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©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Cer
amic
Su
rfac
e M
ou
nt
C 0805 C 103 K 5 R A C*CERAMICSIZE CODESPECIFICATIONC - StandardCAPACITANCE CODEExpressed in Picofarads (pF)First two digits represent significant figures.Third digit specifies number of zeros. (Use 9for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)(Example: 2.2pF = 229 or 0.50 pF = 508)CAPACITANCE TOLERANCEB – ±0.10pF J – ±5%C – ±0.25pF K – ±10%D – ±0.5pF M – ±20%F – ±1% P – (GMV) – special order onlyG – ±2% Z – +80%, -20%
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics• 10, 16, 25, 50, 100 and 200 Volts• Standard End Metalization: Tin-plate over nickel
barrier• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and+80%-20%
• Tape and reel packaging per EIA481-1. (See page92 for specific tape and reel information.) BulkCassette packaging (0402, 0603, 0805 only) perIEC60286-6 and EIAJ 7201.
• RoHS Compliant
FEATURES
CAPACITOR OUTLINE DRAWINGS
END METALLIZATIONC-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVELA- Not Applicable
TEMPERATURE CHARACTERISTICDesignated by Capacitance
Change Over Temperature RangeG – C0G (NP0) (±30 PPM/°C)R – X7R (±15%) (-55°C + 125°C)P– X5R (±15%) (-55°C + 85°C)U – Z5U (+22%, -56%) (+10°C + 85°C)V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE1 - 100V 3 - 25V2 - 200V 4 - 16V5 - 50V 8 - 10V
WL
T B
S
TIN PLATE
NICKEL PLATE
CONDUCTIVEMETALLIZATION
ELECTRODES
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
(Standard Chips - ForMilitary see page 87)
9 - 6.3V7 - 4V
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)+ For extended value 1210 case size - solder reflow only.
72
1 - 100V 3 - 25V2 - 200V 4 - 16V5 - 50V 8 - 10V6 - 35V 9 - 6.3V
7 - 4V
EIA SIZECODE
METRICSIZE CODE L - LENGTH W - WIDTH T
THICKNESS B - BANDWIDTHS
SEPARATIONminimum
MOUNTINGTECHNIQUE
0201* 0603 0.6 (.024) ± .03 (.001) 0.3 ± (.012) ± .03 (.001) 0.15 (.006) ± .05 (.002) N/A0402* 1005 1.0 (.04) ± .05 (.002) 0.5 (.02) ± .05 (.002) 0.20 (.008) -.40 (.016) 0.3 (.012)0603 1608 1.6 (.063) ± .15 (.006) 0.8 (.032) ± .15 (.006) 0.35 (.014) ± .15 (.006) 0.7 (.028)0805* 2012 2.0 (.079) ± .20 (.008) 1.25 (.049) ± .20 (.008) 0.50 (.02) ± .25 (.010) 0.75 (.030)1206* 3216 3.2 (.126) ± .20 (.008) 1.6 (.063) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A1210* 3225 3.2 (.126) ± .20 (.008) 2.5 (.098) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A1808 4520 4.5 (.177) ± .30 (.012) 2.0 (.079) ± .20 (.008) 0.60 (.024) ± .35 (.014) N/A1812 4532 4.5 (.177) ± .30 (.012) 3.2 (.126) ± .30 (.012) 0.60 (.024) ± .35 (.014) N/A1825* 4564 4.5 (.177) ± .30 (.012) 6.4 (.252) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A2220 5650 5.6 (.220) ± .40 (.016) 5.0 (.197) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A2225 5664 5.6 (.220) ± .40 (.016) 6.3 (.248) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A
Solder Wave +or
Solder ReflowSee page 78for thicknessdimensions.
