet

Parameter/Condition Symbol -667 -53E -40E Units

Operating o ne b ank active-precharge current: tCK = tCK (IDD ),tRC = tRC (IDD ), tRAS = tRAS MIN (IDD ); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD 0 1,620 1,440 1,260 mA

Operating o ne bank active-read-precharge current:IOU T= 0mA;BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS

MIN (IDD), tRCD = tRCD (IDD ); CKE is HIGH, S# is HIGH b et w ee n va lid

comma nds; Add ress bus input s are sw itching ; Data pa tte rn is same a s

IDD 4W

IDD 1 1,800 1,710 1,440 mA



IDD2P 126 126 126 mA

Precharge quiet standby current: All device ba nks idle; tCK = tCK (IDD);

CKE is HIGH, S# is HIGH; Oth er con tro l and a dd ress bus input s are sta ble;Data bus inputs are f loat ing

IDD 2Q 990 738 630 mA

Precharge standby current: All device ba nks idle; tCK = tCK (IDD); CKE isHIGH, S# is HIGH; Other con trol a nd ad dress bus inputs are switching;

Dat a b us inputs are sw itching

IDD 2N 1,080 810 720 mA

Active power-down current: All device banks open;tCK = tCK (IDD ); CKE is LOW; Oth er con tro l an d a dd ress bus


Fa st PDN exit

MR[12] = 0

IDD3P 720 540 450 mA

Slow PDN exit

MR[12] = 1

180 180 180 mA

Active standby current: All device banks open; tCK = tCK (IDD),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n

valid com ma nds; Other control and ad dress bus inputs are switching;


IDD 3N 1,260 990 810 mA

Operating burst w rite current: All device b an ks ope n; Cont inuousburst w rites; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD 4W 2,880 2,340 1,980 mA

Operating b urst read current: All device ba nks open; Cont inuous burstread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD ),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD4R 2,880 2,610 1,980 mA

Burst refresh current: tCK = tCK (IDD ); REFRESH command at everytRFC (IDD ) int erva l; CKE is HIGH, S# is HIGH be tw ee n va lid comm a nd s;

Other cont rol and a dd ress bus inputs are switching; Dat a b us inputs are

switching

IDD 5 4,680 4,500 3,960 mA


IDD 6 126 126 126 mA

Operating bank inte rleave read current: All de vice ba nks inte rleavingread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = tRCD (IDD ) - 1 x tCK (IDD);tCK = tCK (IDD ), tRC = tRC (IDD ), tRRD = tRRD (IDD), tRCD = tRCD (IDD); CKE is

HIGH, S# is HIGH be tw een valid comma nds; Address bus inputs are sta ble


IDD 7 5,400 5,220 4,680 mA


11/18




Tab le 13: DDR2 IDDSpecifications a nd Cond itions (Die Revision E) 2GBVa lues sho w n fo r MT47H256M4 DDR2 SDRAM on ly and a re comp ute d f rom va lues specified in the

1Gb (256 Meg x 4) compo nent da ta sheet

Parameter/Condition Symbol

-80E/

-800 -667 -53E -40E UnitsOperating o ne b ank active-precharge current: tCK = tCK (IDD ),tRC = tRC (IDD ), tRAS = tRAS MIN (IDD ); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD 0 1,620 1,530 1,260 1,260 mA

Operating o ne bank active-read-precharge current:IOU T= 0mA;BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS

MIN (IDD), tRCD = tRCD (IDD ); CKE is HIGH, S# is HIGH b et w ee n va lid

comma nds; Add ress bus input s are sw itching ; Data pa tte rn is same a s

IDD 4W

IDD 1 1,980 1,800 1,710 1,620 mA



IDD2P 126 126 126 126 mA

Precharge quiet standby current: All device ba nks idle; tCK = tCK (IDD);CKE is HIGH, S# is HIGH; Oth er con tro l and a dd ress bus input s are sta ble;

Data bus inputs are f loat ing

IDD 2Q 900 720 720 630 mA

Precharge standby current: All device ba nks idle; tCK = tCK (IDD); CKE isHIGH, S# is HIGH; Other con trol a nd ad dress bus inputs are switching;


IDD 2N 900 720 720 630 mA

Active power-down current: All device banks open;tCK = tCK (IDD ); CKE is LOW; Oth er con tro l an d a dd ress bus


Fa st PDN exit

MR[12] = 0

IDD3P 720 540 540 540 mA

Slow PDN exit

MR[12] = 1

180 180 180 180 mA

Active standby current: All device banks open; tCK = tCK (IDD),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n

valid com ma nds; Other control and ad dress bus inputs are switching;


