Copyright PDES, Inc. R 2000.01.26 ISO-IEC 10303-210 Overview for Supply Chain Support NASA STEP for Aerospace Workshop at Jet Propulsion Laboratory, Pasadena,

Copyright PDES, Inc.

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2000.01.26

ISO-IEC 10303-210 Overview for Supply Chain Support

NASA STEP for Aerospace Workshop at Jet Propulsion Laboratory,

Pasadena, CA.

January 26, 2000Thomas R. ThurmanRockwell Collins Inc.


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Agenda

Domain, Scope and Usage Configuration and Design Management Requirements Functional Models & Port Mapping Part Models Assembly Concepts Interconnect Model Material & External Definition


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AP210 Domain

Domain is Configuration Controlled Design of Electronic Assemblies, their Interconnection and Packaging

Product Enclosure

Package

Die

Packaged PartPrinted Circuit Assemblies

Interconnect Substrate

Die


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AP210 Scope

Scope is the “As-Required” & “As-Designed” Product Information

– Design “In Process” & “Release” Sharing Partners:

– Engineering Domains

– Design / Analysis

– Manufacturing / Analysis

Sharing Across Several Levels of Supply Base


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DeviceSupplier

Configuration ManagedCorporate Data Process

System EngineerSimulation Model Supplier

FabricationVendor

AssemblyVendor

Package DataSupplier

Requirements

AP210 Usage Supply Chain

Design Team

MCAD

ECAD


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System Engineer

AP210 Usage Data Re-Use

EE

Initial TaskNegotiationand data dumpto EE

Vendor Web Site

Sys EngGets MoreData

Sys Engsends datato EE

EE PerformsTask

EE TransmitsData to SysEng

FinalData PackageStored inRepository


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AP210: Overview

Assembly Models

• User View• Design View• Component Placement• Material product• Complex Assemblies with Multiple Interconnect

Component / Part Models

• Analysis Support • Package• Material Product• Properties• “White Box”/ “Black Box”

Requirements Models• Design• Constraints• Interface• Allocation

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Functional Models

• Functional Unit• Interface Declaration• Network Listing• Simulation Models• Signals

Interconnect Models

• User View• Design View• Bare Board Design• Layout templates• Layers

planarnon-planar

conductive non-conductive

Configuration Mgmt• Identification• Authority • Effectivity • Control• Net Change


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Configuration and Design Management Capabilities

Conventional Design Control for In-Process and Released Data (e.g., based on AP 203 with Extensions)

Manage All Product Models

Configuration Mgmt• Identification• Authority • Effectivity • Control• Net Change

Net Change Capability:

– Add, Delete, Change Properties

– Applies to Any Sensible Design Object Change Request / Change Order:

– Reference Net Change Capability to Identify Explicit Change Request or Change Applied


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Relationships Between Design Definition and“Published Library Data” May be Establishedand Managed Under Configuration Control.

Details are Invisible to Customer.

Protecting Intellectual Property

Design Archives

PublishedLibrary

Data

CustomerAccessibleData(Interfaces,ICDs,Pin Maps,ComputerBehaviouralModels,OrganizationalOwnershipDeclarations,Parameters...)

ConfigurationManagedRelationshipsHigh Accuracy Models,

Design Definitions


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Requirements Models

Requirements• Design• Constraints• Interface• Allocation

Requirements Model is a Product Model. Requirements Model has a Tree Structure. Each Requirement may be for one of Several

Purposes (e.g.,Design, Constraint, Interface..).

Each Requirement may be composed of other Requirements using AND, OR combinations.

Each Requirements may be DERIVED from other Requirements.

Source Specification is Identified


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Requirements Models

Requirements may be Allocated to Almost any Design Aspect. Some Design aspects Serve as Explicit Requirements for Other Design Aspects

- Connectivity for Layout

- Assembly for Interconnect


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Functional Unit– Product Model– EE / Systems Paradigm– Includes Interface Declaration– Includes Definition Declaration

» Behavioural Description

» Network Listing Description

Functional Models

Functional Models



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Interface Declaration– “Usage View”– Contents

» Parameter Declaration

» Terminal Declaration

» Function Name Declaration

Functional Models

Functional Models



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Functional Models

Network Listing Definition:– “Design View”

– Folded Hierarchical Network listing

– Flattened Network Listing

– Flattened Network Listing With Routing Constraints

– Nodal Representation

– Instantiation of Simulation Models

– Provide Mapping Between Folded and Flattened


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Functional Models

Simulation Model Simulation Model is a Product Model Simulation Model includes Interface Declaration Simulation Model includes Source Code whose Syntax is

Defined by External Simulation Language (I.e., VHDL, Spice, VHDL-AMS, Mast, Verilog, ...)


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Functional Models

Simulation Model Port Type Classification defines the Engineering Domain that the Network Listing models Represent

» Electrical--Causal, non-causal, lumped, distributed

» Thermal, Displacement

Explicit Assignment to Product Data is provided in order to map from Geometric model space into other model spaces.


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Functional Specification

Behavioral Characterization:– Model of Functional “Test Bench”

– Modeled from Data Sheet Functional Definition (Charts, Graphs, …)

– Signal Data Type Definition Uses External Definition Capability (e.g., ATLAS)


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Functional Specification

Functional Specification (cc26) Defines the Information needed to Characterize a Device Under Test via Measured Data.May be Many Inputs and Outputs

Application objects: Functional_specification, Signal_specification, Representation etc.