Solder Reflow
Solder Reflow
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP/STANDARD
Cer
amic
Su
rfac
e M
ou
nt
X5R CAPACITANCE RANGE
NOTE: For non-standard capacitance values or voltages, contact your local KEMET sales representative.50 Volt Ceramic Chips can be used for 63 volt applications.* EIA preferred chip sizes
C0805* C1206* C1210* C1812* C1825* C2225100V50V 100V 50V 100V 50V
KCKCKC
100V100V50V100V50V100VDCDCDCDCDCDCDCDCDCDDDDDDDDDDDD
50VM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,ZM,Z
CAPTOL
682822103123153183223273333393473563683823104124154184224274334394474564684824105125155185225
CAPCODE
68008200
10,00012,00015,00018,00022,00027,00033,00039,00047,00056,00068,00082,000100,000120,000150,000180,000220,000270,000330,000390,000470,000560,000680,000820,000
1,000,0001,200,0001,500,0001,800,0002,200,000
CAP.PF
DCDCDC EB
EBEBEBEBEBEBEBEBEBEBEBEBECECECEC
EBEBEBEBEBEBEBECECEBEBEBEB
FBFBFBFBFBFBFCFCFCFCFDFDFDFDFDFFFH
FBFBFBFCFDFDFD
GBGBGBGBGBGBGBGBGBGBGCGCGEGE
GBGBGBGB
HBHBHBHBHBHBHBHBHBHBHBHBHBHB
HBHBHBHBHD
KBKBKBKBKBKBKBKBKCKDKD
M,Z2752,700,000 KD
Z5U CAPACITANCE RANGE(KEMET's Z5U also meets Y5V Characteristics)
50V 100V 50V 100V 50V 100V 50V 100V 50V 100V 50V 100V
6,800 682 M,Z DC DC8,200 822 M,Z DC DC10,000 103 M,Z DC DC EB EB12,000 123 M,Z DC EB EB15,000 153 M,Z DC EB EB18,000 183 M,Z DC EB EB22,000 223 M,Z DC EB EB27,000 273 M,Z DC EB EB33,000 333 M,Z DC EB EB39,000 393 M,Z DD EB EC47,000 473 M,Z DD EB EC FB FB56,000 563 M,Z DD EB EB FB FB68,000 683 M,Z DD EB EB FB FB82,000 823 M,Z DD EB EB FB FC GB GB100,000 104 M,Z DD EB EB FB FD GB GB120,000 124 M,Z EC FB FD GB GB150,000 154 M,Z EC FC FD GB GB180,000 184 M,Z EC FC GB HB HB220,000 224 M,Z EC FC GB HB HB270,000 274 M,Z FC GB HB HB330,000 334 M,Z FD GB HB HB KB KC390,000 394 M,Z FD GB HB HD KB KC470,000 474 M,Z FD GB HB KB KC560,000 564 M,Z FD GC HB KB680,000 684 M,Z FD GC HB KB820,000 824 M,Z FF GE HB KB1,000,000 105 M,Z FH GE HB KB1,200,000 125 M,Z HB KB1,500,000 155 M,Z HB KC1,800,000 185 M,Z HB KD2,200,000 225 M,Z HB KD2,700,000 275 M,Z KD
C1825* C2225Cap
pF
Cap
Code
Cap
Tol.
C0805* C1206* C1210* C1812*
See page 78 for Thickness Code Reference Chart.
NOTE: For non-standard capacitance values or voltages, contact your local KEMET sales representative.
+Reflow only ° Available M ±20% tolerance onlyImproved product with higher ratings and tighter capacitance tolerance product may be substituted within the same size (length, width, and thickness) at KEMET's option.Reels with such substitutions will be marked with the improved KEMET part numbers.
