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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

    1/18

    STD-BSI

    D D

    ENV 583-b-ENGL 2 0 0 0

    L b 2 4 b b 9 0859070 3 b 3 =

    DRAFT FOR DEVELOPMENT

    Non-destructive

    testing Ultrasonic

    examination

    Part

    6:

    Time-of-flight diffraction

    technique

    as a

    method

    for

    detection and

    sizing

    of

    discontinuities

    ICs 19.100

    DD ENV

    583-6:2000

    NO COPYING

    WITHOUT

    BSI PERM ISSION EXCEPT

    AS

    PERMIITED BY COPYBIGHT

    LAW

    opyright European Committee for Standardizationovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

    2/18

    S T D m B S I

    D D E N V 5ö3-6-ENGL

    2000

    =

    L b 2 4 b b 9 0859073

    2 T T I m

    having been prepared under the

    direction of the Engineering

    Amd.No. Date

    Sector Committee,

    was

    published

    under the authority of the

    Standards Committee and comes

    into effect on 15

    July 2000

    DD ENV 583-6:2000

    Comments

    National

    foreword

    This Draft for Development

    is

    the official English language version of

    ENV 58362000. During the development of ENV 5836, the

    UK

    expressed concern

    about some of its provisions. Particular attention is drawn to the points outlined in

    national annex

    NA.

    Attention is also drawn to the related British Standard

    BS 77061993.

    This publication s not to be regarded as a British Standard.

    The UK participation

    in

    its preparation was entrusted to Technical Committee

    WEW46,

    Non-destructive testing, which has the responsibility to:

    id enquirers to understand the text;

    resent to the responsible European committee any enquiries on the

    onitor related international and European developments and promulgate

    interpretation, or proposals for change, and keep the

    UK

    interests informed

    them in the

    UK

    A

    list

    of organizations represented on

    t s

    committee can be obtained on request to

    its secretary.

    Cross-references

    The British Standards which implement international or European publications

    referred to in

    t s

    document may be found

    in

    the BSI Standards Catalogue under the

    section entitled ?International Standards Correspondence Index?,or by using the

    ?Find? acility of the BSI Standards Electronic Catalogue.

    Summary of pages

    This

    document comprises

    a

    front cover, an inside front cover, the ENV title page,

    pages

    2 to 15

    and a back cover.

    The BSI copyright notice displayed in

    thi s

    document indicates when the document

    was last issued.

    O BSI 07-2000

    ISBN O 580 34871 7

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

    3/18

    ~

    ~

    ~

    STD-BSI D D ENV

    583-b-ENGL 2 0 0 0 =

    1 b 2 4 b b 9 0 8 5 7 0 7 2 1 3 b

    =

    EUROPEAN PRJESTANDAEI;D

    ENV 583-6

    PRENoRMEEuR0PEE E

    EUROPAISCHE vomom January

    2ooo

    ICs

    19.100

    Engush

    version

    Nondestructive

    testi ng ltrasonic

    exambtion

    Part

    6 'Iirne-of-flq$t dZ&action technique as a method

    for

    detection

    and sizing

    of discontinuities

    Essais non destructifs ontrôle Ultsasonore

    Partie 6:Technique de difiiwtion du temps de vol

    utilisée comme méthode de détection et de

    dimensionnement des discontinuités

    zerstörungsfeie

    Prufung

    ltraschaiiprufung

    Teil6 Beugungsla.ufzei@chnik, ein Technik zum

    Aunuiden und

    Ausmessen

    von Jnhomogenitäkn

    This

    European &standard (ENV)

    was

    approved by CEN on 21May1997 as

    a

    prospective standard for provisional application.

    The period

    of validity of ths

    ENV

    is

    limited initially to

    three

    years. After

    two

    years

    the members

    of

    CEN

    will

    be requested to submit their comments, particularly on

    the question whether the ENV can be converted

    into

    a

    European Standard.

    CEN members are required to announce the existence of

    t s

    ENV in the same way

    as for an EN and

    to

    make the ENV available promptly at

    national

    level in an

    appropriate form. It

    is

    permissible

    to

    keep conflicting national

    standards in

    force

    (in parallel to the ENV)

    untü

    the

    f i n l

    decision about the possible conversion of the

    ENV into an EN is reached.

    CEN members are the national standards bodies

    of Austria,

    Belgium, Czech

    Republic, Denmark,

    Finiand,

    France,

    Gennany,

    Greece, Iceland, Ireland, Italy,

    Luxembourg, Netherlands, Norway,

    Portugai,

    Spain, Sweden, Switzerland and

    United Kingdom.

    CEN

    European Committee for Standardization

    Comité Européen de Normalisation

    Europäisches Komitee

    fur

    Normung

    Central Secretariat:

    rue

    de

    Stassart

    36,

    B-1060 Brussels

    O

    2000 CEN

    All

    rights

    of

    exploitation

    in any

    form and by

    any means

    reserved worldwide for CEN

    national

    Members.

    Ref.

    No.

    ENV

    583-6:2000

    E

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

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    STDmBSI

    D D ENV 583-6-ENGL 2 0 0 0 b 2 1 i b b 9 0 8 5 9 0 7 3 0 7 2

    W

    Page 2

    ENV

    583 6:2000

    Foreword

    This European Prestandard has been prepared by

    Technical Committee CENEC 138, Nondestructive

    testing, the Secretariat of which is held by AFNOR.

    According to the CENKENELEC Internal Regulations,

    the national standards organizations of the following

    countries are bound to announce t s European

    Prestandard Austria, Belgium, Czech Republic,

    Denmark, Finland, fiance, Germany, Greece, Iceland,

    Ireland, Itaìy, Luxembourg, Netherlands, Norway,

    Portugal, Spain, Sweden, Switzerland and the United

    Kingdom.

    EN

    583,

    Non-destructive testing ltrasonic

    examination

    consists of the

    following

    parts:

    EN

    583-1,

    Non-destructive testing ltrasonic

    examination art : Generalprinciples.

