#TheConFab2016

China’s Penetration into Mobiles –Real or Imaginary?

Dick James, Senior Fellow/Technology Analyst

Chipworks/TechInsights

#TheConFab2016

_________________________________________________________________________

� Chipworks Inc. – now TechInsights!

� Reverse engineering legality

� Smartphone statistics

� Design wins

� Huawei Mate 8

� Jinxing Digital (JXD) T5 Blaster Mini

� Lenovo LePhone T2

� Lava Iris Atom

� Apple’s iPhone 6 SE

� Patent landscapes

� Summary & conclusions

Outline

#TheConFab2016

The combined company has the scale and resources to advance the breadth

and depth of its offerings to the global technology industry, and to support

owners of technology patents everywhere.

We offer:

- the most extensive database of technology intelligence of electronics

- leading reverse engineering and analysis capabilities

- an unmatched team of technology and patent experts

We work with 37 of the top 50 US patent holders

TechInsights and Chipworks have announced the combining of their

businesses, creating a global leader in advanced technology intelligence and

technology founded patent advisory services.

_________________________________________________________________________

#TheConFab2016

_________________________________________________________________________

� Founded in 1989 (CW 1992) to provide advanced reverse

engineering services to companies seeking to grow the

potential of their intellectual property

� Headquartered in Ottawa, Canada with over 280 employees

� Provides patent intelligence and competitive technical

intelligence solutions to over 200 global technology,

semiconductor and electronics companies

� In-house laboratories with advanced tools and equipment for

in-depth, world-class analysis

� Offices in Canada, USA, Europe, Japan, Korea, and Taiwan

Corporate Overview

#TheConFab2016

_________________________________________________________________________

� Aggressively explore the largest consumer electronics markets

to find innovative & disruptive semiconductor events

� These events manifest themselves in different way - new devices / device

types, new competitors, new processes, new circuit design, new circuit

layout – or some combination of all of the above

� When a disruptive event occurs, we report on it with the most

appropriate method

� Blogs, exploratory analysis, standard reports (process and circuit)

� Throughout all of the above Chipworks/TechInsights furthers

our knowledge on semiconductor components inside Consumer

Electronics

� Understand market shares, capable of forecasting disruptive events

What we do

#TheConFab2016

_________________________________________________________________________

Patent Knowledge Technology Expertise Market Understanding

• 60K patents read

• Our engineers read patents every

day across a variety

of technology areas

• Hire engineers out of their

specific industry sector and teach

them how to evaluate patents

and speak to lawyers

• Wide spectrum of technology

analysis expertise from

semiconductor process

and design techniques

to electronics and software

• 80+ engineering projects going at

any one time

• Broad view of important industries

– deep understanding of the key

players, their products and revenue

• Proactively analyze five products a

week

• Monitor current and future product

trends to assess licensing potential

Our services are built on three pillars

#TheConFab2016

_________________________________________________________________________Reverse Engineering - Is it legal?YES!!!

� RE is actually protected by the USA Semiconductor Chip Protection

Act:

� Title 17. Copy rights

� Chapter 9. Protection of Semiconductor Chip Products

� 906. Limitations on exclusive rights; reverse engineering; first

� (a) Notwithstanding the provisions of section 905, it is not an infringement of

the exclusive rights of the owner of a mask for –

� (1) A person to reproduce the mask work solely for the purpose of

teaching, analyzing, or evaluating the concepts or techniques embodied in

the mask work or the circuitry. Logic flow, or organization used in the mask

work; or

� (2) A person who performs the analysis or evaluation described in

paragraph (1) to incorporate the results of such conduct in an original mask

work which is made to be distributed

#TheConFab2016

_________________________________________________________________________Smartphone Statistics

#TheConFab2016

_________________________________________________________________________Smartphone Statistics

#TheConFab2016

_________________________________________________________________________Design Wins

�Mediatek

�Spreadtrum

�HiSilicon

#TheConFab2016

_________________________________________________________________________Design Wins - Mediatek

� 24 design wins

in 2016, 50 in

2015

� 63 phones, 5

watches, 3

media players,

3 “other”

#TheConFab2016

_________________________________________________________________________Design Wins - Spreadtrum

� 3 design wins in

2016, 7 in 2015

� All phones!

