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Providing Providing
Solutions for Solutions for
Next Next
Generation Generation
ProductsProducts
Dynamic Details, Inc.Dynamic Details, Inc.
DDiTime &
Technology
Gil White November 2004
www.www.ddiglobalddiglobal.com.com
Laser Drilled
Blind & Buried
Microvias
DDi Technology
DDi TechnologyIPC-2315 HDI/ Microvia Types
IPC Type I IPC Type II
IPC Type II - variable depth IPC Type II – stacked vias
IPC Type III IPC Type III – stacked vias
cost
Enabling Technology
• RCC™ Resin Coated Copper– single stage, double stage or B & C stage
• RCF Resin Coated Foil Single stage• Glass Reinforced Prepreg FR4 = 106, 1080• Thermount®• SpeedBoard ™ C
Microvia Materials
DDi Technology
DDi Technology
Test test test
PresentTechnology
Via-in-PadTechnology
QFP Land Pattern
PresentTechnology Via-in-Pad
Technology
BGA Land Pattern
Fine Pitch-SMT and BGA area array with Via-in-Pad
Via-in-Pad Microvia Technology
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
3. Laminate Microvia material (FR4, RCF, Thermount™, Speedboard C)
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
3. Laminate Microvia material (FR4, RCF, Thermount™, Speedboard C)
4. Laser Drill Microvias (150 microns down to 100 microns)
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
3. Laminate Microvia material (FR4, RCF, Thermount™, Speedboard C)
4. Laser Drill Microvias (150 microns down to 100 microns)
5. Mechanical Drill through-holes
6. Desmear through holes and microvias to roughen dielectric surface prior to plating
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
3. Laminate Microvia material (FR4, RCF, Thermount™, Speedboard C)
4. Laser Drill Microvias (150 microns down to 100 microns)
5. Mechanical Drill through-holes
6. Desmear through holes and microvias to roughen dielectric surface prior to plating
7. Electroless copper plate through holes, Microvias, and surface areas
DDi TechnologyBuild-Up-Multilayer (BUM)
1. Fabricate multilayer PCB (2 - 38 layers)
2. Fill plated through holes with non-conductive epoxy fill
3. Laminate Microvia material (FR4, RCF, Thermount™, Speedboard C)
4. Laser Drill Microvias (150 microns down to 100 microns)
5. Mechanical Drill through-holes
6. Desmear through holes and microvias to roughen dielectric surface prior to plating
7. Electroless copper plate through holes, Microvias, and surface areas
8. Pattern Plate outer layer circuits
Prior to the Design of Microvia Technology, Consult with your assembly Team to ensure they have experience with the assembly of Microvia or
Via-in-Pad Technology
Microvia Design
Guidelines
DDi Technology
DDi Technology
NA125 to 150NA125 to 150Laser drilled Microvia diameter from layer 1 to 2INA0.5 to 0.6:1NA0.3 to 0.4: 1Aspect ratioJ
10%25 to 7510%25 to 50Layer 1 – 2 dielectric thicknessC10%4020%40Minimum Layer 2 copper thicknessB10%4520%52Minimum Layer 1 copper thicknessA
+/- 0.6+/-0.6NANANA
+/-
7575250250300
µmStandard Microvia
+/- 0.350Minimum Line width on Layer 2H+/- 0.350Minimum Line width on Layer 1G
NA200Minimum drill diameter for buried viaFNA250Minimum Layer 1 pad for Layer 1 to 2 MicroviaENA300Minimum Layer 2 pad for Layer 1 to 2 MicroviaD
+/-µmAdvanced Microvia Description#