    EN 583-2, Non-destructive testing ltrasonic

    examination art 2:Sensitivity and range

    setting.

    EN

    583-3,

    Non-destructive testing ltrasonic

    examination art 3: P a m i s s i o n technique.

    EN 583-4, Non-destructive testing ltrasonic

    examination art 4: Examinat ion

    for

    discontinuities

    perpendicular to

    the surface.

    EN

    583-5,

    Non-destructive testing ltrasonic

    examination art

    5:

    C h a r a c M a t i o n and

    sizing

    of

    discontinuities.

    ENV 583-6, Non-destructive testing ltrasonic

    examination art 6: 'Pime-offlight dìff mc tion

    techniqw?as a method for detection and sizing of

    discontinuities.

    Contents

    Foreword

    1

    Scope

    2 Normative references

    3 Definitions and symbols

    4 General

    4.1

    Principle of the technique

    4.2 Requirements for surface condition

    4.3

    Materials and process type

    5 Qualification

    of

    personnel

    6

    Equipment requirements

    6.1

    Ultrasonic equipment and display

    6.2 Uiîrasonic probes

    6.3

    Scanning mechanisms

    7 Equipment Set-up procedures

    7.1 General

    7.2

    7.3 Time window setting

    7.4

    Sensitivity setting

    7.5

    Scan resolution setting

    7.6 Setting of scanning speed

    7.7

    Checking system performance

    8

    Interpretation and analysis of data

    8.1

    Basic analysis of discontinuities

    8.2 Detailed analysis of discontinuities

    9 Detection and sizing in complex

    geometries

    10 Limitations of the technique

    10.1

    Precision and resolution

    10.2 Dead zones

    11

    TOFD examination without data

    12

    Examination procedure

    13 Examination report

    Annex A (normative) Reference blocks

    and couplant

    Probe choice and probe separation

    recording

    Page

    2

    3

    3

    3

    4

    4

    4

    6

    6

    6

    6

    6

    8

    8

    8

    9

    9

    9

    9

    9

    9

    10

    10

    11

    12

    12

    12

    13

    13

    13

    13

    14

    O

    BSI

    07 2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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    STD-BSI D D ENV 5ô3-b-ENGL 2000 L h 2 4 b b 9 0859074 TO9

    Page 3

    ENV

    583422000

    1 scope

    This European hestandard defines the general

    principles for the application of the Timeof-flight

    diffracton ('ï0FD) technique for both detection and

    sizing

    of discontinuities in low alloyed carbon steel

    components. It could

    also

    be used for other

    types

    of

    materials,

    provided the application of the TOFD

    technique is performed with necessary consideration of

    geomeixy, acoustical properties of the materialsand the

    sensitivity of the examination

    Although it is applicable, in general terms,

    to

    discontinuities in materials and applications covered by

    EN 583-1, it contallis references to the application on

    welds.

    This approach has been chosen for reasons of

    clarity as o the ultmsonic probe positions and

    directions of scanning.

    Unless otherwise specified in the referencing

    documents, the minimum requirements of ths

    hestandard are applicable.

    Unless explicitly stated otherwise, thi s hestandard is

    applicable

    to

    the

    following

    product classes as defined

    in EN 583-2

    lass 1,without restrictions;

    lasses 2 and 3, restrictions will apply as stated in

    clause 9.

    The inspection

    of

    products of classes

    4

    and

    5 wiil

    require special procedures. These are addressed in

    clause

    9

    as

    well.

    2 Normative references

    This European

    hestandard

    incorporates by dated or

    undated reference, provisions from other publications.

    These normative references are cited at the

    appropriate places in the text and the publications are

    listed hereafter. For dated references, subsequent

    amendments to or revisions of any of these

    publications apply to thi s European Fhstandard only

    when incorporated in it by amendment

    or

    revision. For

    undated references the latest edition of the publication

    referred to applies.

    EN

    473,

    Qud jfication and certjfic atio n of

    NDT

    EN 583-1,Non-destructive testing ltrasonic

    examination art :

    G M

    rinciples.

    EN 583-2, Non-destructive testing ltrasonic

    examination art 2:S m s i t iv i t ~ nd range sett ing.

    EN 126681,Ultrasonic exa min ation

    Characterization and verification of ultrasonic

    examina tion equipment art : Instruments.

    EN 126682,Ultrasonic exa min ation

    Characterization and verification of ultrasmic

    examination equipment art 2:

    h b e s .

    EN 126683, Ultrasonic exam inatio n

    chamcterization and v df ic at io n of ul trasonic

    examin ation equipment art 3: C o mb in ed

    equipment.

    personnel

    eneml

    pr inÆìpb .

    O

    BSI 07-2000

    3

    Definitions and symbols

    OFD

    ïimeof-flight diffmdion.

    h

    Y

    Y

    hz

    d

    öd

    Ddw

    c

    &

    R

    t

    At

    z

    Dds

    öt

    td

    tP

    t

    S

    6s

    W

    dead zone

    back wall

    dead zone

    A - s c ~ ~

    k a n

    n o n - p d e l

    parallel scan

    scan

    coordinate parallel

    to

    the scanning

    surface, and parallel to a

    predetermined reference line.

    In

    case

    of weld inspection this reference line

    should coincide with the weld. The

    origin

    of the axes may be defined

    as

    best suits the specimen under

    exanunah'on (see Figure 1);

    imperfection length;

    coordinate parallel to the scanning

    surface, perpendicular

    to

    the

    predetermined reference line

    (*e

    Figure

    1);

    error in

    lateral

    position;

    coordinate perpendicular to the

    scanning surface (see Figure i);

    imperfection height;

    depth of a imperfection tip below the

    scanning surface;

    error in depth;

    scanning-surface dead zone;

    backwail dead zone;

    sound velocity;

    error in sound velocity;

    spatial resolution;

    timeof-flight from the transmitter to

    the receiver;

    heof-flight difference between the

    lateral

    wave and a second uitrasonic

    signai;

    error in ümeof-flight;

    time-of-fight

    at

    depth d;

    length (in time) of the acoustical pulse

    up to

    an ampiitude

    of

    10

    %

    of the

    maximum;

    time-of-flight of the backwall echo;

    half the distance between the index

    poinîs of

    two ultrasonic probes;

    error in

    half

    the probe separation;

    wall thickness;

    zone where indications may be

    obscured due to the presence of

    signais of geometrical origin;

    extra dead zone where signais may be

    obscured by the presence of the back

    wall echo;

    display of the ultrasonic signal

    amplitude

    as

    a

    function of time;

    display of the time-of-flight of the

    ultrasonic signal

    as

    a function of

    probe displacement;

    scan perpendicular

    to

    the ultrasonic

    beam direction (see

    Figure 4);

    scan parallel

    to

    the uitrasonic beam

    direction (see Figure

    5).

