Circular Magnetron - KCMCkcmc.biz/v2/download/GENCOA/Circular_magentron_gencoa.pdf · –Conventional 2 pole magnetic design –Confined plasma ... • Sputter Chimney • Gas injection

Circular Magnetron

Thursday, 17 November 2011

Basic features

• Target Size– 2”, 3”, 4”, 6”, 8”, 10”, 12”, 14” & 16”

Standard 4” circular target dimensions

Targetφ BPφ2” 46 50

3” 71 75

4” 96 100

6” 146 150

8” 192 200

10” 242 250

Standard target canbe mounted by modifying the target clamp


Basic features

• Target Fixture - clamping on diaphragm

Target Clamp

Target Assembly

SW50-2” balanced magnetron

Magnetron Body


!"#$%&'()*+,% *"-#%&)./%)0 1,,2'("&'3$

!"#$#%&'&()*+#,#-.'*

//#$#0(%&'&()*+#,#-.'*

12#$#34*)5#3&67&%'*

89#$#57:5#;7*'+

<<=#$#>0''#>&)*#*6.?7.(

@!#$#+.0%'*#A&:(*46.(

,B$CD !4&(+&6+#?.06)*#>.6##:*(*6&'#-6.)*??7(:

,B$CD !4&(+&6+#?.06)*#>.6#7.(#&??7?4*+#+*-.?747.(

,B$ED 1&67*?#7.(#&??7?4#A&:(*47)#?46*(:45

ED$BD =(5&()*+#4&6:*4#0?*#?.06)*

ED$FD G'*&(#4&6:*4#?-044*67(:#*3*(#7(#6*&)473*#A.+*

?**#&%.3* H*&)473*#+7*'*)467)#+*-.?747.(

6” and larger target size


Magnetic options include the following:

!"#$%&'()*+,% *"-#%&)./%)0 1,,2'("&'3$

!"#$#%&'&()*+#,#-.'*

//#$#0(%&'&()*+#,#-.'*

12#$#34*)5#3&67&%'*

89#$#57:5#;7*'+

<<=#$#>0''#>&)*#*6.?7.(

@!#$#+.0%'*#A&:(*46.(

,B$CD !4&(+&6+#?.06)*#>.6##:*(*6&'#-6.)*??7(:

,B$CD !4&(+&6+#?.06)*#>.6#7.(#&??7?4*+#+*-.?747.(

,B$ED 1&67*?#7.(#&??7?4#A&:(*47)#?46*(:45

ED$BD =(5&()*+#4&6:*4#0?*#?.06)*

ED$FD G'*&(#4&6:*4#?-044*67(:#*3*(#7(#6*&)473*#A.+*

?**#&%.3* H*&)473*#+7*'*)467)#+*-.?747.(

6” and larger target size



Typical 2 pole magnetic design


3D Simulation capability to improve products

3D magnetic modeling technique in hand

Plasma simulation and plasma picture (SW300FFE)


Magnetic optionBalanced (SW) & unbalanced (PP)

• Balanced– Conventional 2 pole magnetic design– Confined plasma

• Unbalanced– 2 pole design– Increase plasma reactivity– Suitable for ion assisted coating process

• hard coating, decorative coating... etc.

Height of zero point represents the difference of degree of balance-unbalance


Magnetic option - High Yield (HY)

• Multi-pole magnetic design• High target use - more than 40%

6” HY - SW150-HY42% from 6mm thick target


Flatter field shape= wide erosion

Magnetic Option - HY


2D magnetic field model for an High Yield type of design

2D magnetic field model for an standard 2 pole type of design

Comparison of standard 2 pole and high yield type magnetics

Flatter field shape= wide erosion

Magnetic Option - HY


Variable magnets - Vtech (VT)

• Mechanically move magnets to change from balanced to unbalanced

UnbalancedBalanced

Targ

et S

urfa

ce

Zero Point


Ion current by different unbalance

VT75


Magnetic Option - Full Face Erosion (FFE)