76
6.3V 16V 4V 6.3V 10V 16V 6.3V 10V 16V 25V 4V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 35V 50V10,000 103 K,M AA~12,000 123 K,M BB BB BB15,000 153 K,M BB BB BB18,000 183 K,M BB BB BB22,000 223 K,M BB BB BB27,000 273 K,M BB BB BB33,000 333 K,M BB BB BB39,000 393 K,M BB BB BB47,000 473 K,M BB BB BB56,000 563 K,M BB BB BB68,000 683 K,M BB BB BB82,000 823 K,M BB BB BB
100,000 104 K,M AA~ BB BB BB120,000 124 K,M150,000 154 K,M180,000 184 K,M220,000 224 K,M BB270,000 274 K,M CC CC CC EB330,000 334 K,M CC CC CC EB390,000 394 K,M CC CC CC EB470,000 474 K,M CC CC CC DC EC560,000 564 K,M CC CC CC DD ED680,000 684 K,M CC CC CC DE EE820,000 824 K,M CC CC CC DF EF
1,000,000 105 K,M BB BB CC CC CC CD DG DG DG DG ED FH+ FH+ FH+1,200,000 125 K,M DD DD DD EC FD+ FD+1,500,000 155 K,M DC DC DC EC EC EC EC FD+ FD+1,800,000 185 K,M DD DD DD EC EC EC EC FD+ FD+2,200,000 225 K,M BB° CC+ CC+ CC+ DD DK DD EE EE EE EE FG+ FG+2,700,000 275 K,M EF EF EF EF FG+ FG+3,300,000 335 K,M BB° CC+° DF DF DH EH EH EH EH FG+ FG+ FG+ FG+4,700,000 475 K,M BB° CC+ CC+ DH DH DH DG EH EH EH EH EH° FG+ FG+ FG+ FG+5,600,000 565 K,M FG+ FG+ FG+ FG+6,800,000 685 K,M ED ED EH FG+ FG+ FG+ FG+8,200,000 825 K,M ED ED EH FG+ FG+ FG+ FG+
10,000,000 106 K,M CD°+ DK+ DK+ DK+ EH EH EH EH+ FT+ FT+ FO+ FH+ FT°+12,000,000 126 K,M FD+ FD+ FG+15,000,000 156 K,M FG+ FG+ FL+18,000,000 186 K,M FG+ FG+ FH+22,000,000 226 K,M DH+° EH+ EH+° FH+ FH+ FJ+27,000,000 276 K,M33,000,000 336 K,M39,000,000 396 K,M47,000,000 476 K,M DJ°+ DK°+ EH°+ EH°+ FQ°+ FQ+° FQ°+
100,000,000 107 K,M EH°+ FQ°+
C1210*C0805* C1206*CappF
CapCode
CapTol.
C0603*0201 C0402*
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
This ch
Thickness Code Reference ChartPackaging Quantity Based on Finished Chip Thickness Specifications
78
This chart refers to ceramic chip thickness codes on pages 73 – 76. Note: TU suffix represents tape and reel packaging of unmarked components. Note: TM suffix represents tape and reel packaging of marked components. Cases sizes 1210 are 8mm tape with 4mm pitch and Case Sizes >1210 are 12mm tape and 8mm pitch.
art refers to ceramic chip thickness codes on pages 73-76.
ThicknessCode
ChipSize
Chip ThicknessRange (mm)
Qty per Reel7" Plastic
Qty per Reel13" Plastic
Qty per Reel 7" Paper
Qty per Reel13" Paper
Qty per BulkCassette
