Capacitor Bank Switching and HMI Subsystem Reference ... · tida-00454 msp430f67791a spi/ gpio i2c 5.0 v gpio tpl7407l (7 ch. relay driver) 3 relay 3 uart iso7340c (digital iso -

TIDA-00454MSP430F67791A

SPI/

GPIO

I2C

5.0 V

GPIO

TPL7407L(7 Ch. Relay

Driver)3

RELAY

3

UART

ISO7340C(DIGITAL ISO - 4/

0)

4 4

3.3 V

5.0 V

DRV8803(QUAD DRIVER)

2

24 V

24 V

CH 5

CH 4

CH 3

CH 2

CH 1

CH 0

Sig-DelADC(24 Bit)

12 V

TMP451EVM

Remote/ Local Temperature Sensor EVM

3.3 V

I2C

V3

V2

V1

I3

I2

I1

TLC5916(8 Ch. LED Driver)


OE, LE

SDO

SDI

SCLK

SDI

SDOPNP

(x4)

3.3 V

3.3 V

4

8

DISPLAY

CONTACTOR/THYRISTOR DRIVE

LIGHT AND TEMP SENSOR

OPT3001(Ambient Light Sensor)

3.3 V

MEASUREMENT

5.0 V

I2CI2C

NOTE: External boards: TIDA-00454, TMP451EVM

TIDA-00737

TPS7A4101(LDO)

CONNECTOR

(COMMUNICATIONS)

TLC59025(16 Ch. LED

Driver)

SPI, OE, LE

3.3 V

16

5.0 VSTATUS/ ALARM

x 8

x 8

AA

THYRISTORCONTROLMODULE

1TIDUB67A–December 2015–Revised March 2016Submit Documentation Feedback

Copyright © 2015–2016, Texas Instruments Incorporated

Capacitor Bank Switching and HMI Subsystem Reference Design forAutomatic Power Factor Controller

TI DesignsCapacitor Bank Switching and HMI Subsystem ReferenceDesign for Automatic Power Factor Controller

All trademarks are the property of their respective owners.

TI DesignsThis TI Design demonstrates the working of variousfunctional blocks of an automatic power factorcontroller used in mid- to low-voltage electricaldistribution, including accurate measurement andcomputation of voltages, currents, power, and powerfactor; display of measured parameters using 4-digit 7-segment display; alarms and status indications usingLEDs; switching outputs for driving contactor orthyristor for switching capacitor banks; and monitoringlocal and remote temperature using a breadth ofproducts from TI’s portfolio. An ambient light sensor isincluded for 7-segment LED display brightness control.The design is made modular with provision forexpanding the system features includingcommunication, harmonics computation, and storageof system alarms.

Design Resources

TIDA-00737 Design FolderTLC5916 Product FolderTLC59025 Product FolderISO7340C Product FolderTPL7407L Product FolderDRV8803 Product FolderOPT3001 Product FolderTPS7A4101 Product FolderTMP451EVM Product FolderMSP430F67791A Product FolderTIDA-00454 Tools Folder

ASK Our E2E Experts

Design Features• Accurate Measurement of 3 Φ Voltage, Current,

Power, and Power Factor• Accuracy < ±0.5% Achieved Using Simultaneous

Sampling, 24-Bit Sigma-Delta ADCs• 7-Segment LED Display (SSD)

– Two Constant-Current Drivers are Cascaded toDrive Display With Decimal Point

• Relay and Transistor Output Switching– Three Channels (Expandable to Seven) for

Controlling Relay Output (Contactors)– Two Channels (Expandable to Four), With

Isolation for Controlling Transistor Output(Thyristors)

• Status Indication: 16 LEDs Controlled UsingConstant-Current LED Sink Driver– Eight LEDs Indicate Phase, Parameter Being

Displayed and Power Factor Direction(Lead/Lag)

– Five LEDs Indicate Capacitor Bank Steps– Three LEDs Indicate Different Alarm Conditions

• Temperature and Ambient Light Sensors– Option to Measuring Remote (or Local)

Temperature for Capacitor Bank PanelTemperature Measurement

– Ambient Light Sensor to Control 4-Digit SSDIntensity

• Extended Features (TIDA-00454 Board)– Polyphase Metering System-on-Chip Library

Tailored for Advanced Power Quality Analysis– Four Configurable Universal Asynchronous

Receiver Transmitter Ports Connector (forImplementing RS-232 and RS-485 Interface)

Featured Applications• Power Factor Controller (PFC)• Reactive Power Control (RPC) Relay

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=TIDUB67A

http://www.ti.com/tool/TIDA-00737

http://www.ti.com/product/TLC5916

http://www.ti.com/product/TLC59025

http://www.ti.com/product/ISO7340C

http://www.ti.com/product/TPL7407L

http://www.ti.com/product/DRV8803

http://www.ti.com/product/OPT3001

http://www.ti.com/product/TPS7A4101

http://www.ti.com/product/TMP451EVM

http://www.ti.com/product/MSP430F67791A


http://e2e.ti.com

http://e2e.ti.com/support/applications/ti_designs/

iR iC

iI iZeR eC

eI eZ

System Description www.ti.com

2 TIDUB67A–December 2015–Revised March 2016Submit Documentation Feedback



An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and otherimportant disclaimers and information.

1 System Description

1.1 Active and Reactive PowerIn any electric system, the phase difference between the voltage and current is dependent on the natureof the load as well as the type of current flowing through the system.

In direct current (DC) circuits, where current flows in one direction, the voltage and current are in phaseand only dissipates "real" power, which is the product of voltage and current.

In alternating current (AC) systems, where the current reverses direction, the nature of the load introducesa phase difference between the voltage and current. The current, with respect to voltage, will be in phasefor purely resistive loads, lead by 90° for purely capacitive loads, and lag by 90° for purely inductive loads.The effective load (vectorial combination of all load elements) introduces a net phase difference betweenvoltage and current, which in turn results in two different types of power consumption in AC systems.

Figure 1. V, I Phasor (Resistive, Capacitive, Inductive, Combinational Loads in AC Systems)

In-phase current component (iZ × cos(θ)) results in the real component of power and the out-of-phasecurrent (iZ × sin(θ)) results in imaginary component of power. The following summarizes various types ofpower in an AC system:• Active power (P): Active power (ϑZ × iZ × cos(θ)), expressed as watts (W), is the "real" power used by

all electrical load to perform the work of heating, lighting, moving, and so on. The direction of energyflow is always in one direction. Resistive component of the transducers in the load use this energy forconverting it into other forms or useful energy.

• Reactive power (Q): Reactive power (ϑZ × iZ × sin(θ)), expressed as volt-amperes-reactive (var), isoften referred to as "non-working" power. This power is used for storing and reversing energy asmagnetic or electrostatic field in the reactive elements of the load. The direction of energy flowreverses as a portion of the energy stored is returned by the reactive elements.

• Apparent power (S): Apparent power, expressed as volt-amperes (VA), is the vectorial combination ofactive and reactive power. The ratio between these two types of loads becomes important as moreinductive equipment is added.

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www.ti.com System Description




1.2 Power FactorPower factor (PF) is the ratio of active power (P) to apparent power (S), expressed as W/VA. PFmeasures how effectively the current is being converted into useful work output and indicates the effect ofthe load current on the efficiency of the supply system.

Most of the commercial and industrial installations have heavy electrical loads such as motors, machines,air conditioners, drivers, and so on, which are inductive in nature. Introducing inductive loads results in a"lagging" PF. The reactive power results from the current and voltage waveforms being out of phase witheach other.

1.3 Significance of Reactive PowerReactive power increases the burden on the generation and transmission networks. Introduced byinductive and capacitive loads, higher reactive power translates to higher current for a given active power.This results in rise in temperature in the power cable, which leads to higher power losses in thedistribution networks.

With proper matching, the reactive element of the load can be balanced, thereby minimizing the reactivepower. Managing reactive power properly results in reduced energy consumption.

1.4 Improving PFIf inductors and capacitors are connected in parallel, then the inductive current will be out of phase withthe capacitive current by 180°. With proper sizing of the capacitor, the leading capacitive currentintroduced can neutralize the lagging inductive current (and vice versa) thereby reducing the reactivecurrent considerably in the circuit. This is the essence of improving the PF.

For residential customers, inductive loads such as motors or transformers found in common householdappliances and air conditioners are compensated with built-in capacitors; therefore, no external PFcorrection is needed. However, for large industrial customers the PF could vary widely.

PF can be improved by using various methods: adding capacitor banks close to the inductive motors,filtering input to remove harmonics, running synchronous motors to provide capacitive loading, and so on.Capacitors are often used as they are readily available and can be installed at multiple points in anelectrical system. There are two ways for capacitive compensation:• Fixed compensation: If the load reactance profile is fixed and steady, then fixed compensation can be

applied by using a known capacitance value. The reactive power supplied in this case is constantirrespective of any variations in the PF of the load. These capacitor banks are switched on eithermanually (using circuit breaker or switches) or semi-automatically by a remote-controlled contactor.

• Automatic power factor correction (APFC): For loads that require varying reactive power, APFC isused. Also, under light load conditions, a fixed capacitor provides a leading power factor. APFC panelsare used in industries or in the distribution network for APFC.

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System Description www.ti.com




1.5 APFC Panel for Automatic Control of PF• PFC: PFCs measure voltage and current, calculates the reactive and active power, and switches

capacitors depending on the reactive power that needs to be corrected. APFCs have 6 to 16 relaysteps for capacitor bank switching.

• External current transformer (CT): Due to large currents that are required to be measured, externalCTs are used for monitoring industrial loads. CT steps down the primary current to a standardized 1- or5-A secondary current. This secondary current is measured by the APFC to determine the primarycurrent.

• Capacitor bank: The capacitor bank is a critical component of APFC panel. Each capacitor can beindividually fused with an appropriately sized current limit fuse.

• Capacitor bank switching:– Conventional switching — Contactor: Contactors are electrically controlled switches for handling

higher currents. They are used when the variation in reactive power is slow and the capacitorswitching interval is in increments of seconds. Capacitors draw very large transient currents whenthey are switched in and out. Use caution as an oscillating inrush current can cause their failure,and too high currents can even fuse certain contacts. Capacitor duty contactors have additionalauxiliary contacts with current limiting resistors (pre-charging resistors) in series. The auxiliarycontacts come on first, and then the main contacts take over the steady state current of thecapacitors. Also, the capacitor are completely discharged before reconnecting to avoid prematurefailure.

– Dynamic switching — Thyristor switching module (TSM): A TSM is used when the load variation israpid for applications like presses, cranes, lifts, spot welding, plastic extrusion, and so on. They arealso effective in eliminating inrush current of capacitors as they can be made to switch on when thevoltage across the thyristor is zero.

• Auxiliary power supply: The APFC panel will have an auxiliary power supply that powers its variousfunctional blocks.

• Exhaust fans: The APFC panel has a number of capacitor banks and busbars that carry large currents.Exhaust fans are used to maintain the temperature of the APFC panel.

