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Page 1: Data Sheet

SEMICONDUCTOR TECHNICAL DATA

1 REV 1 Motorola, Inc. 1997

6/97

The MC74VHC245 is an advanced high speed CMOS octal bustransceiver fabricated with silicon gate CMOS technology. It achieves highspeed operation similar to equivalent Bipolar Schottky TTL while maintainingCMOS low power dissipation.

It is intended for two–way asynchronous communication between databuses. The direction of data transmission is determined by the level of theDIR input. The output enable pin (OE) can be used to disable the device, sothat the buses are effectively isolated.

All inputs are equipped with protection circuits against static discharge.

• High Speed: tPD = 4.0ns (Typ) at VCC = 5V• Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C• High Noise Immunity: VNIH = VNIL = 28% VCC• Power Down Protection Provided on Inputs• Balanced Propagation Delays• Designed for 2V to 5.5V Operating Range• Low Noise: VOLP = 1.2V (Max)• Pin and Function Compatible with Other Standard Logic Families• Latchup Performance Exceeds 300mA• ESD Performance: HBM > 2000V; Machine Model > 200V• Chip Complexity: 308 FETs or 77 Equivalent Gates

APPLICATION NOTES

1. Do not force a signal on an I/O pin when it is an active output, damage mayoccur.

2. All floating (high impedence) input or I/O pins must be fixed by means ofpull up or pull down resistors or bus terminator ICs.

3. A parasitic diode is formed between the bus and VCC terminals. Therefore,the VHC245 cannot be used to interface 5V to 3V systems directly.

LOGIC DIAGRAM

ADATAPORT

A8

A7

A6

A5

A3

A4

A2

A1

9

8

7

6

5

4

3

2

DIR

OE

1

19

18

17

16

15

14

13

12

11

B1

B2

B3

B4

B5

B6

B7

B8

BDATAPORT

FUNCTION TABLE

Control Inputs

O iOE DIR Operation

L L Data Transmitted from Bus B to Bus A

L H Data Transmitted from Bus A to Bus B

H X Buses Isolated (High–Impedance State)

PIN ASSIGNMENT

A5

A3

A2

A1

DIR

GND

A8

A7

A6

A4 5

4

3

2

1

10

9

8

7

6

14

15

16

17

18

19

20

11

12

13

B3

B2

B1

OE

VCC

B8

B7

B6

B5

B4

DW SUFFIX20–LEAD SOIC PACKAGE

CASE 751D–04

ORDERING INFORMATIONMC74VHCXXXDWMC74VHCXXXDTMC74VHCXXXM

SOICTSSOPSOIC EIAJ

DT SUFFIX20–LEAD TSSOP PACKAGE

CASE 948E–02

M SUFFIX20–LEAD SOIC EIAJ PACKAGE

CASE 967–01

Page 2: Data Sheet

MC74VHC245

MOTOROLA VHC Data – Advanced CMOS LogicDL203 — Rev 1

2

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS*ÎÎÎÎÎÎ

SymbolÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ParameterÎÎÎÎÎÎÎÎÎÎÎÎ

ValueÎÎÎÎÎÎ

UnitÎÎÎÎÎÎ

VCCÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply VoltageÎÎÎÎÎÎÎÎÎÎÎÎ

– 0.5 to + 7.0ÎÎÎÎÎÎ

VÎÎÎÎÎÎ

VinÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input VoltageÎÎÎÎÎÎÎÎÎÎÎÎ

– 0.5 to + 7.0ÎÎÎÎÎÎ

VÎÎÎÎÎÎ

VoutÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output VoltageÎÎÎÎÎÎÎÎÎÎÎÎ

– 0.5 to VCC + 0.5ÎÎÎÎÎÎ

VÎÎÎÎÎÎ

IIKÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Diode CurrentÎÎÎÎÎÎÎÎÎÎÎÎ