AA 0201 0.30 ± 0.03 N/A N/A 15,000 N/A N/ABB 0402 0.50 ± 0.05 N/A N/A 10,000 50,000 50,000CB 0603 0.80 ± 0.07 N/A N/A 4,000 10,000 15,000CC 0603 0.80 ± 0.10 N/A N/A 4,000 10,000 N/ACD 0603 0.80 ± 0.15 N/A N/A 4,000 10,000 N/ADB 0805 0.60 ± 0.10 N/A N/A 4,000 10,000 10,000DC 0805 0.78 ± 0.10 N/A N/A 4,000 10,000 N/ADD 0805 0.90 ± 0.10 N/A N/A 4,000 10,000 N/ADE 0805 1.00 ± 0.10 2,500 10,000 N/A N/A N/ADF 0805 1.10 ± 0.10 2,500 10,000 N/A N/A N/ADG 0805 1.25 ± 0.15 2,500 10,000 N/A N/A N/ADH 0805 1.25 ± 0.20 2,500 10,000 N/A N/A N/ADJ 0805 1.25 ± 0.20 3,000 N/A N/A N/A N/ADK 0805 1.25 ± 0.15 3,000 N/A N/A N/A N/ADL 0805 0.95 ± 0.10 4,000 10,000 N/A N/A N/AEB 1206 0.78 ± 0.10 4,000 10,000 4,000 10,000 N/AEC 1206 0.90 ± 0.10 4,000 10,000 N/A N/A N/AED 1206 1.00 ± 0.10 2,500 10,000 N/A N/A N/AEE 1206 1.10 ± 0.10 2,500 10,000 N/A N/A N/AEF 1206 1.20 ± 0.15 2,500 10,000 N/A N/A N/AEG 1206 1.60 ± 0.15 2,000 8,000 N/A N/A N/AEH 1206 1.60 ± 0.20 2,000 8,000 N/A N/A N/AEJ 1206 1.70 ± 0.20 2,000 8,000 N/A N/A N/AEK 1206 0.80 ± 0.10 2,000 8,000 N/A N/A N/AEL 1206 1.15 ± 0.15 2,000 8,000 N/A N/A N/AEM 1206 1.25 ± 0.15 2,500 10,000 N/A N/A N/AEN 1206 0.95 ± 0.10 4,000 10,000 N/A N/A N/AFB 1210 0.78 ± 0.10 4,000 10,000 N/A N/A N/AFC 1210 0.90 ± 0.10 4,000 10,000 N/A N/A N/AFD 1210 0.95 ± 0.10 4,000 10,000 N/A N/A N/AFE 1210 1.00 ± 0.10 2,500 10,000 N/A N/A N/AFF 1210 1.10 ± 0.10 2,500 10,000 N/A N/A N/AFG 1210 1.25 ± 0.15 2,500 10,000 N/A N/A N/AFH 1210 1.55 ± 0.15 2,000 8,000 N/A N/A N/AFJ 1210 1.85 ± 0.20 2,000 8,000 N/A N/A N/AFK 1210 2.10 ± 0.20 2,000 8,000 N/A N/A N/AFL 1210 1.40 ± 0.15 2,000 8,000 N/A N/A N/AFM 1210 1.70 ± 0.20 2,000 8,000 N/A N/A N/AFN 1210 1.85 ± 0.20 2,000 8,000 N/A N/A N/AFO 1210 1.50 ± 0.20 2,000 8,000 N/A N/A N/AFP 1210 1.60 ± 0.20 2,000 8,000 N/A N/A N/AFQ 1210 2.50 ± 0.22 1,500 N/A N/A N/A N/AFR 1210 2.25 ± 0.20 2,000 8,000 N/A N/A N/AFS 1210 2.50 ± 0.20 1,000 4,000 N/A N/A N/AFT 1210 1.90 ± 0.20 1,500 4,000 N/A N/A N/ALD 1808 0.90 ± 0.10 4,000 10,000 N/A N/A N/AGB 1812 1.00 ± 0.10 1,000 4,000 N/A N/A N/AGC 1812 1.10 ± 0.10 1,000 4,000 N/A N/A N/AGD 1812 1.25 ± 0.15 1,000 4,000 N/A N/A N/AGE 1812 1.30 ± 0.10 1,000 4,000 N/A N/A N/AGF 1812 1.50 ± 0.10 1,000 4,000 N/A N/A N/AGG 1812 1.55 ± 0.10 1,000 4,000 N/A N/A N/AGH 1812 1.40 ± 0.15 1,000 4,000 N/A N/A N/AGJ 1812 1.70 ± 0.15 1,000 4,000 N/A N/A N/AGK 1812 1.60 ± 0.20 1,000 4,000 N/A N/A N/AGL 1812 1.90 ± 0.20 1,000 4,000 N/A N/A N/AGM 1812 2.00 ± 0.20 1,000 4,000 N/A N/A N/AGN 1812 1.70 ± 0.20 1,000 4,000 N/A N/A N/AGO 1812 2.50 ± 0.20 500 N/A N/A N/A N/AHB 1825 1.10 ± 0.15 1,000 4,000 N/A N/A N/AHC 1825 1.15 ± 0.15 1,000 4,000 N/A N/A N/AHD 1825 1.30 ± 0.15 1,000 4,000 N/A N/A N/AHE 1825 1.40 ± 0.15 1,000 4,000 N/A N/A N/AHF 1825 1.50 ± 0.15 1,000 4,000 N/A N/A N/AJB 2220 1.00 ± 0.15 1,000 4,000 N/A N/A N/AJC 2220 1.10 ± 0.15 1,000 4,000 N/A N/A N/AJD 2220 1.30 ± 0.15 1,000 4,000 N/A N/A N/AJE 2220 1.40 ± 0.15 1,000 4,000 N/A N/A N/AJF 2220 1.50 ± 0.15 1,000 4,000 N/A N/A N/AJG 2220 1.70 ± 0.15 1,000 4,000 N/A N/A N/AJH 2220 1.80 ± 0.15 1,000 4,000 N/A N/A N/AJO 2220 2.40 ± 0.15 500 2,000 N/A N/A N/AKB 2225 1.00 ± 0.15 1,000 4,000 N/A N/A N/AKC 2225 1.10 ± 0.15 1,000 4,000 N/A N/A N/AKD 2225 1.30 ± 0.15 1,000 4,000 N/A N/A N/AKE 2225 1.40 ± 0.15 1,000 4,000 N/A N/A N/A