#TheConFab2016

_________________________________________________________________________Design Wins - HiSilicon

� 3 design wins in

2016, 12 in 2015

� All Huawei

phones, but 2

security camera

SoCs

#TheConFab2016

_________________________________________________________________________Mobile Phone Teardowns

�Huawei Mate 8

�Jinxing Digital (JXD) T5 Blaster Mini

�Lenovo LePhone T2

�Lava Iris Atom

�Apple’s iPhone 6 SE

#TheConFab2016

_________________________________________________________________________Huawei Mate 8

CPU/ROM/RAM CPU: HiSilicon Kirin 950, 2.3 GHz x 4 + 1.8 GHz x 4

ROM: 32 GByte

RAM: 3 Gbyte

Main camera 16.0 MP OIS CMOS with auto focus, LED flash

Protocol (MHz) 4G: FDD-LTE: 700, 800, 850, 900, 1700, 1800, 1900, 2100, 2600

4G: TD-LTE: 1900, 2300, 2500, 2600

3G: WCDMA: 800, 850, 900, 1700, 1900, 2100

3G: CDMA: –

3G: TD-SCDMA: –

2G: GSM: 850, 900, 1800, 1900

HSDPA/HSUPA (Mbps) 3G: 42.2/5.76 LTE: 300/50

Wireless LAN 802.11 a/b/g/n/ac

Bluetooth 4.2

GPS Yes

RFID/NFC NFC

#TheConFab2016

_________________________________________________________________________Huawei Mate 8

#TheConFab2016

_________________________________________________________________________Huawei Mate 8Teardown & component ID

App’s processor = HiSilicon 3650 (Kirin 950)Use in other

phones?