– 20ÎÎÎÎÎÎ

mAÎÎÎÎÎÎ

IOKÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Diode CurrentÎÎÎÎÎÎÎÎÎÎÎÎ

± 20ÎÎÎÎÎÎ

mAÎÎÎÎÎÎ

IoutÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per PinÎÎÎÎÎÎÎÎÎÎÎÎ

± 25ÎÎÎÎÎÎ

mAÎÎÎÎÎÎ

ICCÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND PinsÎÎÎÎÎÎÎÎÎÎÎÎ

± 75ÎÎÎÎÎÎ

mAÎÎÎÎÎÎÎÎÎ

PDÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air SOIC Packages†TSSOP Package†

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

500450

ÎÎÎÎÎÎÎÎÎ

mW

ÎÎÎÎÎÎ

TstgÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature ÎÎÎÎÎÎÎÎÎÎÎÎ

– 65 to + 150 ÎÎÎÎÎÎ

C

* Absolute maximum continuous ratings are those values beyond which damage to the devicemay occur. Exposure to these conditions or conditions beyond those indicated may adverselyaffect device reliability. Functional operation under absolute–maximum–rated conditions is notimplied.

†Derating — SOIC Packages: – 7 mW/C from 65 to 125C TSSOP Package: – 6.1 mW/C from 65 to 125C

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎÎÎÎÎ

Symbol ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter ÎÎÎÎÎÎ

MinÎÎÎÎÎÎ

MaxÎÎÎÎÎÎ

Unit

ÎÎÎÎÎÎÎÎ

VCC ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage ÎÎÎÎÎÎ

2.0ÎÎÎÎÎÎ

5.5 ÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎ

Vin ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage ÎÎÎÎÎÎ

0 ÎÎÎÎÎÎ

5.5 ÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎ

Vout ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage ÎÎÎÎÎÎ

0 ÎÎÎÎÎÎ

VCCÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎ

TA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature ÎÎÎÎÎÎ

– 40ÎÎÎÎÎÎ

+ 85ÎÎÎÎÎÎ

C

ÎÎÎÎÎÎÎÎ

tr, tf ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time VCC = 3.3V ±0.3VVCC =5.0V ±0.5V

ÎÎÎÎÎÎ

00ÎÎÎÎÎÎ

10020ÎÎÎÎÎÎ

ns/V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC ELECTRICAL CHARACTERISTICS

ÎÎÎÎÎÎÎÎS b l

ÎÎÎÎÎÎÎÎÎÎÎÎP

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎT C di i

ÎÎÎÎÎÎ

VCCÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

TA = 25°C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

TA = – 40 to 85°C ÎÎÎÎU iÎÎÎÎ

ÎÎÎÎSymbol ÎÎÎÎÎÎ

ÎÎÎÎÎÎParameter ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎTest Conditions ÎÎÎ

ÎÎÎ

VCCV ÎÎÎÎÎÎÎÎ

Min ÎÎÎÎÎÎ

TypÎÎÎÎÎÎÎÎ

Max ÎÎÎÎÎÎÎÎ

Min ÎÎÎÎÎÎÎÎ

Max ÎÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎ

VIH ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Minimum High–LevelInput Voltage

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

2.03.0 to5.5

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.50VCC x 0.7

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.50VCC x 0.7

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VILÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Low–LevelInput Voltage

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.03.0 to5.5

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

0.50VCC x 0.3

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

0.50VCC x 0.3

ÎÎÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Minimum High–LevelOutput Voltage

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VIH or VILIOH = – 50µA

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.03.04.5

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

1.92.94.4

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.03.04.5

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

1.92.94.4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VIH or VILIOH = – 4mAIOH = – 8mA

ÎÎÎÎÎÎÎÎÎ

3.04.5

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.583.94

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.483.80

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

VOLÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Low–LevelOutput Voltage

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VIH or VILIOL = 50µA

ÎÎÎÎÎÎÎÎÎ

2.03.04.5

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

0.00.00.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.10.10.1

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.10.10.1

ÎÎÎÎÎÎ

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VIH or VILIOL = 4mAIOL = 8mA

