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Contents
• Introduction(Chapter 1)Introduction(Chapter 1)• Logic Synthesis for Low Poser(Chapter 6)Logic Synthesis for Low Poser(Chapter 6)• Low Power Arithimetic Components(Chapter 7)Low Power Arithimetic Components(Chapter 7)• Low Power Microprocessor Design(Chapter 9)Low Power Microprocessor Design(Chapter 9)• Algorithm and Architectural Level MethodologiesAlgorithm and Architectural Level Methodologies (Chapter 11)(Chapter 11)• Low Power Clock Distribution(Chapter 5)Low Power Clock Distribution(Chapter 5)• Portable Video-on-Demand in Wireless CommunicatiPortable Video-on-Demand in Wireless Communicati
on(Chapter 10)on(Chapter 10)
INTRODUCTION(CHAPTER 1)
1.1 Motivation1.1 Motivation
1.2 Sources of Dissipation in Digital 1.2 Sources of Dissipation in Digital Integrated CircuitsIntegrated Circuits
1.3 Degrees of Freedom1.3 Degrees of Freedom
1.4 Recurring Themes in Low-Power1.4 Recurring Themes in Low-Power
1.5 Emerging Low Power Approaches1.5 Emerging Low Power Approaches
1.6 Summary1.6 Summary
1.1 Motivation[1]
• Traditional system performanceTraditional system performance
- Synonymous with circuit speed or processing power- Synonymous with circuit speed or processing power
- MIPS or MFLOPS- MIPS or MFLOPS
- Direct correspondence between silicon area and cost- Direct correspondence between silicon area and cost
- Increasing the implementation area- Increasing the implementation area
-> higher packaging costs as well as reduced fabrication -> higher packaging costs as well as reduced fabrication yieldyield
-> increased product cost-> increased product cost
- Improvements in system performance- Improvements in system performance
-> the expense of silicon real estate-> the expense of silicon real estate
- Until recently, power considerations were only secondary - Until recently, power considerations were only secondary
concernconcern
1.1 Motivation[2]
• Recent Design trendRecent Design trend
- Remarkable success and growth of the portable - Remarkable success and growth of the portable consumer consumer
electronics marketelectronics market
- Lap-top computers, Personal Digital Assistants, - Lap-top computers, Personal Digital Assistants, Cellular Cellular
phones, Pagers, MP3, and other portable devicesphones, Pagers, MP3, and other portable devices
-> Average power consumption has become a -> Average power consumption has become a critical design critical design
concernconcern
1.1 Motivation[3]
• Future portable multi-media terminalFuture portable multi-media terminal - supports high bandwidth wireless communication, bi-directional - supports high bandwidth wireless communication, bi-directional
motion video, high quality audio, speech and pen-based input and fmotion video, high quality audio, speech and pen-based input and full texts/graphicsull texts/graphics
-> Projected power budget: 40W-> Projected power budget: 40W -> Nickel-Cadmium battery offers around 20 Watt-hours/pound -> Nickel-Cadmium battery offers around 20 Watt-hours/pound -> 20 pounds of batteries for 10 hours of operation-> 20 pounds of batteries for 10 hours of operation -> Nickel-Metal-Hydride offers around 30-35 Watt-hours/pound-> Nickel-Metal-Hydride offers around 30-35 Watt-hours/pound -> 7 pounds-> 7 pounds - Battery capacity has improved with a factor 2 to 4 over 30 ye- Battery capacity has improved with a factor 2 to 4 over 30 ye
arsars - Rechageable lithium or polymers is anticipated to increase ba- Rechageable lithium or polymers is anticipated to increase ba
ttery life-time with no more than 30 to 40% around year 2000ttery life-time with no more than 30 to 40% around year 2000
1.1 Motivation[4]
