Call For Papers4th World Congress on Micro and Nano Manufacturing

WCMNM 202123-25 March 2021, Mumbai, India

IIT Bombay

DATES

Paper Submission� 30 September 2020

Review Completion� 30 November 2020

Registration (Starts)� 1 December 2020

Application deadline of studentaward� 7 December 2020

Registration (Early Bird Ends)� 31 January 2021

Registration (Closes)� 15 March 2021

Congress Dates� 23-25 March 2021

REGISTRATION FEES

Early BirdStudents: USD 250Non-Members: USD 425I2M2, 4M, IFMM: USD 375

RegularStudents: USD 300Non-Members: USD 475I2M2, 4M, IFMM: USD 425

On-SiteStudents: USD 350Non-Members: USD 525I2M2, 4M, IFMM: USD 475(Inclusive of taxes and transaction fees)

TOPICS OF INTEREST• Micro fabrication technologies, process chains and process characterization

• Miniaturization of machines and equipment; positioning, motion generation,sensors systems, and control

• Novel product designs, micro-assembly technologies and micro-handling

• Surface engineering and interface nanotechnology

• Process modelling and simulation

• Processing and characterization of smart materials, energy materials, meta-materials and nanomaterials

• Micro and nano additive, subtractive, joining, and hybrid manufacturing tech-nologies

• Micro and desktop factory concepts, systems, components and modules

• On-line monitoring and inspection systems, and smart manufacturing

• Standardization in micro manufacturing and micro factories

• Applications of micro and nano technologies

• Emerging micro manufacturing methods and equipment, including those thatbridge the nano- and macro- worlds

• Biomanufacturing and biomedical devices

PAPER SUBMISSION

Full Paper (Max. 4 pages)Submission is now OPEN� Deadline: 30 September 2020

Submit here: https://www.me.iitb.ac.in/∼wcmnmUse the Conference Template available on the website

PROCEEDINGSAll final papers accepted for presentation will be included in the WCMNM2020 Electronic Proceedings. The authors shall retain the copyright.Selected papers will be considered for publication in Special Issues ofASME Journal of Micro and Nano Manufacturing and Micromachines.

STUDENT AWARDS

50 Student Awards

• Covers Registration Fees• Free shared accommodation at the Venue• Will be based on the reviews and inputs fromthe scientific committee

• Will be notified by 15 December 2020

PAPER REVIEW

To ensure a high-quality Congress all paperswill be reviewed by the congress’ ScientificCommittee under the leadership of the Sci-entific Chairs:Ming Chiyuan Lu½ National Chung Hsing University, Taiwan

Ahmed Elkaseer½ Karlsruhe Institute of Technology, Germany

Tohru Sasaki½ University of Toyama, Japan

COMMITTEE

Congress ChairRamesh Singh½ IIT Bombay, India

Congress Co-ChairsMassimiliano Annoni½ Politecnico di Milano, Italy

Stefan Dimov½ University of Birmingham, UK

Kuniaki Dohda½ Northwestern University, USA

Suhas Joshi½ IIT Bombay, India

Sathyan Subbiah½ IIT Madras, India

Host Committee ChairDeepak Marla½ IIT Bombay, India

Host Committee Co-ChairSohamMujumdar½ IIT Bombay, India

VENUEVictor Menezes Convention CenterIndian Institute of Technology Bombay (IIT Bombay)Powai, Mumbai, India

IIT BOMBAY½ Mumbai, India

Recognised worldwide as a leader in the field of engineering educationand research, the IITB is known for the outstanding calibre of studentsand has graduated more than 42,000 of India’s top engineers and sci-entists over the past five decades. It is regarded as one of the best en-gineering schools in India.The campus is situated in the heart of the city, about 10 km from theInternational Airport.

MumbaiMumbai has many attractions in and around the city for visitors of ev-ery age and type. The major attractions in Mumbai include places likeGateway of India, Haji Ali, Mahalakshmi Temple, EsselWorld, MarineDrive, Chhatrapati Shivaji Terminus, Global Vipassana Pagoda, Juhu andChowpatty Beach.

Nearby Tourist AttractionsThere are a few off the mainland attractions for a 1-day visit like Ele-phanta Caves, Matheran, Western Ghats (listed in UNESCOWorld Her-itage), and numerous forts & beaches.