ÎÎÎÎÎÎÎÎÎÎÎÎ

3.04.5

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

0.360.36

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

0.440.44

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎIin ÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum InputLeakage Current

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = 5.5 V or GND(DIR, OE)

ÎÎÎÎÎÎ

0 to 5.5ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

± 0.1 ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

± 1.0 ÎÎÎÎ

µA

This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this high–impedance cir-cuit. For proper operation, Vin andVout should be constrained to therange GND (Vin or Vout) VCC.

Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or VCC).Unused outputs must be left open.

Page 3: Data Sheet

MC74VHC245

VHC Data – Advanced CMOS LogicDL203 — Rev 1

3 MOTOROLA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC ELECTRICAL CHARACTERISTICSÎÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

TA = – 40 to 85°CÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

TA = 25°CÎÎÎÎÎÎVCC

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎ

SymbolÎÎÎÎ

UnitÎÎÎÎÎÎÎÎ

MaxÎÎÎÎÎÎÎÎ

MinÎÎÎÎÎÎÎÎ

MaxÎÎÎÎÎÎ

TypÎÎÎÎÎÎÎÎ

MinÎÎÎÎÎÎ

VCCV

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Test ConditionsÎÎÎÎÎÎÎÎÎÎÎÎ

ParameterÎÎÎÎÎÎÎÎ

SymbolÎÎÎÎÎÎÎÎÎÎÎÎ

IOZÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Three–StateLeakage Current

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VIL or VIHVout = VCC or GND

ÎÎÎÎÎÎÎÎÎ

5.5ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

± 0.25ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

± 2.5ÎÎÎÎÎÎ

µA

ÎÎÎÎÎÎÎÎÎÎÎÎ

ICC ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum QuiescentSupply Current

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND ÎÎÎÎÎÎÎÎÎ

5.5 ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

4.0 ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

40.0 ÎÎÎÎÎÎ

µA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)ÎÎÎÎÎÎÎÎ

S b l

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

P

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

T C di i

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

TA = 25°CÎÎÎÎÎÎÎÎÎÎÎÎ

TA = – 40 to 85°CÎÎÎÎ

U iÎÎÎÎÎÎÎÎ

SymbolÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ParameterÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Test ConditionsÎÎÎÎÎÎÎÎ

MinÎÎÎÎÎÎ

TypÎÎÎÎÎÎÎÎ

MaxÎÎÎÎÎÎ

MinÎÎÎÎÎÎÎÎ

MaxÎÎÎÎ

UnitÎÎÎÎÎÎÎÎÎÎÎÎ

tPLH,tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay,A to B or B to A

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 3.3 ± 0.3V CL = 15pFCL = 50pF

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

5.88.3

ÎÎÎÎÎÎÎÎÎÎÎÎ

8.411.9

ÎÎÎÎÎÎÎÎÎ

1.01.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

10.013.5

ÎÎÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 5.0 ± 0.5V CL = 15pFCL = 50pFÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

4.05.5ÎÎÎÎÎÎÎÎÎÎÎÎ

5.57.5ÎÎÎÎÎÎÎÎÎ

1.01.0ÎÎÎÎÎÎÎÎÎÎÎÎ

6.58.5ÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎ

tPZL,tPZHÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Enable TimeOE to A or B

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 3.3 ± 0.3V CL = 15pFRL = 1 kΩ CL = 50pF

ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

8.511.0ÎÎÎÎÎÎÎÎ

13.216.7ÎÎÎÎÎÎ

1.01.0ÎÎÎÎÎÎÎÎ

15.519.0ÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 5.0 ± 0.5V CL = 15pFRL = 1 kΩ CL = 50pF