1.6 TIDA-00737This TI Design demonstrates the working of various blocks that are typically used in the APFC in anoptimized way with flexibility to expand.• Multiplexed 4-digit SSD with the decimal point (DP) controlled by two cascaded 8-bit constant-current

LED sink drivers (with intensity control) with SPI• 16 LEDs for status and alarm indication using a single 16-bit LED driver with SPI• Low-side driver for switching relays (driver rated up to 40 V)• Isolated transistor outputs to switch thyristors using digital isolator and low-side driver (driver rated up

to 60 V)• Ambient light sensor for intensity control of SSD• Three-phase voltages and currents measurement and computation of active, reactive, and apparent

power and PF• Remote temperature sensor for temperature alarm

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www.ti.com Key System Specifications




2 Key System SpecificationsThe various system specifications can derived by looking at different functional blocks of an APFC:• Current and voltage measurement• Computation of powers and PF• Relay and transistor switching for capacitor bank control• Display• LED indications• Communication• Sensors (temperature and light)• Keys for user interface

Table 1 lists the common specifications for each functional block.

Table 1. Design Specifications

NO PARAMETERS SPECIFICATION1 7-segment LED display (SSD) Four digits with DP

2 7-segment LED display brightness control(firmware controlled) Depending on ambient light

3 Number of alarm and status monitoring LEDs

16 in total:• 5 for capacitor bank switching status• 3 for alarm• 8 for parameter selection

4 Light sensor Ambient light sensor (ALS)5 Temperature sensor Remote and local temperature sensor6 Relay output (for switching contactor) Three7 Transistor output (for switching thyristor module) Two, open drain8 Current inputs Three with onboard CT9 Voltage inputs Three with onboard potential divider

10 Input frequency 50 or 60 Hz

11 Current measurement accuracy < ±0.5% from 5% to 200% of rated current(In = 5 A)

12 Voltage measurement accuracy < ±0.5% from 10% to 120% of rated voltage (Un = 230 V)13 Power measurement accuracy < ±0.5%14 Number of ADC inputs, type, and sampling rate Six sigma-delta ADC with 24-bit resolution, 4096 Hz

17 External DC power supply input Isolated 24 VNon-isolated 5 V, 12 V

http://www.ti.com


TIDA-00454MSP430F67791A

SPI/

GPIO

I2C

5.0 V

GPIO

TPL7407L(7 Ch. Relay

Driver)3

RELAY

3

UART

ISO7340C(DIGITAL ISO - 4/

0)

4 4

3.3 V

5.0 V

DRV8803(QUAD DRIVER)

2

24 V

24 V

CH 5

CH 4

CH 3

CH 2

CH 1

CH 0

Sig-DelADC(24 Bit)

12 V

TMP451EVM

Remote/ Local Temperature Sensor EVM

3.3 V

I2C

V3

V2

V1

I3

I2

I1



OE, LE

SDO

SDI

SCLK

SDI

SDOPNP

(x4)

3.3 V

3.3 V

4

8

DISPLAY

CONTACTOR/THYRISTOR DRIVE

LIGHT AND TEMP SENSOR

OPT3001(Ambient Light Sensor)

3.3 V

MEASUREMENT

5.0 V

I2CI2C

NOTE: External boards: TIDA-00454, TMP451EVM

TIDA-00737

TPS7A4101(LDO)

CONNECTOR

(COMMUNICATIONS)

TLC59025(16 Ch. LED

Driver)

SPI, OE, LE

3.3 V

16

5.0 VSTATUS/ ALARM

x 8

x 8

AA

THYRISTORCONTROLMODULE

Block Diagram www.ti.com




3 Block Diagram

Figure 2. Functional Block Diagram for TIDA-00737

http://www.ti.com


VDD

8

8

8

8

8

8

I/O Regulator

Control

Logic

OUT0 OUT1 OUT6 OUT7

Output Driver and

Error Detection

8-Bit Output

Latch

SDOSDI

CLK

LE(ED1)

OE(ED2)

R-EXT

8-Bit Shift

Register

Configuration

Latches

www.ti.com Block Diagram




3.1 Highlighted Products

3.1.1 TLC5916—8-Channel Constant-Current LED Sink DriverThe TLC5916 contains an 8-bit shift register and data latches, which convert serial input data into paralleloutput format. Each output is independently controlled and can be programmed to be on or off by theuser. The constant sink current for all channels is set through a single external resistor. The constantoutput current range is 3 to 120 mA. The TLC5916 is designed for up to 20 V at the output port. The highclock frequency (30 MHz) also satisfies the system requirements of high-volume data transmission.

The serial data is transferred into the TLC5916 through SDI, shifted in the shift register, and transferredout through SDO. Latch Enable (LE) latches the serial data in the shift register to the output latch. OutputEnable (OE) enables the output drivers to sink current.

The TLC5916 is available in a 16-pin SOIC package and is specified to operate at temperatures from–40°C to 125°C.

Figure 3. TLC5916 Functional Block Diagram

http://www.ti.com


OU

T0

OU

T7

VDD

SDO

R-EXT

GND

SDI

CLK

LE

OE

720 720 720

OU

T0

OU

T7

VDD

SDO

R-EXT

GND

SDI

CLK

LE

OE

OU

T0

OU

T7

VDD

SDO

R-EXT

GND

SDI

CLK

LE

OE

VLED

VDD: 3.0V to 5.5V

SDI

CLK

LE

OE

Read back

TL

C5916

TLC

5916

TLC

59

16

Contr

olle

r

Multiple Cascaded Drivers

26-mA Application





The TLC5916 is designed to work alone or cascaded. Figure 4 shows the cascading implementation of theTLC5916.

Figure 4. Cascading of Multiple TLC5916 Drivers

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SDO

VDD

R-EXT

OE

LE

CLK

SDI

CONTROL

LOGIC

I/O REGULATOR

CONFIGURATION

LATCHES

OUTPUT DRIVER

16-BIT SHIFT

REGISTER

8

16

8

16

16

16

OUT15OUT14OUT0 OUT1

16-BIT OUTPUT

LATCH





3.1.2 TLC59025—16-Channel Constant-Current LED Sink DriverThe TLC59025 contains a 16-bit shift register and data latches, which convert serial input data into paralleloutput format. At the TLC59025 output stage, 16 regulated-current ports provide uniform and constantcurrent for driving LEDs. Users can adjust the output current from 3 to 45 mA through an external resistor,REXT, which gives flexibility in controlling the intensity of LEDs. The TLC59025 is designed for up to 17 V atthe output port. The high clock frequency, 30 MHz, also satisfies the system requirements of high-volumedata transmission.

The serial data is transferred into the TLC59025 through SDI, shifted in the shift register, and transferredout through SDO. LE latches the serial data in the shift register to the output latch. OE enables the outputdrivers to sink current.

The TLC59025 is available in 24-pin SSOP package and is specified for operation at temperatures from–40°C to 125°C.

Figure 5. TLC59025 Functional Block Diagram

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UnifiedClock

System

512KB256KB128KB

Flash

MCLK

ACLK

SMCLK

CPUXV2and

WorkingRegisters(25 MHz)

EEM(S: 8+2)

XIN XOUT

JTAG,SBW

Interface

Port PJ

eUSCI_A0eUSCI_A1eUSCI_A2eUSCI_A3

(UART,IrDA,SPI)

SD24_B

7 Channel6 Channel4 Channel

ADC10_A

10 Bit200 KSPS

LCD_C

8MUXUp to 320Segments

REF

Reference1.5 V, 2.0 V,

2.5 V

DVCC DVSS AVCC AVSS PA

I/O PortsP1, P2

2×8 I/OsInterrupt,Wakeup

PA1×16 I/Os

P1.x P2.xRST/NMI

32KB16KB

RAM

PJ.x

DMA

3 Channel

PMMAuxiliarySupplies

LDOSVM, SVS

BOR

MPY32

SYS

Watchdog

PortMapping

Controller

CRC16

PD

I/O PortsP7, P8

2×8 I/Os

PD1×16 I/Os

I/O PortsP9, P102×8 I/O

PE1×16 I/O

P7.x P8.x

PC

I/O PortsP5, P6

2×8 I/Os

PC1×16 I/Os

P5.x P6.x

PB

I/O PortsP3, P4

2×8 I/Os

PB1×16 I/Os

P3.x P4.x

eUSCI_B0eUSCI_B1

(SPI, I C)2

RTC_CE

(32 kHz)

AUX1 AUX2 AUX3

TA1TA2TA3

Timer_A2 CC

Registers

Ta0

Timer_A3 CC

Registers

COMP_B(ExternalVoltage

Monitoring)

I/O PortsP11

1×6 I/O

PF1×6 I/O

PF

P9.x P10.x

PE

P11.x





3.1.3 MSP430F67791A—Mixed Signal MicrocontrollerThe Texas Instruments MSP430F67xx1A family of polyphase-metering system-on-chips (SoCs) arepowerful, highly-integrated solutions for revenue meters that offer accuracy and a low-system cost withfew external components. The MSP430F67xx1A family of devices use the low-power MSP430™ MCUfrom TI with a 32-bit multiplier to perform all energy calculations, metering applications (such as tariff ratemanagement), and communications with automatic meter reading (AMR) and advanced meteringinfrastructure (AMI) modules.

The MSP430F67xx1A features 24-bit sigma-delta converter technology from TI. Device family membersinclude up to 512KB of flash, 32KB of RAM, and a LCD controller with support for up to 320 segments.

The ultralow-power nature of the MSP430F67xx1A family of devices means that the system power supplycan be minimized to reduce the overall cost. Low standby power means that backup energy storage canbe minimized, and critical data can be retained longer in case of a mains power failure.

The MSP430F67xx1A family executes the energy measurement software library from TI, which calculatesall the relevant energy and power results. The energy measurement software library is available with theMSP430F67xx1A at no cost. Industry standard development tools and hardware platforms are available tohasten the development of meters that meet all of the American National Standards Institute (ANSI) andInternational Electrotechnical Commission (IEC) standards, globally.

This TI Design utilizes the MSP430F67791A. For cost optimization, the user can select anotherMSP430F67xx1A MCU-based device for design requirements such as flash, RAM, and so forth. Figure 6shows the MSP430F67791A functional block diagram.

The MSP430F67791A is available in a 128-pin LQFP package and is specified to operate at temperaturesfrom –40°C to 85°C.

Figure 6. MSP430F67791A Functional Block Diagram

http://www.ti.com


COM

OUT(1-7)

IN(1-7)

1M

50k

OVP

Regulation

Circuitry

DRIVER

1

2

3

4

5

6

7

8 9

10

11

12

13

14

15

16

NC

INA

GND1

GND2

GND2

INB

INC

OUTA

OUTC

OUTB

EN

IND OUTD

GND1

VCC1

VCC2





3.1.4 ISO7340C—Quad-Channel 4/0 Digital IsolatorThe ISO7340C provides galvanic isolation up to 3000 VRMS for 1 minute per UL and 4242 VPK per VDE.The ISO7340C has four isolated channels comprised of logic input and output buffers separated by asilicon dioxide (SiO2) insulation barrier. The ISO7340C has four channels in forward direction. The suffix'C' on the end of "ISO7340C" indicates that the default output is high, in case of input power or signal loss.Used in conjunction with isolated power supplies, the ISO7340C prevents noise current on a data bus orother circuits from entering the local ground and interfering with or damaging sensitive circuitry. TheISO7340C has an integrated noise filter for harsh industrial environments where short noise pulses maybe present at the device input pins. The ISO7340C has transistor-transistor logic (TTL) input thresholdsand operates from 3- to 5.5-V supply levels.

