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CHRIS LEONARD
Space Products Marketing
Challenges for Electronic
Circuits in Space Applications
10/12/2016
Agenda
► An Overview of the Harsh Environmental Conditions in Space
► A High Level View of the Satellite Industry and Applications Driving Growth in the Industry
► A Brief Outline of the Radiation Environment and Effects on Electronic Devices
► How Analog Devices is Supporting Designs for Space Level Applications
2
The Space Environment
► Noise and Vibration
► Out Gassing
► Satellite Charging
► High Temperature
Fluctuations
► Thermal Management
in a Vacuum
► Prohibited Materials
► Radiation
Supporting the Aerospace & Defense Industry
40+ year History Supplying High Reliability Products
4
5
A High Level View of the Satellite Market
and Applications Driving Growth in the
Industry
The Satellite Market
► Satellite Manufacturing
► Satellite Launch Industry
► Ground Based Equipment
► Satellite Services
NAVCOM
SATCOM
Earth Observation
Leisure
Vessel
Gen Aviation
Outdoor Rec
Personal LBS
Maritime
Rail
Commercial
Aviation
Environment
Monitoring
Agriculture
Forest
Energy
Water
Homeland Sec
Law Enforce
Humanitarian
Disaster
Management
Consumer
Services
Cartography
Land
Use
Transport
Coastal
Mgmt
Professional
Weather
Forecast
IP Direct
Access
Professional
Mobile Com
Messaging &
Asset Tracking
Corporate
Networks
Defense
Security
Rural Com
Telemedicine
DTH
Business TV
Education TV
Content Mgmt
In Flight
Government
Road
Professional
Consumer
Transport
Consumer
Broadband
Mobile Com
Satellite
Networks
Video
Distribution
Video
Contribution
Mobile
EntertainNatural
Resource
Management
Defense &
Security
Land
Monitoring
Oceanography
Meteorology
DefensePublic Safety
Fleet Mgmt
Telemetrics
Scientific
Agi/Fish
Asset Mgmt
Time & FreqSurveying
Traffic Mgmt
Satnav
Satcom
EO
Satellite Services – Driving New Payload Designs
Basic Elements of a Satellite
8
Aerospace and Defense Spectrum Usage
Complete Solutions for the Entire Spectrum
9
10
A Brief Outline of the Radiation
Environment and the Effects on
Electronic Devices
Space Radiation
Trapped Radiation
► Particles (protons/electrons) from Sun – Solar Wind
► Earths magnetic field deflects most particles
► Some become trapped in the Earth’s magnetic field
Transient Radiation
Galactic Cosmic Radiation (GCR):
► Ionized atoms originating outside the solar system
► Travel at close to the speed of light
► Earth’s magnetic field provides shielding for most except at the poles
Solar Particle Events:
► Particles created by solar flares and
coronal mass ejections
► Can travel from the sun to earth in minutes
11
Radiation Effects on IEEE Devices
Total Ionizing Dose (TID) HDR, LDR, ELDRS• Trapped Radiation (Krad)
• Accumulated charge over mission life time
• Creates leakage currents and Volt shifts
• Is, Ib, Vos, G degradation
• Threshold Shifts
• Leakage Current
• Timing Changes
Single Event Effects (SEE) • Galactic Cosmic Radiation and Solar Particle Events
Non-‐Destructive, Soft Errors, SET, SEU, SEFI, SEL• Changed states in memory cells or registers
• Device latch up, “stuck bits” in memory
• Transient signals….a voltage pulse
Destructive…Hard Errors…SEL, SEGR, SEB• Run away supply current from activated SCR effect
• Single event Gate Rupture and Single Event Burnout
12
Technology Trends and Radiation Effects
Payload w/ complex signal processing on board:
More opportunity for TID and SEE Radiation Effects
Increase in the use of commercial grade components:
COTS generally more sensitive to radiation effects
NanoSat & MicroSat provide less shielding from
the satellite structure
Finer Geometries of integrated circuits w/ higher levels of integration:
The scaling down of the gate oxide thickness decreases the TID effects.
SEE expand with scaling (less energy required to produce SEU)
Higher Frequency devices:
Single event transients translate into SEUs, increasing the number of
SEFI. Mitigation techniques to address transient voltages is more
challenging.