#TheConFab2016

_________________________________________________________________________Device Type Manufacturer Part No. # of Parents

Electronic Compass AKM AK09911C 74

PA Duplexer Module AVAGO ACFM-2013 9

GPS (Global Positioning

System) Broadcom BCM47531A1IUB2G 15

WiFi SoC Broadcom BCM43455XKUBG 4

Transceiver FCI FC7712A 2

Applications Processor

HiSilicon Technologies Co.,

Ltd HI3650 5

Envelope Tracking Power

Supply

HiSilicon Technologies Co.,

Ltd Hi6422 3

RF Transceiver

HiSilicon Technologies Co.,

Ltd Hi6362 3

Power Management IC

HiSilicon Technologies Co.,

Ltd Hi6421GWC 11

Audio CODEC

HiSilicon Technologies Co.,

Ltd Hi6402 6

DC-DC Converter Intersil, Inc. ISL91110 9

Gyroscope Sensor Invensense IDG-2030U 18

LCD Display Japan Display Inc LPM060A299B 1

Audio Amplifier Maxim MAX98925EWV 7

Charge-control and Protection Maxim MAX4946 5

DRAM Micron Technology MT53B384M64D4NH-062 3

NFC Controller NXP Semiconductors 54802 6

Other On Semi TCC−103A−R 4

Antenna Switch Module RF Micro Devices 91A 7

Unclassified RF Micro Devices RF1117 7

RF Switch RF Micro Devices Z9 9

Power Amplifier Module RF Micro Devices RF3240A 4

Power Amplifier Module RF Micro Devices RF7305 4

Power Amplifier Module RF Micro Devices RF7460 1

Gyro & Accelerometer STMicroelectronics LSM6DS2 22

DRAM Samsung K3RG3G30MM-AGCH 3

NAND Flash SanDisk SDIN9DW4-32G 2

Antenna Switch Module Skyworks SKY13416-485LF 20

RF Switch Skyworks SKY13351-378LF 20

Unclassified Skyworks SKY003 7

RF Switch Skyworks SKY13455-31 3

Touch Screen Controller Synaptics S3320A 11

Power Supply Texas Instruments TPS65132 38

Other Sensors Texas Instruments DRV2605 13

LED Driver Texas Instruments LM3646 11

Switch/RF Power Control

Device Texas Instruments SN74LVC1G3157DCK 3

Unclassified Texas Instruments QXA 13

Power Switch Texas Instruments TPS22913CYZ 9

Power Switch Texas Instruments INA231 6

DC-DC Converter Texas Instruments LP8758-B0 2

DC-DC Converter Texas Instruments LM3243 10

LED Driver Texas Instruments TPS61163A 22

Power Switch Texas Instruments TPS22908 21

Li-Ion Management Texas Instruments BQ25892 10

Front End Module Triquint Semiconductor TQF6297H 2

Other Unknown 340 1

Microphone Unknown G257 1

Microphone Unknown G434 1

Microphone Unknown G441 1

Pressure Sensor Unknown BM1 1

Baseband Processor VIA Telecom CBP8.2D 2

Power Management IC VIA Telecom CMP1.0A 2

Device Type Manufacturer Part No.

# of

Parents

Applications Processor HiSilicon Technologies Co., Ltd HI3650 5

Envelope Tracking

Power Supply HiSilicon Technologies Co., Ltd Hi6422 3

RF Transceiver HiSilicon Technologies Co., Ltd Hi6362 3

Power Management IC HiSilicon Technologies Co., Ltd Hi6421GWC 11

Audio CODEC HiSilicon Technologies Co., Ltd Hi6402 6

Huawei Mate 8 Teardown

Manufacturer Name Model No. Reception Date

Huawei Mate 8 NXT-AL10 12/22/15

Huawei P8 GRA-UL00 07/21/15

Huawei Mate S CRR-UL00 10/07/15

Huawei Ascend Mate 7 MT7-UL00 12/05/14

Huawei Mate 7 MT7-TL00 11/27/14

Huawei Honor 6 H60-L01 07/15/14

Huawei Honor 7 PLK-UL00 07/22/15

Huawei Honor X2 GEM-703L 06/04/15

Huawei Honor 6+ Plus PE-TL10 06/16/15

Huawei Honor 6+ Plus PE-UL00 06/16/15

Huawei Huawei P9 EVA-AL00 04/26/16

Use in other phones

#TheConFab2016

_________________________________________________________________________

Manufacturer Part No.

Length

(mm)

Width

(mm)

Thickness

(µm) Metals

Metal

Layers

Poly

Layers

Process

Type

Process

Generation Foundry

HiSilicon Technologies HI3650V100 8.2 10.69 89 Aluminum | Copper 10 1

CMOS-

FIN-FET 16FF+ TSMC

HiSilicon HI3650 (Kirin 950)

CPU 1

4x Cortex A72

CPU 2

4x Cortex

A53

GPU

Mali T880MP4

#TheConFab2016

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Teardown & component ID

JXD T5 (Blaster Mini) – top 10 phone in Asia-Pac March 16!

CPU/ROM/RAM CPU: Mediatek MT6732, Cortex A53 1.5 GHz x 4

ROM: 4 GByte

RAM: 1 Gbyte

Main camera 5 MP CMOS with auto focus, LED flash

Protocol (MHz) 4G: TD-LTE: 1900, 2300, 2500, 2600

TD-SCDMA / GSM (2G)

WiFi, Bluetooth, GPS

A value 4G smartphone

#TheConFab2016

_________________________________________________________________________JXD T5 (Blaster Mini)

Device Type Manufacturer Part No. # of Parents

Touchscreen Controller

FocalTech

Systems FT5306DE4 11

Camera Module OmniVision T5_Pri_Camera_CIS 2

DDR3 SDRAMKingston

Memory

08EMCP08-

EL3CV100 1

Accelerometer Kionix KXCJK 5

Unclassified MediaTek MT6311P 9

WiFi SoC MediaTek MT6625LN 25

Power Management IC MediaTek MT6325V 9

RF Transceiver MediaTek MT6169V 37

Applications Processor MediaTek MT6732V 1

Antenna Switch Module Skyworks SKY13416-485LF 20

Antenna Switch Module Skyworks SKY13488 2

Power Amplifier Module Skyworks SKY77621-11 14

Power Amplifier Module Skyworks SKY77778-51 19

Li-Ion Management

Texas

Instruments BQ24158 9

� Touchscreen controller in

addition to Mediatek parts

� Omnivision now China-owned

#TheConFab2016

_________________________________________________________________________Lenovo LePhone T2 – top 10 phone in Asia-Pac March 16!