The ISO7340C is available in 16-pin SOIC package and is specified to operate at temperatures from–40°C to 125°C.

Figure 7. ISO7340C Pin Configuration and Function

3.1.5 TPL7407L—40-V, 7-Channel Low-Side DriverThe TPL7407L is a high-voltage, high-current NMOS transistor array. This device consists of sevenNMOS transistors that feature high-voltage outputs with common-cathode clamp diodes for switchinginductive loads. The maximum drain-current rating of a single NMOS channel is 600 mA. The user can setthe transistors as parallel for higher-current capability.

The key benefit of the TPL7407L is its improved power efficiency and lower leakage than a bipolarDarlington implementation. With the lower VOL, the user dissipates less than half the power of traditionalrelay drivers with currents less than 250 mA per channel.

The TPL7407L is available in a 16-pin SOIC package and is specified to operate at temperatures from–40°C to 125°C.

Figure 8 shows the TPL7407L functional block diagram.

Figure 8. TPL7407L Functional Block Diagram

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Thermal

Shut down

OUT1

GND

(multiple pins)

VCLAMP

IN1

IN2

IN3

Internal

Reference

Regs

UVLO

Int. VCC

nFAULT

Control

Logic

IN4

nENBL

VMLS Gate

Drive

OUT2

OUT3

OUT4

OCP

&

Gate

Drive

8.2V – 60V

OCP

&

Gate

Drive

OCP

&

Gate

Drive

OCP

&

Gate

Drive

8.2V – 60V

Optional

Zener

Inductive

Load

Inductive

Load

Inductive

Load

Inductive

Load

RESET





3.1.6 DRV8803 — 60-V, 4-Channel Low Side DriverThe DRV8803 provides a 4-channel low-side driver with overcurrent protection. It has built-in diodes toclamp turn-off transients generated by inductive loads. The DRV8803 is controlled through a parallelinterface. Internal shutdown functions are available for overcurrent protection, short-circuit protection,over-temperature protection, and undervoltage lockout. Faults are indicated by a fault output pin.

The DRV8803 is available in a 16-pin HTSSOP package and is specified to operate at temperatures from–40°C to 150°C.

Figure 9. DRV8803 Functional Block Diagram

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SCL

SDA

ADDR

VDD

OPT3001

INTAmbient

Light

GND

I2C

Interface

VDD

ADCOptical

Filter

UVLO

Thermal

Shutdown

Current

Limit

EnableError

Amp

IN

EN

OUT

FB

Pass

Device





3.1.7 TPS7A4101 — LDOThe TPS7A41 is a high voltage-tolerant linear regulator that offers the benefits of a thermally-enhancedpackage (MSOP-8) and is able to withstand continuous DC or transient input voltages of up to 50 V.

The TPS7A41 is stable with any output capacitance greater than 4.7 μF and any input capacitance greaterthan 1 μF (over temperature and tolerance). Thus, implementations of this device require minimal boardspace because of its miniaturized packaging (MSOP-8) and a potentially small output capacitor. Inaddition, the TPS7A41 offers an enable pin (EN) compatible with standard CMOS logic, to enable a low-current shutdown mode.

The TPS7A41 has an internal thermal shutdown and current limiting to protect the system during faultconditions. The MSOP-8 packages has an operating temperature range of TJ = –40°C to 125°C.

In addition, the TPS7A41 is ideal for generating a low-voltage supply from intermediate voltage rails intelecom and industrial applications. The linear regulator can not only supply a well-regulated voltage rail,but can also withstand and maintain regulation during fast voltage transients. These features translate tosimpler and more cost-effective electrical surge-protection circuitry for a wide range of applications.

Figure 10. TPS7A41 Functional Block Diagram

3.1.8 OPT3001 — Digital ALSThe OPT3001 is a sensor that measures the intensity of visible light. The digital output is reported over anI2C, two-wire serial interface. Measurements can be either continuous or single-shot.

The OPT3001 is available in 6-pin small form factor USON-6 package and is specified to operate attemperatures from –40°C to 85°C.

Figure 11. OPT3001 Functional Block Diagram

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3.1.9 TMP451— Remote Temperature SensorThe TMP451 is a high-accuracy, low-power remote temperature sensor monitor with a built-in localtemperature sensor. The temperature is represented as a 12-bit digital code for remote sensors, giving aresolution of 0.0625°C. The temperature accuracy is ±1°C (maximum) in the typical operating range forthe local and the remote temperature sensors. The two-wire serial interface accepts the SMBuscommunication protocol.

The TMP451 is ideal for high-accuracy temperature measurements in multiple locations and in a variety ofindustrial subsystems. The device is specified for operation over a supply voltage range of 1.7 to 3.6 Vand a temperature range of –40°C to 125°C.

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5V

1.80k

R3

20.0k

R25

1.80k

R30

20.0k

R26

1.80k

R31

20.0k

R27

1.80k

R32

20.0k

R28

DIG1 DIG2 DIG3 DIG4

SEG-A

SEG-F

SEG-B

SEG-E

SEG-D

SEG-H

SEG-C

SEG-G

5V 5V 5V

K1

K2

K3

K4

K5

A6

K7

A8

A9

K10

K11

A12

D18

LDQ-M286RI

TP

44

TP

45

TP

46

TP

47

TP48

TP49

TP50

TP51

3

1

2

Q1

MMBT3906

3

1

2

Q2

MMBT3906

3

1

2

Q3

MMBT3906

3

1

2

Q4

MMBT3906

www.ti.com System Design Theory




4 System Design Theory

4.1 Display

4.1.1 7-Segment LED Display (SSD)The working of SSD is showcased using four digits. Each digit patten has seven segments and a decimalpoint LED that can be turned ON depending on the number that needs to be displayed. In order to reducethe number of control lines required to control four digits, multiplexing is used. At any given instant onlyone digit is enabled and driven for 250 μs, followed by subsequent digits. The pattern is cycled at a rategreater than persistence of vision (POV) so that all digits are visible at a time.

4.1.1.1 MultiplexingFigure 12 shows the internal connection diagram for a multiplexed 4-digit SSD.

Figure 12. Multiplexed 4-Digit SSD

Each digit in the module has a common anode pin. However, all the digits across the display moduleshare cathode connections. This allows each digit to be controlled independently.

The LDQ-M286RI (D18 in Figure 13) is a 4-digit SSD. The anode of each digit is connected to the supplythrough the PNP switch (time multiplexed). Only one digit receives supply at a time. At any given instant,only one PNP switch is turned ON using one of the two TLC5916.

Figure 13. Interface for Multiplexing 4-Digit SSD

The TIDA-00737 has 4-digit SSD implementation for auto-cyclic display with scrolling time of 4 secondsfor displaying nine parameters, namely three voltages, three currents, and three PFs.

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GND1

SDI2

CLK3

LE(ED1)4

OUT05

OUT16

OUT27

OUT38

OUT49

OUT510

OUT611

OUT712

OE(ED2)13

SDO14

R-EXT15

VDD16

U4

TLC5916ID

1µFC16

0.1µFC17

DVCC

DGND

DGND

PM_UCA0SIMO

PM_UCA0CLKPM_UCA0CLK

CASCADEPM_UCA0SIMO

OE_SEG

DGND

OE_SEG

SEG-ASEG-BSEG-CSEG-DSEG-ESEG-FSEG-GSEG-H

LE_SEG

10kR38

DVCC

1.58k

R34

10kR2

DGND

GND1

SDI2

CLK3

LE(ED1)4

OUT05

OUT16

OUT27

OUT38

OUT49

OUT510

OUT611

OUT712

OE(ED2)13

SDO14

R-EXT15

VDD16

U5

TLC5916ID

1µF

C180.1µFC19

DVCC

DGND

DGND

PM_UCA0SOMI

CASCADEPM_UCA0CLK

PM_UCA0CLK

PM_UCA0SOMI

DGND

DIG1DIG2DIG3DIG4

1.58k

R35

OE_SEGLE_SEG

LE_SEG

OE_SEG

TP

37

TP

38

System Design Theory www.ti.com




4.1.1.2 CascadingTwo TLC5916 are used in this design: one for selecting the digit and other for driving SSD. The TLC5916contains an 8-bit shift register and latches data, which converts serial input data into parallel output format.At the output stage, eight regulated current ports are designed to provide uniform and constant current fordriving LEDs.

The TLC5916 constant-current LED sink driver is designed to work alone or cascaded. Cascadedconfiguration is useful when more number of outputs are required and MCU pins are limited.

The cascading of the two devices is done by:• Connecting the same SPI clock from MCU to both TLC5916 drivers• SDO of MCU is connected to SDI of Device 1. SDO of Device 1 is connected to SDI of Device 2• SDO of Device 2 is connected to SDI of MCU• Connecting two GPIOs from the MCU to LE_SEG and OE_SEG of both the devices

Figure 14. SSD Driver Interface

4.1.1.3 Current ControlSSD intensity can be controlled depending on the ambient light for better visibility when the APFC ismounted into a panel. The LED sink current of the TLC5916 can be controlled by external resistor REXTand also by a 256-step programmable global current gain using firmware.

The TLC5916 scales up the reference current, IREF, set by the external resistor REXT to sink a current, IOUT,at each output port. The procedure to calculate the target output current IOUT,TARGET in the saturation regionis as follows.

Firmware control of IOUT,TARGET uses a bit definition of the configuration code. This bit definition of the codein the configuration latch is shown in Table 2.

Table 2. Bit Definition of 8-Bit Configuration Code

0 1 2 3 4 5 6 7MEANING CM HC CC0 CC1 CC2 CC3 CC4 CC5DEFAULT 1 1 1 1 1 1 1 1

Bits 1 to 7 {HC, CC [0:5]} determine the voltage gain (VG) that affects the voltage at REXT and indirectlyaffects the reference current, IREF, flowing through the external resistor at REXT. Bit 0 is the currentmultiplier (CM) that determines the ratio IOUT,TARGET/IREF. Each combination of VG and CM gives a specificcurrent gain (CG).

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1270.791 15 11.87 mA

128= ´ ´ =

OUT,TARGET REFI I 15 CG= ´ ´

REF

1.25 VI 0.791mA

1580= =

W

REF

EXT

VR EXTI

R

-

=

( )1 1 127VG 3 VG

128

-= ´ = =

( )CM 1CG VG 3

-= ´

1271.26 1.25 V

128= ´ =

VR EXT 1.26 V VG- = ´

D CC0 25 CC1 24 CC2 23 CC3 22 CC4 21 CC5 20= ´ + ´ + ´ + ´ + ´ + ´

( ) D1 HC 1

64VG

4

æ ö+ ´ +ç ÷è ø=





VG is the relationship between {HC,CC[0:5]} and the voltage gain, which is calculated as shown inEquation 1 and Equation 2:

(1)(2)

The maximum possible value of the configuration code is {CM, HC, CC[0:5]} = {1,1,111111}.

Using the values in Equation 2, D = 63.

Placing D = 63 and HC = 1 in Equation 1, VG = 127/128 = 0.992.

REXT is the external resistor connected between the R-EXT terminal and ground (R34 and R35 shown inFigure 14) and VR-EXT is the voltage of R-EXT, which is controlled by the programmable voltage gain(VG). VG is defined by the configuration code.