IDD 3N 1,080 990 810 720 mA

Operating burst w rite current: All device b an ks ope n; Cont inuousburst w rites; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD 4W 2,880 2,430 2,250 1,890 mA

Operating b urst read current: All device ba nks open; Cont inuous burstread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = 0; tCK = tCK (IDD ),tRAS = tRAS MAX (IDD ), tRP = tRP (IDD); CKE is HIGH, S# is HIGH b et w ee n


switching

IDD4R 2,880 2,430 2,250 1,890 mA

Burst refresh current: tCK = tCK (IDD ); REFRESH command at everytRFC (IDD ) int erva l; CKE is HIGH, S# is HIGH be tw ee n va lid comm a nd s;

Other cont rol and a dd ress bus inputs are switching; Dat a b us inputs are

switching

IDD 5 4,230 3,870 3,780 3,690 mA


IDD 6 126 126 126 126 mA

Operating bank inte rleave read current: All de vice ba nks inte rleavingread s; IOUT= 0mA; BL = 4, CL = CL (IDD ), AL = tRCD (IDD ) - 1 x tCK (IDD);tCK = tCK (IDD ), tRC = tRC (IDD ), tRRD = tRRD (IDD), tRCD = tRCD (IDD); CKE is

HIGH, S# is HIGH be tw een valid comma nds; Address bus inputs are sta ble


IDD 7 6,030 5,040 4,860 4,680 mA


12/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMRegister an d PLL Specificatio ns

Register and PLL Specifications

Notes : 1. Timing and sw itching specif ica t ions for the reg ister l isted ab ove are crit ica l fo r proper

ope ration of t he DDR2 SDRAM registered DIMMs. These are me an t to be a subset o f th e

pa rame ters for the specific device used on th e mod ule. Detailed informa tion fo r this regis-

te r is ava ilable in JEDEC sta nd a rd JESD82.

Table 14: Register SpecificationsSSTU32866 devices o r eq uiva len t J ESD82-16

Parameter Symbol Pins Condition Min Max Units

DC hig h-level

input voltag e

VIH(DC) Address,

control,

command

SSTL_18 VREF(DC) + 125 VDD Q + 250 V

DC low -level

input voltag e

VIL(DC) Address,

control,

command

SSTL_18 0 VREF(DC) - 125 V

AC high-level

input voltag e

VIH(AC) Address,

control,

command

SSTL_18 VREF(DC) + 250 VDD V

AC low -leve l

input voltag e

VIL(AC) Address,

control,

command

SSTL_18 0 VREF(DC) - 250 V

Output high voltag e VOH Pa rit y o ut put LVCMOS 1.2 V

Output low volt ag e VOL Pa rit y o ut put LVCMOS 0.5 V

Input current II All pins VI= VDDQ or VSSQ 5 5 A

Sta t ic sta ndby IDD All pins RESET# = VSSQ (IO= 0) 100 A

Static operating IDD All pins RESET# = VSSQ;

VI= VIH(AC) or VIL(DC)

IO= 0

40 mA

Dynamic operat ing

(clock tree )

IDDD n/a RESET# = VDD , VI= VIH(AC) or

VIL(AC), IO= 0; CK and CK#

swit ching 50% du ty cycle

Va ries by

manufacturer

A

Dynamic operat ing

(per ea ch input)

IDDD n/a RESET# = VDD , VI= VIH(AC) or

VIL(AC), IO= 0; CK and CK#

swit ching 50% du ty cycle;One dat a input sw itching a t

tCK/2, 50% d ut y cy cle

Va ries by

manufacturer

A

Input capacitance

(per device, per pin)

CI All inputs

except RESET#

VI= VREF 250mV;

VDDQ = 1.8V

2.5 3.5 pF

Input capacitance

(per device, per pin)

CI RESET# VI= VDDQ or VSSQ Va ries by

manufacturer

pF


13/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMRegister an d PLL Specificatio ns

Notes : 1. PLL t iming a nd switching specif ica t ions are crit ica l for proper operat ion of t he DDR2 DIMM.

This is a subset of pa ram et ers for th e specific PLL used. De ta iled PLL info rma tion is a vailab le

in JEDEC stan da rd JESD82.