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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    STDmBSI D D ENV SB3-b-ENGL 2000 = L b 2 4 b b 9

    0 8 5 9 0 7 5 945

    Page

    4

    ENV 583-6:2000

    Figure 1 oordinate definition

    4 General

    4.1 Principle of the technique

    The TOW technique relies on the interaction of

    ultmsonic waves with the tips of discontinuities. This

    interaction results in the emission of diffracted waves

    over a large

    m r

    range. Detection of the diffracted

    waves makes it possible to establish the presence of

    the imperfection. The time-of-fìight of the recorded

    signals

    is

    a measure for the height of the imperfection,

    thus enabhg sizing of the defect. The dimension

    of

    the imperfection is always determined kom the

    timeof-flight of the difîracted signals. The signal

    amplitude is not used in size estimation.

    The basic conñguration for the

    TOFD

    technique

    consists of

    a

    separate ultrasonic trammitter and

    receiver (see Figure 2). Wide-angie beam compression

    wave probes are normally used since the diffraction

    of

    ulhasonic waves is only weakly dependent on the

    orientation of the imperfection tip. This enables the

    inspection

    of

    a certain volume

    in

    one scan. However,

    restrictions apply to the size of the volume that can be

    inspected during

    a

    single scan (see

    7.2 .

    The

    first

    signal to arrive at the receiver after emission

    of an acoustic pulse is

    usually

    the lateral wave which

    travels

    just

    beneath the upper surface of the test

    specimen.

    In the absence of discontinuities the second signai to

    arrive at the receiver is the backwail echo.

    These

    two

    signals axe normally used for reference

    purposes. If mode conversion is neglected, any signals

    generated by discontinuities in the material should

    arrive between the lateral wave and the backwail echo,

    since the latter

    two

    correspond, respectively, to the

    shortest and longest paths between fmnsmitter and

    receiver. For similar reasons the diffracted signal

    generated

    at

    the upper tip of

    an

    imperfection wili

    arrive before the signal generated at the lower tip of

    the imperfection.A typical pattern of indications

    (A-scan)

    is

    shown

    in

    Figure 3. The height of the

    imperfection can be deduced from the difference in

    time-of-fiight of the two diffracted signals (see 8.1.6).

    Note

    the phase reversal between the lateral wave and

    the backwall echo, and between echoes of the upper

    and lower tip of the imperfection.

    Where access to both surfaces of the specimen

    is

    possible and flaws are distributed throughout the

    specimen thickness, scanning from both surfaceswili

    improve the overall precision, particularly in regard to

    flaws near the surfaces.

    4.2

    Requirements

    for

    surface condition and

    couplant

    Care

    shaü

    be taken that the surface condition meets

    at

    least the requirements stated in EN

    583-1.

    Since the

    diffracted signals may be weak, the degradation of

    signal quality due to poor surface condition

    wili

    have a

    severe impact on inspection reliabiiiw.

    O BSI 07-2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

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    STD.BS1

    D D

    ENV 583-b-ENGL 2 0 0 0

    R

    1 b 2 4 b b 9 08570'7b 8B1

    Page

    5

    ENV 683-6:2000

    Legend

    1 Itansmitter

    2

    Receiver

    a Laterai wave

    b Uppertip

    c included angle

    d Imperfection

    e Lowertip

    f

    Backwallecho

    Figure 2 asic TOFD configuration

    Legend

    X Amplitude

    Y Time

    a

    Laterai

    wave

    a

    -b

    C

    d

    b

    Uppertip

    c

    Backwallecho

    d Lowertip

    Figure

    3

    chematic A-scan

    of

    embedded imperfection

    O BSI

    07-2000

    opyright European Committee for Standardization

    ovided by IHS under license with CENNot for Resaleo reproduction or networking permitted without license from IHS

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    ~

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    STD-BSI D D E N V

    583-6 -ENGL

    2ODü L b 2 4 6 6 9 Oô59077

    718 m

    Page 6

    ENV 583-6.2000

    Different coupling media can be used, but their type

    shall be compatible with the materials to be examined.

    Examples are: water, possibly containing an agent

    (wetting, anti-freeze, corrosion inhibitor), contact paste,

    oil,

    grease, cellulose paste containing water, etc.

    The characteristics of the coupling medium shall

    remain constant throughout the examination. It shall

    be suitable for the temperature range in which it

    wili

    be used.

    4.3

    Materials and process type

    Due

    to

    the relatively low signal amplitudes that are

    used in the TOFD technique, the method can be

    applied routinely on materials with relatively low levels

    of attenuation and scatter for ultrasonic waves. In

    general, application on unalloyed and low alloyed

    carbon steel components and welds

    is

    possible, but

    also

    on fine grained austenitic steels and duminium.

    Coarse-grained materials and materials with significant

    anisotropy however, such

    as

    cast iron, austenitic weld

    materials and high-nickel alloys,

    will

    require additional

    validation and additional data-processing.

    By mutual agreement,

    a

    representative test specimen

    with artificial and/or natural discontinuities can be

    used to confirm inspectability. Remember that

    ciifhction characteristics of artificial defects can differ

    significantly from those of real defects.

