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Comment on ‘‘Compressive Stress in Polycrystalline Volmer-Weber Films’’ In a recent Letter [1] Koch et al. attempted to demon- strate that the reversible stress evolution observed during interruptions of Volmer-Weber growth cannot be explained by relaxation of kinetic roughening [2– 4] or reversible nonequilibrium incorporation of adatoms at grain bounda- ries during growth [5]. We find the arguments made by Koch et al. fundamentally flawed. First, the authors suggest that the observed reversible stress changes are associated with grain growth or recrys- tallization that occurs during growth interruptions [1]. As first pointed out by Shull and Spaepen [6,7], this cannot be the explanation since grain growth and recrystallization are not reversible. In addition, Koch et al. suggest that the reversible tensile rise observed during growth interruptions occurs as ‘‘ma- terial moves away from the compressive surface regions between grains and then reattaches in the tensile grain boundary regions...’’. However, adatoms move to mini- mize chemical potential as defined by summing strain energy and curvature terms. Since the strain energy scales as the square of the stress, diffusion in general acts to minimize the magnitude of the stress (compressive or tensile). It has also been shown that the reversible stress changes observed during growth interruptions for poly- crystalline and single crystalline (homoepitaxial) films of the same material are very similar in both magnitude and kinetic characteristics [3], so that an important role for grain boundaries seems unlikely. Finally, an error was made in approximating the Laplace pressure acting on islands in the precoalescence regime. The authors incorrectly use the surface energy rather than the surface stress f [8,9]. Thus, the agreement be- tween the capillary model discussed by Koch et al. and the experimental results (1:2 GPa versus 1:3 GPa) would seem coincidental. There are several competing models for the origins of growth interruption induced reversible stress changes dur- ing Volmer-Weber growth of polycrystalline [2–5], homo- epitaxial [3], and heteroepitaxial [10] films. In variance with Koch et al. ’s concluding remarks, this issue is not resolved. Cody Friesen 1 and Carl V. Thompson 2 1 Chemical & Materials Engineering Mechanical Engineering Arizona State University Tempe, Arizona 85287-6006, USA 2 Department of Materials Science and Engineering M.I.T. Cambridge, Massachusetts 02139, USA Received 19 August 2005; published 23 November 2005 DOI: 10.1103/PhysRevLett.95.229601 PACS numbers: 68.35.Gy, 68.35.Ja, 68.35.Md [1] R. Koch, D. Hu, and A.K. Das, Phys. Rev. Lett. 94, 146101 (2005). [2] C. Friesen and C.V. Thompson, Phys. Rev. Lett. 89, 126103 (2002). [3] C. Friesen and C.V. Thompson, Phys. Rev. Lett. 93, 056104 (2004). [4] C. Friesen, S.C. Seel, and C. V. Thompson, J. Appl. Phys. 95, 1011 (2004). [5] E. Chason, B. W. Sheldon, L. B. Freund, J. A. Floro, and S. J. Hearne, Phys. Rev. Lett. 88, 156103 (2002). [6] A. Shull and F. Spaepen, J. Appl. Phys. 80, 6243 (1996). [7] A. Shull, Ph.D. thesis, Harvard University, 1996. [8] F. Spaepen, J. Mech. Phys. Solids 44, 675 (1996). [9] R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz, J. Mater. Res. 15, 2468 (2000). [10] C. Friesen, Ph.D. thesis, MIT, 2004. PRL 95, 229601 (2005) PHYSICAL REVIEW LETTERS week ending 25 NOVEMBER 2005 0031-9007= 05=95(22)=229601(1)$23.00 229601-1 © 2005 The American Physical Society

Comment on “Compressive Stress in Polycrystalline Volmer-Weber Films”

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Page 1: Comment on “Compressive Stress in Polycrystalline Volmer-Weber Films”

PRL 95, 229601 (2005) P H Y S I C A L R E V I E W L E T T E R S week ending25 NOVEMBER 2005

Comment on ‘‘Compressive Stress in PolycrystallineVolmer-Weber Films’’

In a recent Letter [1] Koch et al. attempted to demon-strate that the reversible stress evolution observed duringinterruptions of Volmer-Weber growth cannot be explainedby relaxation of kinetic roughening [2–4] or reversiblenonequilibrium incorporation of adatoms at grain bounda-ries during growth [5]. We find the arguments made byKoch et al. fundamentally flawed.

First, the authors suggest that the observed reversiblestress changes are associated with grain growth or recrys-tallization that occurs during growth interruptions [1]. Asfirst pointed out by Shull and Spaepen [6,7], this cannot bethe explanation since grain growth and recrystallization arenot reversible.

In addition, Koch et al. suggest that the reversible tensilerise observed during growth interruptions occurs as ‘‘ma-terial moves away from the compressive surface regionsbetween grains and then reattaches in the tensile grainboundary regions. . .’’. However, adatoms move to mini-mize chemical potential as defined by summing strainenergy and curvature terms. Since the strain energy scalesas the square of the stress, diffusion in general acts tominimize the magnitude of the stress (compressive ortensile). It has also been shown that the reversible stresschanges observed during growth interruptions for poly-crystalline and single crystalline (homoepitaxial) films ofthe same material are very similar in both magnitude andkinetic characteristics [3], so that an important role forgrain boundaries seems unlikely.

Finally, an error was made in approximating the Laplacepressure acting on islands in the precoalescence regime.The authors incorrectly use the surface energy � ratherthan the surface stress f [8,9]. Thus, the agreement be-tween the capillary model discussed by Koch et al. and the

0031-9007=05=95(22)=229601(1)$23.00 22960

experimental results (�1:2 GPa versus �1:3 GPa) wouldseem coincidental.

There are several competing models for the origins ofgrowth interruption induced reversible stress changes dur-ing Volmer-Weber growth of polycrystalline [2–5], homo-epitaxial [3], and heteroepitaxial [10] films. In variancewith Koch et al.’s concluding remarks, this issue is notresolved.

Cody Friesen1 and Carl V. Thompson2

1Chemical & Materials EngineeringMechanical EngineeringArizona State UniversityTempe, Arizona 85287-6006, USA

2Department of Materials Science and EngineeringM.I.T.Cambridge, Massachusetts 02139, USA

Received 19 August 2005; published 23 November 2005DOI: 10.1103/PhysRevLett.95.229601PACS numbers: 68.35.Gy, 68.35.Ja, 68.35.Md

1-1

[1] R. Koch, D. Hu, and A. K. Das, Phys. Rev. Lett. 94,146101 (2005).

[2] C. Friesen and C. V. Thompson, Phys. Rev. Lett. 89,126103 (2002).

[3] C. Friesen and C. V. Thompson, Phys. Rev. Lett. 93,056104 (2004).

[4] C. Friesen, S. C. Seel, and C. V. Thompson, J. Appl. Phys.95, 1011 (2004).

[5] E. Chason, B. W. Sheldon, L. B. Freund, J. A. Floro,and S. J. Hearne, Phys. Rev. Lett. 88, 156103 (2002).

[6] A. Shull and F. Spaepen, J. Appl. Phys. 80, 6243(1996).

[7] A. Shull, Ph.D. thesis, Harvard University, 1996.[8] F. Spaepen, J. Mech. Phys. Solids 44, 675 (1996).[9] R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz,

J. Mater. Res. 15, 2468 (2000).[10] C. Friesen, Ph.D. thesis, MIT, 2004.

© 2005 The American Physical Society