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitorspackaged in 8mm and 12mm plastic tape on 7" and13" reels in accordance with EIA standard 481-1:Taping of surface mount components for automatichandling. This packaging system is compatible with alltape fed automatic pick and place systems. See page 78for details on reeling quantities for commercial chipsand page 87 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORSPackaging Information
Tape & Reel Packaging
8mm ±.30(.315 ±.012")
or12mm ±.30
(.472 ±.012")
178mm (7.00")or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape(.10mm (.004") Max Thickness)
Chip Orientation in Pocket(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
ghandling. This packaging system is compatible with alltape fed automatic pick and place systems. See page 81for details on reeling quantities for commercial chipsand page 90 for MIL-PRF-55681 chips.
KEMET®
X
C
G
ZY
Gridplacementcourtyard Z
2.142.783.304.504.505.905.907.007.00
G0.280.680.701.501.502.302.303.303.30
X0.741.081.602.002.903.706.905.506.80
Y(ref)0.931.051.301.501.501.801.801.851.85
C(ref)1.211.732.003.003.004.104.105.155.15
Z
3.183.704.904.90
G
0.680.701.501.50
X
0.801.101.402.00
Y(ref)
1.251.501.701.70
Smin
1.932.203.203.20
Wave SolderReflow Solder
Calculation FormulaZ = Lmin + 2Jt + TtG = Smax - 2Jh -ThX = Wmin + 2Js + TsTt, Th, Ts = Combined tolerances
040206030805120612101812182522202225
DimensionNot Recommended
Not Recommended
�
�
���� ��!����������"���
� #$
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
Pack
agin
g
Case Sizes ≤ 1210 are 8 mm tape with 4 mm pitch.Case Sizes >1210 are 12 mm tape with 8 mm pitch.
Note: TU suffix represents tape and reel packaging of unmarked components.TM suffix represents tape and reel packaging of marked components.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Performance Notes1. Cover Tape Break Force: 1.0 Kg Minimum.2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength8 mm 0.1 Newton to 1.0 Newton (10g to 100g)
12 mm 0.1 Newton to 1.3 Newton (10g to 130g)The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carriertape shall be 165� to 180� from the plane of the carrier tape. During peeling, the carrier and/or cover tapeshall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
NOTES1. B1 dimension is a reference dimension for tape feeder clearance only.2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanicalrestriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mmmaximum in the pocket (not applicable to vertical clearance.)