    5 Qualification

    of

    personnel

    Personnel performing examinations with the TOFD

    technique shall,

    as a minimum,

    be qualified in

    accordance with

    EN

    473, and shall have received

    additional

    traini ng

    and examhation on the use of the

    TOFD technique on the product classes to be tested, as

    specified in a written practice.

    6

    Equipment requirements

    6.1 Ultrasonic equipment and display

    Ultrasonic equipment used for the TOFD technique

    shall,

    as

    a minimum,

    comply with the requirements of

    EN 126681, EN 126682 and EN 126683.

    In

    addition, the following requirements

    shall

    apply:

    he receiver bandwidth

    shall,as

    a minimum,

    range between 0,5 and

    2

    times the nominal probe

    frequency at

    -6 dB,

    nless specific materials and

    product classes require

    a

    larger bandwidth.

    Appropriate band filters can be used;

    he transmitting pulse can either be unipolar

    or

    bipolar. The rise time

    shall

    not exceed

    0,25

    times the

    period corresponding

    to

    the nominal probe

    frequency;

    he unrectified

    signals

    shall be digitized with

    a

    sampling rate of

    at

    least four times the nominal

    probe frequency;

    or general applications combinations of

    ultrasonic equipment and scanning mechanisms

    (see

    6.3)

    shall be capable of acquiring and digitizing

    signals with

    a

    rate of at least one A-scan per

    1

    mm

    scan length. Data acquisition and scanning

    mechanism movement

    shall

    be synchronized for th s

    purpose;

    o select an appropriate portion of the time base

    within which A-scans are digitized,

    a

    window with

    programmable position and length

    shall

    be present.

    Window

    start

    shall be programmable between

    O and 200

    ps

    from the transmitting pulse, window

    length

    shaii

    be programmable between 5 and 100

    p.

    In thi s

    way, the appropriate

    signals

    (iaterai or

    creeping wave, backwall signal, one or more mode

    converted signals

    as

    described in

    4.1

    can be

    selected to be digitized and displayed;

    igitized A-scans should be displayed in

    amplitude related grey or single-colour levels, plotted

    dacen tly to form

    a

    Escan. See Figures

    4

    and

    5

    for

    typical B-scans of non-parallel and parallel scans

    respectively. The number of grey or single-colour

    scales should at least be

    64;

    or archiving purposes, the equipment shaii be

    capable of storing all A-scans or B-scans

    (as

    appropriate) on a magnetic or optical storage

    medium such as hard disk, floppy disk, tape or

    optical disk For reporting purposes, it shall be

    capable of making hard copies of

    A-scans

    or B-scans

    (as

    appropriate);

    he equipment should be capable of performing

    signal averaging.

    In

    order to achieve the relatively

    high

    gain settings

    required for typical TOFD-signals,

    a

    preamplifier may

    be used, which should have a

    flat

    response over the

    frequency range of interest.

    This

    preamplifier

    shall

    be

    positioned as close

    as

    possible to the receiving probe.

    Additional requirements regarding features for basic

    and advanced analysis of discontinuities are described

    in clause

    8.

    6.2 Ultrasonic probes

    Ulkasonic probes used for the TOFD technique s h d

    comply with

    at

    least the following requirements:

    umber of probes:

    2

    (transmitter and receiver);

    ype: any suitable probe (see

    7.2 ;

    ave mode: usually compression wave; the use of

    shear wave probes

    is

    more complex but may be

    agreed upon in special cases;

    oth probes shall have the same centre frequency

    within

    a

    tolerance of 320 /o; frequency: for detajls on

    probe frequency selection, see 7.2;

    he pulse length of both the lateral wave and the

    backwall echo shall not exceed two cycles,

    measured at 10

    %

    of the peak amplitude;

    ulse repetition rate shall be set such that no

    interference occurs between acoustical signals

    caused by successive transmission puises.

    O BSI 07-2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

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    X

    t

    /

    eference line

    Transmitter

    Direction o f Directiono f

    probe probe

    displacernent displacement

    ( X direction) X direction)

    t

    t

    /

    \

    la

    I

    - Y

    Transit time

    (through wall extent)

    Lateral

    wave

    irection o f probe

    displacement (

    X

    direction)

    \

    Receiver

    Backwall

    reflection

    I

    Figure

    4

    on-parallel scan, with the typical direction of probe displacement

    shown on the left, and

    the

    corresponding B-scan shown on the right

    O BSI 07-2000

    ~

    opyright European Committee for Standardizationovided by IHS under license with CEN

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    X

    t

    /

    eference line

    Transit time

    (throug h wall extent)

    Lateral

    wave

    displacement

    \

    Trancm tte r Receiver

    Backwall

    re f ect

    o

    n

    irection of p robe

    X direction)

    Figure

    6

    arallel scan, with the typical direction of probe displacement shown

    on the le ft, and the corresponding B-scan shown on the right

    6.3

    Scanning mechanisms

    Scanning mechanisms shall be used to maintain

    a

    constant àistance and aiignment between the index

    points of the

    two

    probes.

    An

    additional function of scanner mechanisms

    is

    to

    provide the ultrasonic equipment with probe position

    information, in order

    to

    enable the generation of

    position-related B-scans. Information on probe position

    can be provided by means of e.g. incremental magnetic

    or optical encoders, or potentiometers.

    Scanning mechanisms

    in TOFD

    can either be motor or

    manually driven. They shall be guided by means of

    a

    suitable guiding mechanism (steel band, belt, automatic

    track foliowing systems,

    guiding

    wheels etc.).

    Guiding accuracy with respect to the centre

    of a

    reference h e e.g. the centre h e of

    a

    weld) should be

    kept

    within

    a

    tolerance

    of

    I10

    % of the probe index

    point separation.

    7

    Equipment Set-up procedures

    7.1 General

    Probe selection and probe configuration are important

    equipment Set-up parameters. They largely detemine

    the overall a~curacy,he

    signal-to-noise

    ratio and the

    coverage

    of

    the region

    of

    interest of the

    TOFD

    technique.