CPU/ROM/RAM CPU: Spreadtrum SC9830A, Cortex A7

1.5 GHz x 4

ROM: 4 GByte

RAM: 512 Mbyte

Main camera 5 Mp

Protocol (MHz) 900 MHz, 1800 MHz, 1900 MHz, 2 GHz,

Band 38, Band 39, Band 40, 2010 ~ 2025

MHz, 1880 ~ 1920 MHz

WiFi, Bluetooth, GPS

A basic 2G/3G phone

#TheConFab2016

_________________________________________________________________________Lenovo LePhone T2Teardown & component ID

Device Type Manufacturer Part No. # of Parents

Touchscreen Controllers FocalTech Systems FT6336U 2

WiFi SoC SPREADTRUM SC2341B 1

Applications Processor SPREADTRUM SC9830A 1

Power Management IC SPREADTRUM SC2723G 1

RF Transceiver SPREADTRUM SR3592 1

Accelerometer STMicroelectronics C3H 86

DDR3 SDRAM Samsung KMFJ20005A-B213 1

Transistor TY Semiconductor WPT2F30 3

RF PA Module Vanchip Technologies Ltd VC7578 1

RF PA Module Vanchip Technologies Ltd VC7592-11 1

RF Switch Nationz Technologies Inc. NZ5703 RF Switch

� Touchscreen controller

& RF front end in

addition to Spreadtrum

parts

#TheConFab2016

_________________________________________________________________________

CPU/ROM/R

AM

CPU: Spreadtrum SC7731G, Cortex

A7 1.5 GHz x 4

ROM: 8 GByte

RAM: 512 Mbyte

Main

camera

5 Mp

Protocol

(MHz)

3G GSM 900/1800 MHz, WCDMA

2100 MHz, WiFi, Bluetooth, GPS

A basic 2G/3G phone

Lava Iris Atom

#TheConFab2016

_________________________________________________________________________

Device Type Manufacturer Part No. # of Parents

Accelerometer Bosch BMA222E 51

Touchscreen controller FocalTech Systems FT6X36 1

Multi Chip Package Kingston Memory 08EMCP04-NL2AV100 2

Primary Camera Module Galaxycore Inc 2145 1

Secondary Camera

Module Galaxycore Inc 09 1

RF Transceiver SPREADTRUM SR3131 4

Applications Processor SPREADTRUM SC7731G 2

Video Encoder and

Decoders SPREADTRUM SC2671H 2

Power Management IC SPREADTRUM SC2662H 2

WiFi SoC SPREADTRUM SR2351C 2

Front End Module SPREADTRUM SR2319A 1

Bi-Polar Transistor Will Semiconductor WPT2E33 5

� Touchscreen controller

& cameras in addition to

Spreadtrum parts

� Spreadtrum now also

supplying RF parts

Lava Iris Atom

#TheConFab2016

_________________________________________________________________________

CPU / ROM / RAM CPU: Apple A9, dual core, 1.84 GHz

ROM: 16 GByte

RAM: 2 Gbyte

Main Camera 12.0 MP CMOS with auto focus, LED flash

Protocol (MHz) 3.9G: FDD-LTE: 700, 800, 850, 900, 1700, 1900, 2100

3.9G: TD-LTE: –

3G: WCDMA: 850, 900, 1700, 1900, 2100

3G: CDMA: 800, 1700, 1900, 2100

3G: TD-SCDMA: –

2G: GSM: 850, 900, 1800, 1900

HSDPA/HSUPA (Mbps) 3G: 42.2/5.76 LTE: 150/50

Wireless LAN 802.11 a/b/g/n/ac

Bluetooth 4.2

GPS Yes

RFID/NFC NFC

iPhone SE

#TheConFab2016

_________________________________________________________________________iPhone SE TeardownTeardown & component ID

Use in other phones?

