11
Calibration of a Piezo-Electric Printhead in the Selective Inhibition Sintering (SIS) Process for Fabrication of High Quality Metallic Parts Payman Torabi*, Matthew Petros*, Behrokh Khoshnevis* *Daniel J. Epstein Department of Industrial and Systems Engineering, Los Angeles, CA 90089 Abstract Selective Inhibition Sintering (SIS) is a disruptive Additive Manufacturing process capable of printing parts from polymers, metals and ceramics. In this paper the application of a commercial piezo-electric printhead in SIS-metal is studied. This replaces the single-nozzle solenoid valve previously used in the process and allows the fabrication of high quality metallic parts due to smaller droplet sizes as well as high resolution printing mechanisms. A Design of Experiments (DoE) approach has been utilized to study the effects of important factors in printing the inhibitor. These factors include: composition of the inhibitor, quality of the print, and amount of fluid deposited for each layer. Based on the results of these experiments, parameters have been identified for the creation of highly accurate three-dimensional parts. Introduction Additive manufacturing Additive manufacturing (AM) processes fabricate physical objects directly from 3D models and other digital data sources through a layer by layer manufacturing process. There are many different processes with different methods for the fabrication of each layer of the part, but all share four common steps: i) The part is first modeled in a CAD software in computer ii) The 3D model is sliced digitally into different layers with specific thicknesses iii) The physical part is built layer by layer in the AM process iv) The part is post-processed to achieve the desired aesthetics and/or mechanical properties Industrial processes are looking for ways to fabricate parts with higher qualities without sacrificing the production speed. With this end in mind, inkjet technologies present a tremendous opportunity to AM processes due to their high resolution and high speed print abilities. Therefore, integrating inkjet printing into a potential process can vastly increase its capabilities. Use of inkjet printheads in AM Inkjet printing involves depositing droplets of ink as small as 10 microns in diameter under precise digital control. There are many different methods for generating and ejecting the droplets out of the print-head nozzles. Most of these methods can be classified into two main categories; continuous inkjet (CIJ) and drop-on-demand (DoD). This classification can be seen in Figure 1. Both methods print liquid through small orifices called nozzles. In CIJ the flow of the liquid is continuous. Conversely, DoD systems are impulsive, meaning small droplets are formed which can be positioned separately as needed [1]. 323

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Page 1: Calibration of a Piezo-Electric Printhead in the Selective Inhibition …utw10945.utweb.utexas.edu/sites/default/files/2014-028... · 2019. 10. 17. · without aff inhibitor is ted

Calibration of a Piezo-Electric Printhead in the Selective Inhibition Sintering (SIS) Process for Fabrication of High Quality Metallic Parts

Payman Torabi*, Matthew Petros*, Behrokh Khoshnevis*

*Daniel J. Epstein Department of Industrial and Systems Engineering, Los Angeles, CA 90089

Abstract Selective Inhibition Sintering (SIS) is a disruptive Additive Manufacturing process capable of printing parts from polymers, metals and ceramics. In this paper the application of a commercial piezo-electric printhead in SIS-metal is studied. This replaces the single-nozzle solenoid valve previously used in the process and allows the fabrication of high quality metallic parts due to smaller droplet sizes as well as high resolution printing mechanisms. A Design of Experiments (DoE) approach has been utilized to study the effects of important factors in printing the inhibitor. These factors include: composition of the inhibitor, quality of the print, and amount of fluid deposited for each layer. Based on the results of these experiments, parameters have been identified for the creation of highly accurate three-dimensional parts.

Introduction

Additive manufacturing Additive manufacturing (AM) processes fabricate physical objects directly from 3D models and other digital data sources through a layer by layer manufacturing process. There are many different processes with different methods for the fabrication of each layer of the part, but all share four common steps:

i) The part is first modeled in a CAD software in computer ii) The 3D model is sliced digitally into different layers with specific thicknesses iii) The physical part is built layer by layer in the AM process iv) The part is post-processed to achieve the desired aesthetics and/or mechanical

properties

Industrial processes are looking for ways to fabricate parts with higher qualities without sacrificing the production speed. With this end in mind, inkjet technologies present a tremendous opportunity to AM processes due to their high resolution and high speed print abilities. Therefore, integrating inkjet printing into a potential process can vastly increase its capabilities.