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size D0 E P0 P2 T Max T1 Max
8 mm 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.100and +0.10 -0.0
12 mm (0.059 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.004)+0.004, -0.0)
Variable Dimensions — Millimeters (Inches)Tape Size Pitch B1 Max. D1 Min. F P1 R Min. T2 Max W A0B0K0
Note 1 Note 2 Note 3 Note 4
8 mm Single 4.4 1.0 3.5 ±0.05 4.0 ±0.10 25.0 2.5 8.0 ±0.30(4 mm)
(0.173) (0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984) (0.098) (.315 ±0.012)
12 mm Double 8.2 1.5 5.5 ±0.05 8.0 ±0.10 30.0 4.6 12.0 ±0.30(8 mm) (0.323) (0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)
TANTALUM, CERAMIC ANDALUMINUM CHIP CAPACITORS
Packaging Information
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Embossed Carrier Tape Configuration (cont.)
Sketch D: Tape Camber (Top View)
Allowable camber to be 1 mm/250 mm.250mm (9.843)
1mm (0.039) Max.
1mm (0.039) Max.
Table 2 – REEL DIMENSIONS (Metric will govern)
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Tape Size A Max B* Min C D* Min N Min W1 W2 Max W3
8 mm 330.0 1.5 13.0 ± 0.20 20.2 50.0 8.4 14.4 7.9 Min(12.992) (0.059) (0.512 ± 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311)
See (0.331 10.9 MaxNote 3 +0.059, -0.0) (0.429)
12 mm 330.0 1.5 13.0 ± 0.20 20.2 Table 1 12.4 18.4 11.9 Min(12.992) (0.059) (0.512 ± 0.008) (0.795) +2.0, -0.0 (0.724) (0.469)
(0.488 15.4 Max+0.078, -0.0) (0.606)
TANTALUM, CERAMIC ANDALUMINUM CHIP CAPACITORS
Packaging Information
Figure 2:Tape Leader& TrailerDimensions(MetricDimensionsWill Govern)
400mm (15.75) Min.
20°
95
Pack
agin
g
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20°
20°Maximumcomponent rotation.
Typicalcomponentcenter line
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from thebody and/or the body dimensions of the component. The clearance between the ends of the terminals orbody of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the componentwithin the cavity of not more than 20 degrees (see sketches A and B).2. Tape with components shall pass around radius "R" without damage.3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mmand
12mm
1.5+0.10, -0.0
(.059+0.004, -0.0)
1.75 ±0.10
(.069 ±0.004)
4.0 ± 0.10
(.157 ± 0.004)
2.0 ± 0.05
(.079 ± 0.002)
0.10(.004)Max.
0.75(.030)Min.
0.75(.030)Min.
25 (.984)See Note 2
Table 1
TapeSize
D0 P0E P2 T1 G1 G2 R Min.
8mm1/2
Pitch
2.0 ± 0.10(.079 ±.004)See Require-
mentsSection 3.3 (d)
3.5 ± 0.05
(.138 ± .002)
8.0 ± 0.3
(.315 ± 0.012)
See Note 1Table 1
1.1mm (.043)Max. for PaperBase Tape and1.6mm (.063)Max. for Non-Paper BaseCompositions.See Note 3.