• Rotating magnet array• Plasma scans all target surface• Available from 3” circular

– 3”-10” conventional FFE– 12”~ uniformity adjustable

• Cleaner target = less arcing


Target use results SW150FFE

• 54% from the top 6mm thick Cu target

No Re-dep at centre


Uniformity SW350FFE

75 RPM = ±10.85%

200 RPM = ±3.82%

240 RPM = ±0.66%

300 RPM = ±6.53%

0-50-100-150 50 100 150

SW350FFE - Uniformity v Rotation speed

Rotation speed can tune the uniformity (12” or larger FFE only)


Magnetic Option - Dual (AS)

Circular magnetron can do dual operation too


Mechanical options



Standard Internal and External mount


SW75 with shutter, tilt & feedthrough

SW75-I

Shutter blade

Tilt Mech.Wall mount feedthrough


Mechanical Options

• RF high power• Tilt : ±30 degrees• Shutter• Electrical shield (RF)• Sputter Chimney• Gas injection• Anode cooling• etc...


The options and mounting styles are almost endless – here are a selection of some of them


Circular sources can also be assembled complete with flange plates and shutters etc


The optimisation of the target erosion performed by repeating the simulation cycle

No Plasma test required

Repeat of magnetic design & Simulation


SW50 Uniformity Simulation on Static 300mmOD Substrate

(Guide use only)

0

20

40

60

80

100

120

0 20 40 60 80 100 120 140 160

Radial Position, mm (half substrate)

Re

leti

ve

De

po

sit

ion

, %

TS=50 Offset= 0 Tilt=0 --> +/-96.37%

TS=150 Offset= 0 Tilt=0 --> +/-64.06%

Substrate (Rotating)

Target

TS (separation)

Off (Offset)

Tilt

SW50-300sub-M749


SW75 uniformity simulation for 75mm dia. substrate

(Guide use only)

0

20

40

60

80

100

120

0 5 10 15 20 25 30 35 40

Radial Position, mm (half substrate)

Re

leti

ve

De

po

sit

ion

, %

TS=50 Offset= 0 Tilt= 0 --> +/- 38.24%,

+/-11.1% for 50mm dia. Substrate

TS=100 Offset= 0 Tilt= 0 --> +/-

16.08%, +/-3.99% for 50mm dia.

Substrate

Substrate

Target

TS (separation)

Off (Offset)

Tilt

SW75-803H001-Sub75-TS50&100.xls


SW100 Uniformity Simulation

for Static substrate(only use for guidance)

0

20

40

60

80

100

120

0 10 20 30 40 50

Radial Position, mm

Rela

tive D

ep

osit

ion

, %

50 mm Separation : +/-45.66%







SW100-100sub-M949-all.xls


SW150HY Uniformity Real Test

0

20

40

60

80

100

120

0 10 20 30 40 50 60 70 80 90 100

Distance from centre of target, mm

Relative deposition, %

TS=100, 3.46% on 76mm substrate, 29% on 150mm substrate

TS=50, 2.36% on 76mm substrate, 25% on 150mm substrate

S00590TestLog.xls

GENCOA


SW150 Uniformity Simulation

150 dia. substrate(No High Yield option included, only use for guidance)

60

65

70

75

80

85

90

95

100

105

0 10 20 30 40 50 60 70 80

Radial Position, mm

Rela

tive D

ep

osit

ion

, %

Sep=50 on axis : +/-59.8%

Sep=100 on axis : +/-37.75%

Sep=150 on axis : +/-23.97%

Sep=200 on axis : +/-15.96%

Sep=250 on axis : +/-11.18%

SW150-150sub-M743-onAxis-all.xls


Thank you.

Any questions?


Documents

Circular Magnetron - KCMCkcmc.biz/v2/download/GENCOA/Circular_magentron_gencoa.pdf · –Conventional 2 pole magnetic design –Confined plasma ... • Sputter Chimney • Gas injection