To calculate VR-EXT,(3)

aaaaaaaa-

To calculate current gain (CG):

(4)

aaa-

To calculate the reference current (IREF):

(5)

Considering REXT = 1580 Ω (used in this design),

(6)

aaaaaaaaaa-

Hence, each output port is set to sink a current of 11.87 mA in this design.

4.1.1.4 Layout GuidelinesSee Section 12 Layout of the datasheet for layout guidelines and layout example.

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OUT,TARGET

1.21 VI 15.5 10.4 mA

1800

æ ö= ´ =ç ÷

Wè ø

EXT

1.21 VR 15.5 1875

10 mA

æ ö= ´ = Wç ÷

è ø

EXTOUT,TARGET

1.21 VR 15.5

I

æ ö= ´ç ÷

ç ÷è ø





4.1.2 Status and Alarm Indication LEDs16 LEDs are used in this design for indicating alarm, capacitor bank status, and parameter selected:• 8 LEDs indicate phase, parameter selected and lead/lag information• 5 LEDs indicate the capacitor bank status• 3 LEDs indicate the alarm condition

4.1.2.1 LED Current ConfigurationThe TLC59025 has 16 output ports. The forward current of each LED is set around 10 mA. Externalresistor REXT is used to set sink current, IOUT, at each output port.

To calculate the REXT for target output current IOUT,TARGET in the saturation region:

(7)

Placing IOUT,TARGET = 10 mA,

1800 Ω is used in this design.

Calculating IOUT,TARGET with REXT = 1800 Ω,

Each output port of the TLC59025 is set to sink a current of 10.4 mA in this design.

4.1.2.2 Parameter Indication LEDsThe TIDA-00737 displays multiple parameters like voltages, currents, and PF of each phase. The LEDsassociated with the parameter being displayed will be turned ON. Table 3 shows the LEDs that areassigned for the parameter being displayed.

Table 3. LEDs Indicating Parameter Being Displayed on 7-Segment LED

D14 D15 D11 D12 D13 D16 D10 D7VOLTAGE CURRENT PF PHASE R PHASE Y PHASE B LAG LEAD

4.1.2.3 Capacitor Bank Status LEDsThe selective capacitor from the bank will be switched ON/OFF based on reactive power beingcompensated. This design shows the switching of the capacitor bank in five steps for improving thelagging PF (towards unity). This is implemented by switching three relays and two transistor outputs.Further details on relay and transistor output switching are covered in Section 4.2. Associated five LEDfunctionalities for capacitor bank switching status are shown in Table 4.

Table 4. Capacitor Bank Status LED States Proportional to Reactive Power

D9 D8 D5 D4 D1 COMMENTSON OFF var ≥ 200ON ON OFF var ≥ 400ON ON ON OFF var ≥ 600ON ON ON ON OFF var ≥ 800ON ON ON ON ON var ≥ 1000

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4.1.2.4 Alarm IndicationThree LEDs are assigned to indicate alarm conditions for voltage, temperature, and low lightingconditions.

Table 5. LEDs to Indicate Alarms

D2 D3 D6 COMMENTSON X X Input voltage: > 110% of 230-V ACX ON X Remote temperature: > 50°CX X ON Ambient light: < 100 lux

NOTE:• LED1 to LED16 are represented as D1 to D16 in the schematic.• Red and green LEDs are used in alternate rows for easy identification.


4.2 Output Drive

4.2.1 Relay Output DriveThis TI Design provides three high-current output drivers for switching relays. It features the TPL7407L, alow-side relay driver. The COM pin is the power supply pin of the TPL7407L that powers the gate drivecircuitry. This design ensures a full-drive potential with any GPIO above 1.5 V. The gate drive circuitry isbased on low-voltage CMOS transistors that can only handle a max gate voltage of 7 V. An integratedLDO reduces the COM voltage of 8.5 to 40 V to a regulated voltage of 7 V. Though TI recommends an8.5-V minimum for VCOM, the device still functions with a reduced COM voltage, a reduced gate drivevoltage, and a resulting higher RDS(ON).

To prevent overvoltage on the internal LDO output because of a line transient on the COM pin, the COMpin must be limited to below 3.5 V/μs. TI recommends using a bypass capacitor that limits the slew rate tobelow 0.5 V/μs.

Three single-pole, single-throw–normally open (SPST-NO) contact form type relays are installed on theboard. The TPL7407L drives these relays. The contact rating of each relay is 12 A at 250-V AC. TheTPL7407L relay driver outputs are controlled by the MSP430F67791A GPIO pins.

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+12V

OUT1

OUT2

OUT3

1

2

J2

ED120/2DS

1

2

J6

ED120/2DS

1

2

J7

ED120/2DS

5

41

3

K1

G2RL-1A DC12

5

41

3

K2

G2RL-1A DC12

5

41

3

K3

G2RL-1A DC12

+12V

+12V

15V

D19

MM

SZ

47

02

T1G

IN11

IN22

IN33

IN44

IN55

IN66

IN77

GND8

COM9

OUT710

OUT611

OUT512

OUT413

OUT314

OUT215

OUT116

U1

TPL7407LPW

OUT1

OUT2

OUT3

0.1µFC1

10µFC46

10kR6

10kR5

10kR7

10kR8

10kR11

10kR9

RELAY_1

RELAY_2

RELAY_3

10kR10TP2

DGNDDGND

DGND

RELAY_1

RELAY_2

RELAY_3

+12V

TP

3T

P4

TP

5T

P6

1

2

J1

ED120/2DS

DGND

TP12

TP11

TP10

DGND

TP26

TP24

TP22

TP

23

TP

25

TP

27





Figure 15 shows the TPL7407L relay driver switching control and Figure 16 shows relay control.

Figure 15. Relay Driver

Figure 16. Relay Control


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OUT_1

0.1µF

C5

IN1_ISO

IN2_ISO

nENBL_ISO

+24V_ISO

10kR16

VM1

VCLAMP2

OUT13

OUT24

GND5

OUT36

OUT47

ENBL8

RESET9

IN410

IN311

GND12

IN213

IN114

NC15

FAULT16

PAD17

U7

DRV8803PWPR

0R13

0R14

10kR12

10k

R15

5V_ISO

5V_ISO

5V_ISOGND_iso

GND_iso

GND_iso

GND_iso

RESET_DRV_ISO

+24V_ISO

TP

7T

P8

OUT_2

0.1µFC4

48V

D22SMBJ48A-13-F

TP

13

TP30

TP31

OUT_1

OUT_2





4.2.2 Transistor Output Drive

4.2.2.1 Output DriverThis TI Design provides two high-current output driver for switching transistors. It features the DRV8803, alow-side driver that is protected. Each output has an integrated clamp diode connected to a common pin,VCLAMP. The per channel rated output current capacity of the DRV8803 is up to 2-A (one channel on) or1-A (four channels on) continuous output current per channel, at 25°C with proper PCB heatsinking.

Figure 17. Driver for Transistor Output

4.2.2.1.1 nENBL and RESET OperationThe nENBL pin enables or disables the output drivers. nENBL must be low to enable the outputs TheRESET pin, when driven active high, resets internal logic. All inputs are ignored while RESET is active.

4.2.2.1.2 Protection CircuitsThe DRV8803 is protected against undervoltage, overcurrent, and over-temperature events.

4.2.2.1.3 Overcurrent Protection (OCP)An analog current limit circuit on each FET limits the current through the FET by removing the gate drive.If this analog current limit persists for longer than the tOCP deglitch time (approximately 3.5 μs), the driverwill be disabled and the nFAULT pin will be driven low. The driver will remain disabled for the tRETRY retrytime (approximately 1.2 ms), then the fault will be automatically cleared. The fault will be clearedimmediately if either RESET pin is activated or VM is removed and re-applied.

4.2.2.1.4 Thermal Shutdown (TSD)If the die temperature exceeds safe limits (approximately 150°C), all output FETs will be disabled and thenFAULT pin will be driven low. Once the die temperature has fallen to a safe level, operation willautomatically resume. Any tendency of the device to enter TSD is an indication of either excessive powerdissipation, insufficient heatsinking, or too high ambient temperature.

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INA3

INB4

INC5

IND6

OUTA14

OUTB13

OUTC12

OUTD11

EN10

VCC11

VCC216

GND12

GND29

NC7

GND18

GND215

U8

ISO7340CDWR

0.1µF

C9

DGND

DVCC

0.1µF

C10

5V_ISO

DGND

GND_iso

GND_iso

nENBLnENBL nENBL_ISO

IN1_ISO

IN2_ISO

IN1

IN2

IN1

IN2

RESET_DRV_ISORESET_DRVRESET_DRV

0R20

0R21

0R22

0R23

TP33

TP34

TP35

TP36





4.2.2.1.5 Undervoltage Lockout (UVLO)If at any time the voltage on the VM pin falls below the UVLO threshold voltage, all circuitry in the devicewill be disabled, and internal logic will be reset. Operation will resume when VM rises above the UVLOthreshold.

4.2.2.1.6 Layout GuidelinesThe DRV8803PWP package used in this design is an HTSSOP package with an exposed PowerPAD™.The PowerPAD package uses an exposed pad to remove heat from the device. For proper operation, thispad must be thermally connected to copper on the PCB to dissipate heat. On PCB without internal planes,copper area can be added on either side of the PCB to dissipate heat. If the copper area is on theopposite side of the PCB from the device, thermal vias are used to transfer the heat between top andbottom layers.

For details about how to design the PCB, see the TI Application Report PowerPAD Thermally EnhancedPackage (SLMA002) and TI Application Brief PowerPAD Made Easy (SLMA004), both available atwww.ti.com.

4.2.2.2 Digital IsolatorThe DRV8803 is isolated from the MCU using digital isolator. The ISO7340C digital isolator supports datarates up to 25 Mbps. To control two outputs of the DRV8803, a total of four outputs are required. Toprovide these essential outputs, one ISO7340C is used and features four output channels.

Figure 18 shows all four signals interfacing:

Figure 18. Digital Isolator Interface for Transistor Output Control

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http://www.ti.com/lit/pdf/SLMA002

http://www.ti.com/lit/pdf/SLMA004

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VDD1

ADDR2

GND3

SCL4

INT5

SDA6

PAD7

U10

OPT3001DNPR

0.1µF

C25

10kR41

10kR40

10kR24

DGNDDGND

PM_UCB0SCLPM_UCB0SDA

DVCC

DVCC

TP

54T

P5

3

TP

52





Associated five (three relays + two transistor outputs) digital outputs for capacitor bank switching areshown in Table 6.

Table 6. Capacitor Bank Switching States Proportional Reactive Power

RELAY K3 RELAY K2 RELAY K1 TRANSISTOR OUT_1 TRANSISTOR OUT_2 COMMENTSON OFF var ≥ 200ON ON OFF var ≥ 400ON ON ON OFF var ≥ 600ON ON ON ON OFF var ≥ 800ON ON ON ON ON var ≥ 1000

4.2.2.2.1 Layout GuidelinesSee Section 11 Layout of the datasheet for layout guidelines and layout example.

4.3 Sensor Input

4.3.1 ALSSSD intensity can be controlled depending on the ambient light for better visibility when the APFC ismounted in a panel. This design features the ALS OPT3001 to sense ambient light. It measures theintensity of visible light and reports recorded digital output over I2C, two-wire serial interface. Figure 19shows the OPT3001 interfacing:

Figure 19. Ambient Light Sensor OPT3001 Interfacing

Currently, the ALS is mounted on the PCB and is accessible to test different ambient light conditions. Inpractical applications, the board is mounted inside an enclosure, and the ALS is not accessible or visible.For ALS to function in these conditions, a window must be provided in the enclosure for ambient light tofall on the sensor. See OPT3001 application report (SBEA002) for details on designing the window.

