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    Chapter 6: Boiling and

    Condensation

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    ObjectivesWhen you finish studying this chapter, you should be able to:

    Differentiate between evaporation and boiling, and gainfamiliarity with different types of boiling,

    Develop a good understanding of the boiling curve, andthe different boiling regimes corresponding to differentregions of the boiling curve,

    Calculate the heat flux and its critical value associatedwith nucleate boiling, and examine the methods of boilingheat transfer enhancement,

    Calculate the heat flux associated with condensationhorizontal plates, vertical and horizontal cylinders

    Examine dropwise condensation and understand theuncertainties associated with them.

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    Specific convection processes

    Boiling

    Condensation Change of phase

    Boiling : Liquid to vapour phase

    Condensation : Vapour to liquid phase

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    Modes of Heat transfer finds wide application

    1. Cooling of nuclear reactors and rocket motors

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    3. Steam power plant

    4. Refrigeration and air conditioning

    5.Refineries and sugar mill

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    1. Heat transfer to and fro occurs without affecting the fluid

    temperature

    2. The heat transfer coefficients and rates due to latent heat

    associated with phase change are generally much higher

    compared to normal convection process(without phase change)

    Boiling and condensation entails following

    features

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    3. High rate of heat transfer is developed with small

    temp diff

    Phenomena of boiling and condensation is

    complex due to following being significant

    1.Latent heat2.Surface tension

    3. Surface characteristics and other properties of two phase systems

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    General ConsiderationsGeneral Considerations

    Boiling is associated with transformation of liquid to vapor at a solid/liquid

    interface due to convection heat transfer from the solid.

    Agitation of fluid by vapor bubbles provides for large convection coefficients

    and hence large heat fluxes at low-to-moderate surface-to-fluid temperature

    differences.

    Special form ofNewtons law of cooling:

    s s sat eq h T T h T

    saturation temperatur of liquidesatT

    excess temperaturee s sat T T T

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    Boiling Heat Transfer Evaporationoccurs at

    the liquid

    vapor

    interface when the

    vapor pressure is less

    than the saturationpressure of

    the liquid

    at a given

    temperature.

    Boilingoccurs at the

    solid

    liquid interface

    when a liquid is brought

    into contact with a

    surface maintained at atemperature sufficiently

    above the saturation

    temperature of the

    liquid

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    Classification of boilingPool Boiling

    Boiling is called pool

    boilingin the absenceof bulk fluid flow.

    Any motion of the fluidis due to natural

    convection currents andthe motion of thebubbles

    under the

    influence

    of buoyancy.

    Flow Boiling

    Boiling is called flowboilingin the presenceof bulk fluid flow.

    In flow boiling, the fluid

    is forced to move in aheated pipe

    or over a

    surface by

    externalmeans such

    as a pump.

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    Subcooled Boiling

    When the temperature

    of the main body of the

    liquid is below thesaturation temperature.

    Saturated Boiling

    When the temperature

    of the liquid is equal to

    the saturationtemperature.

    Classification of boiling

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    Boiling Regimes

    Pool boiling with liquid vapor interface

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    Pool BoilingBoiling takes different forms, depending on the Texcess=Ts-Tsat

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    The Boiling Curve

    1 atm

    Free convection boilingfluid motion isdetermined principally by free

    convection

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    The Boiling CurveNucleate boilingfrom A to B, we have isolated bubbles at

    nucleation sites which separate from the surface, leads to

    considerable fluid mixing.

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    The Boiling CurveNucleate boilingfrom B to C, vapor escapes as jets or columns which merge

    into slugs of vapor. Point P is an inflection point which corresponds to the

    maximum heat transfer coefficient. Beyond P, q increases since Te grow faster

    than h decreases. Beyond C, h decreases faster than Te increases, so q goes down.

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    The Boiling Curve

    Critical heat fluxconsiderable formation of

    vapor making it difficult to continuously wet the

    surface.

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    Transition boilingbubble formation is so rapid that a vapor film or

    blanket forms on the surface. Thermal conductivity of vapor is much less

    than liquid, so q decreases.

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    Film boilingPoint D is Leidenfrost point, heat flux is a

    minimum, surface is completely covered by a vapor

    blanket. Heat transfer from surface occurs by conduction

    and radiation through the vapor.

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    Experiment was first conducted with nichrome wire which burned out at

    critical heat flux. Subsequent experiments with platinum wire allowed

    cooling from Pt E to D. Beyond D (going to left), Te jumped to curve

    on left.

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    Natural Convection (to PointA on the

    Boiling Curve)

    Bubbles do not form on the heating surface until the

    liquid is heated a few degrees above the saturation

    temperature (about 2 to 6C for water)

    the liquid is slightly superheatedin thiscase (metastable state).

    The fluid motion in this mode of boiling is governed

    by natural convection currents.

    Heat transfer from the heating surface to the fluid is

    by natural convection.

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    Nucleate Boiling

    The bubbles form at an increasing rate at an

    increasing number of nucleation sites as wemove along the boiling curve toward point C.

    RegionABisolated bubbles.

    RegionBC numerous continuous columnsof vaporin the liquid.