Table 15: PLL Specificat ion sCU877 de vice or eq uivalent JESD82-8.01

Parameter Symbol Pins Condition Min Max Units

DC high-level input voltag e VIH RESET# LVCMOS 0.65 VDD V

DC low -level input volta g e VIL RESET# LVCMOS 0.35 VDD V

Input voltag e (limits) VIN RESET#, CK, CK# 0.3 VDD Q + 0.3 V

DC high-level input voltag e VIH CK, CK# Dif ferent ia l input 0.65 VDD V

DC low -level input volta g e VIL CK, CK# Dif ferent ia l input 0.35 VDD mV

Input differential-pair cross

vol t age

VIX CK, CK# Dif ferent ia l input (VDD Q/2) -

0.15

(VDDQ/2) +

0.15

V

Input d if ferent ia l voltag e VID(DC) CK, CK# Diff erent ia l input 0.3 VDD Q + 0.4 V

Input d if ferent ia l voltag e VID(AC) CK, CK# Diff erent ia l input 0.6 VDD Q + 0.4 V

Input current II RESET# VI= VDD Q or VSSQ 10 10 A

CK, CK# VI= VDD Q or VSSQ 250 250 A

Output disabled current IODL RESET# = VSSQ; VI= VIH(AC) or

VIL(DC)

100 A

Static supply current IDDLD CK = CK# = LOW 500 A

Dynamic supply IDD n/a CK, CK# = 270 MHz, a ll

outputs open

(not connected to PCB)

300 mA

Input capacitance CIN Ea ch input VI= VDD Q or VSSQ 2 3 p F

Table 16: PLL Clock Driver Timing Requireme nts and Sw itching Chara cteristics

Parameter Symbol Min Max Units

Stabilization time tL 15 s

Input clock slew rat e tLSI 1.0 4 V/ns

SSC modulation frequency 30 33 kHz

SSC clock input freq uency de viat ion 0.0 0.50 %

PLL loop ba ndw idth (3dB from unity g ain) 2.0 MHz


14/18



512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMSerial Presence-Dete ct

Serial Presence-Detect

Notes : 1 . To a void spur ious st a r t and stop condi t ions, a minimum delay is placed betw een SCL = 1 and

the f alling o r rising ed ge of SDA.

2. This paramet er is sampled.

3. For a resta rt condition, o r follow ing a WRITE cycle.

4. The SPD EEPROM WRITE cycle t ime (tWRC) is the t ime from a valid stop cond ition of a w rite

seq ue nce t o t he en d o f t he EEPROM int ern a l ERASE/PROGRAM cycle. During th e WRITE

cycle, t he EEPROM b us interf ace circuit is disab led, SDA rema ins HIGH d ue t o pull-up re sis-

ta nce, and the EEPROM doe s not respond t o its slave ad dress.

Table 17: Serial Presen ce-Detect EEPROM DC Operat ing Con ditio nsAll voltag es refe renced to VSS; VDDSPD= + 1.7V to + 3.6V

Parameter/Condition Symbol Min Max Units

Supply volta ge VDDSPD 1.7 3.6 V

Input high voltag e: Log ic 1; All inputs VIH VDDSPD 0.7 VDDSPD+ 0.5 V

Input low voltag e: Log ic 0; All inputs VIL 0.6 VDDSPD 0.3 V

Output low volta ge: IOU T= 3mA VOL 0.4 V

Input lea kag e current : VIN= GND to VDD ILI 0.10 3 A

Output leakag e current : VOU T= GND to VDD ILO 0.05 3 A

Standby current ISB 1.6 4 A

Pow er supply current , READ: SCL clock fre q uen cy = 100 kHz ICCR 0.4 1 mA

Po w er supp ly curren t, WRITE: SCL clock fre q ue ncy = 100 kHz ICCW 2 3 mA

Table 18: Serial Presen ce-Detect EEPROM AC Operat ing Con ditio nsAll voltag es refe renced to VSS; VDDSPD= + 1.7V to + 3.6V

Parameter/Condition Sym bol Min Max Units Notes

SCL LOW to SDA da ta -ou t va lid tAA 0.2 0.9 s 1

Time the b us must be free b efo re a new tran sition can sta rt tBUF 1.3 s

Data -out ho ld t ime tDH 200 ns

SDA a nd SCL fa ll time tF 300 ns 2

Data -in hold t ime tHD:DAT 0 s

Sta rt condit ion h old t ime tHD:STA 0.6 s

Clock HIGH period tHIGH 0.6 s

Noise suppression t ime con sta nt at SCL, SDA input s tI 50 ns

Clock LOW perio d tLOW 1.3 s

SDA and SCL rise time tR 0.3 s 2

SCL clock freq uen cy fSCL 400 kHz

Dat a-in setup time tSU:DAT 100 ns

Start condition setup time tSU:STA 0.6 s 3

Stop condition setup time tSU:STO 0.6 s

WRITE cycle t ime tWRC 10 ms 4
http://-/?-http://-/?-http://-/?-http://-/?-http://-/?-http://-/?-http://-/?-http://-/?-http://-/?-


