Upload
others
View
3
Download
0
Embed Size (px)
Citation preview
1
COMPACT HIGH POWER RELAY For automotive applications1 POLE - 70A (For 12V Car Battery)FBR59-HW Series FEATURES• 1 pole, 70A, 1 form U• High temperature grade (-40˚C to 125˚C)• Comparable capability with Power Mini ISO plug-in relays• Through hole reflow type available• RoHS compliant, lead freePlease see page 4 for more information
Part Numbers[Example] FBR59 N D12 - Y - HW - RW
(a) (b) (c) (d) (e) (f)
(a) Relay type FBR59 : FBR59 series(b) Enclosure N : Plastic sealed type
(c) Coil rated voltage D12 : 9...12VDCCoil rating table at page 3
(d) Contact material Y : Silver-tin oxide(e) Contact rating HW : 70A
(f) Soldering NilRW
: Standard: Through hole reflow (THR)
Actual markings does not carry the type name: "FBR"E.g.: Ordering code: FBR59ND12-Y-HW Actual marking: 59ND12-Y-HW
2
FBR59-HW Series
Item FBR59-HW Remarks / conditionsContact data
1 form UConstructionConfiguration
SingleMaterial Silver-tin oxideVoltage drop Max. 100 mV At 1A, 12VDCContact rating 70A, 14VDC
45A, 14VDCResistive loadMotor load
Max. carrying current 70A / 1h At 25 deg C, rated loadMax. inrush current 220A Capacitor inrush basedMin. switching load * 1A 6VDC ReferenceMax. switching load ** 70A, 14VDC
45A, 14VDCResistive loadMotor load
Coil Operating temperature range
-40ºC ~ +125ºC No frost
Timing data
Operate Max. 10ms At nominal voltage(without diode, without bounce)
Release Max. 10ms At nominal voltage(without diode, without bounce)
Storage temperature / humidity
-40ºC to 125ºC, 45 to 85RH No frost
Life Mechanical Min. 1 x 10⁶ operations without contact loadElectrical Min. 50 x 10³ operations at 70A
Min. 100 x 10³ operations at 60Aresistive load
Insula-tion
Insulation resistance Min. 100MΩ at 500VDC InitialDielectric withstanding voltage
Opencontacts
500VAC (50/60Hz), 1 minute
Coil contact 500VAC (50/60Hz), 1 minute
Other Vibration resistance
Misoperation 10 to 200Hz, 44m/s2 (4.5G), constant acceleration
Endurance 10 to 200Hz, 44m/s2 (4.5G), constant acceleration
Shock resis-tance
Misoperation Min. 100m/s² (11 ± 1ms)Endurance Min. 1,000m/s² (6 ± 1ms)
Dimensions / weight 15.0 x 20.0 x 16.8 mm / approx. 13g
Please perform the confirmation test with actual conditions.
* : Minimum switching loads mentioned above are reference values. Please perform the confirmation test with actual load before production since reference values may vary according to switching frequencies, environmental conditions and expected
reliability levels.**: Maximum switching loads mentioned above are reference values. Please refer to operation range graph for continuous current.Note: Values of electrical characteristics are under 15 to 35°C, 25 to 75%RH (JIS standard condition) unless otherwise specified.Note: Care shall be taken on the heat generated on PC board when maximum carrying current exceeds 10A.
Specif ications
3
FBR59-HW Series Coil Data
codeRated Coil
Voltage (VDC)Coil Resistance
+/-10%(Ω)Must Operate
Voltage* (VDC)Must Release
Voltage* (VDC)D09 9 170 5.4 (at 20ºC)
7.7 (at 125ºC)0.7 (at 20ºC)1.0 (at 125ºC)
D10 10 220 6.3 (at 20ºC)9 (at 125ºC)
0.8 (at 20ºC)1.2 (at 125ºC)
D12 12 320 7.3 (at 20ºC) 10.4 (at 125ºC)
1.0 (at 20ºC)1.5 (at 125ºC)
Note: All values in the table are valid at 20°C and zero contact current, unless otherwise specified.: Specified operated values are valid for pulse wave voltage. *
Note: Please use at rated coil voltage. Please refer to characteristic data and set up adequate voltage in case of use at over voltage.
Dimensions• Dimensions
• Schematics(BOTTOM VIEW)
1 2 4
578
15.3
max
.15
.0 ty
p.
0.5 0.512.5
2.5 2.53 4.35 9.65 3
(3.6
)
1.5
20.3 max.20.0 typ.
17.1
max
. / 1
6.8
typ.
16.2
max
. / 1
5.9
typ.
20.9
max
.20
.4 ty
p.
20.3 max.20.0 typ.
15.3 max.15.0 typ.