Laser Drilled Microvias
Layer 1 to 2
B
AC
D
E
F
Microvia Technology
DDi Technology
NA350NA300Minimum Layer 1 pad for Layer 1 to 3 MicroviaJNA400NA350Minimum Layer 2 pad for Layer 1 to 3 MicroviaI
NA250NA300Minimum drill diameter for buried viaK
10%40+- 20%40Minimum Layer 3 copper thicknessC10%40+- 20%40Minimum Layer 2 copper thicknessB10%45+- 20%52Minimum Layer 1 copper thicknessA
+/- 20%
NANANA
+- 10%+- 10%
+/-
75
400250300
25 to 5025 to 50
µmStandard Microvia
+/- 10%50Minimum Line Width/Space on Layers 1, 2, & 3L
NA450Minimum Layer 3 pad for Layer 1 to 3 MicroviaHNA250Minimum Layer 1 pad for Layer 1 to 2 MicroviaGNA300Minimum Layer 2 pad for Layer 1 to 2 MicroviaF10%25 to 75Layer 2-3 dielectric thicknessE10%25 to 75Layer 1-2 dielectric thicknessD
+/-µmAdvanced MicroviaDescription#
G J
Laser Drilled Microvia from layer 1 to 2 = 150 µm diameter From 1 to 3 = 200 – 250 µm diameter
C
B
A
E
DF
H
I
K
Microvia TechnologyLaser Drilled
MicroviasLayer 1 to 2 & Layer 1 to 3
Aspect Ratio: 0.3 to 0.6:1
DDi Technology
NA125NA125 or 150Laser drilled Microvia diameter from layer 1 to 2JNA500Minimum Pad diameter for buried viaI
NA0.5 to 0.6:1NA0.3 to 0.4: 1Aspect ratioK
10%25 to 7510%25 to 50Layer 1 – 2 dielectric thicknessC10%4020%40Minimum Layer 2 copper thicknessB10%4520%52Minimum Layer 1 copper thicknessA
NANANANANA
+/-
300NANA250300
µmStandard Microvia
NA250Minimum drill diameter for buried viaHNA250Minimum Layer 2 pad for Stacked MicroviaGNA250Minimum Layer 1 pad for Stacked MicroviaFNA250Minimum Layer 1 pad for Layer 1 to 2 MicroviaENA300Minimum Layer 2 pad for Layer 1 to 2 MicroviaD
+/-µmAdvanced Microvia Description#
Laser Drilled Microvias
Layer 1 to 2 &Stacked Vias
Microvia Technology
B
AC
D
E
H
F
G
12
DDi Technology
RCC Via fill
IssuesRegistrationVia FillResin Starvation
C-CAP, Sub via plug
IssuesVia fillVia fill expansion at assemblyPlating thickness of sub
Mac -U-Via
Conductive Via fill
IssuesVia fillVia fill expansion at assembly
Dupont CB100 Silver
Laser Drilling Technology
ESI ND:YAG Drilling System
Laser Drilling Techniques ND:YAG (Ultra-Violet)Capable of drilling copper, allre-enforcing materials and alllaminate resin systems. 25 to 50micron beam forms holes by spiraling or trepanning the beam
C02 (Infrared) Capable of drilling most re-enforcing materials and laminate resin systems. Not effective for drilling copper (copper is reflective in the infrared spectrum) Forms holes by pulsing a larger high energy beam
Combination ND:YAG CO2 forms holes by removing copper with the ND:YAG laser and the dielectric and re-enforcing material with the CO2 laser
DDiDDi MicroviaMicrovia TechnologyTechnology
Laser Drilling SystemsLaser Drilling Systems
DDiDDi MicroviaMicrovia TechnologyTechnology
10 Laser Drilling Systems10 Laser Drilling Systems
• Anaheim = 4 3 ESI 5200 & 1 GSI 600
• UK = 3 3 ESI 5200
• Virginia = 2 2 ESI 5200
• Milpitas = 1 1 ESI 5200
Laser DrilledLaser DrilledMicroMicro--viavia
(ESI Equipment)(ESI Equipment)
Characteristics
• Laser drilling can be performed in any laminate.
• Typical thickness requested is .002 in and may be drilled to multiple layers
• Picture indicates UV Laser drilling through surface copper and .002 laminate.
