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Company presentation2017
Sung Wei Electronics – Professional PCB Maker
• Established in 1979 in Taoyuan, Taiwan; since 1996 located in Baoan, Shenzhen, China
• Focused in copper/silver paste through hole (CPTH/STH) and LED application (CEM-1, CEM-3, IMS) printed circuit boards (PCB)• SS since 1979• STH since 1996• CPTH since 2005• IMS (SS) since 2009• PTH (DS) since 2014
• Fully compliant with all the relevant labour laws and regulations; OHSAS 18001 certified since 2006
20172
Sung Wei in Numbers
• Net sales (2016) USD 43.2 million
• Employees (avg. 2016) 742
• Plant area 32,000 m2
• CPTH & STH PCBs capacity 140,000 m2/month • Current CPTH capacity allocation: 70,000 m2/month
• Current STH capacity allocation: 70,000 m2/month
• PTH (DS) capacity 50,000 m2/month
• LED/IMS capacity (SS) capacity: 100,000 m2/month
20173
Net Sales
20174
Change y-o-y
-50 %
-40 %
-30 %
-20 %
-10 %
0 %
10 %
20 %
30 %
40 %
50 %
$-
$10 000 000
$20 000 000
$30 000 000
$40 000 000
$50 000 000
$60 000 000
$70 000 000
$80 000 000
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017E
Net sales Change y-o-y
Investments
20175
Percentage of net sales
0 %
1 %
2 %
3 %
4 %
5 %
6 %
7 %
8 %
9 %
0
500 000
1 000 000
1 500 000
2 000 000
2 500 000
3 000 000
3 500 000
4 000 000
2009 2010 2011 2012 2013 2014 2015 2016 2017E
Recent investments (1/2)
20176
Robot arms for AOI scan loading/unloading
Improved capability, automation
AOI scanner line
Recent investments (2/2)
20177
Automatic Visual Inspection (AVI) to complement final inspection done by operators.
Main Application Areas
• Video game controller, computer peripherals, touch pad (CPTH, SS)
• LED lighting & back lighting (SS, SS IMS)
• Automotive LED lighting (SS IMS, DS PTH)
• Automotive instrumentation (STH, CPTH ramping-up)
• Household appliances (STH, CPTH ramping up)
20178
Quality Management
• Based on certified ISO/TS 16949
• Quality policy• Optimize manufacturing methods
• Build excellent quality
• Continue improving and innovating
• Exceed customers’ requirements
• Targets 2017• Yield: 98% (2016: 97%)
• Automotive DPPM: 18 (29)
20179
Certificates
• UL (E74739) since 1996
• ISO 9002 since 1997
• ISO14001 since 2002
• OHSAS since 2006
• QC08000 since 2008
• ISO/TS16949 since 2005
201710
Organization
201711
Mr. Roy HsiehSales
Mr. Tony WeiCEO
Mr. M.H. GuoManufacturing
Mr. D.H. PongEngineering
Mr. W.J. RenGeneral admin & Materials mgmt
Ms. G.L. ShiFinance
Ms. Dew Zhang (China)
Customer service China & Asia
Mr. Sami Holopainen
(Europe)Customer service
Europe
Ms. Z. L. WanProduction
control
Ms. M. WuEquipment
maintenance
Mr. D.H PongManufacturing
Mr. H.U. WangEnvironmental management
Mr. Z.J.LiFront-end
engineering
Mr. C.W. ChangProcess
engineering
Ms. Sunny Wu Quality
Mr. Bin FuQuality
assurance
Mr. ChrisQuality control
Ms. L.G. ZhuMaterial
management
Mr. C.X. ChangCustoms
Ms. H.F. LiLogistics
Ms. Y.C. WangHuman resources
Ms. Z. ZhuAccounting
Mr. C.M. ZhenAdministration
Ms. Nora Chan (China)
Ms. Emily Hsu (China)
Ms. Cloud Liu (China)
Why Sung Wei?
• Long and proven experience in the focused PCB technologies
• Continuously improving and investing – both in technology and productivity
• Balanced customer base with leading consumer and automotive electronics brands
• Competitive pricing
• Committed owners
20171212
Thank you!
Capability & productsAppendix to company presentation
201714
Capability (1/2)
201715
Note: This is general SW capability. Single parameters may be dependent on each other.
Your approved specifications may differ from enclosed table.