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

5.87.3

ÎÎÎÎÎÎÎÎÎÎÎÎ

8.510.6

ÎÎÎÎÎÎÎÎÎ

1.01.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

10.012.0

ÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

tPLZ,tPHZ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Disable TimeOE to A or B

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 3.3 ± 0.3V CL = 50pFRL = 1 kΩ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

11.5ÎÎÎÎÎÎÎÎÎÎÎÎ

15.8 ÎÎÎÎÎÎÎÎÎ

1.0ÎÎÎÎÎÎÎÎÎÎÎÎ

18.0 ÎÎÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 5.0 ± 0.5V CL = 50pFRL = 1 kΩ

ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

7.0ÎÎÎÎÎÎÎÎ

9.7 ÎÎÎÎÎÎ

1.0ÎÎÎÎÎÎÎÎ

11.0 ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

tOSLH,tOSHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output to Output SkewÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 3.3 ± 0.3V CL = 50pF(Note 1.)

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.5ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.5ÎÎÎÎÎÎ

pF

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VCC = 5.0 ± 0.5V CL = 50pF(Note 1.)

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.0 ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.0 ÎÎÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎ

Cin ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input CapacitanceDIR, OE

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

4 ÎÎÎÎÎÎÎÎ

10 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

10 ÎÎÎÎ

pF

ÎÎÎÎÎÎÎÎÎÎÎÎ

CI/OÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Three–StateI/O Capacitance

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

8ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

pF

C P Di i i C i (N 2 )

Typical @ 25 °C, VCC = 5.0V

FCPD Power Dissipation Capacitance (Note 2.) 21 pF

1. Parameter guaranteed by design. tOSLH = |tPLHm – tPLHn|, tOSHL = |tPHLm – tPHLn|.

2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC/ 8 (per bit). CPD is used to determine the no–loaddynamic power consumption; PD = CPD VCC2 fin + ICC VCC.

NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 5.0V)

S b l P

TA = 25°C

U iSymbol Parameter Typ Max Unit

VOLP Quiet Output Maximum Dynamic VOL 0.9 1.2 V

VOLV Quiet Output Minimum Dynamic VOL –0.9 –1.2 V

VIHD Minimum High Level Dynamic Input Voltage 3.5 V

VILD Maximum Low Level Dynamic Input Voltage 1.5 V

Page 4: Data Sheet

MC74VHC245

MOTOROLA VHC Data – Advanced CMOS LogicDL203 — Rev 1

4

SWITCHING WAVEFORMS

VCC

GND

A or B

B or A

50%

50% VCC

tPLH tPHL

Figure 1.

OE

A or B

A or B

50% VCC

50% VCC

50% VCC

tPZL tPLZ

tPZH tPHZ

VCC

GND

HIGHIMPEDANCE

VOL +0.3V

VOH –0.3V

HIGHIMPEDANCE

VCC

GND50%

Figure 2.

DIR

50% VCC

TEST CIRCUITS

* Includes all probe and jig capacitance

CL*

TEST POINT

DEVICEUNDERTEST

OUTPUT

Figure 3.

* Includes all probe and jig capacitance

CL*

TEST POINT

DEVICEUNDERTEST

OUTPUT

Figure 4.

CONNECT TO VCC WHENTESTING tPLZ AND tPZL.CONNECT TO GND WHENTESTING tPHZ AND tPZH.

1 kΩ

Page 5: Data Sheet

MC74VHC245

VHC Data – Advanced CMOS LogicDL203 — Rev 1

5 MOTOROLA

EXPANDED LOGIC DIAGRAM

OE

DIR

A1

A2

A3

A4

A5

A6

A7

A8

2

3

4

5

6

7

8

9

19

1

B1

B2

B3

B4

B5

B6

B7

B8

18

17

16

15

14

13

12

11

INPUT EQUIVALENT CIRCUIT

INPUT

BUS TERMINAL EQUIVALENT CIRCUIT

DIR, OE

I/O

A, B

Page 6: Data Sheet

MC74VHC245

MOTOROLA VHC Data – Advanced CMOS LogicDL203 — Rev 1

6

OUTLINE DIMENSIONS

DW SUFFIXPLASTIC SOIC PACKAGE

CASE 751D–04ISSUE E

NOTES:1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.13(0.005) TOTAL IN EXCESS OF D DIMENSIONAT MAXIMUM MATERIAL CONDITION.