DDiDDi MicroviaMicrovia TechnologyTechnology
DDi TechnologyLaser Drilling Technology
Traditional laser drilled Microvia geometry
Laser drilled MicroviaLayer 1 to 2
Laser drilled MicroviaLayer 1 to 3
0.005” (125 µm)
Note: Typical aspect ratio on laser drilled holes is 0.5:1 to 0.8:1 max
0.00
5”
Microvia Technology - Via-in-Pad
0.008” (200 µm)
50 µm125 µm
DDi Technology
Chip Scale BGA Package with Microvia in Pad
BGA Pad
Microvia Capture padPWB Land Pad
Solder Ball
Ideal Solder Joint
Laser Drilling Technology Via In PadMicrovia Technology - Via-in-Pad
DDi Technology
2+4+2 HDI Substrate
4 Layer MLB Core
Microvia 1 3
Microvia 1 2
Drilled PTH
Buried via (epoxy filled)
HDI DielectricLayers
Aspect ratio on Microvia’s approximately 0.5:1max.Microvia 1 3 require larger hole diameter
Typical HDI StructureLaser Drilling Technology
Traditional Laser Drilled hole GeometryMicrovia Technology - Via-in-Pad
DDi Technology
Mechanical drilled via’s offset from attachment pad
Conventional MLB Substrate
HDI Substrate
0.8 mm
Laser drilled via in pad(Solder mask defined attachment pad layer # 1)
0.8 mm BGA µ
Solder maskdefined pad Signal routing on layer # 2
Conventional MLB vs HDI
Laser Drilling TechnologyMicrovia Technology - Via-in-Pad
DDi Technology
Thermount Dielectric
Microvia in pad
Two tracksignal routingon surface
1.0 mm BGA
Interstitial Microvia
Laser Drilling TechnologyMicrovia Technology - Via-in-Pad
DDi Technology
0.8 mm BGA
Interstitial Microvias
Layer 1 to 2
Via in pad
Offset via
Laser Drilling Technology
Microvia Technology - Via-in-Pad
DDi Technology
39 x 39 1.0 mm BGA
Layer 1 SignalRouting
1.0 mm
Laser Drilling TechnologyMicrovia Technology - Via-in-Pad
Enabling Technology
Aspect Ratio 10:1
.0394”
Internal Layers
.0046” (115 µm) Trace & space
6 track routing
1 mm BGA
.010” (250 µm) drill
.0194” (485 µm) via pad
Thickness of .093” (2.362 mm) - .100” (2.54 mm)
Hybrid Approach
Laser drilled via’s Mechanically drilled via
0.8 mm BGA
0.8 mm BGATin/Lead Surface Finish
Laser Drilling TechnologyMicrovia Technology - Via-in-Pad
DDi Technology
DDi Technology
Microvias in SMT Pads0.5 mm
Laser Drilled Microvias
Via location doesnot impact assemblydue to it’s extremelysmall volume
Laser Drilling TechnologyMicrovia Technology - Via-in-Pad
0.8 mm BGA
Design Guidelines
DDi Technology
0.8 mm BGA
Aspect Ratio 10:1
.0155” (388 µm)BGA pad
.002” sm clr
.0315”.005” (125 µm) trace
External Layer
SM cv = .001” (25 µm)
DDi Technology
Thickness of .093” (2.362 mm) - .100” (2.54 mm)
.0223” (0.566 mm) space
.010” (125 µm) trace
.010” (250 µm) drill
.019” (475 µm) via pad
.003” (75 µm) space
Aspect Ratio 10:1
Internal Layer
.0315”
.004” (100 µm) Trace & space
1 track routing
DDi Technology
0.8 mm BGAIPC 6011/6012 Class 2
Thickness of .093” (2.362 mm) - .100” (2.54 mm)
.010” (250 µm) drill
.0195” (488 µm) via pad
.028” (0.711 mm) clearance.0035” (88 µm) copper
Aspect Ratio 10:1
DDi Technology0.8 mm BGA
IPC 6011/6012 Class 2
Thickness of .093” (2.362 mm) - .100” (2.54 mm)
0.8 mm BGA IPC 6011/6012 Class 2
Aspect Ratio 10:1
Internal Layer
.0315”
.005” (125 µm) Trace
.00425 (106 µm) Space
1 track routing
DDi Technology
Thickness of .028” (0.711 mm) - .062” (1.575 mm)
.008” (200 µm ) drill
.018” (450 µm) via pad
Aspect Ratio 7.75:1
DDi Technology0.8 mm BGA
IPC 6011/6012 Class 2
Thickness of .028” (0.711 mm) - .062” (1.575 mm)
.026” (0.660 mm) clearance.0055” (138 µm) copper
Microvia Via-in-Pad Technology = Eliminates through vias
31.5 mils
Layer 1 Ball Diameter
0.42 - 0.5 mm
DDi Technology
0.8 mm BGA Design
.0165” (.419 mm) pad
.006” (150 µm)
laser drill
.002” (50 µm)sm clr
.005” (125 µm) Trace
.005 (125 µm) Space
0.8 mm BGA Design
Microvia Technology
Layer 2
DDi Technology
.0115” (288 µm) Pad
.004” (100 µm) Trace
.004 (100 µm) Space
0.8 mm BGA Design
Microvia Technology
No clearance required
DDi Technology
0.8 mm BGA 256 I/O Full Array
Layer 1 Layer 2 Layer 3
Option = 2 layers with 3/3 & .010 pad = 3 track
DDi Technology
DDi Technology
Microvia
DDi Technology
DDi Technology
Chip Scale BGA Package with Microvia in Pad
BGA Pad
Microvia Capture padPWB Land Pad
Solder Ball
Ideal Solder Joint
Laser Drilling Technology Via In PadMicrovia Technology - Via-in-Pad
Microvias with solder voids after assembly
Unacceptable Via-in-Pad Solder Joints
DDi Technology
Conductive Filler
Cu Pad Plating
Component Pad
Rendering
Plated through hole
DDi TechnologyConductive Epoxy Fill & Plate
Conductive Fill
Capture Pad
Copper Plating
DDi TechnologyConductive Epoxy Fill & Plate
Single MicroVias
.004” (100 µm) laser drilled & solid copper plate
.008” (200 µm) pad diameter
Maintain Planar Surface
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
DDi
Topic # 8
Stacked MicroVias(SMVSMV™™)
Dynamic Details, Inc.Dynamic Details, Inc.