SCIENTIFIC COMMITTEETatsuhiko Aizawa½ Shibaura Institute of Technology, Japan

Senthil Kumar½ National University of Singapore, Singapore

Lawrence Kulinsky½ University of California, Irvine, USA

Massimiliano Annoni½ Politecnico di Milano, Italy

Antony H.C. Lee½ MIRDC, Taiwan

Dominiek Reynaerts½ KU Leuven, Belgium

Vito Basile½ STIIMA-CNR, Italy

Kuan-Ming Li½ National Taiwan University, Taiwan

Claudia Pagano½ STIIMA-CNR, Italy

Samuel Bigot½ Cardiff University, UK

Yunn-Shiuan Liao½ National Taiwan University, Taiwan

Tohru Sasaki½ University of Toyama, Japan

Giuliano Bissacco½ DTU, Denmark

Chorng Tyan Lin½ Metal Industries R&D Centre, Taiwan

Steffen G. Scholz½ KIT, Germany

Emmanuel Brousseau½ Cardiff University, UK

Ming-Chyuan Lu½ National Chung Hsing University, Taiwan

Albert Shih½ University of Michigan, USA

Evgueni Bordatchev½ NRC, Canada

Marc J. Madou½ University of California, Irvine, USA

Tomomi Shiratori½ University of Toyama, Japan

Sylvie Castagne½ KU Leuven, Belgium

Numpon Mahayotsanun½ Khon Kaen University, Thailand

Ramesh Singh½ IIT Bombay, India

Kai Cheng½ Brunel University, UK

Yasuo Marumo½ Kumamoto University, Japan

Sathyan Subbiah½ IIT Madras, India

Chunhui Chung½ National Cheng Kung University, Taiwan

Paul T. Mativenga½ University of Manchester, UK

Rossella Surace½ STIIMA-CNR, Italy

Dan Dascalu½ IMT-Bucharest, Romania

Takashi Matsumura½ Tokyo Denki University, Japan

Saleh Tanveer½ International Islamic University , Malaysia

Xianghuai Dong½ Shanghai Jiao Tong University, China

Valeria Marrocco½ STIIMA-CNR, Itlay

Hayden Taylor½ University of California, Berkeley, USA

Jian Cao½ Northwestern University, USA

Tobias Müller½ KIT, Germany

Guido Tosello½ DTU, Denmark

Stefan Dimov½ University of Birmingham, UK

Wataru Natsu½ TUAT, Japan

Yao-Yang Tsai½ National Taiwan University, Taiwan

Gianluca D’Urso½ University of Bergamo, Italy

Gracious Ngaile½ North Carolina State University, USA

Joško Valentinčič½ Univerza v Ljubljani, Slovenia

Kornel Ehmann½ Northwestern University, USA

Jun Ni½ University of Michigan, USA

Pierre Vella½ Malta University, Malta

SCIENTIFIC COMMITTEEAhmed Elkaseer½ KIT, Germany

José Ocaña½ UPM, Spain

Thomas Velten½ Fraunhofer IBMT, Germany

Irene Fassi½ STIIMA-CNR, Italy

Burak Ozdoganlar½ Carnegie Mellon University, USA

J.-J. Junz Wang½ National Cheng-Kuang University, Taiwan

Ming-Wang Fu½ Hong Kong Polytechnic University, Hong Kong

Manuela Pacella½ Loughborough University, UK

Shih-Ming Wang½ Chung Yuan Christian University, Taiwan

Tatsuya Funazuka½ University of Toyama, Japan

Paolo Parenti½ Politecnico di Milano, Italy

Gloria J. Wiens½ University of Florida, USA

Yanquan Geng½ Harbin Institute of Technology, China

Simon Park½ University of Calgary, Canada

Zongwei Xu½ Tianjin University, China

Claudiu Giusca½ Cranfield University, UK

Petko Petkov½ University of Portsmouth, UK

Jiwang Yan½ Keio University, Japan

Ping Guo½ Northwestern University, USA

Frank E. Pfefferkorn½ University of Wisconsin, USA

Yongda Yan½ Harbin Institute of Technology, China

Hans Nørgaard Hansen½ DTU, Denmark

Wilhelm Pfleging½ KIT, Germany

André Zimmermann½ Hahn-Schickard, Germany

Tong Hao½ Tsinghua University, Beijing, China

Raphaël Pugin½ CSEM, Switzerland

Jon Lamabrri½ TEKNIKER, Spain

Hiroshi Ito½ Yamagata University, Japan

Yi Qin½ University of Strathclyde, Glasgow, UK

Amal Charles½ KIT, Germany

Buddhika Jayasena½ Nanyang Technological University, Singapore

Jaber Abu Qudeiri½ United Arab Emirate University, UAE

Ramkumar J½ IIT Kanpur, India

Samuel Johnson½ Rensselaer Polytechnic Institute (RPI), USA

Iban Quintana½ IK4-Tekniker, Spain

Deepak Marla½ IIT Bombay, India

Suhas S. Joshi½ IIT Bombay, India

Kamlakar Rajurkar½ University of Nebraska, USA

Marco Sorgato½ Università di Padova, Italy

Martin Byung-Guk Jun½ Purdue University, USA

Mariangela Quarto½ University of Bergamo, Italy

Davide Masato½ University of Massachusetts Lowell, USA

Shiv G. Kapoor½ University of Illinois Urbana Champaign, USA

Lara Rebaioli½ STIIMA-CNR, Italy

Pin-Chuan Chen½ NTUST, Taiwan

Yannis Korkolis½ Ohio State University, USA

Andrew Rees½ Swansea University, UK