15/18




Table 19: Serial Presen ce-Detect Mat rix

Byte Description Entry (Version) 512MB1 1GB 2GB

0 Numbe r of SPD byt es used by Micron 128 80 80 80

1 Tot al num ber o f b ytes in SPD device 256 08 08 08

2 Funda menta l memory type DDR2 SDRAM 08 08 08

3 Numbe r of ro w ad dresses on SDRAM 13, 14 0D 0E 0E

4 Numbe r of column a dd resses on SDRAM 10 0B 0B 0B

5 DIMM height a nd mo dule ranks 30mm, single ra nk 60 60 60

6 Module da t a w idth 72 48 48 48

7 Reserved 0 00 00 00

8 Module voltage interface levels SSTL 1.8V 05 05 05

9 SDRAM cycle time, tCK

(CL = MAX value , see b yte 18)

-80E

-800

-667

-53E

-40E

3D

50

25

25

30

3D

50

25

25

30

3D

50

10 SDRAM access from clock, tAC

(CL = MAX value , see b yte 18)

-80E/-800

-667

-53E

-40E

50

60

40

45

50

60

40

45

50

60

11 Module configurat ion type ECC

ECC and parity

02

06

02

06

02

06

12 Ref resh ra te /type 7.81s/SELF 82 82 82

13 SDRAM device w idt h (primary SDRAM) 4 04 04 04

14 Error-checking SDRAM da ta w idt h 4 04 04 04

15 Reserved 0 00 00 00

16 Burst leng ths support ed 4, 8 0C 0C 0C

17 Number of banks on SDRAM device 4 o r 8 04 04 08

18 CAS la te ncies suppo rted -80E (5, 4)-800 (6, 5, 4)

-667 (5, 4, 3)

-53E/-40E (4, 3)

18

3070

38

18

3070

38

18

19 Mod ule th ickness 01 01 01

20 DDR2 DIMM t ype Registered

DIMM

01 01 01

21 SDRAM mod ule at tributes 1 PLL, 2 Reg 05 05 05

22 SDRAM d evice a tt ribut es: w ea k driver

(01), or w ea k driver a nd 50ODT(03)

-80E/-800/-667

-53E/-40E

01

03

01

03

01

23 SDRAM cycle time, tCK, MAX CL - 1 -80E/-667

-800

-53E/-40E

50

3D

30

50

3D

30

50

24 SDRAM access from CK, tAC, MAX CL - 1 -80E/-800

-667

-53E

-40E

50

60

40

45

50

60

40

45

50

60

25 SDRAM cycle time, tCK, MAX CL - 2 -80E/-800

-667

-53E/-40E

00

3D /00

50

00

3D /00

50

00

26 SDRAM access from CK, tAC, MAX CL - 2 -80E/-800

-667

-53E/-40E

00

40/00

45

00

40/00

45

00
http://-/?-http://-/?-


16/18




27 MIN row precharg e time, tRP -80E

-800/-667

-53E/-40E

3C

32

3C

3C

32

3C

3C

28 MIN row active-to -row active, tRRD 1E 1E 1E

29 MIN RAS#-t o -CAS# d ela y, tRCD -80E

-800/-667

-53E/-40E

3C

32

3C

3C

32

3C

3C

30 MIN active-to-precharge, tRAS -80E/-800

-667/-53E

-40E

/2D

28

2D

2D

28

2D

2D

28

31 Module rank density 512MB, 1GB, 2GB 80 01 02

32 Address and command setup t ime, t ISb -80E/-800

-667

-53E

-40E

25

35

17

20

25

35

17

20

25

35

33 Address and command hold t ime, t IHb -80E/-800

-667

-53E

-40E

37

47

25

27

37

47

25

27

37

47

34 Dat a/da ta ma sk input setup time, tDSb -80E/-800

-667/-53E

-40E

/10

15

05

10

15

05

10

15

35 Dat a/da ta m ask input hold time, tDHb -80E/-800

-667

-53E

-40E

22

27

12

17

22

27

12

17

22

27

36 Write recovery time, tWR 3C 3C 3C

37 WRITE-to -READ co mm a nd de lay, tWTR -80E/-667/-53E

-800/-40E

//1E

28

1E

28

1E

28

38 READ-to -PRECHARGE co mm a nd d ela y,tRTP

1E 1E 1E

39 Memo ry ana lysis probe 00 00 00

40 Extension fo r byte s 41 and 42 -80E

-800/-667

-53E/-40E

00

00

30

00

00

36

06

06

41 MIN a ctive-to -a ctive/ref resh time , tRC2 -80E

-800/-667/-53E

-40E

//3C

37

39

3C

37

39

3C

37

42 MIN AU TO REFRESH-t o -ACTIVE/

AUTO REFRESH comm a nd pe riod , tRFC

4B 69 7F

43 SDRAM device MAX cycle time,t

CK(MAX)