4.3.1.1 Layout GuidelinesSee Section 10: Layout of the datasheet for layout guidelines and layout example.

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http://www.ti.com/lit/pdf/SBEA002





4.3.2 Remote Temperature Sensor EVMThe TMP451EVM is used as a remote temperature sensor. The TMP451EVM is an evaluation modulethat uses the TMP451, a 1.8-V remote temperature sensor. The TMP451 has the capability of measuringremote temperatures. The TMP451EVM consists of two printed circuit boards (PCBs). One board(USB_DIG_Platform) generates the digital signals required to communicate with the TMP451. The secondPCB (TMP451_Test_Board) contains the TMP451 as well as support and configuration circuitry.TMP_Test_Board is used in this design to measure remote temperature and to communicate withTMP451 over I2C, two-wire serial interface.

Figure 20. TMP451EVM — Remote Temperature Sensor EVM

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4.4 AC InputAC input parameters are measured using the TIDA-00454 MCU AFE board. The TIDA-00454 MCU AFE isinterfaced with the TIDA-00737 board to measure AC input.

The following key features of the TIDA-00454 MCU AFE are used in this design:• MSP430F67791A SoC with six simultaneous sigma-delta ADCs for three-current and three-voltage

measurement• AC input voltage measurement range: 10% to 120% of the rated voltage (230 V)• AC input current measurement range: 5% to 200% of the rated current (5 A)• AC input measurement accuracy < ±0.5%• Provides expansion option for UART interface• Onboard CTs and potential dividers provided for direct measurement of voltages and currents

Figure 21. TIDA-00454 MCU AFE Board

The following sections describe key subsystems of the TIDA-00454. See the TIDA-00454 design guide(TIDUAH1) for more information.

4.4.1 AC Input Measurement

4.4.1.1 Current MeasurementThree-phase current is measured using an onboard CT followed by a burden resistor. The voltage dropacross the burden resistor is connected to the ADC inputs. The user can change the input current rangeby changing CTs and burden resistor value. Ensure the input to the MSP430F67791A SD24_B ADC isless than the differential input range ±919 mV for the maximum input current expected to be measured.

4.4.1.2 Voltage MeasurementThree-phase voltage is measured using onboard voltage divider (resistor divider). The divided voltage isconnected to the ADC inputs. The user can change the input voltage range by changing the voltagedivider ratio (or changing resistor value). Ensure the input to the MSP430F67791A SD24_B ADC is lessthan the differential input range ±919 mV for the maximum input voltages expected to be measured.

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http://www.ti.com/lit/pdf/TIDUAH1

XIN1

XOUT2

AUXVCC33

RTCCAP14

RTCCAP05

P1.5/SMCLK/CB0/A6

P1.4/MCLK/CB1/A47

P1.3/ADC10CLK/A38

P1.2/ACLK/A29

P1.1/TA2.1/VeREF+/A110

P1.0/TA1.1/VeREF-/A011

P2.4/PM_TA2.012

P2.5/PM_UCB0SOMI/PM_UCB0SCL13

P2.6/PM_UCB0SIMO/PM_UCB0SDA14

P2.7/PM_UCB0CLK15

P3.0/PM_UCA0RXD/PM_UCA0SOMI16

P3.1/PM_UCA0TXD/PM_UCA0SIMO17

P3.2/PM_UCA0CLK18

P3.3/PM_UCA1CLK19



COM022

COM123

P1.6/COM224

P1.7/COM325

P5.0/COM426

P5.1/COM527

P5.2/COM628

P5.3/COM729

LCDCAP/R3330

P5.4/SDCLK/R2331

P5.5/SD0DIO/LCDREF/R1332

P5.6/SD1DIO/R0333

P5.7/SD2DIO/CB234

P6.0/SD3DIO35



P4.0/PM_UCA2CLK38

P4.1

/PM

_U

CA

3R

XD

/M_

UC

A3S

OM

I39

P4.3

/PM

_U

CA

3C

LK

41

P4.5

/PM

_U

CB

1S

IMO

/PM

_U

CB

1S

DA

43

P6.1

/SD

4D

IO/S

39

46

P6.2

/SD

5D

IOS

38

47

P6.4

/S36

49

P6.6

/S34

51

P7.0

/S32

53

P7.2

/S30

55

P7.4

/S28

57

P7.6

/S26

59

P8.0

/S24

61

P8.2

/S22

63

P4.2

/PM

_U

CA

3T

XD

/PM

_U

CA

3S

IMO

40

P4.4

/PM

_U

CB

1S

OM

I/P

M_U

CB

1S

CL

42

P4.6

/PM

_U

CB

1C

LK

44

P4.7

/PM

_TA

3.0

45

P6.3

/SD

6D

IO/S

37

48

P6.5

/S35

50

P6.7

/S33

52

P7.1

/S31

54

P7.3

/S29

56

P7.5

/S27

58

P7.7

/S25

60

P8.1

/S23

62

P8.3

/S21

64

P8.4/S2065

P8.5/S1966

P8.6/S1867

P8.7/S1768

VDSYS269

DVSS270

P9.0/S1671

P9.1/S1572

P9.2/S1473

P9.3/S1374

P9.4/S1275

P9.5/S1176

P9.6/S1077

P9.7/S978

P10.0/S879

P10.1/S780

P10.2/S681

P10.3/S582

P10.4/S483

P10.5/S384

P10.6/S285

P10.7/S186

P11.0/S087

P11.1/TA3.1/CB388

P11.2/TA1.189

P11.3/TA2.190

P11.4/CBOUT91

P11.5/TACLK/RTCCLK92

P2.0/PM_TA0.0/BSL_TX93

P2.1/PM_TA0.1/BSL_RX94

P2.2/PM_TA0.295

P2.3/PM_TA1.096

TEST/SBWTCK97

PJ.0/TDO98

PJ.1/TDI/TCLK99

PJ.2/TMS100

PJ.3/TCK101

RST/NMI/SBWTDIO102

SD

0P

01

03

SD

0N

01

04

SD

1P

01

05

SD

1N

01

06

SD

2P

01

07

SD

2N

01

08

SD

3P

01

09

SD

3N

01

10

VA

SY

S2

111

AV

SS

21

12

VR

EF

113

SD

4P

01

14

SD

4N

01

15

SD

5P

01

16

SD

5N

01

17

SD

6P

01

18

SD

6N

01

19

AV

SS

11

20

AV

CC

12

1V

AS

YS

11

22

AU

XV

CC

21

23

AU

XV

CC

11

24

VD

SY

S1

12

5D

VC

C1

26

DV

SS

11

27

VC

OR

E1

28 U6

MSP430F67661A

XINXOUTAUXVCC3

P1.2P1.1P1.0P2.4PM_UCB0SCLPM_UCB0SDAP2.7PM_UCA0RXDPM_UCA0TXDP3.2PM_UCA1CLKPM_UCA1SOMIPM_UCA1SIMO

SDCLKP5.5P5.6

/OD_XTR

PM_UCA2SOMIPM_UCA2SIMOPM_UCA2CLK

PM

_U

CA

3R

XD

PM

_U

CA

3T

XD

P4

.3P

M_

UC

B1S

CL

PM

_U

CB

1S

DA

P7

.1P

7.2

P7

.3P

7.4

P7

.5P

7.6

P7

.7P

8.0

P8

.1P

8.2

P8

.3

DGNDVDSYS1P8.7P8.6P8.5P8.4

TEST/SBWTCKTDOTDITMSTCK

VC

OR

E

V3-

V3+

V2-

V2+

VA

SY

S1

V1-

V1+

I3-

I3+

I2-

I2+

I1-

I1+

RESET

2.2kR104

2.2kR105

2.2kR99

2.2kR98

I1+

I1-

I2+

I2-

I3+

I3-

V1

+

V1

-

V2

+

V2

-

V3

+

V3

-

VA

SY

S1

AU

XV

CC

2

AU

XV

CC

1

VD

SY

S1

VC

OR

E

RESET

TCK

TMS

TDI

TDO

AVCC

TEST/SBWTCK

VASYS1

DVCC

DVCCDVCC

DVCC DVCC

12pF

C22

DNP

12pF

C16

DNP

DGND

32.768KHz

12 3

Y1CMR200T-32.768KDZBTDNP

DGND

XIN

XOUT

VDSYS1

DGND

VDSYS1

AU

XV

CC

3

DGND

AGND

TP31TP32TP34TP40TP43TP35TP39TP41TP42

560KR103

DNP

560KR101

DNP

560K

R100DNP

DGND

0

R102

0.1µF

C66

0

R108

RE

LA

Y_

1

RE

LA

Y_

2

RE

LA

Y_

3

RE

LA

Y_

4

RE

LA

Y_

5

RE

LA

Y_

6

P7

.1

P7

.2

P7

.3

P7

.4

P7

.5

P7

.6

P7

.7

P8

.0

P8

.1

P8

.2

P8

.3

P8.4

P8.5

P8.6

P8.7

P2.7

PM_UCA0RXD

PM_UCA0TXD

P3.2

PM_UCA1CLK

PM_UCA1SOMI

PM_UCA1SIMO

P5.6

PM_UCA2SOMI

PM_UCA2SIMO

PM_UCA2CLK

PM

_U

CA

3R

XD

PM

_U

CA

3T

XD

P4

.3

PM

_U

CB

1S

CL

PM

_U

CB

1S

DA

P5.5

P2.4

P1.0

P1.1

P1.2

SDCLK

PM_UCB0SDA

PM_UCB0SCL

/CS0/OD_XTR

/CS0

VREF

RE

LA

Y_

1R

EL

AY

_2

RE

LA

Y_

3R

EL

AY

_4

RE

LA

Y_

5R

EL

AY

_6

TP36TP37TP38TP18TP19TP20TP21TP22TP23TP10TP24TP25TP26TP11TP12TP13TP14

TP27TP28TP15TP16

TP45TP44

EFLAG1EFLAG2

LE

D1

LE

D2

LE

D1

LE

D2

M2_XTR1M2_XTR2

M2_XTR1

M2_XTR2

TP7

TP17

EFLAG1

EFLAG2





4.4.2 MCUThe TIDA-00454 board has MSP430F67791A MCU. The user can interface three current and threevoltage channels to the ΣΔ ADC available on the MSP430F67791A. Figure 22 shows theMSP430F67791A MCU schematic.

Figure 22. MSP430F67791A MCU Schematic

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1 2

3 4

5 6

7 8

9 10

11 12

13 14

J10

N2514-6002-RB

TEST/SBWTCK

1

2

3

J7

68001-403HLF

EXT

RESET

TCKTMSTDITDO

TEST/SBWTCK

TDO

TDI

TMS

TCK

RESET

DVCC

INT

47kR44

0.1µFC19

DVCC12

34

S17914G-1-000E

DGND

DGND

10

kR

42

DVCC

10

kR

34

10

k

R2

610

kR

41





4.4.2.1 MCU ProgrammingThe TI MSP430 family of MCUs supports the standard JTAG interface, which requires four signals forsending and receiving data. The JTAG signals are shared with the GPIO. The TEST/SBWTCK signal isused to enable the JTAG signals. In addition to these signals, the RESET signal is required to interfacewith the MSP430 development tools and device programmers. Figure 23 shows the JTAG programmingconnector. For further details on interfacing to development tools and device programmers, see theMSP430 Hardware Tools User's Guide (SLAU278).