- In absence of low-power design techniques, current and - In absence of low-power design techniques, current and future portable devices will suffer from either very short future portable devices will suffer from either very short
battery battery life or unreasonable heavy battery packslife or unreasonable heavy battery packs -> A low power design approach should be adopted-> A low power design approach should be adopted• Trend in microprocessor power comsumptionTrend in microprocessor power comsumption - a function of die area x clock frequency- a function of die area x clock frequency - P = - P = αα · area · f · area · fclock clock with with αα = 0.063 W/cm = 0.063 W/cm22 · MHz · MHz - 10 cm2 microprocessor clocked at 500 MHz would consume - 10 cm2 microprocessor clocked at 500 MHz would consume 315 Watt315 Watt -> increasingly expensive packaging and cooling strategies-> increasingly expensive packaging and cooling strategies -> chip power consumption increases-> chip power consumption increases
1.1 Motivation[5]
• Issue of reliabilityIssue of reliability
- High power systems tend to run hot- High power systems tend to run hot
-> high temperature tends to exacerbate several silicon failu-> high temperature tends to exacerbate several silicon failurere
mechanismmechanism
- Every 10 °C increase in operating temperature doubles a compone- Every 10 °C increase in operating temperature doubles a component’s failure ratent’s failure rate
-> Thermal runaway, gate dielectric, junction fatigue, -> Thermal runaway, gate dielectric, junction fatigue,
electromigration diffusion, electrical-parameter shift, packagelectromigration diffusion, electrical-parameter shift, package- e-
related failure, silicon-interconnect fatiguerelated failure, silicon-interconnect fatigue
1.1 Motivation[6]
• Application considerationApplication consideration
- Pace makers and digital watches- Pace makers and digital watches
-> minimize power to an absolute minimum-> minimize power to an absolute minimum
-> Overall power levels are normally below 1 mW-> Overall power levels are normally below 1 mW
- Cellular phones and portable computers- Cellular phones and portable computers
-> keep the battery lifetime reasonable and packaging c-> keep the battery lifetime reasonable and packaging cheapheap
-> Power levels below 2 W-> Power levels below 2 W
- Workstations and set-top computers- Workstations and set-top computers
-> reduce system cost(cooling, packaging, energy bill-> reduce system cost(cooling, packaging, energy bill
1.2 Sources of Dissipation in Digital ICs
• Static PowerStatic Power
- Ideal CMOS circuits dissipate no static (DC) power in - Ideal CMOS circuits dissipate no static (DC) power in the the
steady statesteady state
- In reality, there are leakage currents and substrate - In reality, there are leakage currents and substrate injection injection
currentscurrents
-> give rise to a static component of CMOS power -> give rise to a static component of CMOS power dissipationdissipation
- Static component of power consumption in low-power CMOS- Static component of power consumption in low-power CMOS
should be negligibleshould be negligible
- Focus shifts primarily to dynamic power consumption- Focus shifts primarily to dynamic power consumption
1.2 Sources of Dissipation in Digital ICs
• Dynamic PowerDynamic Power
- dynamic component of power dissipation arises from the - dynamic component of power dissipation arises from the
transient switching behavior of the CMOS devicetransient switching behavior of the CMOS device
- At some point during the switching transient, both the NMOS - At some point during the switching transient, both the NMOS
and PMOS devices will be turned onand PMOS devices will be turned on
-> a short-circuit exists Vdd and ground and currents flows-> a short-circuit exists Vdd and ground and currents flows