Item CPTH STH IMS (SS) PTH (DS)
Laminates CEM-1, CEM-3, FR4 FR1, CEM-1, CEM-3 Al (1060, 5052, 6061), Cu (C1100) FR4, CEM-3
Final thickness 0.5-1.6 mm 0.8-1.6 mm 0.5-3.0 mm 0.4-1.6 mm
Cu thickness 17 or 35 µm 35 µm 17 - 105 µm 17 - 70 µm
Maximum PCB dimensions 600 x 400 mm 600 x 400 mm 1200 x 500 mm 600 x 400 mm
Through holes
Drilled hole size 0.35-0.5 mm 0.45-0.7 mm 0.8-5.7 mm 0.25 mm
Min. finished hole size NA NA NA 0.2
Aspect ratio NA NA NA 10:1
Drill ing tolerance ± 50 µm ± 50 µm ± 100 µm / ± 150 µm if dia > 4.0 mm NPTH: ± 50 µm, PTH: ± 100 µm
Punched holes ≥ 0.70 mm ≥ 0.70 mm ≥ 1.0 mm ≥ 0.70 mm
Punching tolerance ± 100 µm ± 100 µm ± 100 µm ± 100 µm
Imaging
Line/space ≥ 0.127 mm ≥ 0.150 mm ≥ 0.127 mm ≥ 0.1 mm
Clearance between annular ring and trace ≥ 0.30 mm ≥ 0.30 mm ≥ 0.30 mm ≥ 0.30 mm
Annular ring diameter, dril led hole size + 0.6 mm hole size + 0.6 mm hole size + 0.6 mm hole size + 0.4 mm
Annular ring diameter, punched hole size + 0.8 mm hole size + 0.8 mm hole size + 0.8 mm NA
UV cured soldermask
Opening & clearance ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm
Dam ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm
LPI soldermask
Opening & clearance ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm
Dam ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm
Vias Paste through hole Paste through hole Printed through hole
Printing side paste thickness (baked) 10-50 µm 10-50 µm NA NA
Botton side paste thickness (baked) 10-70 µm 10-70 µm NA NA
Hole wall paste thickness (baked) ≥ 20 µm ≥ 20 µm NA NA
Overcoat diameter on printing side CPTH + 0.70 mm STH + 0.70 mm NA NA
Overcoat diameter on bottom side CPTH + 0.90 mm STH + 0.90 mm NA NA
Overcoat distance from pad ≥ 0.30 mm ≥ 0.30 mm NA NA
Item CPTH STH IMS (SS) PTH (DS)
Surface finishing & outline
Available surface finishes (in-house) OSP OSP OSP OSP
Lead-free HASL Lead-free HASL Lead-free HASL Lead-free HASL
Available surface finishes Immersion tin HASL Immersion tin Immersion tin
HASL ENIG HASL HASL
ENIG ENIG ENIG
Punching, dimension toleranses
< 100 mm ± 0.10 mm ± 0.10 mm ± 0.10 mm ± 0.10 mm
> 100 mm ± 0.15 mm ± 0.15 mm ± 0.10 mm ± 0.15 mm
> 200 mm ± 0.20 mm ± 0.20 mm ± 0.15 mm ± 0.20 mm
> 300 mm ± 0.25 mm ± 0.25 mm ± 0.15 mm ± 0.25 mm
> 400 mm NA NA ± 0.20 mm NA
> 500 mm NA NA ± 0.25 mm NA
> 600 mm NA NA ± 0.30 mm NA
> 900 mm NA NA ± 0.40 mm NA
Routing, dimension toleranses
< 100 mm ± 0.15 mm ± 0.15 mm ± 0.15 mm ± 0.15 mm
> 100 mm ± 0.20 mm ± 0.20 mm ± 0.15 mm ± 0.20 mm
> 200 mm ± 0.25 mm ± 0.25 mm ± 0.20 mm ± 0.25 mm
> 300 mm ± 0.30 mm ± 0.30 mm ± 0.20 mm ± 0.30 mm
> 400 mm NA NA ± 0.25 mm NA
> 500 mm NA NA ± 0.30 mm NA
> 600 mm NA NA ± 0.35 mm NA
> 900 mm NA NA ± 0.40 mm NA
Distance between V-cut and hole pad/trace ≥ 0.40 mm ≥ 0.40 mm ≥ 0.40 mm ≥ 0.40 mm
Distance between 2 V-cut l ines ≥ 4.0 mm ≥ 4.0 mm ≥ 4.0 mm ≥ 4.0 mm
Electrical
Voltage / via ≤ 100 V (DC) ≤ 50 V (DC) NA
Instant current load / via ≤ 1 A ≤ 1 A NA
Constant current load / via ≤ 600 mA ≤ 300 mA NA
Resistance / via ≤ 100 mΩ ≤ 100 mΩ NA
Capability (2/2)
201716
Note: This is general SW capability. Single parameters may be dependent on each other.
Your approved specifications may differ from enclosed table.
Products: Automotive instrumentation, household appliances
Laminates: FR1, CEM-1, CEM-3
STH/SCO Applications
201717
Dashboard Control board for washing machine
Products: Video game controller, mouse, keyboard, home audio, household appliances
Laminates: CEM-1, CEM-3, FR4
CPTH Applications (1/2)
201718
Product: Laptop touch panel
Laminate: FR4
CPTH Applications (2/2)
201719
Laminates: IMS, CEM-1, CEM-3
LED Applications
201720
Maximum length of the PCB: 1.2 meters
Contact informationAppendix to company presentation
201721
Contact Information
Europe• Sami Holopainen• Phone (Finland): +358 400 487 180• Phone (China): +86 138 2889 4761• Email: [email protected]
Shenzhen, China• Roy Hsieh• Phone: +86 139 2377 5765• Email: [email protected]
201722
To Get to Sung Wei
Name: Shenzhen Sung Wei Electronics Co., Ltd.
Address: No. 43 Shatou Shangye Road, Shajing, BaoanDist., Shenzhen, Guangdong, China
Name: 深圳松維電子股份有限公司
Address: 深圳市寶安區沙井街道辦沙頭商業路43號
• By car from• Shenzhen airport: 30 min• HK airport 120 min• Guangzhou Baiyun airport 120 min
• By ferry from HK airport• To Fuyong 45 min + car 30 min• To Shekou 30 min + car 60 min
201723
Thank you!