COMMERCIALIZATION - Remap Network€¦ · product commercialization. Hardware and electronics manufacturing differentiates this network. Enabling products – faster. ReMAP is a network

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ACCELERATING COMMERCIALIZATION

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Our Mission is to accelerate the commercialization of electronics innovations – ensuring that Canada’s investment in electronics technology translates into economic growth and job creation.

Our Vision is that the Canadian Electronics Manufacturing sector is recognized as the global leader in product commercialization.

Hardware and electronics manufacturing differentiates this network. Enabling products – faster.

ReMAP is a network of partners (start-ups, small-medium enterprises (SMEs), large organizations and leading research institutions) from across Canada to form a product-enablement network. Through shared resources and knowledge, ReMAP bridges the commercialization gap between applied research and industry.

A collaborative approach accelerates the commercialization of electronics products manufactured in Canada for the global market. Our blueprint, a Product Enablement Value Chain, leverages the strength and synergies from suppliers, manufacturers, researchers and customers that will enable innovative ideas to products for the global market.

Proven technologies from one industry to another can be leveraged to shorten time to market. ReMAP supports lateral innovations across the Aerospace, Defense, Information and Communications Technology (ICT), Healthcare, Industrial and Renewable Energy market segments.

ReMAP is made possible through joint funding from the Government of Canada’s Business-led Networks of Centres of Excellence (BL-NCE) program matched by contributions from our network partners.

What we do.

ReMAP

TRL 1

TRL 2

TRL 3

TRL 4

TRL 5

TRL 6

TRL 7

TRL 8

TRL 9

Basic PrinciplesScientific research begins to be translated into applied R&D. Activities might include paper studies of a technology’s basic properties.

Concept and/or Application Invention begins. Once basic principles are observed, practical applications can be invented. Activities are limited an analytical studies.

Proof of ConceptActive research and development is initiated. This includes analytical studies and/or lab studies. Activities might include components that are not yet integrated or representative.

Basic Validation – Lab EnvironmentBasic technological components are integrated to establish that they will work together. Activities include integration of ‘ad hoc’ hardware in the lab.

Basic Validation – Relevant EnvironmentThe basic technological components are integrated for testing in a simulated environment. Activities include laboratory integration of components.

Demo – Relevant EnvironmentA model or prototype that represents a near desired configuration. Activities include testing in a simulated operational environment or laboratory.

Demo – Operational EnvironmentPrototype at planned operational level and is ready for demonstration in an operational environment. Activities include prototype field testing.

Technology Qualified Through Test and DemoTechnology has been proven to work in its final form and under expected conditions. Activities include developmental testing and evaluation of whether it will meet operational requirements.

Market LaunchActual application of the technology in its final form and under real-life conditions, such as those encountered in operational tests and evaluations. Activities include using the innovation under operational conditions.

ReM

AP

Technology Readiness Level* (TRL)

The ReMAP project portfolio supports later-stage product development (TRL 4-8). Our projects advance the next-generation of innovations by developing new, environmentally-compliant materials for high-reliability applications; cost-effective, miniaturized optics and photonics technologies; and more energy efficient products for the renewable energy industry.