    The Set-up procedure described in

    this

    subclause

    intends to ensure:

    ufficient system gain

    and

    signal-to-noise ratio

    to

    detect the diffracted signals of interest;

    cceptable resolution and adequate coverage of

    the region of interest;

    fficient use

    of

    the dynamic range of the system.

    O BSI 07-2000

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    Centre Crystals ize Nominal

    probe angle

    Wa ll

    mm MHZ

    mm

    thickness frequency

    c

    10 10 15

    2-6 50

    70

    10to

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    8

    Interpretation and

    analysis

    of data

    8.1

    Basic analysis of discontinuities

    8.1.1

    General

    Reporting or acceptance criteria shall be agreed upon

    by contracting parties prior to inspection.

    Discontinuities detected by TOFD

    shall

    be

    characterized by at least:

    heir position in the object x- nd y-

    coordinates);

    heir length

    Ax);

    heir depth and height (z, hz);

    heir type, limited to: “top-surface breaking”,

    “bottom-surfacebreaking” or “embedded.

    8.1.2

    Characterization of discontinuities

    In order to characterize an imperfection, the phase of

    the tip-diffraction associated with thi s imperfection

    shall be determined

    signal with same apparent phase as the lateral

    wave shall be considered

    to

    originate from the lower

    tip of an imperfection;

    signal with the same apparent phase

    as

    the

    backwall echo shall be considered to originate either

    from an upper tip of an imperfection or from an

    imperfection with no measurable height.

    If the signal-tc-noise ratio is insufñcient to aUow the

    phase of the signal to be detected, these identifications

    are invalid.

    8.1.2.1

    Top-surface breaking impe@ection

    An indication consisting of a lower-tip diffraction with

    an associated weakening (check for couplant loss) or

    interruption of the lateral wave shall be considered a

    top-surïace breaking imperfection.

    Sometimes a slight

    shift

    of the laterai wave towards

    longer timeof-flight can be observed.

    8.1.2.2 Bottom-surfàce breaking discontinuities

    An

    indication consisting of an upper-tip diffraction

    with either an associated shift of the backwall echo

    towards longer time-of-fight or an interruption (check

    for couplant loss) of the backwall echo shall be

    considereda bottom-surface breaking imperfection.

    8.1.2.3 Embedded discontinuities

    An

    indication consisting of both

    an

    upper-tip and a

    lower-tip diffraction shall be considered an embedded

    imperfection.

    An indication consisting solely of an apparent upper-tip

    diffraction with no associated indications in either

    lateral wave or backwall echo shall be considered an

    imperfection with no height. Care must be taken

    however, because the indications in the lateral wave or

    backwall echo can be very weak, resulting in

    misinterpretation of the imperfection.

    In

    case of doubt

    appropriate action

    shall

    be taken, either by performing

    multiple TOF’D-scans (see 8.2.1 or by applying other

    techniques.

    In case further characterization is required, reference

    shaii be made to 8.2.

    In case of doubt about the interpretation of a defect,

    the worst possible interpretation

    shall

    be retained,

    until

    the interpretation can be verified

    8.1.3

    Estimation of imperfection position

    In general it

    will

    be sufficiently accurate to assume

    that

    the imperfection

    is

    located on the intersection

    between the x,z-plane mid-way between the two

    ultrasonic probes and the y,z-plane through the

    centre-lines of the two probes.

    The time-of-fight of an indication generated by an

    imperfection can

    also

    be used to estimate its position.

    The surface of constant timeof-flight theoretically is an

    ellipsoid centred around the index points of the

    ultrasonic probes. The exact determination of the

    position of the diffractor can only be achieved by

    at

    least two scans (see8.2.1 .

    If

    a more accurate assessment of the position andíor

    orientation of the imperfection is required, multiple

    TOFD-scans (non-parailel andíor parallel) will have to

    be performed.

    8.1.4

    Estimation of imperfection length

    The estimation of the length of an imperfection shall

    be made directly from the probe displacement of a

    non-parallel scan.

    In

    common with l l ultrasonic

    techniques thi s record is iikely to be elongated because

    of the f inte width of the dtrasonic beam, resulting in

    conservative estimates of the imperfection length.

    Indications with an apparent length of less than

    1,5

    times the size of the probe crystal used are too

    small to be sized, in length, by normal TOFD

    procedures, but see 8.2.2 for additional algorithms to

    determine imperfection length.

    8.1.5

    Estimation of imperfection depth and height

    It is assumed that the dtrasonic energy enters and

    leaves the specimen at the index points of the probes.

    In case the imperfection is assumed to be mid-way

    between the two probes (see 8.1.3 , the depth of the

    defect is given by:

    where

    d

    =

    [ (Ct)2

    $1”

    (1)

    c is the sound velocity;

    t is the time-of-fight of the t i m t i o n ignal;

    d

    is

    the depth of the tip of the imperfection;

    S

    is

    half the distance between the index points of

    the ultrasonic probes.

    The time-of-fight of the ultrasonic signai inside the

    ultrasonic probes shall be subíracted before the

    calculation of the depth is made. Failure to do

    so

    will

    result in grave errors in the calculated depth.

    O

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    To avoid the errors th t may arise from probe delay

    estimation the depth d shall be calculated, if possible,

    from the timeof-flight differences,

    At,

    between the

    lateral wave and the di fhcted pulse. Hence:

    8.1.6.1 Top-suflme brealc.ng discontinuities

    The height of a top-surface breaking imperfection

    is

    determined by the distance between the top surface

    and the depth of the lower-tip diffrctction signal.

    8.1.5.2 Bottom-surJime breaking disco ntinuitie s

    The height of a bottom-suface b r e w mperfection

    is

    determined by the difference in depth between the

    upper-tip diffraction and the bottom surface.

    8.1.5.3

    Embedded impe@ection

    The height of an embedded imperfection

    is

    determined

    by the difference in depth between the upper-tip and

    lower-tip difñ-action.

    8.2 Detailed analysis of discontinuities

    Detailed imperfection analysis can be performed on

    discontinuties already detected by basic TOFD-scam.