For a complete description of the features of the JTAG interface and its implementation, consult theMSP430 Programming through the JTAG Interface User's Guide (SLAU320).

Figure 23. JTAG Programming Connector

4.5 Power SupplyThe following DC power supply have to be connected externally:• Isolated power supply: 24 V; used to drive low-side driver for transistor output• Non-isolated power supply: 5 V; used to drive 4-digit SSD and 16 LEDs• Non-isolated power supply: 12 V; used to drive low-side driver for relay output

The following DC supplies are generated using LDO:• Isolated power supply: 5 V from 24 V; used to drive digital isolator• Non-isolated power supply: 3.3 V from 5 V; used for

– MCU and AFE section of the TIDA-00454– 4-digit SSD and LED sink driver– Sensors for temperature and ambient light

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http://www.ti.com/lit/pdf/SLAU278

http://www.ti.com/lit/pdf/SLAU320

OUT1

FB2

4

EN5

IN8

9

GNDEP

U9ATPS7A4101DGNR

NC3

NC6

NC7

U9B

TPS7A4101DGNR

+24V_ISO

10µF

C11

TP1

100kR18

0.01µFC12

2.98kR19

9.76kR17

10µFC13

GND_isoTP9

GND_iso

GND_iso

5.6V

D21MMSZ4690T1G

5V_ISO

TP

32

28V

D17

MM

SZ

525

5B

-7-F

1

2

3

4

J8

282834-4

+24V_ISO

GND_iso

OUT_1OUT_2

0.1µFC7

1µFC810µF

C6

GND_iso

OUT_1

OUT_2





4.5.1 Isolated Power SupplyThe user must connect the external 24-V DC supply on the 4-pin terminal block J8 to power the isolatedtransistor output section of the TIDA-00737 board (see Figure 24). The power supply is protected fromreverse polarity and overvoltage.

Figure 24. 24-V Input Connection

The DRV8803 and ISO7340C isolated supply side require a 5-V supply voltage. The TPS7A4101 LDO,which is a very high voltage-tolerant linear regulator, is used to step down 24 V to 5 V.

Figure 25 shows the LDO circuit diagram.

Figure 25. 24- to 5-V Power Supply

4.5.1.1 Layout GuidelinesSee Section 11 Layout of the datasheet for layout guidelines.

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1

2

J9

ED120/2DS

5V

DGND

TP17

10µF

C20

1µFC14

0.1µFC15

5.6V

D20MMSZ4690T1G

15V

D19

MM

SZ

47

02

T1G

COM9

OUT710

0.1µFC1

10µFC46

DGND

+12V

TP

6

1

2

J1

ED120/2DS

DGND

www.ti.com Firmware Description




4.5.2 Non-Isolated Power Supply

4.5.2.1 Power Supply for Driving RelaysAn external 12-V DC supply must be connected on a two-pin terminal block J1 to power the relay driverTPL7407L. The power supply is protected for reverse polarity and overvoltage.


4.5.2.2 Power Supply for LED OperationAn external 5-V DC supply must be connected on a two-pin terminal block J9 to power the 4-digit SSDand indication LEDs. The power supply is protected for reverse polarity and overvoltage.


5 Firmware DescriptionFor a firmware description and code examples for the TIDA-00737, see this design's firmware guide(TIDCBV2).

http://www.ti.com


http://www.ti.com/lit/pdf/TIDCBV2

Getting Started Hardware www.ti.com




6 Getting Started HardwareThis section provides details of different connectors that are provided on the TIDA-00737 and TIDA-00454boards and their applications.

6.1 ConnectorsTable 7 provides connection information for the following sections.

The OUTPUTS section covers three relay and two transistor outputs available on TIDA-00737 board.Connector column shows pin number. Example J2.1 means pin 1 of connector J2 on TIDA-00737 board.

Under INTERFACE CONNECTORS, TIDA-00737 and TIDA-00454 boards are interfaced through twoconnectors. One connector is a 16 pin (2 x 8) and another is a 10 pin (2 x 5). Pin number 1 to 16 of J5 ofTIDA-00737 are connected to pin number 1 to 16 of J2 of TIDA-00454, respectively. Pin number 1 to 10 ofJ3 of TIDA-00737 are connected to pin number 1 to 10 of TIDA-00454, respectively. The remotetemperature sensor TMP451EVM interface section covers interfacing of temperature sensor with theTIDA-00454.

The POWER SUPPLY section covers isolated and non-isolated power supply connections.

The MCU – TIDA-00454 section covers about MCU JTAG programming interface connector.

The INPUTS – TIDA-00454 section covers three phase AC voltage input connection of TIDA-00454.Current input is through CT, which is shown in subsequent images.

Table 7. TIDA-00737 and TIDA-00454 Connectors

INPUT OR OUTPUT TYPE SPECIFICATION CONNECTOROUTPUT — TIDA-00737

Relay outputRelay K1 J2.1 – J2.2Relay K2 J6.1 – J6.2Relay K3 J7.1 – J7.2

Transistor outputOUT1 J8.3 – J8.2OUT2 J8.4 – J8.2

INTERFACE CONNECTORS — TIDA-00737 WITH TIDA-00454

Interface connectors (with TIDA-00454 board)

2 × SPI,1 × I2C,

5 × GPIO andDVCC, DGND

J5 of TIDA-00737 – J2 of TIDA-00454(pin 1-pin1 to pin16-pin16)

8 × GPIO J3 of TIDA-00737 – J4 of TIDA-00454(pin 1-pin1 to pin10-pin10)

Remote temperature sensor TMP451EVMinterface(with TIDA-00454 board)

1 × I2C,DVCC, GND

J5 of TIDA-00454 – Test point of TMP451EVMJ5.12 – SCLAJ5.13 – SDAAJ5.15 – GNDJ5.16 – DVCC

POWER SUPPLY — TIDA-00737 AND TIDA-00454

Non-isolated power supply input5-V DC J9.1 wrt J9.2 [TIDA-00737]

J8.1 wrt J8.2 [TIDA-00454]12-V DC J1.1 wrt J1.2

Isolated power supply input 24-V DC J8.1 wrt J8.2MCU — TIDA-00454MCU programming JTAG J10INPUTS — TIDA-00454

Voltage inputChannel 1 J11.1 – J11.2Channel 2 J12.1 – J12.2Channel 3 J13.1 – J13.2

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Isolated TSM interfaceOUT2, OUT1, GND, 24 V

Relay outputK3, K2, K1

Relay supplyDGND, 12 V

Communication and expansion I/O connector

LED supply5 V, DGND

www.ti.com Getting Started Hardware




NOTE: The current inputs have to be applied across the CTs and no connectors have beenprovided.

Figure 28 shows the interface connectors of the TIDA-00737 board.

Figure 28. TIDA-00737 Interface Connectors

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Communication andexpansion I/O connector

TMP451EVM interfaceDVCC, DGND, SDA, SCL

JTAGconnector

5-V supply5 V, DGND

Current inputsI1, I2, I3

Voltage inputsV1, V2, V3

Getting Started Hardware www.ti.com




Figure 29 shows the interface connectors of the TIDA-00454 board.

Figure 29. TIDA-00454 Interface Connectors

The current input wires are taken through the CT and do not have connectors (see Figure 30). The wiresare connected externally as flying leads. An external terminal block can be used to connect the currentinputs.

Figure 30. Current Input Wire Through CT

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3.3 V

SDA GND SCL

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Figure 31 shows the interface for the remote temperature sensor TMP451EVM board.

Figure 31. TMP451EVM Interface

6.2 External DC Power SupplyThe following external power supplies are connected:• Non-isolated: 5 V and 12 V• Isolated: 24 V

NOTE: Consider the current limit setting.

See Section 4.5 for more details.

6.3 AC Input RangeThe current input range for this design is 0.25 to 10 A. The voltage input range for this design is23 to 320 V.

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PTS3.3CTest System

Current inputs Voltage inputs

TIDA-00454 board

I2C Power inputInterface connectors

TMP451EVM 5-V DC source

Power input + TSM O/P (×2)

Power inputRelay O/P (×3)

24-V DC sourceisolated (for TSM)

12-V DC source(for relay)

Interface connectors

TIDA-00737 board

Contactor

Test Setup www.ti.com




7 Test Setup

7.1 Test Setup ConnectionFigure 32 shows test setup for the TIDA-00737 board. The TIDA-00454 board is interfaced with theTIDA-00737 board. A programmable three-phase current and voltage source (PTS3.3C) is used forapplying three-phase voltages and currents to the TIDA-00454 board. The remote temperature sensorTMP451EVM is interfaced with the TIDA-00454 board through I2C serial communication. 5-V, 12-V, and24-V power supply connections are shown. A three-phase contactor is connected on the relay output ofthe TIDA-00737 board. The contactor consists of a contactor coil, main contacts, and auxiliary contacts.The contactor coil is used to control main contacts and are controlled through the relay output. Auxiliarycontacts are used for auxiliary indication of main contacts position.

Figure 32. Test Setup to Connect TIDA-00737 With TIDA-00454

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7.2 Test SystemPTS3.3C with a 0.05% accuracy class is used for measurement. Using PTS3.3C provides minimumuncertainty during measurement.

Figure 33. Three-Phase Test System with Programmable Power Source

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Test Data www.ti.com




8 Test Data

8.1 Power Supply TestingThe following external power supplies are connected:• Isolated: 24 V• Non-isolated: 12 V, 5 V

The following supplies are generated on board using LDOs:• Isolated: 5 V• Non-isolated: 3.3 V

See Section 4.5 for more details.

Externally connected and generated power supply voltage levels measured are shown in Table 8.

Table 8. Functional Test Results

PARAMETERS ACTUAL VALUE (VDC) MEASURED VALUE (VDC)

Non-isolated power supply5 4.9812 12.013.3 3.29

Isolated power supply24 24.015 5.05

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AC Input Voltage (V)

Err

or

0 30 60 90 120 150 180 210 240 270 300-0.27%

-0.24%

-0.21%

-0.18%

-0.15%

-0.12%

-0.09%

-0.06%

-0.03%

0

0.03%

0.06%

D001

RYB

www.ti.com Test Data




8.2 Accuracy TestingThree-phase voltages and currents are applied using the PTS3.3C. Accuracy of voltages, currents, activepowers, and reactive powers for three phases are observed. Measurements were adjusted for gain, offset,and phase angle as required.