#TheConFab2016

_________________________________________________________________________

Device Type Manufacturer Part No.

# of

Parents

Microphone AAC TEchnologies 2DALM1 1

Power Amplifier Module AVAGO ACPM-8020 14

Applications Processor Apple APL0898 12

Audio Amplifier Apple 338S1285 15

Audio CODEC Apple 338S00105 14

Li-Ion Management Apple 338S00171-A1 1

Microphone GoerTek Inc GWM2 5

Mobile SDRAM Hynix H9HKNNNBTUMUMR-NLH 14

Gyro & Accelerometer Invensense EMS-A 4

Unclassified NXP Semiconductors 8416A1 13

NFC Controller NXP Semiconductors 66V10 15

Other NXP Semiconductors 1610A3 17

Antenna Switch Module Qorvo 1346 2

Envelope Tracking Power

Supply Qualcomm QFE1100 67

RF Receiver Qualcomm WFR1620 19

Power Management IC Qualcomm PM8019 16

Modem Qualcomm MDM9625M 16

RF Transceiver Qualcomm WTR1625L 46

Antenna Switch Module RF Micro Devices RF5159 14

Power Amplifier Module Skyworks SKY77357-8 14

Power Amplifier Module Skyworks SKY77611 2

Power Amplifier Module Skyworks SKY77827-12 1

Li-Ion Management Texas Instruments TPS65730A0P 33

LED Driver Texas Instruments 3539 14

Li-Ion Management Texas Instruments SN2400AB0 14

Touch Controllers Texas Instruments 343S0645 11

NAND Flash Toshiba THGBX5G7D2KLDXG 2

Power Amplifier ModuleTriquint

SemiconductorTQF6410 5

Power Amplifier ModuleTriquint

SemiconductorTQF6430 3

WiFi ModuleUniversal Scientific

Industrial339S00134 2

iPhone SE Teardown

Device Type Manufacturer Part No.

# of

Parents

Applications Processor Apple APL0898 12

Audio Amplifier Apple 338S1285 15

Audio CODEC Apple 338S00105 14

Li-Ion Management Apple 338S00171-A1 1

Envelope Tracking

Power Supply Qualcomm QFE1100 67

RF Receiver Qualcomm WFR1620 19

Power Management IC Qualcomm PM8019 16

Modem Qualcomm MDM9625M 16

RF Transceiver Qualcomm WTR1625L 46

#TheConFab2016

_________________________________________________________________________Manufacturer Name Model No. Manufacturer Name Model No. Manufacturer Name Model No.

Amazon Fire Phone SD4930UR Apple iPhone 6 Verizon MG5W2LL/A Samsung Galaxy S5 LTE-A SM-G906S

Apple iPhone 6S MKQK2VC/A Apple iPhone 6S MKT02LL/A Samsung Galaxy S5 LTE-A SM-G906S

Apple iPhone 6S 16GB MKQJ2VC/A Apple iPhone SE MLM02LL/A Samsung Galaxy S5 SM-G900F

Apple iPhone 6s MKRE2LL/A Apple iPhone 6 16GB MG482LL/A Samsung Galaxy S5 SM-G900S

Apple iPhone 6S MKR12LL/A Apple iPhone SE MLLP2VC/A Samsung Galaxy Round SM-G910S

Apple iPhone 6s Verizon MKRR2LL/A Blackberry Passport SQW100-1 Samsung Galaxy S5 SM-G900A

Apple iPhone 6S MKQK2TA/A HTC HTC One M9 OPJA100 Samsung Note 3 AT&T SM-N900A

AppleiPhone 6S 16GB

China MKQL2TA/A HTC HTC One M9 99HADH003-00 Samsung Galaxy Round SM-G910S

AppleiPhone 6s MKQX2LL/A HTC HTC One M8 HTC6525L Samsung

GALAXY Note 4

Verizon SM-N910V

AppleiPad Pro 128GB

Cellular ML3N2LL/A HTC HTC One E8 0PAJ310 Sony Xperia Z5 Dual E6683

AppleiPhone 6S Plus MKTL2LL/A Huawei Nexus 6P H1511 Sony

Xperia Z5

Premium E6853

Apple iPhone 6s MKQ52LL/A LG Electronics Nexus 5X LG-H790 Sony Xperia Z5 Compact E5823

