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Collaboration between University andMentor GraphicsHyperLynx SI

Raul Blecic and Adrijan Baric

University of ZagrebFaculty of Electrical Engineering and ComputingIC&EMC Lab

Zagreb, June 10th 2015

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Contents

1 IntroductionAbout IC&EMC Lab at FER

2 HyperLynx SIMentor Graphics tools at IC&EMC LabExample - LIN (Local Interconnect Network)Example - design of RF amplifierMore applications

3 Conclusion

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Introduction HyperLynx SI Conclusion Contact

1 IntroductionAbout IC&EMC Lab at FER

2 HyperLynx SI

3 Conclusion

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Introduction HyperLynx SI Conclusion Contact

About IC&EMC Lab at FER

About IC&EMC Lab at Faculty of Electrical Engineering and Computing,University of Zagreb:

Members:

• Prof. dr. sc. Adrijan Baric,

• Prof. dr. sc. Zeljko Butkovic,

• Associate prof. dr. sc. Igor Krois,

• Assistant prof. dr. sc. Vladimir Ceperic,

• Senior assistant, dr. sc. Tvrtko Mandic,

• Niko Bako, dipl. ing. (PhD student),

• Raul Blecic, dipl. ing. (PhD student),

• Josip Bacmaga, mag. ing. el. (PhD student),

• Marko Magerl, mag. ing. el. (PhD student),

• Hrvoje Stimac, mag. ing. el. (researcher).

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Introduction HyperLynx SI Conclusion Contact

About IC&EMC Lab at FER

Industrial partners:

• ON Semiconductor, Belgium,

• Bosch, Germany,

• Philips, Germany,

• Infineon, Germany,

• NXP, Netherlands/Belgium,

• ams, Unterpremstaetten, Austria,

• Henkel, Belgium,

• CRP, Italy,

• Hanita, Israel,

• Cadence, France,

• CamSemi, Cambridge, UK,

• Locus d.o.o. Zagreb, Croatia.

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Introduction HyperLynx SI Conclusion Contact

About IC&EMC Lab at FER

Collaboration with universities:

• KU Leuven, Belgium,

• IMEC, Belgium,

• Portland State University, Oregon, USA,

• INSA, Toulouse, France,

• University of Cambridge, UK.

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Introduction HyperLynx SI Conclusion Contact

1 Introduction

2 HyperLynx SIMentor Graphics tools at IC&EMC LabExample - LIN (Local Interconnect Network)Example - design of RF amplifierMore applications

3 Conclusion

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Introduction HyperLynx SI Conclusion Contact

Mentor Graphics tools at IC&EMC Lab

Usage of Mentor Graphics tools at IC&EMC Lab:

• Design of printed circuit boards:

• Xpedition Enterprise,• PADS.

• Analysis of printed circuit boards:

• HyperLynx SI.• 2-D field solver.

• SPICE simulations:

• Eldo,• EZwave.

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Introduction HyperLynx SI Conclusion Contact

Mentor Graphics tools at IC&EMC Lab

Simple PCB design in Xpedition PCB:

• high-frequency characterisation of RF transistors.

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Introduction HyperLynx SI Conclusion Contact

Mentor Graphics tools at IC&EMC Lab

Complex PCB design in Xpedition PCB:

• system for characterisation of power transistors.

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Introduction HyperLynx SI Conclusion Contact

Example - LIN (Local Interconnect Network)

Example - LIN (Local Interconnect Network)

• Communication between components in vehicles:

• speed up to 20 kbit/s,• automotive - tests up to 1 GHz.

Simple analytical solution does not exist:

PCB during measurements:

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Introduction HyperLynx SI Conclusion Contact

Example - LIN (Local Interconnect Network)

Analysis in HyperLynx SI:

HyperLynx SI (boardsim): HyperLynx SI (linesim):

Netlist is generated from HyperLynx SI:

• models of passive components and connectors added to the netlist,

• complete test case is simulated in Eldo.

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Introduction HyperLynx SI Conclusion Contact

Example - LIN (Local Interconnect Network)

Comparison to measurements - return and insertion loss:

• very good agreement up to 3 GHz.

Return loss (S11):

0 0.5 1 1.5 2 2.5 3−40

−30

−20

−10

0

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 0.5 1 1.5 2 2.5 3−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

MeasurementsCircuit model

Insertion loss (S12):

0 0.5 1 1.5 2 2.5 3−40

−30

−20

−10

0

Frequency, f [GHz]

Magnitude[dB]

0 0.5 1 1.5 2 2.5 3−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Analyzed path:

P2

P1

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Introduction HyperLynx SI Conclusion Contact

Example - LIN (Local Interconnect Network)

Comparison to measurements - coupling:

• good agreement up to 3 GHz.