4
FBR59-HW Series• PC Board Mouting Hole
Layout (BOTTOM VIEW)
( ): Reference value Unit: mm
Characteristic Data (Reference)
(3) 4.35 9.6512
.5
2 -2.8×0.85 0+0.1 2 -1.8×0.85 0
+0.1 2 -2.8×0.85 0+0.1
2.8
1.8
0.85
0.85
+0.10
+0.1 0
(R)
(R)
B
B
A
A
* Dimensions of the terminals do not include thickness of pre-solder.* Tolerance of PC board mounting hole layout : ±0.1 unless otherwise specified.
00
234567891011121314151617
20
40
60
80
100
1 2 3 4 5 6 7 8 9 10 11 12
Operate voltageRelease voltage
FBR59ND12-Y-HWn=5020
Distribution of operate/release voltage
00
20
40
60
80
100
5 10 15 20 25 30 35 40 45 50
Distribution of contact resistance
00
20
40
60
80
100
1 2 3 4 5 6 7 8 9 10
Distribution of operate/release time
(ambient temperature 25)Contact current capacityOperating range
Applicable voltage range
Operate vol
tage (cool c
oil)
7.3V max. at
20
10000
1000
100
10
25
125
85
FBR59ND12-Y-HWn=5020
FBR59ND12-Y-HW25
FBR59ND12-Y-HWn=5020
25
50FBR59ND12-Y-HW
Operate timeRelease time
Operate/release voltage (VDC) Contact resistance (mΩ) Time (ms)
Applied time (sec.)
Applied voltage (V)
Dis
tribu
tion
(%)
Dis
tribu
tion
(%)
Dis
tribu
tion
(%)
Coil temperature rise ( )
Applied voltage 16V
AWG10 x 2
12V
8V
60A continuous current
Max. coil temperature +180
45A continuous current
5
FBR59-HW SeriesCoil temperature rise
(ambient temperature 25)
Coil temperature rise(ambient temperature 85)
Coil temperature rise(ambient temperature 25)
Contact current capacity10000
1000
100
10
11 10 1000
25
125
85
FBR59ND12-Y-HW25
00
25
50
5 10 15 20 25 30
FBR59ND12-Y-HW
Applied time (min.)
Appl
ied
time
(sec
.)
Current (A)
Applied voltage 16V
AWG10 x 2 (connect a wire on each terminal)
12V
8V
Coi
l vol
tage
(V)
-50 50
5
00
100
10
15
130e ()rutarepmet tneibmA
Operating range
Applicable voltage range
-40°C min. +125°C max.
45A continuous
Coil: 16V max.
60A continuous70A continuous
Operating voltage (Cool condition)
(7.3V max., 20°C)
Max. coil temperature: 180°C
1000
100
10
10.1 1 10
Coi
l tem
pera
ture
rise
(°C
)
1000
100
10
1
Coi
l tem
pera
ture
rise
(°C
)
Coi
l tem
pera
ture
rise
(°C
)
Coil power (W) 0.1 1 10
Coil power (W)
70A60A45A
30A
15A
0A0A
58 erutarepmet tneibmAApplied coil voltage: 8 to 16VApplied contact current: 0 to 60A
70A60A45A
52 erutarepmet tneibmAApplied coil voltage: 8 to 16VApplied contact current: 0 to 60A
30A
15A
6
FBR59-HW Series
800
600
400
200
0
1000
X1
X1
X
X2
X2
Y1
Y1
Y2
Y2
Z1
Z1
Z2
Z2
Applied shock 980m/s²
Specification 98m/s2
Make contact (coil de-energized) Make contact (coil energized)
Shock resistance characteristics
Vibration resistance characteristics
Shock application time: 6±1ms half-sine waveTest conditions: Coil energized(12VDC) and de-energized Shock direction: see diagram belowDetection level: chatter >1ms
Frequency : 10 to 1000HzTest conditions: Coil energized(12VDC) and de-energized Shock direction: see diagram belowDetection level: chatter >1ms
Y
Z
1.5 1 0.5 0.1 0.01100
10
1
2
10 100 1000 10000
Frequency(Hz)
Sweep frequency1000Hz Max.
Specification10~55Hz
No chattering in 10~1000Hz100m/s2 area
Shock direction
Shoc
k le
vel (
m/s
2 )
Double amplitude (mm)
Acceleration (m/s)
7
FBR59-HW SeriesCAUTIONS
GENERAL INFORMATION1. ROHS Compliance• All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU, including commission
delegated directive 2015/863.
Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified. This material has been verified to be compatible with PbSn assembly process.
2. Recommended lead free solder condition•
• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.
3. Moisture Sensitivity• Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable
length whisker was found by our in house test.
Flow Solder Condition: Refow Solder Condition:(Applicable only for reflow capable type)
Important notes for reflow soldering
Pre-Heating: maximum 120˚Cwithin 90 sec.
