Broadcom AFEM-8100 System-in- · Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections. The report contains a complete analysis of the

©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 SeriesSP20522 – RF report by Stéphane ELISABETH

Laboratory Analysis by Nicolas RADUFE & Guillaume CHEVALIERMarch 2020 – SAMPLE

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of ContentsOverview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Broadcom

o Company Major Customers in 2019

o Filter technologies

o Apple iPhone 11 Pro Max Teardown

Market Analysis 17

o RF Components Market Forecast

o Supply Chain

Physical Analysis 22

o Summary of the Physical Analysis 23

o Module 25

Package Views & Dimensions

Package Opening:

Power amplifier, Switch, RF IC, Filters

Bloc Diagram Estimation

Package Cross-Section:

Overview, Dimensions, Substrate, Internal & External Shielding

Summary of physical data

o Power Amplifier, Switch, LNA 62

Die Views & Dimensions

Die Cross-Section

Die Process Characteristics

o Filter Dies 99

High/Mid band repartition

Dies Views, Dimensions & Opening

Dies Overview: Cap, Substrate, Cells

Die Cross-Section:

Sealing Frame, Anchor, TSV, Holes, FBAR Structure

Die Physical Data Summary

Comparison with previous Mid/High band FEM from Broadcom 134

o Package Evolution with Technology Enabler

o Package Cross-Section

o Package Integration Evolution:

Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost

o Supplier Evolution: Power Amplifier, Switches

Manufacturing Process 146

o Global Overview

o Switch & matching RFIC Die Front-End Process

o Filter Die Front-End Process & Fabrication Unit

o Filter Die Front-End Process Flow

o Packaging Process & Fabrication Unit

o Packaging Process Flow

Cost Analysis 178

o Summary of the cost analysis

o Yields Explanation & Hypotheses

o PA die

Die Front-End Cost

Die front Cost per process steps

Die Wafer & Die Cost

o Switch & LNA Die

Die Front-End Cost


o Filter die

Die Front-End Cost

Die front Cost per process steps


o Packaged Component

Packaging Cost

Packaging Cost per process steps

Component Cost

Filter & Front-End Module Estimated Price 216

Feedbacks 220

Company services 222




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical & Cost Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

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About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Broadcom AFEM-8100.

In 2019, Broadcom remains the only supplier of the same module for several versions of the latest Apple iPhone series: 11, 11Pro and 11 Pro Max. Like its predecessor, the AFEM-8092, the AFEM-8100 is a Mid- and High-Band (MB and HB) Long TermEvolution (LTE) FEM. It features several dies, including Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film BulkAcoustic Resonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-Scale Packaging (CSP)technology with Through-Silicon Vias (TSVs) enabling electrical contacts and scandium doped aluminum nitride (AlScN) as apiezoelectric material.

For this special version, Broadcom has innovated in several directions. Thanks to the double side BGA technology, thepackaging is denser and the critical master switches and Low-Noise Amplifier dies have been completely isolated from thefiltering part. In the EMI Shielding, a new integration method has allowed a huge reduction in the packaging cost. Finally, withthe latest GaAs PA technology using Flip-Chip configuration, the PA area has shrunk by 30 %. Thanks to all these innovations,Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections.

The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, the LNA, the filtering dies, andthe internal/external EMI shielding. The report also features a cost analysis and a price estimation of the component. Finally, italso integrates a comparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X and the AFEM-8092, MB/HB LTEFEM in the Apple iPhone Xs.




Overview / Introduction

Company Profile & Supply Chain o Broadcomo Major Customer in 2019o Filter technologyo Apple iPhone 11 Pro Max

Teardown

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Broadcom Major Customers in 2019Extracted from RF Front-End Module Comparison 2020 – Vol 1.





Company Profile & Supply Chain o Broadcomo Major Customer in 2019o Filter technologyo Apple iPhone 11 Pro Max

Teardown

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

Apple iPhone 11 Pro Max Teardown






Market Analysis

Physical Analysis o Summaryo Package Assembly

o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section

o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis



Cost Analysis


Feedbacks

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About System Plus

Summary of the Physical Analysis






Market Analysis






Cost Analysis


Feedbacks

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Package Overview

Package Opened View – Optical View©2020 by System Plus Consulting

• Xxxxxx

• PA: X

• BAW Filter: XX

• Switch: X






Market Analysis






Cost Analysis


Feedbacks

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Package Overview

Package Bottom View – Optical View©2020 by System Plus Consulting

• XXX

• PMIC: X

• LNA: X

• Switch: X






Market Analysis






Cost Analysis


Feedbacks

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Component Overview – Bloc Diagram (Est.) – Rx