TapeSize
P1 WF A0B0 T
8mm 4.0 ± 0.10(0.157 ± .004)
12mm 4.0 ± 0.10(0.157 ± .004)
12mmDoublePitch
8.0 ± 0.10(0.315 ± .004)
12.0 ± 0.3
(.472 ± .012)
5.5 ± 0.05
(.217 ± .002)
Table 1: 8 & 12mm Punched Tape(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:Max. ComponentRotation - Front
Cross Sectional View
Sketch C:Component Rotation - Top View
A0
B0
P1
P0
P2D0
F
E
W
Center linesof cavity
10 pitches cumulativetolerance on tape±0.2 (±0.008)
TopTapeCover
T
User Direction of Feed
T1Max. Cavity Size
See Note 1Table 1
BottomTapeCover
G2
R(Min.)Sketch A:
Bending RadiusSee Note 2Table 1
CERAMIC CHIP CAPACITORSPackaging Information
96
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORSPackaging Information
CAPACITOR MARKING TABLE(Marking Optional - Not Availablefor 0402 Size or Y5V Dielectric)
ABCDEFGHJKLMNPQRSTUVWXYZabdefmnty
0.100.110.120.130.150.160.180.200.220.240.270.300.330.360.390.430.470.510.560.620.680.750.820.910.250.350.400.450.500.600.700.800.90
1.01.11.21.31.51.61.82.02.22.42.73.03.33.63.94.34.75.15.66.26.87.58.29.12.53.54.04.55.06.07.08.09.0
101112131516182022242730333639434751566268758291253540455060708090
100110120130150160180200220240270300330360390430470510560620680750820910250350400450500600700800900
100011001200130015001600180020002200240027003000330036003900430047005100560062006800750082009100250035004000450050006000700080009000
10,00011,00012,00013,00015,00016,00018,00020,00022,00024,00027,00030,00033,00036,00039,00043,00047,00051,00056,00062,00068,00075,00082,00091,00025,00035,00040,00045,00050,00060,00070,00080,00090,000
100,000110,000120,000130,000150,000160,000180,000200,000220,000240,000270,000300,000330,000360,000390,000430,000470,000510,000560,000620,000680,000750,000820,000910,000250,000350,000400,000450,000500,000600,000700,000800,000900,000
AlphaCharacter
Numeral
9 0 1 2 3 4 5
Capacitance (pF) For Various Numeral Identifiers
1,000,0001,100,0001,200,0001,300,0001,500,0001,600,0001,800,0002,000,0002,200,0002,400,0002,700,0003,000,0003,300,0003,600,0003,900,0004,300,0004,700,0005,100,0005,600,0006,200,0006,800,0007,500,0008,200,0009,100,0002,500,0003,500,0004,000,0004,500,0005,000,0006,000,0007,000,0008,000,0009,000,000
7
10,000,00011,000,00012,000,00013,000,00015,000,00016,000,00018,000,00020,000,00022,000,00024,000,00027,000,00030,000,00033,000,00036,000,00039,000,00043,000,00047,000,00051,000,00056,000,00062,000,00068,000,00075,000,00082,000,00091,000,00025,000,00035,000,00040,000,00045,000,00050,000,00060,000,00070,000,00080,000,00090,000,000
6
Laser marking is available as an extra-cost option formost KEMET ceramic chips. Such marking is twosided, and includes a K to identify KEMET, followed bytwo characters (per EIA-198 - see table below) toidentify the capacitance value. Note that marking isnot available for size 0402 nor for any Y5V chip. Inaddition, the 0603 marking option is limited to the Konly.
Example shown is 1,000 pF capacitor.KA3
Table 2 – Capacitance Values AvailableIn Bulk Cassette Packaging
0402
0603
0805
All
All
C0G
X7R
Y5V
All
All
109109109
221221221221221
104104
All
All
181331102
392103273104104
224224
CaseSize Dielectric Voltage
Min.Cap
Value
Max.Cap
Value
All
All
20010050
200100502516
2516
Terminations: KEMET nickel barrier layer with a tin overplate.
0.30.70.75
EIASizeCode
LengthL
WidthW
ThicknessT
BandwidthB
MinimumSeparation
S
MetricSizeCode
Number ofPcs/Cassette
50,00015,00010,000
040206030805
1.0 ± 0.051.6 ± 0.072.0 ± 0.10
0.5 ± 0.050.8 ± 0.071.25 ± 0.10
0.5 ± .050.8 ± .070.6 ± .10
0.2 to 0.40.2 to 0.50.5 to 0.75
100516082012
Table 1 – Capacitor Dimensions for BulkCassette Packaging – Millimeters
Unit: mm* Reference
110 ± 0.7
31.5
±00.
2
36 ±
0 0.2
19.0
*
5.0*
10*
53.3* 6.8
± 0.
18.
8 ±
0.1
12.0
± 0
.1
3.0 ± 00.2
2.0 ± 0.10
1.5 ± 00.1
Bulk Cassette Packaging (Ceramic Chips only)(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
97
Pack
agin
g