Use of inkjet printheads in AM Inkjet printing involves depositing droplets of ink as small as 10 microns in diameter under precise digital control. There are many different methods for generating and ejecting the droplets out of the print-head nozzles. Most of these methods can be classified into two main categories; continuous inkjet (CIJ) and drop-on-demand (DoD). This classification can be seen in Figure 1. Both methods print liquid through small orifices called nozzles. In CIJ the flow of the liquid is continuous. Conversely, DoD systems are impulsive, meaning small droplets are formed which can be positioned separately as needed [1].

323

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Inkjet tecpolymersform witinkjet priin manuf

There is Figure 2technologare numeof a DOD

chnologies cs, and chemith appropriainting in mafacturing.

Figure 2: P

also a wide2E demonstrgy to print berous other AD piezoelectr

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324

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SelectivSIS is a nCaliforniprevent sthe buildinhibitor next layeare repeafurnace uthe ones the part. steps are

SIS-mas:

SIS-MeMuch resfor the pimportanresearch

ve Inhibitionovel AM pria [3]. The sintering. Fod tank. An i

is only deper is then sprated until alunder approptreated by tAn analogy summarized

metal has se

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etal Alphasearch has bprocess. Th

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or fabricatingnhibitor solu

posited on thread over thl the layers priate atmosthe inhibitor

would be tod in Figure 3

Figu

everal advan

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a Machine been conductis is evidens of the SIS cond genera

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re 3: Steps for

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upports are ae quality is n

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ation of SI

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mercially ava

he use of a crs y of the partart should beof the printeon of the builthe “sacrific

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at the Univeed regions oof powder ised regions o

ffecting interdeposited ag

art is then be part will bmanually remde a sacrifici

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ailable metal

commercial p

t needs to bee scanned ored parts. Bigld cial mold”,

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ersity of Souof the powds first spreadof the layerrnal regionsgain. These

bulk sinteredbe sintered emoved, reveial mold. Th

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an be

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ogress on of urrent d by

325

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Yoozbashused for and jettinthicknessgeneratioproof-of-

SIS-MeIn order their corruse of a market aprintheadan air bupiezoeleca dropleprintheadpropertiethe calibrmaterials

The Epso[8], was different

hizadeh [6], depositing tng force, ths were relation machine)-concept for

etal Beta Mto print highresponding pDOD high

are commercds. In a thermubble whichctric (PZT) ht by pushin

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Figu

a single Dohe inhibitor

he penetratioively large a and its resthe process

Machine h quality parpenetration resolution i

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rts, having cdepth onto inkjet printhse photo prid, a heated rdroplet of i

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mple parts arand specifica

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hat need to b

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ize of 0.005”k of control r and conseqS-metal alph

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on the layerr this purposle options il or Piezoeleof the ink forher hand, wsqueeze and that makes variances in

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326

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process rWF30 prdedicatedother thre

The SIS-printhead

CalibraThere are(inhibitorinhibitionFor the gUnfortunis fine-tupowder bresolution

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requirementsrinthead hasd to black coee color cart

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s. The calibrs three rowsolor cartridgtridges (Cyan

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ure 5: (a) SIS-

ration of thes of nozzles ges and one n, Magenta a

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e Paramets that play kgs. The fluid, these two tion to occuviscosity of are importa

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scussed in laning 180 noee 60-nozzle

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ade-off betwrefore a serieolution. The surface tensid on the inese solutionscosities we

of the machine

ater sectionsozzles. Two e sections fo

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sition of the it is jettablewith each o

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327

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comparedviscositydetermin

The expestrain, anink and th

Table 1: V

Table 2: V

The averink was 1

Printer As mentiand resolfactors ainhibitor

d to the viscy approximaning the visco

erimental pand a varyinghe chosen in

Viscosity test r

Fre

Viscosity test r

Fre

rage viscosit17.4 cP.