-> 10-15% of the total power-> 10-15% of the total power
- Capacitance charging consumes most of the power by CMOS- Capacitance charging consumes most of the power by CMOS
- CMOS power consumption depends on the switching activity - CMOS power consumption depends on the switching activity
of signals involvedof signals involved
1.2 Sources of Dissipation in Digital ICs
• Dynamic PowerDynamic Power
- Average CMOS power consumption- Average CMOS power consumption
Pdyn = Pdyn = αα C V C V22dddd ff
- Dynamic power is proportional to switching activity, cap- Dynamic power is proportional to switching activity, capacitive acitive
loading, and the square of the supply voltageloading, and the square of the supply voltage
- In CMOS, 90% of the total power dissipation- In CMOS, 90% of the total power dissipation
1.3 Degree of Freedom[1]
• Three degree of freedom inherent in the low-Three degree of freedom inherent in the low-power design spacepower design space
- Voltage- Voltage
- Physical capacitance- Physical capacitance
- Activity- Activity
- Reduce one or more of these factors- Reduce one or more of these factors
- These parameters are not completely - These parameters are not completely orthogonal and orthogonal and
can not be optimized independentlycan not be optimized independently
1.3 Degree of Freedom[2]
• 1.3.1 Voltage1.3.1 Voltage
- Most direct and dramatic means of minimizing energy - Most direct and dramatic means of minimizing energy
comsumptioncomsumption
- Figure 1.6- Figure 1.6
-> Energy consumption vs. Supply voltage-> Energy consumption vs. Supply voltage
-> Circuit delay vs. Supply voltage -> Circuit delay vs. Supply voltage
- Designer sacrifice increased physical capacitance or - Designer sacrifice increased physical capacitance or
circuit activity for reduced voltagecircuit activity for reduced voltage
- Performance requirement & Compatibility- Performance requirement & Compatibility
-> Primary derterming factor-> Primary derterming factor
1.3 Degree of Freedom[3]
• As supply voltage is loweredAs supply voltage is lowered
- Circuit delays increase (Figure 1.6b)- Circuit delays increase (Figure 1.6b)
-> Reduce system performance-> Reduce system performance
- In order to meet system performance requirements, - In order to meet system performance requirements,
these delay increases must be checkedthese delay increases must be checked
- Some techniques must be applied - Some techniques must be applied
-> Technological or architectural compensation -> Technological or architectural compensation
- Limit of the advantageous range of voltage supply- Limit of the advantageous range of voltage supply
VVdddd ≈ V ≈ Vtt
1.3 Degree of Freedom[4]
• Issue of Compatibility and Inter-operabilityIssue of Compatibility and Inter-operability
- Most off-the-shelf components operate off either 5V,- Most off-the-shelf components operate off either 5V,
3.3V or, more recently less than 3V supply3.3V or, more recently less than 3V supply
- Communications are required with components operating- Communications are required with components operating
at a standard voltageat a standard voltage
- This dilema can be lessened by the availability of - This dilema can be lessened by the availability of
DC-DC level converters -> More cost DC-DC level converters -> More cost
- System operates off a single low voltage (e.g 2V- System operates off a single low voltage (e.g 2Vt t ))
-> level shifting only required for communication -> level shifting only required for communication
with the outside worldwith the outside world
1.3 Degree of Freedom[5]
• 1.3.2 Physical Capacitance1.3.2 Physical Capacitance
- Power consumption depends linearly on the - Power consumption depends linearly on the physicalphysical
capacitance being switched.capacitance being switched.
