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CPUs and motherboards
Unit objectives: Describe the function and features of CPUs,
identify a CPU, and classify CPUs according to their specifications. Learn how to replace a CPU
Describe the techniques used to cool CPUs and other components in a PC
Describe motherboards, their components, and form factors. Learn how to replace a motherboard
Identify the symptoms of, probable causes of, and potential solutions to problems with motherboards and CPUs
Topic A
Topic A: Central processing units Topic B: Cooling techniques Topic C: Motherboards Topic D: Motherboard and CPU
troubleshooting
Central processing unit (CPU)
“Brains” of your PC Processes instructions, manipulates data,
controls interactions of other circuits Contains:
– A control unit– One or more
execution units– Registers– Single-core vs.
multi-core processors
CPU design characteristics
Addressable RAM Address bus Data bus Internal bus Cache Clock speed Dual Independent Bus (DIB) Front-side bus speed
continued
CPU characteristics, continued
Hyperthreading Multimedia extensions (MMX) Multiprocessing Overclocking Pipelining Superscalar Throttling
Multiple-processor support
Requires symmetric multiprocessing code for OS and applications
Symmetric multiprocessing code is included in:– Windows 2000 Professional
– Windows XP Professional
– Windows Vista Business, Ultimate, Enterprise
– Windows 7 32-bit versions
Linux and Linux applications are available in symmetric multiprocessing versions
64-bit versions of Windows 7 use NUMA
Processor specifications
Manufacturers (e.g.):– Intel– AMD– Centaur Technology– Elbrus International – Integrated Device Technology, Inc. (IDT)– SIS (Silicon Integrated Systems)– ST Microelectronics
Primary specifications Bus width specifications Internal specifications
Activity A-1
Identifying CPUs
Inside the case
Chipsets CPU packaging Slots Cooling techniques
Chipsets
Memory control System bus functions Audio functions Video display functions System management functions
Northbridge and Southbridge
Two most important components of a PC chipset
Northbridge controls interactions between the CPU, memory (including cache), AGP and PCIe video control circuitry, and the Southbridge
continued
Northbridge/Southbridge, continued
Southbridge controls interactions between buses and devices not controlled by the Northbridge– PCI expansion bus– Floppy drive controller– Serial port– Parallel port– PS/2 keyboard and mouse ports– USB and FireWire– BIOS and CMOS– Etc.
CPU packaging
Chip = die A package is made up of
– Die– Plastic, metal, or ceramic case– Wires or connectors– Support chips– Cooling components
PGA package
80486
SECC package
Pentium 3
Package Full name Description Processors
PDIP Plastic dual inline package
Die is encased in plastic. Large, flat, metal pins are inserted into socket that’s soldered to motherboard.
8080, 8086, 8088
PGA Pin grid array Rows of pins extend from bottom of package. Nickel-plated copper slug sits atop the die to improve thermal conductivity. Pins are arranged so that chip can be inserted in just one way.
80286 (68 pins), 80386 (132 pins), 80486 (168), and Xeon (603 pins)
CPGA Ceramic pin grid array
Uses a ceramic substrate with pins arranged in a pin grid array.
AMD Socket A Athlons and the Duron
SPGA Staggered pin grid array
Similar to PGA, but pins are staggered to fit more in a given area.
Pentium, Pentium MMX, Pentium Pro with 387 pins
Packages
continued
Package Full name Description Processors
PPGA Plastic pin grid array
Updated version of SPGA package.
Pentium Pro; early Celeron processors; Pentium III with 370 pins
FC-PGA Flip chip pin grid array
Similar to PGA, but die is exposed on top. Enhances heat transfer and cooling options.
Pentium III and Celeron with 370 pins; 423-pin version used with Pentium 4 processors
FC-PGA2 Flip chip pin grid array 2
Similar to FC-PGA, but with integrated heat sink, connected to the die during manufacturing.
Pentium III and Celeron with 370 pins; 478-pin version used with Pentium 4 processors; 469 version used with AMD Athlon Thunderbird processors
OOI OLGA On Interposer
Die mounted face-down, as with FC-PGA, for better cooling, but uses different pin arrangement.
423-pin Pentium 4
Packages, continued
continued
Package Full name Description Processors
OPGA Organic pin grid array
Silicon die is attached to organic plastic plate, which is pierced by array of pins to make connections to socket. Cheaper, thinner, and lighter than ceramic package. Reduces electrical impedance.
AMD Athlon XP
SECC Single Edge Contact Cartridge
Mounts CPU vertically on motherboard. Uses an edge connector similar to an adapter card’s. Package is covered with metal case. Metal thermal plate mounted to back of cartridge acts as heat sink.