13
14
How Analog Devices is Supporting
Designs for Space Level Applications
QML V MIL-PRF-38535, SMC-S-010, 311-INST-001 Level 1
QML V w/ RHA Radiation Harness Assurance
Internal Space Flow Parallels MIL-PRF-38535
SCD Source Control Drawings
Total Dose - HDR Testing to 100 Krad. Can test higher
Total Dose - LDR 50 Krad RHA Designator and 100 Krad Data
SEE Available on New Product Releases
DD Capability via Contract
DLA SMC NASA
Processes
Design
Radiation
Leverage ADI Core Silicon
Modify ADI Core Silicon
Port ADI Core Silicon
Captive Proprietary SOI Processes
Partnership SOI Processes
Analog Devices Design, Processes & Radiation
15
Typical Semiconductor Device Categories
Product Type Package Temp Processing
Commercial Plastic 0 to 70 C OEM Specific
Industrial Plastic Varies by Model OEM Specific
Enhanced Product Plastic -40/-55 to 105/125 C AQEC
Automotive Plastic/Ceramic -40 to 125 C Auto/AEC-Q100
Military Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38535 (QMLQ)
Military Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38534 (QMLH)
(Hybrid/MCM)
Space Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38535 (QMLV)
Space Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38534 (QMLK)
(Hybrid/MCM)
16
MIL-PRF-38535 QMLV Screening & QCI
Screen 100% or sample Test Method___________
Wafer Lot Acceptance All Lots TM-5007
Nondestructive Bond Pull 100% Eliminated effective 4/15/03
Internal Visual 100% TM-2010, Condition A
Temperature Cycle 10 Cycles (reduced from 100) TM-1010, Condition C
Constant Acceleration 100% TM-2001, condition E
External Visual Inspection 100% TM-2009
Particle Impact Noise 100% TM-2020, Condition A
Serialization 100%
Burn-In 100% TM-1015 to 240 hours
Post Burn-In electrical 100% IAW Device Datasheet
Reverse Bias (RB) Burn-In 100% (if applicable) TM-1015, to 72 hours
Post RB Burn-in electrical 100%
17
MIL-PRF-38535 QMLV Screening & QCI cont.
Screen 100% or Sample Test Method .
Percent Defective Allowable All Lots 5% - Overall, 3% - Catastrophic
Final Electrical Test 100% IAW Device Datasheet
Fine Leak Inspection 100% TM-1014
Gross Leak Inspection 100% TM-1014
X-Ray 100% TM-2012
External Visual 100% TM-2009
Quality Conformance Inspection - QCI Testing .
Group A Electrical test Each inspection lot
Group B Assembly related test Each inspection lot or sub-lot
Group C Die related test TCI - Each Fab lot
Group D Package related test Each package-family type every 6 months
Group E Radiation hardness Each wafer/wafer lot
18
Integrated Solutions & Space Product Types
Hybrid/Module• Standard…
Connectorized Packages
• DC – 45 GHz
• Custom Configurations
Packaged Monolithic• DIP, CAN, LCC, FLAT PACK
• 2 – 52 I/O, MMIC I/O
G7, G8, G16, G24
& G32 up to 4GHz
LH5 & LH250 up to 20GHz
LSHx up to 40GHz, 3 Watts
Die• Standard Product
• Source Control Drawings
• Custom Product/Test
Enhance Product (EP/EP+)• Die process qualified over full Mil
temp range
• Assembly
-Commercial Overmold
-NiPdAu lead finish
-No copper wire bonds
• Parts guaranteed from -55C to
+105 or +125C
• Controlled Baseline
-One assembly site
-One test site
-One fab site
• Limited PEMs screen (EP+)
• Radiation benchmarking (EP+)
19
Enhance Product (EP) & EP+ Market Summary
► Enhance Product (EP) High Reliability Application Market requirements
UAV / Avionics Market for extended temp
EP devices now mandated by US Army for Missile programs Commercial Off the Shelf Solutions
Designed to meet high performance, mission critical High Reliability Applications
Controlled Manufacturing Baseline – One Assembly Site, One Test Site, One Fab site
Extended temperature to meet needs of Aerospace and Defense applications
Address concerns over Tin Whiskering … NiPdAu lead finish…
Enhanced Product Change Notification process
DLA Vendor Items Drawings (VID or V62) device part numbers
► Enhance Product Plus (EP+) Addressing Space Market requirements
Low Earth Orbit Systems
High Altitude Applications Provide additional screening to standard Enhance Product (EP) devices
Standard Screening Flow TBD…currently available as Source Control Drawings.
20
A New Device Concept for Space - EP+ Devices
► Emerging low cost satellite applications and high altitude
applications
are looking for lower cost space solutions for shorter
mission profiles
► EP+ is envision to be everything that EP is + rad qualified
die + some additional screening as defined with the
customer as it significantly affects price
21
$
Class SCommercial 883BEP EP+
Starting Material Radiation Qualified Die
Thermal Cycle
Electrical Test
Life Test
Electrical Test Min,25,Max
External Visual
Unbiased Hast
Final Electrical Min,25,Max
External Visual
Serialization
Visual
Thermal Cycle
CSAM
X-Ray
Electrical Test
Burn-In
Electrical Test
DPA
Visual
Characterization
Unit Screening► EP+ is available only via SCD (source control drawing) today
as we work with customer to define the optimal screening flow.