*Buyandsell.gc.ca


Product Enablement

Global Commercialization

Lateral Innovation

Accelerating Commercialization

MARKET SEGMENTS10

ResearchPartners

8Large

IndustryPartners

20+Industry

Associations

14Start-ups

andSMEs

38 Labs

14 Projects

ICT

Aerospace

Defense

Healthcare

Industrial

Renewable Energy

$19million

in funding

Product Enablement Ecosystem

MARKET SEGMENTS9ResearchPartners

$19million

in funding

7Large

IndustryPartners

3Not-for-profits

20+Industry

Associations

11Start-ups

andSMEs

38 Labs

15 Projects

ICT

Aerospace

Defense

Healthcare

Industrial

Renewable Energy


$19million

in funding

7Large

IndustryPartners

3Not-for-profits

20+Industry

Associations

11Start-ups

andSMEs

38 Labs

15 Projects

ICT

Aerospace

Defense

Healthcare

Industrial

Renewable Energy


$19million

in funding

7Large

IndustryPartners

3Not-for-profits

20+Industry

Associations

11Start-ups

andSMEs

38 Labs

15 Projects

ICT

Aerospace

Defense

Healthcare

Industrial

Renewable Energy

Lateral Innovation Across Market Segments

Leveraging 38 labs & manufacturing lines across Canada in 3 research areas

Global Commercialization

Renewable Energy

Optics/Photonics

New Materials

ReMAP Priorities

Labs and Manufacturing Lines 14 Projects38


High-Reliability Product Enablement

Materials M1 Lower Temperature Soldering Alloys The introduction of environmental legislation such as the European Union’s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to pad cratering which occurs in high temperature assembly processes which - may result in catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics.

This project focuses on developing new lower temperature

alloys and test methods that are environmentally friendly and

meet the aerospace industry’s performance reliability standards.

Product Enablement Value Chain

Made in Canada Fait au Canada

RESEARCH DEVELOPMENT MANUFACTURING MARKET

183ºC

220ºC

260ºC

230ºC

205 ºC

217ºC

Next-GenPb-Free Solders

Traditional Sn-Pb Solder

Pb-Free Solders

• Gold Standard for Electronics Manufacturing Since 1950s

• Increased risk of field failures in high reliability applications

- Pad Cratering - Aging - Tin whiskers - Mechanical /Thermal

Mechanical

• RoHS Compliant

• Expensive

• Mitigates propensity of field failures in high reliability applications

• ROHS Compliant

• Lower cost

P.T.

P.T.

P.T.

M.P.

M.P.

M.P.

Assessing melting temperatures of traditional leaded solders compared to lead-free solder alloys

Melting Point (M.P.) Peak Temperature (P.T.) Patents Pending



Materials M2 Tin Whiskers

The introduction of environmental legislation such as the European Union’s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to spontaneous growth of filaments known as tin whiskers. Over time, this may cause catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics.

This project focuses on developing new alloys to mitigate tin whisker growth and increase reliability in applications that are exposed to extreme environmental conditions.




Human Hair Width Compared to Tin Whisker Filament, Celestica



Materials M3 Aging

The introduction of environmental legislation such as the European Union’s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to solder cracks due to aging. Over time, this may cause catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics.

This project focuses on developing new alloys and test methods to increase reliability for applications exposed to various environmental conditions, such as an extended lifespan (20+ years).


Crack

Solder Crack Due to Aging, Celestica


Solder 20+ YearsNew Solder




Materials M4 Electronically Conductive Adhesives Developing Electrically Conductive Adhesives (ECAs) using nanomaterials is an alternative to traditional solders. Traditional solders are limited in reflow temperatures and particle size, rendering them restricted to a set pitch and temperature.

ECAs can bind at lower temperatures – reducing the risk of stress while maintaining product reliability. ECAs also enable higher density interconnects due to the structure of the material.

This project is focused on developing ECA materials that support larger process windows, higher density interconnects and electronics miniaturization.


RESEARCH

DEVELOPMENT MANUFACTURING MARKETS

Sub-Micron Silver Nano Crystals, University of Waterloo



Next Generation Solar Solutions

Renewable Energy S1 Smart Lamination Materials

In order for solar power to become a viable alternative to mature energy systems, solar panel power efficiencies must be increased without adding steps or complexities to the current manufacturing process. Silicon solar cells convert only a portion of the solar spectrum into electricity.

This project focuses on developing nanostructure-embedded smart lamination materials that are capable of broadening the usable range of the solar spectrum. These materials can increase the power conversion efficiency of the solar module without additional cost or changes to the manufacturing process.



Photoluminescence of Synthesized Quantum Dots Coating on Glass, University of Waterloo




Renewable Energy S2 Enhanced Laminate Materials

There are a number of factors which are impeding the widespread adoption of solar photovolatics (PV) as an alternative energy source, with cost in the form of $/watt being the main driver.