- Factors contributing to the physical - Factors contributing to the physical capacitance of capacitance of
a circuita circuit
- Two primary sources of capacitance in CMOS- Two primary sources of capacitance in CMOS
-> Devices and Interconnect-> Devices and Interconnect
1.3 Degree of Freedom[6]
• 1.3.2 How to keep the capacitance at a minimum1.3.2 How to keep the capacitance at a minimum
- Use less logic, smaller devices, fewer and - Use less logic, smaller devices, fewer and shortershorter
wireswires
• Techniques for reducing the active areaTechniques for reducing the active area
- resource sharing- resource sharing
- logic minimization- logic minimization
- gate sizing- gate sizing
1.3 Degree of Freedom[7]
• Techniques for reducing the interconnectTechniques for reducing the interconnect
- register sharing- register sharing
- common sub-function extraction- common sub-function extraction
- placement and routing- placement and routing• Reducing device sizesReducing device sizes
-> Reduce physical capacitance-> Reduce physical capacitance
-> but also reduce the current drive of the transistors-> but also reduce the current drive of the transistors
-> cause the circuits to operate more slowly-> cause the circuits to operate more slowly
-> prevents us from lowering V-> prevents us from lowering Vdd dd as much as we might as much as we might
otherwise be able to dootherwise be able to do
1.3 Degree of Freedom[8]
• Increase in physical interconnect capacitanceIncrease in physical interconnect capacitance
-> Reduce significantly voltage and/or -> Reduce significantly voltage and/or activityactivity
-> this may result in a net decrease in power-> this may result in a net decrease in power
• Low power design is a joint optimization Low power design is a joint optimization process in which the variables cannot be process in which the variables cannot be manipulated independentlymanipulated independently
1.3 Degree of Freedom[9]
• 1.3.3 Activity1.3.3 Activity - Even if a chip contains a huge amount of physical- Even if a chip contains a huge amount of physical capacitance, no dynamic power will be consumed capacitance, no dynamic power will be consumed without switchingwithout switching
• Two key components to switching activityTwo key components to switching activity 1) Data rate, 1) Data rate, ff -> in synchronous systems, f might correspond to -> in synchronous systems, f might correspond to the clock frequencythe clock frequency 2) Data activity, 2) Data activity, αα - Average periodicity of data arrivals- Average periodicity of data arrivals - depends on the switching activities, logic functions, - depends on the switching activities, logic functions, and spatial and temporal correlations among the circuit inputand spatial and temporal correlations among the circuit input
1.3 Degree of Freedom[10]
3) Glitching3) Glitching - Spurious and unwanted transitions that occur before- Spurious and unwanted transitions that occur before a node settle down to its final steady-state valuea node settle down to its final steady-state value• Effective Physical capacitance CEffective Physical capacitance Ceffeff
CCeffeff = = αα C C
- Power Consumption by a CMOS circuit: P- Power Consumption by a CMOS circuit: P P = P = ααCVCV22f = f = CCeffeffVV22ff - Reducing switching activity in FSM- Reducing switching activity in FSM -> power conscious state encoding[25], multi-level-> power conscious state encoding[25], multi-level logic optimizationlogic optimization - Data representation - Data representation -> Sign magnitude representation vs. Two’s comprement representation-> Sign magnitude representation vs. Two’s comprement representation -> Activity vs. computation complexity-> Activity vs. computation complexity
1.4 Recurring Themes in Low-Power[1]
• Four principle themesFour principle themes
- Trading area-performance for power- Trading area-performance for power
- Adapting designs to environmental conditions or data structur- Adapting designs to environmental conditions or data structuree
- Avoiding waste- Avoiding waste
- Exploiting locality- Exploiting locality• Trding area-performance for powerTrding area-performance for power
- The most important theme- The most important theme
- Power can be reduced by decreasing the system supply - Power can be reduced by decreasing the system supply
voltage and allowing the performance of the system to voltage and allowing the performance of the system to
degradedegrade
1.4 Recurring Themes in Low-Power[2]
- If the system designer is not willing to give up the performa- If the system designer is not willing to give up the performancence
-> consider applying techniques such as parallel processing -> consider applying techniques such as parallel processing
to maintain perfornance at low voltageto maintain perfornance at low voltage
-> These techniques may incur an area penalty-> These techniques may incur an area penalty
• Adapting design to environmental conditionsAdapting design to environmental conditions