Vin Vout


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• Analysis Support • Package• Material Product• Properties• “White Box”/ “Black Box”

Electrical /Mechanical Components -- Product Model Functional and Physical Interface Description Package (container for semiconductors) -- Product Model Functional and Physical Characterization Including

Dimensions and Tolerances Provides verifiable correlation between the 2D and the 3D

Product Definition of the Component Provides Highly Explicit Model for Analysis Support


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AP210: Part ConceptPackage Packaged

Part

PackagedPartTerminal

BareDie

Package Body

ConnectionZone


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Building a Library Package Definition(CC14)

Primary Reference Terminal

Primary orientation featureDatum Plane in role of Seating Plane

PackageGeometricOrigin


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Join Terminals

Interface Terminals

Packaged_connector in AP 210

Packaged_connector has additional functionality:There is a short between an Interface Terminaland a Join Terminal

Interface TerminalsMate with OtherInterface Terminalsin an Assembly

Join Terminalsmate with some interconnectingmaterial in aLayout


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Information structures often found in “library”– Tightly Coupled Simulation Models and Product Definition

Data

– Defined Parameter Types

– Defined Port Names and Types

– Models Instantiated by Explicit Assignment of Product Definition Data to Parameters and Ports

Provides verifiable correlation between the 2D land pattern and the 3D Product Definition of the Component

Component / Part Models• Functionality• Termination • Shape 2D, 3D • Material Product• Characteristics


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Part Model Capability (cont-d)

Part• Functionality• Termination • Shape 2D, 3D • Material Product• Characteristics

Extend Package Definition from Drawings to Digital Data

Implements Programmable “Make From” Parts

Multi-level Multi-Discipline Part Shape Representation– Environment– Purpose– Material Condition


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Mapping between Structural and Simulation Models

Establishes Explicit Relationship between Functional or Physical Model and Simulation Models.


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analytical_model_port

part_feature_model_port_assignment

Part_feature

analytical_model

Part_feature to Model port Assignment

Part_feature: Some aspectof a Part that is identifiedfor the purpose of communicatingdesign intent.


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connection_zone_model_port_assignment

connection_zoneanalytical_model

Connection_zone To Model port Assignment

Connection_zone: An area on a feature suitable for making a mechanical connection to the featurefor electrical or mechanical purposes.


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Datum_difference_model_port_assignment

Datum_difference

analytical_model

Datum_difference to Model port Assignment

Datum_difference: a measureof the relative displacementbetween two datum.


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Assembly Model– Product Model– Includes Interface Declaration

» Physical & Functional

– Includes Definition Declaration» Physical & Functional

» Multiple Interconnect

Assembly Models

Assembly Models



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Assembly Model– Assembly Features– Connectivity Implementation

Assigned to Specific Interconnect– Assembly Model Reflects

Connectivity Requirements and Layout Requirements

– Assembly Model May be used in Process Planning (Assy. Panel)

Assembly Models

Assembly Models



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Assembly Relationship

physical_unit_design_view

(ABS)physical_unit

usage_view

physical_unit_usage_view

assembly_module

assembly_component

usage_definition physical_unit_or_

part_template

(INV) assembly S[1:?]

assembly_composition_relationship

*assembly

*component

packaged_part

interconnect_module_

usage_view

next_higher_assembly_relationship

1

1


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Assembly Relationship

assembled_feature_select

assembly_component

packaged_component

packaged_component_join_

terminal

(RT) associated_component

interconnect_module_

component_terminal

(RT) associated_component

interconnect_module_component

assembly_joint

assembly_features S[2:2]

description

name

1


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Assembly Joint

assembled_feature_select

packaged_component_join_

terminal

interconnect_module_component_terminal

assembly_joint

assembly_features S[2:2]

description STRING

name STRING

connection_zone

assembly_joint_with_

connection_zonesconnection_zone_2

connection_zone_1


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Interconnect Models

• Interface Description• Design View• Bare Board Design• Layout templates• Layers

planarnon-planar


Interconnect Models

Interconnect Model– Product Model– Includes Interface Description

» Physical & Functional

– Includes Design Description» Physical & Functional

» Layout “Metal” Description

» Material Stackup


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Interconnect Models

• Interface Description• Design View• Bare Board Design• Layout templates• Layers

planarnon-planar


Interconnect Models

Interconnect Model– Support Requirements from

Multiple Assemblies– Design Model also applies to

Manufacturing Tooling Creation (Panelization)


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Material Model

Material Description Material Composition Material Assembly Material Identification via

Standard Registration Document


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External Definition

Externally Defined Data types Reference Authoritative Documents, for example:

– Frequency Modulation ( Frequency, Deviation, Modulation Percent) defined in ARINC ATLAS …

– transition frequency (ft, Mhz) defined in Spice Language Reference Manual v1.2

– Externally Defined Data Types Provide Technology Independence.


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Additional Information:

AP 210 Web sites: ap210.aticorp.org NASA STEP web sites:

http://www.step.nasa.gov, http://www.step.jpl.nasa.gov

ISO web site: http://www.nist.gov/sc4