Your best contact in contactless: www.ask-rfid.com

Main features

• Laminatedinlayswithchip&antenna• VersatileinlaycompliantwithPVC,PETG,PETF

(Melinex®)orPolycarbonatematerials• Forlonglastingcards,abletowithstand100,000ISO

bendingcycles• BenefitoftheASKpatentedcontactlesstechnology• ProducedinaMasterCardcertifiedsite

Application for card manufacturing

• Compliantwithbankingcardembossing(PayPass,VisaWave)

• Mifare®transitcard• IDcard,drivinglicence,healthcarecard• Polycarbonatecard• UHFlongrangecard

Laminated inlays for contactless smartcards

CoreLam®

CoreLam®rangeofproductisawidefamilyofinlaysforcontactlesssmartcards,meetingcustomerrequirementsinlinewiththeidentityandbankingmarkets.

AversatileinlaycompliantwithvariousouterlayermaterialsandASKpatentedcontactlesstechnologyconstitutethebestfeaturesdescribingtheCoreLam®products.

Your best contact in contactless: www.ask-rfid.com© A

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Product specifications

Overview

• Laminatedinlayswithchip&silverantenna

• Designedtobelaminatedwithvariousmaterial:PVC,PETG,PETF(Melinex®),Polycarbonate,or

clearlaminate

Product description

• UHFantennaandHFClass1antenna

• ASKpatentedtechnology

• MadeofTeslin®,PVC,PETG,Polycarbonate

• Sheetregistration:referenceedges,opticalregisteredmarks,blackspots

Qualified chips

• UHFEPCGen2

• Mifare®

• Chipsforbankingapplications(PayPass,VisaWave)

• Chipsforidentityapplications(ICAO,ICAOlite)

Transponder specification

• CompliantwithISO14443,ISO18006-C&ISO10373

• Compliantwithstandardfrequencies:13.56Mhz(HF)&900Mhz(UHF)

• Sheetsize:5x5,3x7,6x6,…&customizedlayout

Performances

Benefitsinclude:

• Thininlays(<350µm)• Resistancetobendingupto100,000cycles• Modulefreetechnologysimplifiesthelogisticflowofcardmanufacturer

Versatility

CoreLam® structure isamulti-layeredcontructionmadeof long lastingmaterials.CoreLam®caneasilybelaminatedwithvariousouter layerssuchasPVC,PETG,PETFMelinex®. ItprovidesreliablesolutionforTeslin®cardandpolycarbonatethatarerequiredforthedemandingidentitymarket(IDcardandpassport).ThesametypeofCoreLam®canacceptdifferentouterlayers,ensuringversatilityandeffectivenessforthesmartcardmanufacturerwhocanproduceseveralendproductsfromthesamerawmaterial.EachCoreLam®inlayisavailableindifferentformatsuponcustomerrequest:from5x5to4x10.FinallytheCoreLam®isfullycompliantwithanyequipmentabletolaminateanddiecutsmartcardswithoutmodificationofmanufacturingprocess.

Field-proven

Theknow-howacquiredinthecontactlessareasince1997allowsASKtosupportitscustomerswithateamofexpertsintheelectronic&processmanufacturing.ASKdesignsitsownantennasinordertoreachthebestperformancesaswellastocomplywiththevariousRFIDstandards.EachCoreLam® product includes a guideline document, ensuring a perfectinlayprocessingallowingtogettheexpectedsmartcard.

Any type of chips

ASK is independent from any chip manufacturer, and acts as an inlaymanufacturer.ASK’s strategy is to focuson contactless technologyandbe chipagnostic. Thusourbusinessmodel ineID consists in supplyingthe contactless inlaywhenour customers supply the chip/OS solution.Fromverysmalldies(UHF)tomuchlargerones(ICAO80KBofEEPROM),ASKhasalreadyqualified itsCoreLam®productwithawide rangeofcontactlesschips.

Product range

Thickness MainfeaturesClearcore

UHFqualified

chips

HFqualified

chips

Compliantwithouterlayers

madeof

ISObendingcycles

CoreLam®24x 410µm “Versatileinlay“ No EPCGen2EEPROM

1KBto80KBPVC,PETG,PETF

(Melinex®)>100000cycles

CoreLam®35x 520µm“Theinlaydedicated

forTeslin®cards”No EPCGen2

EEPROM1to80KB

PET/PElaminateforTeslin®cards

>100000cycles

CoreLam®43xCoreLam®44x

300µm400µm

“The100%PCinlay” Yes EPCGen2EEPROM1to80KB

Polycarbonate,PETG,PETF(Melinex®)

>40000cycles