    In addition, the application

    of

    other NDT-techniques

    can be considered in order

    to

    arrive at a more detailed

    characterization

    The motivation for detailed imperfection anal ysi s can

    be:

    d =

    [(CAt)z

    +

    kAtS]'

    (2)

    ore accurate assessment of imperfection length,

    depth and height;

    ssessment of imperfection orientation;

    etailed estimation of imperfection type.

    The detailed imperfection analysis nvolves performing

    additional scans with different probe angles,

    frequencies and/or probe separation. Also parallel

    scans can be performed. The detailed

    analysis

    can

    also

    involve the application of additional computer

    algorithmsto analyse the data

    8.2.1Additional scans

    8.2.1.1 Scans wit h

    lower

    testfreq.uency

    Scans with lower test frequencies can be performed

    if

    the signal-to-noise ratio is too low to permit detailed

    imperfection

    analysis

    even with considerable averaging.

    In general

    thi s will

    be at the expense of an increased

    dead zone, and a decreased resolution.

    The equipment Set-up parameters shall be optimized

    (see clauses 6 and

    7).

    8.2.1.2 Scans with

    higher

    testfrequency

    Scans

    with higher test frequencies can be performed to

    obtain increased resolution, increased s i z i i accuracy

    and

    a

    reduced dead zone, at the expense of

    a

    reduced

    signal-tenoise

    ratio,

    due to increased

    grain

    noise. The

    equipment Set-up parameters

    shall

    be optimized

    (see clauses 6 and 7).

    8.2.1.3 Scans

    with

    redwed probe ang k

    Scans with

    a

    reduced probe angle and an associated

    decreased probe separation

    can

    be performed

    to

    obtain increased resolution, increased s i z i i accura~y

    and a reduced dead zone

    at

    the expense of a smalier

    honified volume

    of

    the specimen. The equipment

    Set-up parameters shall be optimized (see clauses 6

    and 7).

    8.2.1.4 Scans

    with

    d i f f m t

    probe

    offset

    In

    order

    to

    obtain the lateral position of the

    imperfection (ydirection) and/or its orientation, either

    a parailel scan or an additional non-parailel scan with

    different probe distance (offset) can be made. The

    equipment Set-up parameters sh llbe optimized

    (see clauses

    6

    and

    7).

    It

    shall

    be checked that the phase relationship of the

    signals

    observed in these scans is identical to the

    phase relationship in the initial scans.

    The surface of constant timeof-fight for

    a

    tipdifhction

    signal

    (locus curve)

    is

    an ellipsoid. If we

    consider oniy the

    y z-phne

    through the probes, the

    ellipse describing a constant path

    is

    expressed by:

    From

    this

    expression it

    is

    clear th t

    a

    different offset

    of the diffractor

    h m

    he cenire plane between the

    probes (ie.

    a

    different y-value)

    will resuit

    in

    a

    different

    time-of-flight of the t ipdi fhct ion. Therefore the

    apparent depth of the imperfection-tip

    will

    change in

    scans with different probe positions.

    The lateral position of

    a

    imperfection-tip (y-direction)

    can be determined directly from

    a

    parallel scan by the

    position of minimum apparent depth. A number of

    adjacent parallel scans at different x-coordinates

    will

    be required

    to

    find the position of real

    minimal

    depth

    of the imperfection.

    Once the position and depth of both tips of an

    imperfection are known its orientation

    can

    be

    determined from the axis throughthe

    two

    imperfection-tips.

    in

    principle, two non-parallel scam, offset with respect

    to each other,

    also

    suffice for

    the

    accurate

    determination of imperfection depth, length and

    orientaiion, provided that the overlap of the insonified

    volumes

    is

    sufficient.

    However, the determination of the position of the

    imperfection-tip íkom two non-parallel scans

    is

    less

    straightforward and

    will

    involve the

    drawing

    of locus

    curves by additional so h a r e , (see

    8.2.2).

    Additional parallel scam

    may also

    be used

    to

    detect

    near=surface defects, th t are poorly resolved because

    of the proximity of the lateral wave or the backwall

    echo. The apparent depth of the defect

    will

    change in

    each scan and

    thi s

    will

    enable resolving it from the

    lateral

    wave or the backwall echo.

    ct = [d2+

    S

    + [ d 2+

    S

    +

    (3)

    O ES1 07-2000

    opyright European Committee for Standardization

    rovided by IHS under license with CEN

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    8.2.2Additional algorithms

    Computer algorithms can be useful in analysing the

    data recorded in a TOFDscan.

    For example:

    urve fitting overlays for accurate determination

    of imperfection length (see also 8.1.4);

    ubtraction of lateral wave andíor backwall echo

    in order to detect indications otherwise obscured

    due to interference (see 10.2). If the surface

    is

    rough

    or pitted, the effectiveness of thi s technique should

    be demonstrated in trials;

    inearization algorithms to linearize complete

    &scans to accurately determine the depth or the

    height of the imperfection;

    odelling algorithms enabling the drawing of

    locus curves and the analysis of mode converted

    signais. This can provide additional insight in the

    position, depth and orientation of the imperfection.

    Detailed understanding of the physics and modelling

    software are required

    The algorithms to be used in analysing the data shall

    be agreed upon by the contracting parties prior

    to

    inspection.

    9 Detection and sizing in complex

    geometries

    For class

    2

    objects, if the surface between the two

    probes

    is

    flat, no further restrictions apply.

    Otherwise for class 2 objects and for all class

    3

    objects,

    a modified inspection and interpretation procedure will

    be required to allow for the curvature of the object.

    For class4 nd

    5

    objects special data processing

    techniques and operating conditions will apply.

    Computer algorithmswill be useful in analysing the

    data in these cases.

    To

    confirm imperfection detection capabilities, the use

    of representative test specimens

    with natural flaws or

    artificial defects is strongly recommended in these

    cases as well.

