Upload
mayta-anggraini
View
268
Download
3
Embed Size (px)
DESCRIPTION
elektronika
Citation preview
Diode Leadless Chip Carrier - DLCCThe DLCC family of Ceramic Leadless Chip Carrier packages
Specialists In
Ceramic surface mount products Hermetic metal packaged devices Hermetic power modules Standard and custom products Screening and qualifications Continued supply of earlier device types and packages
Semelab holds approvals for many aerospace semiconductordevices, and can manufacture in accordance with CECC,JANTX, ESAlevel 5000 and other major process flows.
Please let us know your requirements - we can almostcertainly meet them.
Experience and Innovation in Semiconductor Solutions
Issue No. A-10
Your Semelab Distributor:
ISO 9001FM36235
M/0103/CECC/UK VQC-03-003050VQC-03-003049
DSCCQualified
ManufacturersList
DefenceSupply Center
Columbus
EuropeanSpace Agency
MODRegistration
Members of theComponent
ObsolescenceGroupCage
Code U3158Qualification 253 2M8S02BS 9000
1360/M
Designed & produced by Triad. www.triad.uk.com
Semelab LimitedCoventry Road, Lutterworth,Leicestershire. LE17 4JBUK
Tel: +44 (0) 1455 556565Fax: +44 (0) 1455 552612Email: [email protected]
Web: www.semelab-tt.comA subsidiary of TT electronics plc.
Features
The DLCC family of Ceramic Leadless ChipCarrier packages for Diodes is designed forall high reliability applications Space,Aerospace, High temperature and Military.
Detailed informationThe DLCC package design takes full advantage of the provenhigh reliability pedigree of the High Temperature CofiredCeramic (HTCC) surface mount packaging technology, whichis easily integrated for automated assembly. Semelab hastaken the existing standards for ceramic surface mountpackage manufacture and added additional design featuresto enhance thermal performance, to present a competitivealternative for high reliability applications.
The physical dimensions for the DLCC ceramic packages aredesigned to fully utilise the recommended solder footprintfor the popular MELF packages, and as such present a dropin replacement for existing board design. Thermal viasimprove the heat transfer to the solder pads reducing thediode junction temperature and increasing operatinglifetime; options are also available to allow the lid to beconnected to the Anode or Cathode. Connecting the metallid to a known electrical potential stops deep dielectricdischarge in space applications; see the Space Weather linkwww.semelab.co.uk/mil/DLCC on the Semelab web site.
The DLCC has been designed and tooled to be able to meet small, medium and high volume demand allowingcustomers to access the technology and grow therequirements with their product, utilising scalable assemblytechniques to offer high rel diodes, at competitive pricingstructures. This includes full pre cap access for inspection ofsemiconductor prior to hermetic encapsulation.
Semelab has more than 35 years of history in themanufacture of semiconductor devices for high reliabilityapplications with tier one suppliers of Worldwide Space,Military and Aerospace equipment. Our diverse productrange, focused customer response coupled with flexiblebatch size processing and screening in accordance with themost recognised reliability standards offers an attractive andcost effective solution for new and existing designs.
Diode Leadless Chip Carrier - DLCC
Histogram of Thermal Impedance and probability Plots.
Gage R&R%Contribution
Source VarComp (of VarComp)Total Gage R&R 0.8975 1.27Repeatability 0.8916 1.26Reproducibility 0.0058 0.01Operators 0.0058 0.01Part-To-Part 69.8376 98.73Total Variation 70.7350 100.00
Measurements of Delta VF are capable with