Soldering: dip within 5 sec. at 255°C±5°C solder bath
Recommended reflow soldering profileIRS (infrated reflow soldering)
Relay must be cooled by air immediately after soldering
Solder by Soldering Iron:Soldering Iron: 30-60WTemperature: maximum 340-360˚CDuration: maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
・ All values mentioned in this datasheet are provided under ideal conditions. Please perform the confirmation testbefore actual use.
・ Reflow soldering is prohibited for flow soldering type.・ Do not use relays in the atmosphere with sulfide gas, chloride gas or nitric oxide. Contact resistance may increase.・ Do not use silicon or silicon-containing product or materials near relays. It may cause contact failure.
250
220
170130Tem
pera
ture
(°C
)
Max.120 sec.
90 to 120 sec. 20 to 30 sec.
(Time)
Pre-heating Air cooling
Peak temperature: Max.250°C
• Temperature shall be measured at PC board upper surface• Temperature at PC board upper surface may be change of PC board, components mounted on the PC board
and/ or heating method. Please perfom the confirmation test with your actual PC board.• This reflow solder condition is applicable only for reflow-capable relays. Do not reflow reflow-incapable relays.
8
FBR59-HW SeriesContactJapanFUJITSU COMPONENT LIMITEDShinagawa Seaside Park Tower12-4, Higashi-shinagawa 4-chome,Tokyo 140 0002, JapanTel: (81-3) 3450-1682Email: [email protected]
North and South America
Asia Pacific
FUJITSU COMPONENTS AMERICA350 Cobalt Way, M/S 160 Sunnyvale, CA 94085 U.S.A.Tel: (1-408) 745-4900Email: [email protected]
Web: www.fcl.fujitsu.com/en/
EuropeFUJITSU COMPONENTS EUROPEDiamantlaan 252132 WV Hoofddorp, Netherlands Tel: (31-23) 5560910Email: [email protected]
FUJITSU COMPONENTS ASIA.No. 20 Harbour Drive, #07-01BSingapore 117612Tel: (65) 6375-8560 Email: [email protected]
ChinaFUJITSU ELECTRONIC COMPONENTS (SHANGHAI)Unit 4306, InterContinental Center100 Yu Tong Road, Shanghai 200070, ChinaTel: (86 21) 3253 0998 Email: [email protected]
Hong KongFUJITSU COMPONENTS HONG KONGRoom 13, 23/F, Seapower Tower, Concordia Plaza, No.1 Science Museum Road, Tsim Sha Tsui East, Kowloon, Hong KongTel: (852) 2881 8495 Email: [email protected]
KoreaFUJITSU COMPONENTS KOREAAlpha Tower #403, 645 Sampyeong-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 13524 KoreaTel: (82 31) 708-7108Email: [email protected]
© 2022 Fujitsu Component Limited. All rights reserved. All trademarks or registered trademarks are the property of their respective owners.
Fujitsu Products are intended for general use, including without limitation, in personal, household and office environments, in buildings and for ordinary usein the industry. Fujitsu Products are not intended to be used in applications where extremely high safety is required (”High Safety Required Applications”), such as, but not limited to, applications in nuclear facilities, in aircraft automatic flight control, in air traffic control, in mass transit system control, in missile launch system, in weapon systems, in medical equipment for life support or any application involving a direct serious risk of physical injury or death.Please do not use Fujitsu Products without securing the sufficient safety and reliability required for the High Safety Required Applications.In addition, Fujitsu shall not be liable against the customer and/or any third party for any claims or damages arising in connection with the use of Fujitsu Products in the High Safety Required Applications.Fujitsu warrants that its Products, if properly used and services, will conform to their specification and will be free from defects in material and workmanshipfor twelve months from delivery.The implied warranties of merchantability and fitness for a particular purpose and all other warranties, representations and conditions, express or implied bystatute, trade usage or otherwise, expect as set forth in this warranty, are excluded and shall not apply to the Products delivered.
The contents, data and information in this datasheet are provided by Fujitsu Component Ltd. as a service only to its user and only for general informationpurposes. The use of the contents, data and information provided in this datasheet is at the users’ own risk.Fujitsu has assembled this datasheet with care and will endeavor to keep the contents, data and information correct, accurate, comprehensive, complete andup to date.Fujitsu Component Limited and affiliated companies do however not accept any responsibility or liability on their behalf, nor on behalf of its employees, forany loss or damage, direct, indirect or consequential, with respect to this datasheet, its contents, data, and information and related graphics and the correctness, reliability, accuracy, comprehensiveness, usefulness, availability and completeness thereof.Nor do Fujitsu Component Limited and affiliated companies accept on their behalf, nor on behalf of its employees, any responsibility or liability with respectto these datasheets, its contents, data, information and related graphics and the correctness, reliability, accuracy, comprehensiveness, usefulness, availabilityand completeness thereof. Rev. May 19, 2022.