    10

    Limitations of the

    technique

    This

    clause considers the limitations of the

    TOFD

    technique and

    is

    e q d y applicable to basic

    TOFD-detectionas

    well

    as

    to TOFD-sizing. The

    limts

    of achievable accuracy under normal conditions are

    defined and the influence of dead zones, which can

    affect detectabihty, is discussed. It is important to

    realize that the overall reliability of the technique is

    determined by a large number of contributing factors

    and the overall error will not be less than the

    combined errors discussed in thi s clause.

    Defects which are highiy tilted or skewed, such as

    transverse cracks in non-parallel scans, are likely to be

    more àifñcuit to detect and it is recommended that

    specific demonstrations

    of

    capability are carried out in

    such cases. In addition flaws which are not serious,

    such as point defects, have some ability to mimic more

    serious flaws such

    as

    cracks. Once again it is

    recommended that the abiìity to distinguish

    smal l

    cracks

    is

    demonstrated, where appropriate.

    Demonstrations of capability can be specific to the

    inspection or can be referred back to other

    documented data.

    10.1 Precision and resolution

    A distinction should be made between precision and

    resolution. Precision is the degree to which the

    position of a reflector or diffractor can be determined,

    whereas resolution defines the degree to which closely

    spaced W actors c m be distinguished from one

    another.

    The precision of a TOFD-measurementwiii be

    influenced by timing errors, errors in the sound

    velocity, probe separation errors and errors in the

    assumed lateral position of an indication. Under

    normaì circumstances the overall precision will be

    dominated by the latter,

    10.1.1Errors in the lateral position

    As stated in 8.1.3, the lateral position of an indication

    is n o d y ssumed to be mid-way between the two

    probes.

    In

    reality the indication will be located on

    an

    eìlipse [equation

    (3)].

    The error in depth

    (Sd)

    due

    to

    the error in lateral position (Sy) can be calculated by:

    6d=(c2 t2 -@)

    ( 6 ~ 2 / ~ 2 t 2 ) l [ ( 0 , 2 5 - 6 ~ 2 / ~ 2 t 2 ) ] ' / 2

    4)

    In principle, the lower edge of the acoustic beams

    determines

    6y.

    If no reliable information on the lower

    beam edge is available,

    Sy

    =

    S shall be used

    10.1.2 riming errors

    The limit of precision in the depth of an indication,

    due to

    t i mng

    errors (Et), can be estimated from:

    where

    ôd = c6t[d2

    +

    $1 1 2 d

    (5)

    6d

    is the error in

    d.

    The timing error can be reduced by using a shorter

    pulse

    andíor a higher frequency.

    10.1.3Errors in sound velocity

    The limit of precision in the estimate of the depth of

    an indication, due to errors in the sound velocity k) ,

    is given by:

    This error

    is

    reduced if the probe separation

    is

    reduced. Independent calibration

    of

    the velocity by

    measurement of the delay of the backwali echo, with a

    known wall thickness, greatly reduces ths error.

    d

    =

    6c[d2+9

    S(d2

    + $) I I Cd

    (6)

    O

    ES1 07-2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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    10.1.4 Errors in probe separation

    Errors in the distance between the index points (ss)

    will result in errors in depth-measurement. The error in

    depth 6d can be calculated by:

    o

    It should be noted th t errors in probe separation can

    arise from both measurement errors in the distance

    between the probes,

    as

    well

    as

    errors in the index

    point caiibration.

    When the probe separation is smaller than twice the

    specimen thickness, the index point can no longer be

    considered a

    fixed point, but it becomes a function of

    depth In this case, if accurate sizing is required, the

    depth measurement shallbe caiibrakd with the aid of

    a

    representative test specimen.

    10.1.6 Spatial resolution

    The spatial resolution (R)s

    a

    function of depth and

    can be calculated by:

    where

    6d

    = w ( d 2 +@) s] l d

    R

    =

    [C2 td

    + $J2/4 1  

    d

    8)

    tp is the length of the acoustic pulse and t is the

    timeof-flightat depth d .

    The resolution increases with increasing depth, and

    can be improved by decreasing the probe separation

    or

    the acoustic pulse length.

    10.2 Dead

    zones

    Near the scanning surface there

    is a

    dead zone (D&)

    due to presence of the lateral wave. Interference

    between the lateral wave and the imperfection

    indication can obscure the indication. The depth of the

    socalied scanning-swface dead zone

    is

    given by:

    (9)

    Near the backwall there is also a dead zone ( w) due

    to presence of the backwall+xho. The depth of the

    backwali dead zone

    is

    given by:

    where

    D = [ c2 t2 1 4

    +

    scfpp

    DdW= [$(& +

    fp 2

    /

    4

    1 - w

    (10)

    is

    the time-of-flight of the backwall echo and

    W

    is

    the wall thickness.

    11 T O D examination without data

    recording

    In

    manualiy applied TOFD, where interpretation is

    obtained directly from the A-scan, unrectifíed display

    of the signais shall be

    used

    This

    form of the

    TOF'D

    technique should

    only

    be used

    on product classes with simple geometries, and the

    equipment Set-up shali comply with the requirements

    of 7.2,7.3 and 7.4.

    In general it

    will

    not be possible to perîorm the

    detailed investigation of any response

    th t is

    possible

    with recorded data It

    will

    be more difficult to detect

    phase changes, slight changes in transit m e nd

    defect echoes close

    to

    the lateral wave.

    12 Examination procedure

    TOFD examination procedures shall comply with the

    requirements given in EN 583-1,

    as

    applicable.

    Specific conditions of application and use of the

    TOFD

    technique

    will

    depend on the type of product

    examined

    and

    specific requirements, and

    will

    be

    described in written procedures.

    13 Examination report

    TOFD examination reports shall comply with the

    requirements given in EN

    583-1, as applicable.

    In addition,

    TOF D

    examination reports shall contain

    the following information:

    description of the test specimen or reference

    block, if a test specimen or reference block has been

    used;

    robe type, frequency, angle(s), separation and

    position with respect to a reference line (e.g. weld

    centre line);

    lotted images (hard copies) of at least those

    locations where relevant indications have been

    detected. Details of equipment

    settings

    and method

    of setting test sensitivity.