www.www.ddiglobalddiglobal.com.com
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
SMVSMV™™ Technology Provides Solutions for Next Generation Products
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
Definition:.004” (100 µm) laser drilled MicroVia
(solid copper plate)
Stacked MicroViasSingle MicroVias
Single MicroVias
.004” (100 µm) laser drilled & solid copper plate
.008” (200 µm) pad diameter
Maintain Planar Surface
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
Definition: .004” (100 µm) laser drilled MicroVia
Planar Surface Stacked MicroVias (SMV)
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
solid copper plate
10 Layer SMV™ Technology
Core = Solid Copper Plate
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
1:1 aspect ratio
.004” (100 µM) dielectric
.004” (100 µM) laser drill
Six Stacked MicroVias
Seven layers for fan-out of 0.65 mm, 0.5 mm & 0.4 mm BGAs
0.5 mm = .008” (200 µm) diameter pad using a .004” (100 µm) laser drill, .0039” (98 µm) trace & space
0.4 mm = .008” (200 µm) diameter pad, .004” (100 µm) laser drill, .0026” (65 µm) trace & space
Capable of creating a 14 Layer stacked configuration
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
Advantages:
• Design flexibility (SMV post or buried SMV) single or stacked
• Provides a solid copper plate
• Improves Current Carrying Capability & Thermal Management
• Provides a Planar surface for BGA (Via-in-Pad)
• Increases routing density for Fine Pitch BGAs (0.65 mm, 0.5 mm & 0.4 mm)
• Allows Design Fan-out on multiple layers using .010” (250 µm) or .008” (200 µm) pad diameters
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
Applications:
• Mobile Phones (including Cell/PDA & camera phone)
• Hand Held products (PDAs, Cameras, GPS/Navigation)
• Telecom (Networks, Switches, Servers)
• Wireless LAN
• Medical Equipment
• Reference Designs
• Flip Chip BGA Interposer
• MCM BGA Interposer
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
1mm BGA
Design Guidelines
IPC 6011 / 6012
Class 2
DDi Technology
1 mm BGA
.0278” (706 µm) space
Thickness of .093”(2.362 mm) Aspect Ratio 10:1
.020” (500 µm)BGA pad
.010” (250 µm) drill
.020” (500 µm) via pad
.003” (75 µm)sm clr
.010” (250 µm) trace
.03937”.005” (125 µm) trace
External
DDi Standard Technology
1 mm BGA IPC 6011/6012 Class 2
Aspect Ratio 10:1
.0394”
Internal
.004” (100 µm) Trace & space
2 track routing
DDi Standard Technology
.010” (250 µm) drill
.0194” (492 µm) via pad
Thickness of .093”(2.362 mm)
1 mm BGA IPC 6011/6012 Class 2
.004” (100 µm) laser drill
.008” (200 µm) via
.0394”
Internal
.00348” (88 µm) trace & space
4 track routing
OR
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.004” (100 µm) Trace
.003” (75 µm) space
4 track routing
1 mm BGA IPC 6011/6012 Class 2
.0394”
Internal
.0045” (112.5 µm) Trace & space
3 track routing
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.004” (100 µm) drill
.008” (200 µm) via pad
0.8 mm BGA
Design Guidelines
IPC 6011 / 6012
Class 2
DDi Technology
Microvia Technology
.0165” (.419 mm) pad 31.5 mils
.006” (150 µm) laser drilled Microvias
.002” (50 µm) dielectric from Layer 1 to 2
Layer 1 Ball Diameter
0.42 - 0.5 mm
DDi Standard Microvia Technology
0.8 MM BGA Design
.003” (75 µm)sm clr
Standard Microvia Technology Layer 1 - 2
.004” (100 µm) trace 2 plcs
.004” (100 µm) space 3 plcs
.0115” (292 µm) Pad
Layer 2
DDi Standard Microvia Technology
0.8 MM BGA Design
Standard Microvia Technology Layer 1 - 3
Layer 3
DDi Standard Microvia Technology
