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CMS Phase 2 Tracker R&DR. Lipton 3/27/2014

Module R&D Allocation:• Requested ~ $320k, received ~160k– Eliminate VICTR testing (continue with FNAL funds and whatever

time is available)– Eliminate engineering for contributions to the PS chip– Eliminate interconnect R&D

• Institutes received 70-80% of requested labor funding, Fermilab about 30%

• M&S cut by about ½• Travel unchanged

- I plan to send this back to Max next week

R. Lipton

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Other Items

• US sensor manufacturing was also not funded (in Uli’s proposal). We may try to pursue this through an SBIR or drop the initiative.

• Additions to the dummy layout:– Wafer fiducials and cut lines– Chip placement fiducials

R. Lipton

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Wafer layout

R. Lipton

Flipping the MaPSA upside down

francois.vasey@cern.ch

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Strip sensor

March 2014

CoolingPixel Sensor

Strip sensor

Cooling

Extended Pixel Sensor

Proposal

Nov 2013

…Plus: Cannot get bumped MPAs from TSMCBecause of mixed wire/bump bond requirement- Why not shift constraint to more flexible sensor producer ?

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TSVs

We had originally planned to collaborate with CERN on the TSV work based on the 3T chip. The vendor doubled his price and we had to drop out of that phase. I hope to keep this work going in the US, funds are still allocated.An obvious possibility is to demonstrate insertion of TSVs in the PSI46 chip – which can then be bonded to sensors and tested. This is synergistic with the TSV interests of the phase 2 pixels.I have written to Jorgen Christianson, Roland Horisberger, Gino Bolla so far with no response…

R. Lipton

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Update on 3D

• We received word that processing of the final 3D wafers integrated with sensors is complete at Ziptronix.

• Although not perfect the process looks encouraging.– This was an extremely ambitious process involving three layers

of DBI bonded parts.

R. Lipton

Excellent alignment

Ziptronix Proprietary 7

Wafer 2 Die Wafer Handle bond

8Ziptronix Proprietary

Wafer 2 Die to Wafer bondUltrasonic microscopy• White are bond voids

VICTRVIPIC

VIP

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Karlsruhe

R. Lipton

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FPIX Thoughts

• I think that a design based on a simple disk (no turbine blades) should be pursued for phase 2

• I also think that such a design could also utilized TSVs to great effect, simplifying geometry and assembly.– Thermal mismatch between readout PCB and silicon• Flex on CF?

• We could test this with wafers intended for the 3D interposer work

R. Lipton

Carbon fiber/carbon foam disk

ROIC ROICsensor

Readout PCB

CO2 cooling

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Modules 30 degreerectangular ICs

R. Lipton

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Wedges

R. Lipton

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22.5 deg

R. Lipton

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Wedges…

• Wedges are nice but …– Need plasma or laser dicing (not a big deal)– Require at least 3 different chip variants. At least $200k per

mask set for each design• Wedge • Mirror wedge• Rectangle

– The periphery is hard to manage• Chip design tools do not easily accommodate non-

Manhattan geometries• Central chip has no area for periphery

R. Lipton