Apple iPhone 6 MG3A2CL/A LG Electronics Nexus 5 LG-D820 Sony Xperia Z3+ E6533

Apple iPhone 6 Plus MG9M2CL/A LG TeleCom NEXUS 5 D820 Sony Xperia Z5 Compact E5823

Apple iPhone 6 MG4N2LL/A Microsoft Lumia 950 RM-1118 Xiaomi Tech Mi4c MI4C

Apple iPad Air 2 MGGX2CL/A Motorola Nexus 6 XT1103 Xiaomi Tech Mi Note Pro 2015021

Apple iPhone 6 MG5Y2LL/A Nubia Z7 NX506J Xiaomi Tech Mi4 2014215

AppleiPhone 6 MG4P2LL/A OnePlus OnePlus 2 A2001 Xiaomi Tech Mi4

2014215-

16GB

Apple iPhone 6S Plus MKV32LL/A Philips I999 I999 ZTE Grand S II S291

Apple iPhone 6 128GB MG622LL/A Qualcomm Snapdragon 800 65-N9050-29 ZTE Axon A1P

Apple iPhone 6 128GB MG572LL/A Samsung Galaxy S6 Verizon SM-G920V

iPhone SE Teardown

Use in other phones

#TheConFab2016

_________________________________________________________________________Qualcomm QFE1100 Envelope Tracker Manufacturer Part No. Die Mark Length

(mm)

Width

(mm)

Thickness

(µm)

Metals Metal

Layers

Poly

Layers

Process

Type

Process

Generation

Foundry

Qualcomm QFE1100 HG11-

N8125-100

2.37 1.97 Unknown Aluminum 4 1 CMOS 180 nm Unknown

Qualcomm QFE1100 HG11-

N8125-220

2.37 1.97 Unknown Aluminum 4 1 CMOS 180 nm Unknown

Qualcomm QFE1100 HG11-

NC612-220

1.97 2.37 250 Aluminum 5 1 CMOS 180 nm TSMC

HG11-N8125-100 HG11-N8125-100 PolyHG11-N8125-220 HG11-N8125-220 Poly

#TheConFab2016

_________________________________________________________________________Design Wins

�Mediatek

�Huawei

�Apple

#TheConFab2016

_________________________________________________________________________

� 3119 Active US

patents indicated

on this landscape

� Relatively few

process or

packaging patents

which is not

unusual for fabless

companies

Mediatek US Patent Landscape

#TheConFab2016

_________________________________________________________________________

� Nice and distinguished

patent technology areas

� Portfolio dominated by

system patents (system

patents faded not to clog

the image)

� Circuit , process and

package patents

throughout the plot

Huawei US Patent Landscape

#TheConFab2016

_________________________________________________________________________

� Apple’s patent landscape reflects

its development in the various

technological aspects of cloud,

security, and mobile development

� Gateway & Network patents and

applications at the top portion are

related low-level wireless

processing

� Compute & Storage patents and

applications to the left are related

to memory management and

security

� Things patents and applications to

the right are related to image

processing and all kinds of sensing

technology from fingerprint, to

light sensing, to motion and force

sensing

� Analytics patents and applications

mainly overlap with the Compute

& Storage area

� No semiconductor process patents

noted

Apple US Patent Landscape

#TheConFab2016

_________________________________________________________________________Seven IC types out of Eight!

****

****************

********

#TheConFab2016

_________________________________________________________________________

� Reviewed design wins & four China-based phones, plus

iPhone SE

� China has definitely entered the mobile space, both by growth

and acquisition (e.g. Omnivision)

� Phone and fabless companies are following Apple’s lead

� Application processor, then add in baseband, then PMICs, audio,

RF

� Sensor & peripheral co’s also entering – e.g. FocalTech, Goodix,

MEMSensing

� Chinese companies cognizant of the need for patent protection

& acquisition (e.g. the recent Xiaomi/Microsoft deal)

� Watching the space is our business – stay tuned!

Summary & Conclusions