0.8 MM BGA Design
.0165” (.416 mm) pad
.003” (75 µm) trace 2 plcs
.003” (75 µm) space 3 plcs
0.8 MM BGA Design
SMV™ Technology = Triple track on multiple layers
Layer 2 - 7
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.0034” (85 µm) trace
.0034” (85 µm) space
.008” (200 µm) pad
0.65 mm BGA
Design Guidelines
DDi Technology
.012” (300 µm) BGA pad.006” (150 µm) laser drill
.002” (50 µm) sm clr
.0256”.005”(125 µm) trace
External
Soldermask dam = .0096” (240 µm)
DDi Standard Microvia Technology0.65 mm BGA
Via-in-Pad Microvia Technology
.012” (300 µm) pad
.0045” (112 µm) trace & space
.0256”
Internal
Single Track
0.65 mm BGA Via-in-Pad Microvia Technology
DDi Standard Microvia Technology
.008” (200 µm) pad
.0035” (87.5 µm) trace & space
.0256”
Double Track layers 2 - 7
0.65 mm BGA
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
0.5 mm BGA
Design Guidelines
IPC 6011 / 6012
Class 2
DDi Technology
0.5 mm BGA
.0139” (353 µm) space
.010” (250 µm)BGA pad
.005” (125 µm) laser drill
.010” (250 µm) Microvia pad
.002” (50 µm)sm clr
.010” (250 µm trace
.0197” .004” (100 µm) trace
External
DDi Standard Microvia Technology
0.5 mm BGA
.003” (75 µm) trace
.0033 (82.5 µm) space
.0197”
Internal
DDi Standard Microvia Technology
Single Track layer 2
.005” (125 µm) laser drill
.010” (250 µm) Microvia pad
0.5 mm BGA
.0039” (98 µm) trace
.0039” (98 µm) space
.008” (200 µm) MicroVia pad
.0197”
Internal
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
Single Track layers 2 - 7
0.4 mm BGA
Design Guidelines
IPC 6011 / 6012
Class 2
DDi Technology
0.4 mm BGA
.002” (50 µm)sm clr
.0157” .004” (200 µm) trace
External
DDi Standard Microvia Technology
.005” (125 µm) laser drill
.010” (250 µm) pad
.0157”
0.4 mm BGA
.004” (200 µm) trace
.004 (200 µm) space
DDi Standard Microvia Technology
Single Track layer 1 & 2 Two row BGA Limit
Layer 3 not an option
.010” (250 µm) pad
0.4 mm BGA
.008” (200 µm) SMV™ pad
.004” (100 µm) laser drill
.0157”
Single Track layers 1 – 7 7 layers available for routing
with option of 14 layers
.004” (100 µm) trace
.004 (100 µm) space
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
0.4 mm BGA
.008” (200 µm) SMV™ pad
.004” (100 µm) laser drill
.0157”
Single Track layers 1 – 7 7 layers available for routing
with option of 14 layers
.004” (100 µm) trace
.004 (100 µm) space
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
0.4 mm BGA
.0026” (65 µm) trace
.0026 (65 µm) space
.008” (200 µm) SMV™ pad
.004” (100 µm) laser drill
.0157”
Single Track layers 2 – 7 7 layers available for routing
with option of 14 layers
.004” (100 µm) trace
.004 (100 µm) space
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
0.25 mm BGA
Design Guidelines
IPC 6011 / 6012
Class 2
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.003” trace or .004” trace
.004” laser drill
.007” SMV™ pad
0.25 mm Flip Chip
.003” space
.0098”
External Layer 1
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.004” laser drill
.007” SMV™ pad
0.25 mm Flip Chip
.003” space
.0098”
Internal Layer 2
.003” trace or .004” trace
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
.007” SMV™ pad
0.25 mm Flip Chip .0098”
Internal Layer 3
.003” trace or .004” trace
DDi SMVSMV™™ TechnologyStacked MicroVia (SMVSMV™™)
DDi Technology
Gil White
Time & Technology
Dynamic Details, Inc.Dynamic Details, Inc.
Providing Providing
Solutions for Solutions for
Next Next
Generation Generation
ProductsProducts
Dynamic Details, Inc.Dynamic Details, Inc.
DDiTime &
Technology