8.2.1 AC Input Voltage MeasurementFor measurement at 50 Hz:

Table 9. Input Voltage versus Measurement Error at 50 Hz

% OFNOMINAL

APPLIEDVOLTAGEINPUT (V)

MEASURED PHASE VOLTAGE (V) MEASUREMENT ERROR (%) MEASUREDFREQ (Hz)R Y B R Y B

5 11.5 11.471 11.472 11.470 –0.25 –0.24 –0.26

49.99

10 23.0 22.951 22.952 22.949 –0.21 –0.21 –0.2220 46.0 45.918 45.920 45.914 –0.18 –0.17 –0.1950 115.0 114.871 114.891 114.879 –0.11 –0.09 –0.11

100 230.0 229.773 230.005 229.984 –0.10 0.00 –0.01120 276.0 275.753 275.855 276.103 –0.09 –0.05 0.04

Figure 34. AC Input Voltage versus Measurement Error at 50 Hz

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AC Input Voltage (V)

Err

or

0 30 60 90 120 150 180 210 240 270 300-0.3%

-0.27%

-0.24%

-0.21%

-0.18%

-0.15%

-0.12%

-0.09%

-0.06%

-0.03%

0

D002

RYB





For measurement at 60 Hz,

Table 10. Input Voltage versus Measurement Error at 60 Hz

% OFNOMINAL

APPLIEDVOLTAGEINPUT (V)

MEASURED PHASE VOLTAGE (V) MEASUREMENT ERROR (%) MEASUREDFREQ (Hz)R Y B R Y B

5 11.5 11.470 11.469 11.468 –0.26 –0.27 –0.28

59.98

10 23.0 22.943 22.944 22.941 –0.25 –0.24 –0.2620 46.0 45.898 45.900 45.895 –0.22 –0.22 –0.2350 115.0 114.817 114.832 114.817 –0.16 –0.15 –0.16

100 230.0 229.713 229.916 229.887 –0.12 –0.04 –0.05120 276.0 275.753 275.999 275.952 –0.09 0.00 –0.02

Figure 35. AC Input Voltage versus Measurement Error at 60 Hz

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AC Input Current (A)

Err

or

0 1 2 3 4 5 6 7 8 9 10-0.175%

-0.15%

-0.125%

-0.1%

-0.075%

-0.05%

-0.025%

0

0.025%

0.05%

D003

RYB





8.2.2 AC Current Input MeasurementFor measurement at 50 Hz,

Table 11. Input Current versus Measurement Error at 50 Hz

% OFNOMINAL

APPLIEDCURRENTINPUT (A)

PHASE CURRENT MEASURED (A) MEASUREMENT ERROR (%) MEASUREDFREQ (Hz)R Y B R Y B

5 0.25 0.250 0.2500 0.2498 0.04 0.00 –0.08

49.99

10 0.50 0.500 0.4998 0.4996 0.02 –0.04 –0.0820 1.00 1.000 0.9990 0.9994 0.00 –0.10 –0.0650 2.50 2.500 2.4990 2.4980 0.00 –0.04 –0.08

100 5.00 4.996 4.9940 4.9920 –0.08 –0.12 –0.16200 10.00 9.998 9.9920 9.9890 –0.02 –0.08 –0.11

Figure 36. AC Input Current versus Measurement Error at 50 Hz

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AC Input Current (A)

Err

or

0 1 2 3 4 5 6 7 8 9 10-0.2%

-0.175%

-0.15%

-0.125%

-0.1%

-0.075%

-0.05%

-0.025%

0

0.025%

D004

RYB





For measurement at 60 Hz,

Table 12. Input Current versus Measurement Error at 60 Hz

% OFNOMINAL

APPLIEDCURRENTINPUT (A)

PHASE CURRENT MEASURED (A) MEASUREMENT ERROR (%) MEASUREDFREQ (Hz)R Y B R Y B

5 0.25 0.2500 0.2499 0.2497 0.00 –0.04 –0.12

59.98

10 0.50 0.4998 0.4996 0.4994 –0.04 –0.08 –0.1220 1.00 1.0001 0.9995 0.9990 0.01 –0.05 –0.1050 2.50 2.5000 2.4962 2.4979 0.00 –0.15 –0.08

100 5.00 4.9990 4.9960 4.9930 –0.02 –0.08 –0.14200 10.00 9.9940 9.9820 9.9840 –0.06 –0.18 –0.16

Figure 37. AC Input Current versus Measurement Error at 60 Hz

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8.2.3 Power (Reactive and Active) MeasurementThe following inputs were applied and powers were observed for the following conditions:• AC voltage: 230 V• Current: 5 A• Frequency: 50 Hz• PF: Performed between 0 to 1 (lead or lag)

Table 13. Power Measurement: R-Phase

PF TYPEAPPLIED PHASE ANGLE

BETWEEN CURRENTAND VOLTAGE

EXPECTED W MEASURED W EXPECTED var MEASURED var

LAG 45 813.05 812.73 813.05 813.35ZPF 90 N/A 1150 1149.58UPF 0 1150 1150.24 N/A

LEAD 45 813.05 813.85 813.05 812.44

Table 14. Power Measurement: Y-Phase




LAG 45 813.05 813.02 813.05 813.51ZPF 90 N/A 1150 1149.96UPF 0 1150 1150.34 N/A

LEAD 45 813.05 813.73 813.05 812.23

Table 15. Power Measurement: B-Phase




LAG 45 813.05 812.13 813.05 813.36ZPF 90 N/A 1150 1149.17UPF 0 1150 1149.91 N/A

LEAD 45 813.05 814.28 813.05 811.46

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Capacitor Bank Switching and HMI Subsystem Reference Design for AutomaticPower Factor Controller

8.3 Functional Testing: SSD Display and LED IndicationsAn AC voltage of 230 V and AC current of 1 A are applied and the following were observed:• Display of parameters like voltage, current, and PF• LED indications• Display updated every 4 seconds between the selected parameters• Cyclic display of selected parameters

Table 16. SSD Display and LED Indications

INPUTPARAMETER

PARAMETERS (OBSERVED) PHASES (OBSERVED) PF (OBSERVED) DISPLAY (SSD)D14 D15 D11 D12 D13 D16 D10 D7 EXPECTED OBSERVED

VoltagePhase R (V) ON OFF OFF ON OFF OFF OFF OFF 230.3 230.3

VoltagePhase Y (V) ON OFF OFF OFF ON OFF OFF OFF 230.4 230.4

VoltagePhase B (V) ON OFF OFF OFF OFF ON OFF OFF 230.4 230.4

CurrentPhase R (A) OFF ON OFF ON OFF OFF OFF OFF 1.001 1.001

CurrentPhase Y (A) OFF ON OFF OFF ON OFF OFF OFF 1.001 1.001

CurrentPhase B (A) OFF ON OFF OFF OFF ON OFF OFF 1.001 1.001

PFPhase R (LAG) OFF OFF ON ON OFF OFF ON OFF 0.707 0.707

PFPhase Y (LAG) OFF OFF ON OFF ON OFF ON OFF 0.707 0.707

PFPhase B (LAG) OFF OFF ON OFF OFF ON ON OFF 0.707 0.707

PFPhase R(LEAD)

OFF OFF ON ON OFF OFF OFF ON 0.707 0.707

PFPhase Y(LEAD)

OFF OFF ON OFF ON OFF OFF ON 0.707 0.707

PFPhase B(LEAD)

OFF OFF ON OFF OFF ON OFF ON 0.707 0.707

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8.4 Capacitor Bank (Simulated Reactive Power) Switching TestThe design provides:• Three relay outputs for contactor switching. A three-phase contactor with a main contacts rating of 220

V, 25 A is used for the test. Each relay is connected with a separate contactor. The relay output isconnected to the contactor coil. Auxiliary contact of contactor is monitored for main contact’s switchingstatus – ON/OFF.

• Two transistor outputs for thyristor switching.

The output switching is simulated by increasing and reducing the reactive power (applying constantcurrent and voltage and varying the PF).

When multiple relay and transistor output status needs to be changed. the relay and transistor outputs areswitched ON or OFF sequentially with a delay of 4 seconds (See Section 3 of the firmware design guide(TIDCBV2) for more details).

8.4.1 Increase of Reactive Power

Table 17. Relay and Transistor SwitchingINPUT RELAY K3 RELAY K2 RELAY K1 TRANSISTOR OUT_1 TRANSISTOR OUT_2

var(V = 230 V,

I = 5 A)EXPECTED OBSERVED EXPECTED OBSERVED EXPECTED OBSERVED EXPECTED OBSERVED EXPECTED OBSERVED

< 200 OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF

≥ 200 ON ON OFF OFF OFF OFF OFF OFF OFF OFF

≥ 400 ON ON ON ON OFF OFF OFF OFF OFF OFF

≥ 600 ON ON ON ON ON ON OFF OFF OFF OFF

≥ 800 ON ON ON ON ON ON ON ON OFF OFF

≥ 1000 ON ON ON ON ON ON ON ON ON ON

Table 18. LEDs to Indicate Switching StepsINPUT D9 D8 D5 D4 D1

var(V = 230 V,








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http://www.ti.com/lit/pdf/TIDCBV2





8.4.2 Reduction of Reactive Power

Table 19. Relay and Transistor SwitchingINPUT RELAY K3 RELAY K2 RELAY K1 TRANSISTOR OUT_1 TRANSISTOR OUT_2

var(V = 230 V,

I = 5 A)EXPECTED OBSERVED EXPECTED OBSERVED Expected OBSERVED EXPECTED OBSERVED EXPECTED OBSERVED







Table 20. LEDs to Indicate Switching StepsINPUT D9 D8 D5 D4 D1

var(V = 230 V,








8.5 ALS TestAlarm LED D6 indicates ambient light intensity level. The following tests were performed.

Table 21. Ambient Light Status

AMBIENT LIGHT EXPECTED LIGHT ALARM LED (D6)STATUS

OBSERVED LIGHT ALARM LED (D6)STATUS

Bright OFF OFFDim (below 100 lux) ON ON

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8.6 Remote Temperature Sensor TestAn environment chamber with the capability to program temperature is used to perform this test. TheTMP451EVM is placed inside the environment chamber. The following temperatures were set and thetemperature alarm LED indication was tested.

Table 22. Remote Temperature Sensor Status

SET TEMPERATURE (°C) EXPECTED TEMPERATURE ALARMLED (D3) STATUS

OBSERVED TEMP ALARM LED (D3)STATUS

25 OFF OFF51 ON ON

8.7 AC Input Voltage — Overvoltage TestThe overvoltage alarm LED D2 indicates the overvoltage level. The following tests were performed.