- Dynamically change operation of the circuits as the - Dynamically change operation of the circuits as the
characteristics of the environmental and/or the statistics ocharacteristics of the environmental and/or the statistics of the f the
input streams varyinput streams vary
1.4 Recurring Themes in Low-Power[3]
-> Choosing the most economic communication medium and -> Choosing the most economic communication medium and
changing error recovery and encoding to suit the chchanging error recovery and encoding to suit the channel annel
noise and error tolerencenoise and error tolerence
-> Selectively precompute the output logic values of the -> Selectively precompute the output logic values of the
cuircuits one clock cycle before they are requiredcuircuits one clock cycle before they are required
-> And then, use the precomputed values to reduce intern-> And then, use the precomputed values to reduce internal al
switching activity in the succeeding clock cycleswitching activity in the succeeding clock cycle
1.4 Recurring Themes in Low-Power[4]
• Avoiding wasteAvoiding waste
- Clock modules when they are idle- Clock modules when they are idle
- Glitching - Glitching
-> avoid by path balancing and choice of logic family-> avoid by path balancing and choice of logic family
- Use dedicated rather than programmable hardware- Use dedicated rather than programmable hardware
- Reduce control overhead by using regular algorithms and - Reduce control overhead by using regular algorithms and
architecturearchitecture
- Take the form of designing system to meet rather than surpass - Take the form of designing system to meet rather than surpass
performance requirementsperformance requirements
1.4 Recurring Themes in Low-Power[5]
• Exploiting localityExploiting locality
- Grobal operations inherently consume a lot of power- Grobal operations inherently consume a lot of power
- Data transferring- Data transferring
-> at expense of swithing a large bus capacitance-> at expense of swithing a large bus capacitance
- Design partitioned to exploit locality of reference - Design partitioned to exploit locality of reference
-> minimize the amount of expensive global communications-> minimize the amount of expensive global communications
employed in favor of much less costly local interconnemployed in favor of much less costly local interconnect ect
networksnetworks
-> Especially for DSP applications-> Especially for DSP applications
1.5 Emerging Low Power Approaches[1]
• Low power digital design requires optimization at all levels Low power digital design requires optimization at all levels of the design hierachyof the design hierachy
- techonology, devices, circuits, logics, architecture, - techonology, devices, circuits, logics, architecture, and system level[Figure 1.8]and system level[Figure 1.8]• The goal of this book is to give a comprehensive overview of The goal of this book is to give a comprehensive overview of
the different approaches that are currently being conceived the different approaches that are currently being conceived at the various levels of design abstractionat the various levels of design abstraction
• The techniques and approaches ultimately all come down to a The techniques and approaches ultimately all come down to a fundamental set of concepts: dissipation is reduced by lowerfundamental set of concepts: dissipation is reduced by lowering either the supply voltage, the voltage swing, the physicing either the supply voltage, the voltage swing, the physical capacitace, the swithing activity or a combination of the al capacitace, the swithing activity or a combination of the aboveabove
1.5 Emerging Low Power Approaches[2]
• System: Patitioning, Power-down, Power statesSystem: Patitioning, Power-down, Power states• Algorithm: Complexity, Concurrency, Regularity, Algorithm: Complexity, Concurrency, Regularity,
LocalityLocality• Architecture: Paralleism, Pipelining, Redundancy, Architecture: Paralleism, Pipelining, Redundancy,
Data encodingData encoding• Circuit/Logic: Logic styles + manipulation, Circuit/Logic: Logic styles + manipulation,
Transistor sizing, Energy recoveryTransistor sizing, Energy recovery• Technology: Threshold reduction, Technology: Threshold reduction,
Double-threshold devicesDouble-threshold devices
1.6 Summary[1]
• A low voltage/low threshold technology and circuit A low voltage/low threshold technology and circuit approachapproach
• Low power interconnectLow power interconnect
• Low-power system synchronization approachesLow-power system synchronization approaches
• Dynamic power management techniquesDynamic power management techniques
• Application specific processingApplication specific processing
• A conscientious drive towards parallel and distributed A conscientious drive towards parallel and distributed computingcomputing
• A system-level approach towards power minimizationA system-level approach towards power minimization
• An integrated design methodology including synthesis and An integrated design methodology including synthesis and compilation toolscompilation tools