Optimizing power efficiency is a critical factor in reducing cost. There are opportunities to gain significant power improvements through advancements in materials, such as the laminate. Current lamination materials have limitations when exposed to certain environmental conditions (darkening in hot climates and loss of mechanical properties in low temperature climates).

This project focuses on enabling higher panel efficiencies through the use of nanocrystals to improve solar performance.



3D Laser Scanning Confocal Microscopy Image of Quantum Dots in EVA Film, Western University




Renewable Energy S3 Smart Electronics

Today’s energy infrastructure is evolving into adaptive, intelligent networks. Powering these networks requires unique smart energy products that can meet industry’s rapidly evolving requirements.

Increasing the deployment of distributed generation systems based on solar photovolatics (PV) is driving demand for reliable, networked power conversion and optimization technologies. Pricing pressures are adding an additional driver for solar installations; impact panel and inverter manufacturers and solar power developers.

This project focuses on developing smart electronics in solar module manufacturing.



Power Optimizer Reference Design, Solantro




Renewable Energy S4 Solar Windows

Solar farms represent the majority of solar installations. By 2020, 60% of the global solar installations are predicted to be in residential or commercial applications; while solar farms will only represent 20% of the market share.

Semi-transparent solar windows can provide significant energy savings in architectural installations. For cooling-dominated buildings, they can replace tinted or fritted glass as a means of reducing cooling energy loads.

This project focuses on the development of new semi-transparent windows that will enhance sustainable buildings.



Transparent Solar Window, Concordia University



Miniaturizing Optical Technologies

Optics & Photonics O1 Optical Interconnects

Packaging is viewed by the industry as one of the biggest technical hurdles in enabling the successful commercialization of photonic integrated circuits (PICs), particularly those implemented in silicon photonics (SiP).

In mature technologies like semiconductor lasers for optical communications, packaging accounts for up to 90% of the total cost of the product. To remain competitive, this cost needs to be dramatically reduced, particularly in large volume applications targeted for SiP technology.

This project focuses on the development of cost effective and manufacturable solutions for the integration of photonic circuits and electronics with an emphasis on optical interfacing to optical fibres and lasers.



Silicon Photonics Test Station, University of British Columbia and CMC Microsystems




Optics & Photonics 03 Monolithically Integrated Laser Materials on Silicon Global mobile internet use is creating a traffic tsunami affecting both mobile and fixed communications networks. Managing exponential internet data growth requires innovative, smaller components with lower power dissipation. One solution is silicon photonics (SiP).

This project focuses on developing a robust and effective process to grow laser sources on a silicon wafer using semiconductor technologies. This will enable higher performance and cost-effective solutions for the next generation of photonic integrated circuits (PICs).



GaAs Quantum Dots (QD), University of Toronto




Optics & Photonics O4 Integrated OCT System

Current state-of-the-art Optical Coherence Tomography (OCT) is expensive, bulky and sensitive to mechanical shock and vibration. An integrated photonic OCT solution, with key optical elements on a single chip, would allow the development of miniaturized OCT systems. These systems can be designed for a broader range of applications, such as ophthalmology, resulting in greatly improved reliability due to fewer component interfaces.

This project focuses on the integration of an OCT solution that combines superluminescent laser diode, spectrometer and interferometer into a single silicon chip.



Silicon Chip




Optics & Photonics O6 Low Cost Optical Integrated Transceiver

Consumer off the shelf (COTS) electronics technology has been leveraged by aerospace, defense and the military for the past 20 years to reduce cost. Similarly, there is the opportunity to leverage advancements in optics from the telecommunications industry to reduce cost for aerospace and defense applications.

This project focuses on developing a low-cost optical integrated transceiver that meets high-reliability industry standards and aligns to regulatory compliance legislation for aerospace and defense applications.



Extreme Temperature LightABLE ™ Optical Engines for Embedded Computer Systems




Optics & Photonics 07 Optically Guided Laser Ablation with Integrated Surgical Navigation System

Patients undergoing neurosurgery may be at risk for spinal cord injury, repetitive corrective surgery or other complications.