Market Analysis






Cost Analysis


Feedbacks

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Package Overview – Package Shielding






Market Analysis






Cost Analysis


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Package Cross-Section

Package Cross-Section – Optical View©2020 by System Plus Consulting

• System in Package thickness: XXX µm

PCB substrate thickness: XXX µm

Filter dies height (without balls): XXX µm Package molding thickness: XXX µm






Market Analysis






Cost Analysis


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Die Cross-Section – (Est.) HEMT Structure






Market Analysis






Cost Analysis


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Die Cross-Section

• The switch dies are using SOI substrate with XX nm ofmono-cristal silicon on a XXX nm oxide BOX.






Market Analysis






Cost Analysis


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Filter – Die Overview






Market Analysis






Cost Analysis


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Filter – Die Overview – High-Band – SubstrateBecause of the size of the filter, we didn’t get all thesubstrate intact with the resonator.






Market Analysis






Cost Analysis


Feedbacks

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Filter – Die Cross-Section






Market Analysis

Physical Analysis

Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply


Cost Analysis


Feedbacks

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Package View & Dimensions – Evolution






Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Package Opening – Die Number

AFEM-8072 AFEM-8092 AFEM-8100

Total Number of Dies XX +X % XX -X % XX

Power Amplifier X (XX mm²) -X % X (XX mm²) -X % X (XX mm²)

BAW Filter X (XX mm²) +X % X (XX mm²) +X % X (XX mm²)

Switch X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)

RFIC X (XX mm²) +X % X (XX mm²) -X % X (XX mm²)

LNA X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)






Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Package Opening – EMI Shielding

AFEM-8072 AFEM-8092 AFEM-8100

Total Number of Shield Wire XX -X % XX +XX % XX

Number of Bridge Wire bond XX -X % XX +XX % XX

Number of Surrounded Wire Bond XX +X % XX -XX % -

Number of Fence Wire bond - - - +XX % XX

High-Band Area Low-Band Area Isolation






Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

Package Opening – Die Cost






Market Analysis

Physical Analysis


Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &

Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow

Cost Analysis


Feedbacks

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About System Plus

Global Overview






Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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About System Plus

Power Amplfier Front-End Process






Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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Power Amplifier – Process Flow (2/8)






Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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Filter Front-End Process






Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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Filters – Process Flow (1/8)






Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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Packaging Process






Market Analysis

Physical Analysis




Cost Analysis


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Packaging Process Flow (1/4)






Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost


Feedbacks

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PA Front-End Cost per process steps (1/3)






Market Analysis

Physical Analysis






Feedbacks

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Switch #1 Front-End Cost






Market Analysis

Physical Analysis






Feedbacks

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LNA Wafer & Die Cost






Market Analysis

Physical Analysis






Feedbacks

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Filter Front-End Cost






Market Analysis

Physical Analysis






Feedbacks

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Component Cost






Market Analysis

Physical Analysis



Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price

Feedbacks

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Complete System Price

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series






Components Summary

Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis

Feedbacks

Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF• 5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019• Advanced RF System-in-Package for Cellphones 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF & PACKAGING• RF Front-End Module Comparison 2020 – Volume 1• Qorvo QM76018 RFFEM in the Apple iPhone Xr• Broadcom AFEM-8092 System-in-Package in the Apple

iPhone Xs/Xr Series• Qualcomm’s First 5G mmWave Chipset: SDX50M and

QTM052• Murata Incredible High Performance (IHP) SAW Filter



https://www.i-micronews.com/products/advanced-rf-sip-for-cellphones-2019/


https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/




https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-1/

https://www.systemplus.fr/reverse-costing-reports/qorvo-qm76018-rffem-in-the-apple-iphone-xr/

https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8092-system-in-package-in-the-apple-iphone-xsxr-series/

https://www.systemplus.fr/reverse-costing-reports/qualcomms-first-5g-mmwave-chipset-sdx50m-and-qtm052/

https://www.systemplus.fr/reverse-costing-reports/murata-incredible-high-performance-ihp-saw-filter/




C o m p a nyS E RVI CES




Teardown Analysis

Cost Analysis

Manufacturer Price Analysis

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings




Teardown Analysis

Cost Analysis

Manufacturer Price Analysis

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

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KOREAYOLE

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

mailto:[email protected]





Documents

Broadcom AFEM-8100 System-in- · Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections. The report contains a complete analysis of the