Pentium II processors with 242 contacts; Pentium II Xeon and Pentium III Xeon processors with 330 contacts
SECC2 Single Edge Contact Cartridge 2
Similar to SECC, but without thermal plate.
Later versions of the Pentium II and III processor with 242 contacts; AMD Athlon K7
Packages, continued
continued
Package Full name Description Processors
SEP Single Edge Processor
Similar to SECC but without metal case.
Early Celeron processors with 242 contacts
FCBGA Flip chip ball grid array
Similar to FC-PGA, but uses balls for contacts. Balls can’t be bent.
Xeon, plus many support chips in current Pentium-class computers
LGA Land grid array
Has small raised contacts. Corresponding socket has pins that meet the contacts. A very high-density package.
Celeron D, Pentium 4, Pentium 4 D, Pentium Extreme Edition, Core2 Duo, Core2 Extreme
PGA-ZIF Pin grid array-Zero insertion force
Set in place with very little to no force. Weight of package enough to seat. Held in place with lever or slider
Xeon, Mobile Pentium M, Mobile Celeron M, Mobile Core, Core Duo, and Core 2 Duo
Packages, continued
Sockets and slots
continued
Type Supports these packages
Processors Notes
Slot A AMD’s Card Module package
AMD Athlon Wasn’t a popular design; didn’t last long.
Socket A (Socket 462)
SPGA with 462 pins AMD Athlon and Duron
Eleven holes in socket were plugged to ensure that packages were installed correctly.
Socket 5 PGA, SPGA with 320 pins
Pentium
Socket 7 PGA; SPGA with 321 pins; PGA, SPGA, and FC-PGA with 296 pins
AMD K5 and K6, Cyrix 6x86, Pentium, and Pentium MMX
First socket to support dual voltage inputs. Prevents a new CPU from being plugged into a Socket 5 socket.
Sockets and slots, continued
continued
Type Supports these packages
Processors Notes
Socket 8 387-pin PGA, SPGA, and FC-PGA
Pentium Pro Short-lived socket design used primarily with Pentium Pro.
Socket 423
423-pin SPGA and FC-PGA, OOI
Pentium 4 Short-lived socket design used for early Pentium 4 processors.
Socket 478
FC-PGA2 Celeron, Pentium 4, Pentium D, Pentium Extreme Edition
Current general-purpose socket for Pentium-class processors.
Socket 370
SPGA and PPGA with 370 pins
Celeron, Celeron II, Pentium III
Similar to Socket 7 design, with 6 staggered rows of pins rather than 5.
Sockets and slots, continued
continued
Type Supports these packages
Processors Notes
Socket 603
PGA-ZIF Xeon 603 contacts in grid around center of socket.
Socket 604
PGA-ZIF Xeon 604 pins with 603 contacts. Supports heatsink.
Slot 1 SECC, SECC2, SEP with 242 contacts
Pentium II, early Celeron, and Pentium III
Edge connector slot developed specifically for SECC, SECC2, and SEP packages.
Slot 2 SECC, SECC2, SEP with 330 contacts
Pentium II and Xeon
Similar to Slot 1, but CPU can communicate with Level II cache at full CPU speed.
Type Supports these packages
Processors Notes
LGA775 (Socket T)
LGA Celeron D, Pentium 4, Pentium D, Pentium Extreme Edition, Core2 Duo, Core2 Duo Extreme
Designed to work specifically with new high-density LGA package. Intel’s current high-end socket.
LGA 1156 (Socket H)
LGA Pentium, Core i3, Core i5, Core i7 (800 series), Xeon
Allows connections to PCIe 2.0 x16 graphics card. PCIe 2.0 x4 connect for DMI communication. Two memory channels for DDR3 SDRAM.
LGA 1366 (Socket B)
LGA Core i7 (900 series), Xeon (5500 series)
Replaces LGA 775. Access up to three channels of DDR3 memory
Sockets and slots, continued
continued
Sockets and slots, continued
continued
Type Supports these packages
Processors Notes
Socket 479
PGA-ZIF Mobile Pentium M and Celeron M
Physically similar to Socket 478; different electrical pin arrangement.
Socket 495
PGA-ZIF Mobile Celeron Designed to support a heatsink.
Socket M PGA-ZIF Mobile Core Solo, Core Duo, Core 2 Duo Celeron M
Replaces Socket 479, however, one pin is changed.
