China Market Outlook &

Samsung Memory Solution for QRD

HW KimPrinciple EngineerTechnical MarketingSamsung Electronics

China Makers’ Product Positioning Analysis in China

* Source : GFK 13.1H Sales DataShipment Rank

ASP

3 51 10 15 20

Chinese Brand is moving to Better Positioning from 2013

2 4

$200

$400

Previous Now

3Q 4Q 3Q 4Q

Number of Flagship Devices – using 8960 (‘12) & 8974(‘13)

China Flagship Chipset Revolution (8960 vs 8974)

Chinese S/Phone using MSM8974 is increasing fast

3GB3GB

* Source : Samsung

2011 2012 2013

China Flagship Display Size Revolution

2013

QVGA

WVGA

qHD

HD720

F.HD

WQXGA(QHD)

3.0 4.0 5.0 6.03.5 4.5 5.5

(>5.0”)

2012 (4.3~4.8”)China Flagship Trend

2014(>5.5”)

* Source : PDA DB

China Makers are Leading ‘The Big Display Revolution’

20%

40%

60%

80%

100%

2010

2011

2012

2013

2014

→ Smart F/PhoneF/Phone

Set Makers are targeting

Mid to High Segment

S/Phone Market is driven by Mid/Low segments

S/Phone Market Trend - Driven by China

No H/W differentiation

POP vs. eMCP Trend

eMCP Density Portion in ’2013 vs. ’2014 Smart Phone Solution Trend in China

�POP vs. eMCP Trend in China platform

• Over 60% of Smart phone in China will adopt eMCP solution

• LP3 eMCP will increase to 14% in 2014

ME44,

43%

ME48,

25%

MD44,

11%

ME1608,

8%

ME88, 5%

ME22, 3%

`2013

ME44,

26%

ME48,

20%

ME22,

12%

ME1608

, 8%

MV48, 7%

MV44, 7%

MD44, 5%

ME88, 4%

MV1608MD22

`2014

43%

25%13%

27%

9%

6%

23%

54%

51%

14%

6% 11% 16%

0%

50%

100%

`2012 `2013 `2014

POP

MV

ME

MD

ND/OD

Source: Samsung

MV : eMMC + LPDDR3

ME : eMMC + LPDDR2

MD : eMMC + LPDDR1

ND : NAND + LPDDR1

2013, Memory Trend - China S/P

� LPDDR2 based eMCP (ME) is main memory solution in 2013

: from ‘14, LPDDR3 based eMCP will be replaced to ME eMCP

[Memory Solution portion by I/F]

25%

9% 54%

11%

[with Qualcomm – 22%]

[with Others – 78%]

13%

33% 28%

26%

4%

42%

4%

50%

Source: Samsung

MV : eMMC + LPDDR3

ME : eMMC + LPDDR2

MD : eMMC + LPDDR1

ND : NAND + LPDDR1

Samsung Memory Solution for China

Entry

Level

Low-end

Mid-

Range

High-end

2.8/3.2 inch

3.5/4.0 inch

4.0/4.5 inch

4.3/5.0 inch

800Mhz, Single

0.8Ghz~1.2Ghz,

Single

1.0Ghz, Dual

1.7Ghz,

Dual/Quad

WXGA/HD

FWVGA/

WXGA

WVGA/

FWVGA

HVGA/WVGA

Upto 5MP

Upto 5MP

Upto 8MP

Upto 10MP

ND42

ME44

MD44

ME88 (1ch)

ME48/4 (1ch)

3.0/3.5 inch

4.0/4.5 inch

4.5/5 inch

5/5.7 inch

1.0Ghz, Single

1.2Ghz, Dual

1.4Ghz, Quad

1.7~2.3Ghz,

Quad/Octal

FHD/QHD

WXGA/FHD

HD/qHD

WVGA

Upto 5MP

Upto 8MP

Upto 12MP

Upto 13MP

ME42

ME22

ME(V)88

ME(V)44

ME(V)1608

16/32GB +

16Gb LP2 (2ch)

32GB +

2/3GB LP3 (2ch)

Samsung can support full mobile solution – eMCP/ eMMC & LPDDR2/3

MV3216 (1ch)

MV1616 (1ch)

~ 2013. 3Q 2013.4Q~

Available Discrete solution

MV solution from 2Q. ‘14

MCP Available Solution

MV : eMMC + LPDDR3

ME : eMMC + LPDDR2

MD : eMMC + LPDDR1

ND : NAND + LPDDR1� LPDDR3 based eMCP will have competitiveness in ‘14

2013 2014

eMCP Solution for Mass & ULCS Market

� LPDDR3 based MV MCP (MVP) will replace ND and ME MCP

• MV MCP will be ready for MP in late 13.Q4

eMMC Ver.

2012

eMMC 5.0eMMC 4.41 eMMC 4.5

Mass

market

MD44ME44/48

MV48/88

ME22

Smart

F/Phone

(ULCS)ND42

MV3216

MV1616ME1616

ME1608

Cost effective

High performance

MV : eMMC + LPDDR3

ME : eMMC + LPDDR2

MD : eMMC + LPDDR1

ND : NAND + LPDDR1

Summary

� MCP is still the main solution for China market

• Around 84% of China Set will use MCP in ‘14

� LPDDR3 based eMCP for Mid & High Segmentation

• “LPDDR3 based eMCP: Most Valuable Product” can maintain the same BOM

- 6 layer PCB up to 1600Mbps LPDDR3

� Samsung will provide full line-ups of eMCP

• eMMC & LPDDRx with the most advanced technology

• From “2GB eMMC + 2Gb LPDDR2” to “32GB eMMC + 16Gb LPDDR3”