Return loss (S11):

0 0.5 1 1.5 2 2.5 3−6

−4

−2

0

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 0.5 1 1.5 2 2.5 3−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

MeasurementsCircuit model

Coupling (S12):

0 0.5 1 1.5 2 2.5 3−70

−60

−50

−40

−30

Frequency, f [GHz]

Magnitude[dB]

0 0.5 1 1.5 2 2.5 3−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Analyzed path:

P2

P1

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Introduction HyperLynx SI Conclusion Contact

Example - design of RF amplifier

Example - design of RF amplifier:

• 2.5-GHz amplifier,

• GaN transistorNitronex NPTB00004,

• VDS = 14 V,

• ID = 50 mA.

Designed in Xpedition PCB: Analyzed in HyperLynx SI (boardsim):

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Introduction HyperLynx SI Conclusion Contact

Example - design of RF amplifier

Extracted to HyperLynx SI (linesim):

• each interconnect is modelled by a transmission line element.

Netlist is generated from HyperLynx SI:

• models of components added to the netlist (transistor, passivecomponents and connectors),

• complete test case is simulated in Eldo.

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Introduction HyperLynx SI Conclusion Contact

Example - design of RF amplifier

Comparison to measurements - return loss and gain:

Return loss (S11):

0 1 2 3 4 5 6−30

−20

−10

0

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Gain (S21):

0 1 2 3 4 5 6−60

−40

−20

0

20

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Circuit model consists of:

• transistor model,

• model ofinterconnects,

• ideal model of passivecomponents.

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Introduction HyperLynx SI Conclusion Contact

Example - design of RF amplifier

Comparison to measurements - return loss and gain:

Return loss (S11):

0 1 2 3 4 5 6−30

−20

−10

0

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Gain (S21):

0 1 2 3 4 5 6−60

−40

−20

0

20

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Circuit model consists of:

• transistor model,

• model ofinterconnects,

• model of passivecomponents whichincludes packageparasitics.

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Introduction HyperLynx SI Conclusion Contact

Example - design of RF amplifier

Comparison to measurements - return loss and gain:

• very good agreement up to 4 GHz.

Return loss (S11):

0 1 2 3 4 5 6−30

−20

−10

0

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Gain (S21):

0 1 2 3 4 5 6−60

−40

−20

0

20

Frequency, f [GHz]

Magnitude[dB]

MeasurementsCircuit model

0 1 2 3 4 5 6−200

−100

0

100

200

Frequency, f [GHz]

Phase

[deg]

Circuit model consists of:

• transistor model,

• model ofinterconnects,

• model of passivecomponents whichincludes packageparasitics,

• model of RFconnectors.

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Introduction HyperLynx SI Conclusion Contact

More applications

More applications of Mentor Graphics tools at IC&EMC Lab:

• HyperLynx PI:

• analysis of the impedance profile of the power distribution network.

Test case:

Simulation results:

1 MHz 10 MHz 100 MHz 1 GHz0.001

0.01

0.1

1

10

100

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Introduction HyperLynx SI Conclusion Contact

More applications

More applications of Mentor Graphics tools at IC&EMC Lab:

• Electromagnetic properties of interconnects:

• analysis (Z0, coupling),• visualization (field distribution, loss vs frequency),• extraction of RLGC matrices from geometry,• extraction of S-parameter matrix of boards.

Field distribution: Loss vs frequency:

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Introduction HyperLynx SI Conclusion Contact

More applications

• Xpedition PCB:

• design of PCBs.

• HyperLynx SI:

• signal integrity and EMC analysis of PCBs.

• HyperLynx PI:

• power integrity analysis of PCBs.

• FloTHERM and HyperLynx Thermal:

• thermal analysis of PCBs, packages and ICs.

• HyperLynx 3D EM:

• 3D analysis of interconnects,• integrated within the HyperLynx environment.

• HyperLynx DRC:

• PCB design verification,• design rule checks for EMI/EMC, signal and power integrity.

• Calibre:

• DRC, LVS, PEX,• industry standard for verification of IC designs.

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Introduction HyperLynx SI Conclusion Contact

1 Introduction

2 HyperLynx SI

3 Conclusion

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Introduction HyperLynx SI Conclusion Contact

Mentor Graphics - more than PCB design:

• PCB design (Xpedition Enterprise/PADS),

• analysis of signal integrity (HyperLynx SI),

• analysis of power integrity (HyperLynx PI),

• analysis of thermal properties of PCBs (FloTHERM and HyperLynxThermal),

• EM analysis of PCBs (HyperLynx 3D EM),

• PCB design verification (HyperLynx DRC),

• IC design verification (Calibre).

Poveznica na HyperLynx: http://www.mentor.com/pcb/hyperlynx/

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Introduction HyperLynx SI Conclusion Contact

Prof. dr. sc. Adrijan Baric

University of ZagrebFaculty of Electrical Engineering and ComputingUnska 3, 10000 ZagrebCroatia

Tel +385 1 6129 913Email adrijan.baric@fer.hrhttp://www.fer.unizg.hr/icdt

Electronic Design SIMULATION DAY — June 10th 2015 Blecic and Baric — University of Zagreb, FER, IC&EMC Lab