Socket P PGA Mobile Core 2 Duo, Core 2 Quad Celeron M Pentium Dual-Core
478 pins, but incompatible with Socket M or Socket 478.
Pentium with MMX CPU & Socket 7 socket
Activity A-2
Identifying your CPU’s socket and package type
CPU installation
CPU typically replaced as part of new motherboard
Add another CPU to multiprocessor motherboard
CPU packaging must match slot or socket in motherboard
CPU packages held in place by retaining clips, locking lever, or other mechanism
Zero insertion force socket
Locking socket arm
Installing a CPU
1. Unplug the computer and open the case
2. Remove the old CPU
3. Store the old CPU
4. Insert the new CPU package into its socket and secure it with the retaining mechanism
5. Close the case, reconnect cables, and boot the PC
Activity A-3
Replacing a CPU (optional)
Topic B
Topic A: Central processing units Topic B: Cooling techniques Topic C: Motherboards Topic D: Motherboard and CPU
troubleshooting
Typical cooling mechanisms
Fans Heat sinks and cooling fins Heat pipes Water pumps Peltier coolers Phase-change cooling Undervolting
Power supply and CPU fans
Power supply fan
Auxiliary fan
Cooling fins
Cooling fins and a fan
Other cooling techniques
Heat pipes — Small tubes filled with fluid Water pumps — Tubes filled with water,
moved away from CPU to outside case and through cooling fins
Peltier coolers – Electronic device that gets colder when voltage
is applied– Non-convection– Connected directly to CPU– Can be combined with water coolers
continued
Other cooling techniques, continued
Phase-change cooling– Vapor compression– Gas to liquid– Liquid absorbs processor heat and evaporates– Gas returned to compressor– Cycle begins again– More efficient than water cooling systems– Generate significant noise
Undervolting– Less power; less heat– Can cause system problems
Activity B-1
Examining the cooling systems in your PC
Activity B-2
Replacing a system fan
Topic C
Topic A: Central processing units Topic B: Cooling techniques Topic C: Motherboards Topic D: Motherboard and CPU
troubleshooting
A motherboard
Back panel connectors
Socket 478 connector
3 DIMM banks
ATX power supply
2 IDE ports
Chipset
Chipset
Floppy drive port
CMOS battery
BIOS
AGP slot
CD-in connector (white line)
4 PCI slots
Motherboards
Components reviewCPU
Expansion slots
AGP graphics adapter slot
Hard drive interface connectors
Floppy drive interface connector
Optical drive interface connector
Power connector
Memory slots
PS/2 mouse and keyboard ports
USB port
IEEE 1394 / FireWire port
Serial port
Parallel port
Battery
Network interface
Video connectors
Daughter board
A circuit board Connects to another circuit board to
provide or assist with its functions Most often used with video cards
Riser card
Form factor
Size and shape of a motherboard Dictates power supply and case Describes physical layout of
components
Activity C-1
Examining motherboard components and form factor
Motherboard installation
Failures from manufacturing defects or rough handling
Replaced due to failure; upgrades; building PC from scratch
Held in place by screws or plastic clips Remove wires, cables, connectors,
and other system components, such as power supply and drives
Installing a motherboard
1. Unplug the computer and open the case2. Disconnect all wires from old motherboard3. Remove the power supply and drives4. Remove the old motherboard5. Store the old motherboard6. Orient motherboard; match mounting holes7. Remove old standoffs and/or install new
standoffs8. Install the new motherboard9. Reinstall the power supply and drives10.Connect all wires11.Close the case, reconnect cables, and boot
the PC
Windows activation
Type of cataloging process Entered into Microsoft database:
– Software product– Product key– Hardware signature
Commercial versions have 30-day grace period
Activate by:– Internet– Telephone
Volume licenses don’t require activation
Activity C-2
Replacing a motherboard (optional)
Topic D
Topic A: Central processing units Topic B: Cooling techniques Topic C: Motherboards Topic D: Motherboard and CPU
troubleshooting
Motherboard and CPU problems
System fails to boot Burning or foul odor or smoke comes out of
the case Fans come on and power lights indicate that
power is present, but system fails to boot Video display problems occur on system
with integrated display adapter Intermittent problems occur that can’t be
traced to failure of other components
Activity D-1
Troubleshooting motherboard and CPU problems
Unit summary
Described the function and features of CPUs, identified a CPU, and classified CPUs according to their specifications. Learned how to replace a CPU
Described the techniques used to cool CPUs and other components in a PC
Described motherboards, their components, and form factors. Learned how to replace a motherboard
Identified the symptoms of, probable causes of, and potential solutions to problems with motherboards and CPUs