Potential EP+ Product Flow
The amount of selected
screening affects the price curve
Operational Amplifiers
60 600
Low Offset
High Speed /
Low Noise
Low Input Bias
Wide BW
High Speed /
Differential
Instrumentation
AD8629S
AD8351SAD8138S
AD8671S
AMP01SAD524S
PM156S AD648SPM108S
OP42S PM155SOP12S
OP16SSOP43S
OP15S OP215S
OP200S
OP27SOP07S
OP77S
OP270S
OP400SOP484S
AD8041S AD8001S
OP4671S OP470S OP471S
OP227S
OP207S
OP37S
OP22SuV400 300 270 175 125 100 80 60 60 60 50 30 10uV
nAnA 20 7.5 5 5 3 3 0.3 0.3 0.2 .01
nV/rt HznV/rt Hz 57
160 880 GBW- MHzGBW-MHz
BW- MHzBW- MHz 350 500
nV/rt HznV/rt Hz 6.5 6. 3
Log Amp
VGA
AD8306S ADL5513S
BW- MHz BW- MHz400 4000
BW- MHz BW- MHz
AD8367S
500
AD8229S
1
ADA4610
.005
Shunt MonitorAD8212SAD8210S
Common Mode Voltage - V -2 to 65 7 to 65Common Mode Voltage - V
Micro PowerADA4096S
Supply I / Amp - uAADA4084S, Dual
Supply I / Amp - uA
ADA4077S
ADA4084S, Quad
Available Portfolio
Recent Release
In Development/Planned22
ADA4084-2S – Dual Op Amp
Key Benefits
Low Noise and Low Power for Precision Applications
Wide BW and Low Noise for Filters and Instrumentation
Wide Rail-to-Rail I/O range for Buffers and Sensors
Rail-to-Rail I/O for multi stage filters and SNR maintenance
Temperature Package
–55°C to +125°C 10 Pin Flat Pack
Sampling Final Release
Now Now
23
Key Specifications
Noise: 3.9 nV/√Hz
Power: 0.625mA/ch
GBW: 15.9 MHz (G=1)
UGC: 9.9 MHz (G=1)
Supply: 3-30 V Rail-to-Rail I/O
Radiation: TID to 100Krad
Radiation: No SEL at ( Vs=5V, 125C, <=80.7MeV )
Part Number: 5962R1324501VXA (ADA4084-2AF/QMLR)
ADA4610-2S – Dual Channel Precision, Very Low Noise, Low Input Bias
Current, Wide Bandwidth JFET
Key Benefit
Low Offset and Drift
High CMRR and PSRR
Low Noise Improves Signal-to-Noise Ratio
Rail-to-Rail Output Maximizes Dynamic Range
Low Power for improved SWaP
Temperature Package
–55°C to +125°C 10-Lead Flat Pack
Sampling Final Release
Now Now
24
Key Specifications
Low Offset voltage: 1mV max
Low Noise: 7.3 nV/√Hz at 1 kHz typical
Low Bias Current : 1.5nA max at Vsy = ±15v
Low TcVos: 8uV/°C maximum
Low distortion: 0.00006%
Low Isy: 1.85mA
Radiation: 100KRad
Part Number: 5962R1420701VXA (ADA4610-2BF/QMLR)
ADL6010S – In Development
Envelope Detector
Temperature Package
–55°C to +125°C 2 RF Ports, 6 DC Pads
Sampling Final Release
DEC - 2016 JAN - 2017
25
Key Specifications
Input Frequency: 500 MHz – 40 GHz
Input Range: -30 to +15 dBm (referred to 50 ohm)
Temp Stability: <0.5dB
Slope: 2.3 V/VPEAK
Power: 1.6 mA (5V)
Radiation: 100 KRad
Part Number: ADL6010R703LSH6
Key Benefit
Schotty diode front end with on-chip linearization
Linear in V/V average power measurement
Accurate response with minimal slope variation
Excellent Temperature stability
Isolation & Interface
Why Digital Isolators?
• 4x improvement in data rate and timing specifications
• Integrates multiple isolation channels with other functions to reduce size
--and cost
• Operates at power levels up to 90% lower than optocouplers
• Minimizes external components needed to connect to other digital ---------
--devices
• Increases reliability by eliminating LEDs used in optocouplers
25
Recently Released
In Development
Under ConsiderationIsolated Error Amp
Digital Isolator
Mbps Mbps
ADuM141ADuM7442S
Quad Ch.
100
ADuM3190
isoPower
USB 2.0 Compatible
Isolated Gate Drivers
Isolated I2C Isolators
Linear Isolators
Isolated CAN
Isolated RS-485
Isolated RS-232
Isolated A/D Converters
ADI Isolator Family
150
26
Goal: Deliver a “Compete Product” Not Just Components
► Industries most comprehensive portfolio w/ Industry Leading Device Reliability
► Single Lot Date Code Procurement
► Advanced packaging and characterization to meet environmental challenges
► Gold and Tin-Lead Hot Solder Dip Lead finishes
► No prohibited materials certification
► Comprehensive Certificates of Conformance w/ Material Traceability
► Comprehensive QMLV Flight Unit Test Report
► Electrical performance production tested over extended temp ranges (-55 to 125C)
► Fully Qualified QMLV Devices w/ 100% Screening & Quality Conformance Inspection
► Radiation Qualified Devices…HDR, LDR, SEE (single event effects)
► Long Product Life Cycles Are a Cornerstone of ADI’s Business Strategy
► A Dedicated Aerospace & Defense Team
27
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