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By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. Design and development of FPGA based PCI Express card 21/01/2011 ASET

By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

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Page 1: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

By

Sunil G. Kulkarni, SO/F,

Pelletron-Linac Facility,

BARC-TIFR.

Design and development of FPGA based PCI

Express card

Page 2: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Industry Standard Bus Throughput Comparison:

1

10

100

1000

10000

100000USB

Ethernet

PC Buses

Sp

ee

d (

Mb

its/S

)

Year

Ethernet

Fast Ethernet

Gigabit Ethernet

USB 1.1

USB 2.0 ISA

EISA/MC

PCI 1.x

PCI 2.x

PCI -X 1.0

PCI Express Gen 1 PCI Express Gen 2

Page 3: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

PCI Express: Evolution of PCI

*PCI transactions are packetized and then serialized

*GEN1 speed @ 2.5Gb/S, GEN2 speed @ 5Gb/S, GEN3 speed @ 8 Gb/S

*LVDS Signalling, point-to-point, 8B/10B encoded

*Full duplex operation

*Lane-wise Scalability

Page 4: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Advantages of PCI Express:

*High Bandwidth

*Software Backward Compatibility

*Layered Architecture

*Next Generation I/O

*I/O Simplification

Page 5: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

High Bandwidth:

Bus Bandwidth (MBytes/s)PCI (32-bit, 33 MHz) 132x1 PCI Express 250x4 PCI Express 1000x16 PCI Express 4000

Page 6: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Dedicated I/O

Page 7: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Backward Compatibility

PCI PnP Model (init, enum, config)

PCI Software/Driver Model

Packet-based Protocol

Data Integrity

Point-to-point, serial, differential…Physical

Data Link

Transaction

S/W

OS Config

No OS Impact

Future speeds and encoding technologies only impact physical layer

Page 8: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

PCI Express layers:

Page 9: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

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Transaction layer Packet (TLP):

Page 10: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Implementation Options:

Whether ASIC or FPGA?

ASIC : Only for one and four lanes.

Example: PLX 8311 (one lane bridge), NI Modules

FPGA : Eight lanes support.

Example : Xilinx Virtex-5 (eight lanes HARD IP)

Selected Method: Xilinx Virtex-5 FPGA

Page 11: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Topology of PCIe System

Page 12: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Virtex-5 FPGA Integrated Endpoint Block for PCI Express

Designs

• x8, x4, x2, or x1 lane width

• RocketIO™ GTP and GTX transceivers implement a fully compliant PHY

• Block RAMs used for buffering

• Up to 6 x 32 bit or 3 x 64 bit base address registers (BARs)

• Up to two virtual channels (VCs)

Page 13: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Endpoint Block Diagram:

Page 14: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Clock Resources:

Page 15: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Clock Frequency Versus Lane Width

Configured Lane Width

core_clk Frequency (MHz)

user_clk Frequency (MHz)

x1 250 62.5, 125, or 250

x2 250 62.5, 125, or 250

x4 250 125 or 250

x8 250 250

Page 16: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Block RAM Interface

*The Transmit (TX), Receive (RX), and Retry buffers are implemented with block RAM.

*Transmit buffer. Buffers transmitted packets. It is divided into separate FIFOs for posted, non-posted, and completion transactions.

*Receive buffer. Buffers received packets. It is divided into separate FIFOs for posted, non-posted, and completion transactions.

*Retry buffer. Holds a copy of each TLP that is currently in the process of being

*transmitted until the information has been received correctly

Page 17: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

LogiCORE™ Endpoint Block Plus Wrapper

*This tool provides a wrapper around the integrated Endpoint block and automatically connects the block RAMs, RocketIO transceivers, and reset and clock modules.

*This is used via GUI where the user can select number of lanes, different clocks, registers and other memory devices.

Page 18: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

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Snapshots:

Page 19: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Snapshots cont..

Page 20: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

PCI Express Interface Card:

Virtex-5 FPGA

SFP Module

PCI Express

Card Edge

Page 21: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

PCB Design:

* PCB has 16 layers with alternate GROUND layers to avoid signal integrity issues.

* All high speed tracks (PCI Express differential signals as well as differential clock signals) are simulated for impedance calculations (100 ohms) .

* Differential pair lengths are matched within +-5 mils.

* Board design is carried out using cadence tools and board simulations using Hyper lynx from mentor graphics.

Page 22: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Major Design issues:

* Higher pin counts of FPGA means higher number of PCB layers and hence higher fabrication costs.

* FPGA with built-in PCI Express blocks are costly.

* PCB design becomes complex and board simulations are required.

* Due to above constraints , a thorough cost versus functionality audit is needed.

Page 23: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Applications:

* To design data acquisition system with addition of high speed ADCs/DACs on-board.

* To design PXI Express based modular instruments or data acquisition modules.

* To develop high speed peer-to-peer data transfer links via Fiber-optic cables.

* To process or display video applications where bandwidth requirement is very high.

* To design multiple FPGA board for DSP operations and transferring data to PC.

Page 24: By Sunil G. Kulkarni, SO/F, Pelletron-Linac Facility, BARC-TIFR. 21/01/2011 ASET

21/01/2011 ASET

Acknowledgements:

* Shri Jaydeep Gore.

* Shri P. V. Bhagwat.

* Shri V. V. Tambwekar.

* Dr. R. K. Shyamasundar.