–A–

–B–

20

1

11

10

SAM0.010 (0.25) B ST

D20X

MBM0.010 (0.25)P10X

J

F

G18X K

C

–T– SEATINGPLANE

M

R X 45

DIM MIN MAX MIN MAXINCHESMILLIMETERS

A 12.65 12.95 0.499 0.510B 7.40 7.60 0.292 0.299C 2.35 2.65 0.093 0.104D 0.35 0.49 0.014 0.019F 0.50 0.90 0.020 0.035G 1.27 BSC 0.050 BSCJ 0.25 0.32 0.010 0.012K 0.10 0.25 0.004 0.009M 0 7 0 7 P 10.05 10.55 0.395 0.415R 0.25 0.75 0.010 0.029

DT SUFFIXPLASTIC TSSOP PACKAGE

CASE 948E–02ISSUE A

DIMA

MIN MAX MIN MAXINCHES

6.60 0.260

MILLIMETERS

B 4.30 4.50 0.169 0.177C 1.20 0.047D 0.05 0.15 0.002 0.006F 0.50 0.75 0.020 0.030G 0.65 BSC 0.026 BSCH 0.27 0.37 0.011 0.015J 0.09 0.20 0.004 0.008J1 0.09 0.16 0.004 0.006K 0.19 0.30 0.007 0.012K1 0.19 0.25 0.007 0.010L 6.40 BSC 0.252 BSCM 0 8 0 8

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASHOR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH ORPROTRUSION SHALL NOT EXCEED 0.25 (0.010)PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL INEXCESS OF THE K DIMENSION AT MAXIMUMMATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINEDAT DATUM PLANE –W–.

ÍÍÍÍÍÍÍÍÍÍÍÍ

1 10

1120

PIN 1IDENT

A

B

–T–0.100 (0.004)

C

D GH

SECTION N–N

KK1

J J1

N

N

M

F

–W–

SEATINGPLANE

–V–

–U–

SUM0.10 (0.004) V ST

20X REFK

L

L/22X

SU0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40 0.252

––– –––

SU0.15 (0.006) T

Page 7: Data Sheet

MC74VHC245

VHC Data – Advanced CMOS LogicDL203 — Rev 1

7 MOTOROLA

OUTLINE DIMENSIONS

M SUFFIXPLASTIC SOIC EIAJ PACKAGE

CASE 967–01ISSUE O

DIM MIN MAX MIN MAXINCHES

––– 2.05 ––– 0.081

MILLIMETERS

0.05 0.20 0.002 0.0080.35 0.50 0.014 0.0200.18 0.27 0.007 0.011

12.35 12.80 0.486 0.5045.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC7.40 8.20 0.291 0.3230.50 0.85 0.020 0.0331.10 1.50 0.043 0.0590

0.70 0.90 0.028 0.035––– 0.81 ––– 0.032

A1

HE

Q1

LE 10

0 10

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASUREDAT THE PARTING LINE. MOLD FLASH ORPROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWERRADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEADTO BE 0.46 ( 0.018).

HE

A1

LEQ1

cA

ZD

E

20

1 10

11

b

M0.13 (0.005)

e

0.10 (0.004)

VIEW P

DETAIL P

M

L

A

bcDEe

L

M

Z

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Mfax is a trademark of Motorola, Inc.How to reach us:USA/EUROPE/Locations Not Listed : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488

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MC74VHC245/D◊