    Furthermore,

    al

    raw data recorded during the

    examination, stored on a magnetic or optical storage

    medium such ashard disk, floppy disk, tape or optical

    disk shall be kept for later reference.

    Both dead zones can be reduced by decreasing the

    probe separation or by using probes

    with shorter puise

    length.

    O BSI 07-2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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    STD-BSI D D E N V 583-b-ENGL 2000

    W

    l i b 2 4 b b 9 0859085

    874

    Page 14

    ENV

    583-6:2000

    O

    Annex

    A

    (normative)

    Reference blocks

    The purpose of reference blocks

    is

    to set the system

    sensitivity correctly and to establish sufficient

    volumetric coverage.

    The

    minimm

    requirements of a reference block are

    the following:

    a) it should be made of similar materiai as the object

    under inspection (e.g. with regard to sound velocity,

    grain noise and surface condition);

    b) the wall thickness

    shall

    be equal

    to

    or greater

    than the nominal wall thickness of the object under

    inspection;

    c) the width and the length of the scanning surface

    shall be adequate for probe movement over the

    reference diffractom.

    .--a

    Measurements

    shall

    be based on the diffracted signals

    from reference diffractom These are either:

    a) machined notches, open to the scanning surface

    of the reference block or

    b) side drilled holes with a diameter of at least twice

    the wavelength of the nominal frequency of the

    probes utilized in the inspection. The holes should

    be cut to the scanning surface in order to block the

    direct reflection í3om the top of the hole,

    see F'igure A.1.

    Reference diffractors should be present at

    approximately 10 %,

    25

    %, 50 %, 75 % and 90 % of the

    nominal thickness of the object under inspection.

    O

    O

    Legend

    a Sawcut

    b

    Side drilled hole

    Figure A . l Sketch of a reference block, using side drilled holes, connected

    to the scanning surface by means of a scan cut, as reference reflectors

    O BSI 07-2000

    opyright European Committee for Standardizationrovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

    17/18

    STD-BSI D D

    ENV 5 8 3 b E N G L

    2000

    W L b 2 4 b b 9

    0857086

    720

    DD ENV 583-6:2000

    National annex

    NA

    (informative)

    UK comments

    on

    the

    text

    of

    ENV583-6

    NA.l General

    During the development of ENV 583-6, the UK

    expressed concern about some

    of

    its provisions.

    Particular attention

    is

    drawn to the points outlined

    in

    NA.2 to NA.9. In

    addition, throughout the text the

    t e m defect , fiaw , discontinuity and crack are

    used usually, but not always,

    to

    describe imperfections,

    and there

    is

    concern

    that thi s

    might cause confusion

    NA.2 Coordinate definitions

    (see Figures 1 , 4 and 5)

    The labelling of the axis in Figures

    1,4

    and5

    is

    not

    consistent.

    Within

    the

    UK

    it

    is

    common practice

    to

    adopt the convention shown in

    Fïgure 1,

    with the

    addition of

    defuied

    +Y/-Y

    directions.

    This

    would

    avoid, for example, possible ambiguity for parallel

    scans

    carried out transverse

    to

    the weld directions.

    NA.3 Personnel qualincation

    (see clause

    6)

    Clause

    6

    should permit the use of suitable schemes

    other thanEN 473; thi s should be by agreement

    between the contracting parties.

    NA 4 Probe selection

    (see Tables

    1

    and

    2)

    The recommended crystal sizes and probe angie ranges

    in Tables and

    2

    do not fuily represent current

    practice within the

    UK.

    For

    example, for wall

    thicknesses from

    10

    mm up to

    30mm,

    crystal sizes

    of

    10mm

    and nominal probe angies of

    45

    have been

    used.

    NA.6 Probe separation

    (see

    7.2.2)

    For

    guidance, when

    inspecting

    the

    fulì test

    piece

    thickness with

    a

    single pair

    of

    probes, the probe beam

    centses should intersect at

    half

    to

    two-thirds

    of the

    thickness.

    NA.6 Sensitivity setting

    (see

    7.4)

    ENV

    583 6

    attempts

    to

    detail

    a

    specific method

    for

    sensitivity setting based on

    mated grain

    noise.

    BS

    T706

    includes alternative methods which UK

    industry may wish to retain. If the sensitivity setting

    is

    based on material

    grain

    noise, it

    is

    essential that it

    is

    checked

    as

    described in annex

    A

    NA.7 Checking system performance

    (see

    7.7)

    The

    use of

    calibration blocks

    is a

    suitable method for

    pre- and post-inspection sensitivity checks, in which

    case the maximum allowable Merence in signai

    amplitude should be agreed between the contracthg

    parties.

    NA.8 Characterization

    of

    discontinuities

    (see

    8.1.2)

    It should be noted th t parallel scans may be needed

    in addition

    to

    non-paraiiel

    scans

    for characterization of

    certain types of indication, e.g. for embedded

    discontinuities.

    NA.9 Errors in the lateral position

    There

    is

    an error in equation

    (4),

    which should read.

    NA.10 Reference blocks

    (see annex

    A)

    It is important to establish the percentage

    full

    screen

    height to which the

    maximum

    amplitude response

    from the reference

    diffractors

    should be set. This is

    important to ensure repeatability between different

    inspections.

    It should be noted

    that

    ENV

    5û3-6

    permits the use of

    blocks with either machined notches or side-drilled

    holes.

    Figure

    A l is

    not drawn

    to

    scale and attention

    is

    drawn

    to

    the fact

    that

    the horizontal separation between holes

    will be much larger

    than

    shown and it

    may

    be more

    practical

    to

    produce multiple blocks.

    6d

    =

    (c2t2

    4s2) 63

    c2t2 / (1 42 2CY)

    O

    BSI

    07-2000

    15

    opyright European Committee for Standardization

    rovided by IHS under license with CEN

    Not for Resaleo reproduction or networking permitted without license from IHS

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  • 8/19/2019 BS DD ENV 583-6 Ed.2000

    18/18

    DD ENV

    583 62000

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