80 80 80

44 SDRAM de vice MAX DQSDQ skew time ,tDQSQ

-80E/-800

-667

-53E

-40E

1E

23

14

18

1E

23

14

18

1E

23

45 SDRAM de vice MAX rea d d at a hold

skew fa ctor, tQHS

-80E/-800

-667

-53E

-40E

28

2D

1E

22

28

2D

1E

22

28

2D

46 PLL relo ck tim e 0F 0F 0F

Table 19: Serial Presence-Dete ct Matrix (con tinued )

http://-/?-http://-/?-


17/18




Notes : 1. The 512MB module is not available in -80E, -800, or -667 speed g rades .

2. Th e tRC SPD va lues sho w n a re JEDEC DDR2 de vice specificat ion va lues. The a ctua l Micron

DDR2 device specifica tio n is tRC = 55ns for all speed gra des.

4761 Optional fea tures, not supported 00 00 00

62 SPD revision Relea se 1.2 12 12 12

63 Checksum f or b yte s 062

ECC/ECC a nd pa rit y

-80E

-800

-667

-53E

-40E

F5/F95C/60

2E/32CF/D3EA/EE

95/99FC/00

4F/53F0/F4/0B /0F

B6/BA1D /21

64 Ma nuf a cturers JEDEC ID cod e MICRON 2C 2C 2C

6571 Ma nuf a cturers JEDEC ID cod e (co nt inued) FF FF FF

72 Manufa cturing locat ion 112 010C 010C 010C

7390 Module part number (ASCII) Va ria b le da t a Va ria b le da t a Va ria b le da t a

91 PCB ide ntification cod e 19 0109 0109 0109

92 Identification code (continued) 0 00 00 00

93 Yea r of ma nufa cture in BCD Va ria b le da t a Va ria b le da t a Va ria b le da t a

94 Week of ma nufa cture in BCD Va ria b le da t a Va ria b le da t a Va ria b le da t a

9598 Module serial number Va ria b le da t a Va ria b le da t a Va ria b le da t a

99127 Reserved fo r ma nufa cturer-specific dat a 00 00 00

128255 Reserved for customer-specific data FF FF FF

Table 19: Serial Presence-Dete ct Matrix (con tinued )



18/18

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900prodm ktg @micron.com w w w.m icro n.co m Custom er Co mm en t Line: 800-932-4992

Micron, the M logo, and t he Micron logo are trade marks of Micron Technology, Inc. All other t rademarks are the prop-erty of their respective ow ners. This data sheet contains minimum and maxim um limits specified over the completepow er supply and tem perature range f or production devices. Although considered final, these specifications are sub-

ject to chan ge , a s f ur th er produ ct de ve lo pm en t an d da ta characte riza tion sometimes o ccur.

512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMMModule Dimensions


Module Dimensions

Figure 3: 240-Pin DDR2 RDIMM

Not es: 1. All dimensions are in millimet ers (inches); MAX/MIN or typical (TYP) w here no ted .2. The d imensional diagra m is for reference o nly. Refer to the JEDEC MO document fo r com-

plete d esig n dimensions.

30.15 (1.200)

29.85 (1.175)

PIN 1

17.78 (0.700)

TYP2.50 (0.098) D

(2X)

2.30 (0.091)

TYP

5.0 (0. 197) TYP

123.0 (4.84)

TYP

1.0 (0.039)

TYP

0.80 (0.031)

TYP

2.00 (0.079) R

(4X)

0.75 (0.030) R

PIN 120

Front view133.50 (5.256)

133.20 (5.244)

63.0 (2.48)

TYP

55.0 (2.165)

TYP

10.00 (0.394)

TYP

Back view

PIN 240 PIN 121

1.37 (0.054)

1.17 (0.046)

4.00 (0.157)

MAX

U1 U2 U3 U4 U5

U6

U7

U8

U9 U10 U11 U12

U22U21U20U19U18

U17

U16U15U14U13
mailto:[email protected]://www.micron.com/http://www.micron.com/mailto:[email protected]

Documents

DDR2 Tech Details