Settings ioned earlierlution of the

along with thfluid into th

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Figu

arameters forg frequency tnhibitor solu

results for mag

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10Hz 12Hz

results for inhi

equency 8Hz

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ty of the inhi

r, Epson WFe prints, andhe number o

he powder, p

original Epng the ink. e inhibitor so

ure 6: AR 2000

r the rheomethat ranged f

ution are show

genta ink

ibitor solution

ibitor solutio

F30 provided the numbeof prints onowder surfa

pson ink. ThFigure 6 s

olutions and

0ex viscosity te

eter were setfrom 1Hz- 3wn respectiv

n

on is 12.2 cP

es different or of nozzles

n each layer ace quality af

e goal was tshows the ethe ink.

est equipment

t at a consta35 Hz. The rvely in Table

V

V

P and the av

options for ts engaged inr determine fter droplet d

to choose thexperimenta

t

ant temperaturesults for the 1 and Tabl

Viscosity 19.3 cP 16.6 cP 16.2 cP

Viscosity 11.7 cP 12.3 cP 12.5 cP

verage visco

the ink dropn the printinthe penetratdeposition, a

he solution wal setup use

ure of 24 oChe original Ele 2.

sity of the E

plet sizes, qung process. Ttion depth oand print spe

with a d for

C, 1% Epson

Epson

uality These of the eed.

328

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Before calibrating the printer settings, the powder layer thickness needed to be adjusted. The metal powder used in this research was a fully alloyed bronze with chemical composition presented in Table 3. The powder particle size has a distribution of 98.7% -325mesh, 1.3% -200/+325mesh as reported by the manufacturer. Thus, the layer thickness cannot theoretically be less than the largest particle size, approximately 80 µm. For calibration of the layer thickness, the current spreading mechanism in the machine was used to spread layers with differing thicknesses. The minimum layer thickness that could be spread consistently was 120 microns. This layer thickness was used in the determining the print settings. It should be noted that the SIS process is applicable to smaller layer thicknesses. The limiting factor in the current study was the particle size.

Table 3: Chemical Composition of the used bronze powder

Copper 90% Tin 10.00% Lead 0.025% Zinc 0.04% Iron 0.058% Phosphorous 0.085%

A design of experiments approach was utilized here to investigate the significant and optimum values of the print parameters. The goal was to choose the best combination of factors that gives a depth of penetration of slightly more than 120 microns, an acceptable surface quality, and a satisfactory print speed. Each DoE consisted of a set of small squares printed on a thick layer of loose powder. Each square was printed with a unique combination of the controllable factors. The factors included: printed color which determines the number of nozzles engaged, print quality which determines the droplet sizes, and number of passes which directly affects the penetration depth as well as the surface quality. Three different levels were considered for each factor. The factors and their corresponding levels can be seen in Table 4.

Table 4: Important factors and their levels used in the DOE

Levels

Factor Description 0 1 2 1 Color Cyan Magenta Both (Blue) 2 # of Passes 4 7 10 3 Print Quality Text/Image Photo Best Photo

The experimental design is shown in Figure7a. Table 5 shows the print factors for the first 5 squares of the experiment. After printing the squares with their assigned factors, they were bulk sintered in the furnace. The inhibited powder in the printed areas was then removed (Figure7b). As can be seen in the figure, the final part consists of small squares with different depths of penetration. By measuring the depth of each square and visually comparing the surface qualities, the settings that give the most penetration depths as well as the best surface qualities were determined. The experiment was repeated a three times to ensure repeatability.

329

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Table 5: F

Square N

1

2

3

4

5

Based on(which eThis resuillustrateprint quaslightly ospeed andifferent machine.

T

Fa

Sp

Su

Pe

Factor combin

No.

n these expequals to an ults in a fass the penetra

alities. As shover 120 mind surface q

print qualit.

able 6: Comp

actors\print q

peed

urface qualit

enetration de

nations for the

Color

Cyan (C)

Blue (B)

Blue (B)