Image-guided surgical procedures using optical technologies combined with traditional medical imaging modalities (CT and MRI) enables new surgical techniques that increase surgeon confidence, reduce operating time and improve patient safety.

This project focuses on the advancement of optical technologies for image-guided surgery. The integrated surgical lighting and 3D imaging system utilizes sensors, machine vision cameras and advanced computational algorithms to allow pinpoint surgical guidance during neurosurgery.



Spinal Surgical Screws




Optics & Photonics O8 Indium Phosphide High Speed Modulator

In response to the increasing demand for bandwidth, telecommunication systems operating at 100 Gb/s are now deployed in long-haul links. In particular, larger bandwidth is achieved by not only using higher data rates but also using increased spectral efficiency. A critical element of these solutions is 100 Gb/s dual polarization IQ modulators.

This project focuses on developing next-generation optical modulators for high-speed optical communication applications using indium phosphide technology. The resulting modulators will provide smaller form factor packages at a lower cost, improving the scalability of 100Gb/s and future 400Gb/s systems.



Optical Modulator



Lateral Innovation

ReMAP leverages the strengths and synergies from our network partners to accelerate commercialization.


Board of Directors Brad JacksonVice President, Strategic Business Development, Diversified Markets, Celestica Board Chair, ReMAP

Bruce GoodExecutive Director, Conference Board of Canada Board Vice Chair, ReMAP

Jason Field, PhD.President & CEO, Life Sciences Ontario

Larry FitzgeraldPresident & CEO, Wainbee Ltd & Filtramax

Peter Frise, PhD.Scientific Director & CEO, Auto21, Professor, University of Windsor

Paul Johnston, LL.B.Senior Associate, Hickling Arthurs Low (Retired)

George Pinho, PhD.President, Christie Medical Holdings, Inc.

John ReidPresident & CEO, CATAAlliance

Philip Turi, LL.B.General Counsel & Global Business Services, Canadian Manufacturers & Exporters

Marci Vernon, PhD.General Manager, INO-Ontario

Dan WassermanFounder and CEO, Mammoth Health Innovation

Matt Kelly, P.Eng., MBASenior Technical Staff Member and Senior Inventor, IBM Systems

Operations Irene SterianExecutive Director, ReMAP

Loretta Renard Network Manager, ReMAP

Jackie Hatherly-Martin CFO, ReMAP

Nimfa Sacun Financial Analyst, ReMAP

Alex EdwardsDA-Integrated

Danxia Xu, PhD.National Research Council Canada

Lionel C. Kimerling, PhD.Massachusetts Institute of Technology (MIT)

Marianne Romansky, PhD.Celestica Inc.

Martin Guy, PhD.Ciena

Rafael Kleiman, PhD.McMaster University

Robert CorriveauPhotons Canada

S. Manian Ramkumar, PhD.Rochester Institute of Technology

Timothy Pope, PhD.INO-Ontario

Yves PoissantNatural Resources Canada

Reza Ghaffarian, PhD.NASA-Jet Propulsion Lab-CalTech

Andrew KinrossNavigant Consulting

Dan HenesCelestica Inc.

Dan MathersMARS/Ironbit Consulting

Doug CooperSplintir Media

Garth Smith, PhD.Ontario Brain Institute

Ian McWalterCMC Microsystems

Imed Zine, PhD.Roadmap Capital Inc.

Lahav Gil Kangaroo Group

Ning Cheng Lee, PhD.Indium Corporation

Ron MantayPowerStream

Shawn BlakneyCelestica Inc.

Victor Yang, MDRyerson University/ Sunnybrook Research Institute

Technology Development Committee

Technology Adoption & Commercialization Committee

R-02-123015

www.remapnetwork.org

@Remap6

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COMMERCIALIZATION - Remap Network€¦ · product commercialization. Hardware and electronics manufacturing differentiates this network. Enabling products – faster. ReMAP is a network