Table 23. Overvoltage Test

VOLTAGE INPUT (V) EXPECTED OVER VOLTAGE ALARMLED (D2) STATUS

OBSERVED OVER VOLTAGE ALARMLED (D2) STATUS

230 OFF OFF255 (> 110% of 230 V) ON ON

8.8 Summary of Test Results

Table 24. Test Result Summary

SERIAL NUMBER PARAMETERS RESULT1 Power supply testing OK2 AC input measurement accuracy for current, voltage, and powers OK3 LEDs alarm and status indication OK

4 Relay and transistor output testing to indicate switching of capacitor bank(simulated reactive power) OK

5 ALS performance OK6 Remote temperature sensor performance OK7 Scrolling and cyclic display of parameters OK8 AC input voltage — overvoltage test OK

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5V

1.80k

R3

20.0kR25

1.80k

R30

20.0kR26

1.80k

R31

20.0kR27

1.80k

R32

20.0kR28

DIG1 DIG2 DIG3 DIG4

SEG-A

LE_SEG

TP

15

OE_SEG

TP

16

PM_UCA0CLK

TP

18

PM_UCA0SIMO

TP

19

PM_UCA0SOMI

TP

20

SEG-F

SEG-B

SEG-E

SEG-D

SEG-H

SEG-C

SEG-G

GND1

SDI2

CLK3

LE(ED1)4

OUT05

OUT16

OUT27

OUT38

OUT49

OUT510

OUT611

OUT712

OE(ED2)13

SDO14

R-EXT15

VDD16

U4

TLC5916ID

GND1

SDI2

CLK3

LE(ED1)4

OUT05

OUT16

OUT27

OUT38

OUT49

OUT510

OUT611

OUT712

OE(ED2)13

SDO14

R-EXT15

VDD16

U5

TLC5916ID

1µF

C180.1µFC19

DVCC

DGND

1µFC16

0.1µFC17

DVCC

DGND

DGND

DGND

PM_UCA0SOMI

PM_UCA0SIMO


CASCADE

CASCADEPM_UCA0CLK

PM_UCA0CLK

PM_UCA0SIMO

PM_UCA0SOMI

OE_SEG

DGND

DGND

OE_SEG

DIG1DIG2DIG3DIG4

SEG-ASEG-BSEG-CSEG-DSEG-ESEG-FSEG-GSEG-H

5V 5V 5V

K1

K2

K3

K4

K5

A6

K7

A8

A9

K10

K11

A12

D18

LDQ-M286RI

LE_SEG

10kR38

DVCC

1.58k

R34

1.58k

R35

OE_SEGLE_SEG

10kR2

DGND

LE_SEG

OE_SEG

TP

37

TP

38

TP

44

TP

45

TP

46

TP

47

TP48

TP49

TP50

TP51

3

1

2

Q1

MMBT3906

3

1

2

Q2

MMBT3906

3

1

2

Q3

MMBT3906

3

1

2

Q4

MMBT3906

Design Files www.ti.com




9 Design Files

9.1 SchematicsTo download the schematics, see the design files at TIDA-00737.

Figure 38. 7-Segment LED Display + Driver Schematic

http://www.ti.com



GND1

SDI2

CLK3

LE4

OUT05

OUT16

OUT27

OUT38

OUT49

OUT510

OUT611

OUT712

OUT813

OUT914

OUT1015

OUT1116

OUT1217

OUT1318

OUT1419

OUT1520

OE21

SDO22

R-EXT23

VDD24

U3

TLC59025IDBQR

1.80k

R33

RE

D

D1

TLH

R640

5

RE

D

D5

TL

HR

64

05

RE

DD

9

TL

HR

64

05

RE

DD

13

TL

HR

64

05

5V

1µFC21

0.1µFC22

DVCC

DGND

DGND

PM_UCA1CLK

PM_UCA1SIMO

PM_UCA1SOMI

PM_UCA1CLKPM_UCA1SIMOPM_UCA1SOMI

OE

LEOE

DGND

GR

EE

N

D4

TLH

G640

5

GR

EE

ND

8

TL

HG

64

05

GR

EE

ND

12

TL

HG

64

05

GR

EE

N

D1

6

TL

HG

64

05

10kR39

DVCC

DGND10kR4

LE

RE

D

D2

TL

HR

64

05

GR

EE

N

D3

TL

HG

64

05

RE

DD

6

TL

HR

64

05

GR

EE

ND

7

TL

HG

64

05

RE

DD

10

TL

HR

64

05

GR

EE

ND

11

TL

HG

64

05

RE

DD

14

TL

HR

64

05

GR

EE

ND

15

TL

HG

64

05

TP

39

TP

40

TP

41

TP

42

LE

OE

PM_UCA1CLK

PM_UCA1SIMO

TP

43

PM_UCA1SOMI

www.ti.com Design Files




Figure 39. 16 LEDs + Driver Schematic

http://www.ti.com


SW1SW1

SW2SW2

RELAY_1RELAY_2RELAY_3

nENBL

RELAY_1

RELAY_2

RELAY_3

nENBL

IN1

IN2

IN1IN2

1 2

3 4

5 6

7 8

9 10

J3

61301021121

TP14TP21

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

J5

67997-416HLF

DGND

PM_UCA1SIMOPM_UCA1SIMO

OEOE

PM_UCA0SIMOPM_UCA0SIMO


OE_SEGOE_SEG

LELELE_SEG

LE_SEG

PM_UCA1SOMIPM_UCA0CLK

PM_UCA0CLK

PM_UCA0SOMIPM_UCA0SOMI

PM_UCA1SOMI

RESET_DRV

0.1µF

C3

10µF

C2

DGND

RESET_DRV

PM_UCB0SCLPM_UCB0SCL

PM_UCB0SDAPM_UCB0SDA

DVCC0.1µFC23

12

34

S1

79

14

G-1

-000E

SW1

10.0kR36

DVCC

0.1µFC24

12

34

S2

791

4G

-1-0

00

E

SW2

10.0kR37

DVCC

DGNDDGND

11

22

U2

TPD1E10B09DPYR

11

22

U6

TPD1E10B09DPYR

100

R1

100

R29

VDD1

ADDR2

GND3

SCL4

INT5

SDA6

PAD7

U10

OPT3001DNPR

0.1µF

C25

10kR41

10kR40

10kR24

DGNDDGND

PM_UCB0SCLPM_UCB0SDA

DVCC

DVCC

TP28 TP29

TP

54T

P5

3

TP

52

1

2

J9

ED120/2DS

5V

DGND

TP17

10µF

C20

1µFC14

0.1µFC15

5.6V

D20MMSZ4690T1G

INTERFACE CONNECTOR SWITCHES

AMBIENT LIGHT SENSOR5V INPUT

22µF

C26





Figure 40. Interface Connectors + Ambient Light Sensor Schematic

http://www.ti.com


+12V

OUT1

OUT2

OUT3

1

2

J2

ED120/2DS

1

2

J6

ED120/2DS

1

2

J7

ED120/2DS

15V

D19

MM

SZ

47

02

T1G

IN11

IN22

IN33

IN44

IN55

IN66

IN77

GND8

COM9

OUT710

OUT611

OUT512

OUT413

OUT314

OUT215

OUT116

U1

TPL7407LPW

OUT1

OUT2

OUT3

0.1µFC1

10µFC46

10kR6

10kR5

10kR7

10kR8

10kR11

10kR9

RELAY_1

RELAY_2

RELAY_3

10kR10TP2

DGNDDGND

DGND

RELAY_1

RELAY_2

RELAY_3

5

41

3

K1

G2RL-1A DC12

5

41

3

K2

G2RL-1A DC12

5

41

3

K3

G2RL-1A DC12

+12V

+12V

+12V

TP

3T

P4

TP

5T

P6

1

2

J1

ED120/2DS

DGND

TP12

TP11

TP10

DGND

TP26

TP24

TP22

TP

23

TP

25

TP

27





Figure 41. Relay Output Schematic

http://www.ti.com


INA3

INB4

INC5

IND6

OUTA14

OUTB13

OUTC12

OUTD11

EN10

VCC11

VCC216

GND12

GND29

NC7

GND18

GND215

U8

ISO7340CDWR

0.1µF

C9

DGND

DVCC

0.1µF

C10

5V_ISO

DGND

OUT_1

0.1µF

C5

IN1_ISO

IN2_ISO

nENBL_ISO

+24V_ISO

10kR16

VM1

VCLAMP2

OUT13

OUT24

GND5

OUT36

OUT47

ENBL8

RESET9

IN410

IN311

GND12

IN213

IN114

NC15

FAULT16

PAD17

U7

DRV8803PWPR

0R13

0R14

10kR12

10k

R15

5V_ISO

5V_ISO

5V_ISOGND_iso

GND_iso

GND_iso

nENBLnENBL nENBL_ISO

IN1_ISO

IN2_ISO

IN1

IN2

IN1

IN2

GND_iso

GND_iso

GND_iso

RESET_DRV_ISO

RESET_DRV_ISO

RESET_DRVRESET_DRV

+24V_ISO

TP

7T

P8

OUT_2

0.1µFC4

48V

D22SMBJ48A-13-F

TP

13

0R20

0R21

0R22

0R23

TP33

TP34

TP35

TP36

TP30

TP31

OUT_1

OUT_2

28V

D17

MM

SZ

525

5B

-7-F

1

2

3

4

J8

282834-4

+24V_ISO

GND_iso

OUT_1OUT_2

0.1µFC7

1µFC810µF

C6

GND_iso

OUT1

FB2

4

EN5

IN8

9

GNDEP

U9ATPS7A4101DGNR

NC3

NC6

NC7

U9B

TPS7A4101DGNR

+24V_ISO

10µF

C11

TP1

100kR18

0.01µFC12

2.98kR19

9.76kR17

10µFC13

GND_isoTP9

GND_iso

GND_iso

5.6V

D21MMSZ4690T1G

5V_ISO

TP

32

OUT_1

OUT_2





Figure 42. Transistor Output + Digital Isolator 5 V Schematic

http://www.ti.com






9.2 Bill of MaterialsTo download the bill of materials (BOM), see the design files at TIDA-00737.

9.3 PCB Layout PrintsTo download the layout prints, see the design files at TIDA-00737.

9.4 Altium ProjectTo download the Altium project files, see the design files at TIDA-00737.

9.5 Gerber FilesTo download the Gerber files, see the design files at TIDA-00737.

9.6 Assembly DrawingsTo download the assembly drawings, see the design files at TIDA-00737.

http://www.ti.com







References www.ti.com




10 References

1. Texas Instruments, AC Voltage and Current Transducer With DC Analog Outputs and Digital OutputDrivers, TIDA-00454 Design Guide (TIDUAH1)

2. Texas Instruments, Three-Phase Metrology With Enhanced ESD Protection and Tamper Detection,TIDM-3PHMTR-TAMP-ESD Design Guide (TIDU817)

3. Texas Instruments, WEBENCH® Design Center (http://www.ti.com/webench)

11 Terminology

CT— Current transformer

ALS— Ambient light sensor

PFC— Power factor controller

APFC— Automatic power factor correction

LED— Light emitting diode

NO— Normally open

NC— Normally closed

TSM— Thyristor switching module

12 About the AuthorsPRAHLAD SUPEDA, Systems Engineer at Texas Instruments India, is responsible for developingreference design solutions for Grid Infrastructure within industrial systems. Prahlad brings to this role hisextensive experience in power electronics, EMC, analog, and mixed signal designs. Prahlad earned hisbachelor of instrumentation and control engineering from Gujarat University, India. He can be reached [email protected].

KALLIKUPPA MUNIYAPPA SREENIVASA, is a Systems Architect at Texas Instruments, is responsiblefor developing reference design solutions for the industrial segment. Sreenivasa brings to this role hisexperience in high-speed digital and analog systems design. Sreenivasa earned his bachelor ofelectronics (BE) in electronics and communication engineering (BE-E&C) from VTU, Mysore, India.

AMIT KUMBASI, Systems Architect at Texas Instruments Dallas, is responsible for developing subsystemsolutions for Grid Infrastructure within industrial systems. Amit brings to this role his expertise with definingproducts, business development and board level design using precision analog and mixed-signal devices.He holds a master’s in ECE (Texas Tech) and MBA (University of Arizona). He can be reached at [email protected].

http://www.ti.com


http://www.ti.com/lit/pdf/TIDUAH1

http://www.ti.com/lit/pdf/TIDU817

http://www.ti.com/webench

www.ti.com Revision History



Revision History

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (December 2015) to A Revision ................................................................................................ Page

• Changed from preview page............................................................................................................. 1

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