Magenta (M

Cyan (C)

periments, itRGB value

ster printingation depth vown in the fcrons as des

quality are aties. Based

arison of diffe

qualities

ty

epth

Figure 7:(

first 5 square

N

1

1

4

M) 1

4

t was obser of R0, G0,

g process duvs. number ofigure, four psired. To chalso consideon the tabl

erent print qu

Text/Im

High

Low

Low

(a) Experimen

es

No. of Print

10

10

4

10

4

rved that pr, and B255)ue to less pof prints for prints with boose amongered. Table le, photo qu

ualities

mage

ntal design (b)

ts Prin

Pho

Tex

Bes

Bes

Pho

rinting with gives the g

passes requirprinting wit

both colors pg the print q6 summariz

uality is set

Photo

Med

High

High

) The printed

nt Quality

oto (p)

xt/Image (TI

st Photo (BP

st Photo (BP

oto (P)

both colorgreatest deptred for eachth both color

provide a depqualities othezes the comt as the prin

Best P

Low

High

Med

part

)

)

)

s simultaneth of penetrah layer. Figurs under diffpth of penetrer factors su

mparison betnt quality o

Photo

ously ation. ure 8 ferent ration

uch as tween of the

330

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MinimuOnce thefabricateminimum

Figure 9 there areinhibitedsmallest can be pr

The resul

Figure 8: Pen

um feature optimum d in order to

m hole dimen

illustrates te square hold. On the le

gap size. Firinted with th

Fi

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re experimparameters

o test differensions and m

the design ples with dif

eft several lnally, the shhis machine

igure 9: Fabri

easured featu

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ment for the solu

ent features ominimum gap

art fabricatefferent dimeines with dhapes on theunder the de

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ures are dem

rints for both

ution and thof the machip sizes.

ed to test theensions whicdifferent thice right demoefined param

r testing the r

monstrated in

colors with di

he printer wine, such as

e resolution ch show thcknesses areonstrate the mmeters.

resolution of th

n Table 7.

ifferent print

were determthe minimum

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were kness,

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331

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ConcluIn this rea high rethe high experimemanufactbeta mac

Future The futumechanicsurface qshapes an

 

 

 

 

Table 7

FeatGapSquWal

sion esearch an adesolution pie

potentials ents are alsoturing of me

chine.

Researchure researchecal propertiequality of thnd generate l

7: Feature siz

ture p size are Hole Sill Thickness

dditive manuezo-electric pof the SIS

o carried ouetallic parts.

es will be ces of the parhe parts, andlayer slices s

Figure 10: Ba

e measuremen

de s

ufacturing mprinthead. Tprocess in

ut with the mFigure 10 re

concentratedt such as thed developinspecifically

asic shapes fa

nts

Measu330 820 250

machine wasThe develope

the additivemachine to tepresents so

d on the robeir strength a

ng slicing sofor the SIS p

bricated with

urements (m

s designed aned SIS-metae manufactutest and verme basic pa

bustness of and porosityoftware that process.

the SIS-meta

microns)

nd manufactal beta machuring field. rify its capaarts fabricate

the machiney, studying t can handle

al process

tured that uthine demonst

The prelimability in added with SIS-m

e, improvinthe shrinkage complicate

tilizes trates

minary ditive metal

g the e and ed 3d

332

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References

[1] Hutchings, Ian M., and Graham D. Martin, eds. Inkjet technology for digital fabrication. John Wiley & Sons, 2012.

[2] Gibson, Ian, David W. Rosen, and Brent Stucker. Additive manufacturing technologies. New York: Springer, 2010.

[3] Khoshnevis, Behrokh, et al. "SIS–a new SFF method based on powder sintering." Rapid Prototyping Journal 9.1 (2003): 30-36.

[4] Asiabanpour, Bahram, et al. "Advancements in the SIS process." Proceedings from the 14th SFF Symposium, Austin, Texas. 2003.

[5] Behrokh Khoshnevis, Mahdi Yoozbashizadeh, Yong Chen, (2012) "Metallic part fabrication using selective inhibition sintering (SIS)", Rapid Prototyping Journal, Vol. 18 Iss: 2, pp.144 – 153

[6] Yoozbashizadeh, Mahdi. Metallic part fabrication with selective inhibition sintering (SIS) based on microscopic mechanical inhibition. University of Southern California, 2012.

[7] Ink Jet Printers Technical Brief. (2007, May 1). Epson

[8] Epson Micro Piezo Print Head Technology. (2010, January 1). Epson Exceed Your Vision.

[9] Kwan, Joyce G. Design of electronics for a high-resolution, multi-material, and modular 3D printer. Diss. Massachusetts Institute of Technology, 2013.

333