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    Nucleate Boiling

    In regionAB the stirring and agitation caused by theentrainment of the liquid to the heater surface isprimarily responsible for the increased heat transfercoefficient.

    In regionAB the large heat fluxes obtainable in thisregion are caused by the combined effect of liquidentrainment and evaporation.

    After pointB the heat flux increases at a lower rate

    with increasing Texcess, and reaches a maximum atpoint C.

    The heat flux at this point is called the critical (ormaximum)heat flux, and is of prime engineeringimportance.

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    Transition Boiling

    When Texcess is increased past point C, the heat fluxdecreases.

    This is because a large fraction of the heater surface is

    covered by a vapor film, which acts as an insulation.

    In the transition boiling regime, both nucleate and film

    boiling partially occur.

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    Film Boiling Beyond PointDthe heater surface is completely

    covered by a continuous stable vapor film.

    PointD, where the heat flux reaches a minimum is

    called the Leidenfrost point.

    The presence of a vapor film between the heater

    surface and the liquid is responsible for the low heattransfer rates in the film boiling region.

    The heat transfer rate increases with increasing excess

    temperature due to radiation to the liquid.

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    Burnout Phenomenon

    A typical boiling process does not follow the boilingcurve beyond point C.

    When the power applied to the

    heated surface exceeded the

    value at point Ceven slightly,the surface temperature

    increased suddenly to pointE.

    When the power is reducedgradually starting from pointE

    the cooling curve follows Fig. 108 with a sudden

    drop in excess temperature when pointD is reached.

    C

    D

    E

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    Heat Transfer Correlations in Pool

    Boiling

    Boiling regimes differ considerably in their

    character

    different heat transfer relations need

    to be used for different boiling regimes.

    In the natural convection boiling regime heat

    transfer rates can be accurately determined

    using natural convection relations.

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    Heat Transfer Correlations in Pool

    Boiling Nucleate Boiling

    No general theoretical relations for heat transfer in

    the nucleate boiling regime is available.

    Experimental based correlations are used.

    The rate of heat transfer strongly depends on thenature of nucleation and the type and the condition of

    the heated surface.

    A widely used correlation proposed in 1952 byRohsenow:

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    Rohsenows equation:

    1 32

    ,

    , Pr

    p l el v

    s l fg n

    s f fg l

    c Tgq h

    C h

    This was the first and still is the most widely used correlation for nucleate boiling.

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    qs= surface heat flux ,W/m2

    l =Liquid viscosity,kg/ms

    Hfg=Enthalpy of vaporisation, j/kg

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    Rohsenows correlation applies only to clean

    surfaces. When used to estimate heat flux, errors

    can amount to plus/minus 100%.

    However, since Te is proportional to (q)^(1/3), this

    error is reduced by a factor of 3 when the expressionis used to estimate Te from q.

    Since q is proportional to hfg^-2, and hfgdecreases with increasing saturation pressure

    (temperature), the nucleate boiling heat flux will

    increase as the liquid is pressurized.

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    Rohsenows correlation does not predict q max. For this, we must use

    Zubers equation:

    1

    4

    max 2

    l v

    fg v

    v

    gq Ch

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    Heat Transfer Correlations in Pool

    Boiling Nucleate Boiling

    The values in Rohsenow equation can be used for anygeometry since it is found that the rate of heat transferduring nucleate boiling is essentially independent ofthe geometry and orientation of the heated surface.

    The correlation is applicable to clean and relativelysmooth surfaces.

    Error for the heat transfer rate for a given excesstemperature: 100%.

    Error for the excess temperature for a given heattransfer rate for the heat transfer rate and by 30%.

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    Minimum Heat Flux

    Minimum heat flux, which occurs at the Leidenfrostpoint, is of practical interest since it represents thelower limit for the heat flux in the film boiling regime.

    Zuber derived the following expression for theminimum heat flux for a large horizontal plate

    the relation above can be in error by50% or more.

    14

    max 20.09

    l v

    v fg

    l v

    gq h

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    Film Boiling

    The heat flux for film boiling on a horizontal

    cylinderor sphere of diameterDis given by

    At high surface temperatures (typically above 300C), heattransfer across the vapor film by radiation becomes significantand needs to be considered.

    The two mechanisms of heat transfer (radiation and convection)

    adversely affect each other, causing the total heat transfer to beless than their sum.

    Experimental studies confirm that the critical heat flux andheat flux in film boiling are proportional to g1/4.

    143

    0.4v v l v fg pv s sat film film s sat

    v s sat

    gk h C T T q C T T

    D T T

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    Enhancement of Heat Transfer in Pool

    Boiling The rate of heat transfer in the nucleate boiling regime

    strongly depends on the number of active nucleation sites onthe surface, and the rate of bubble formation at each site.

    Therefore, modification that enhances nucleationon theheating surface will also enhance heat transferin nucleateboiling.

    Irregularities on the heating surface, including roughness anddirt, serve as additional nucleation

    sites during boiling.

    The effect ofsurface roughness is

    observed to decay with time.

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    Enhancement of Heat Transfer in Pool

    Boiling

    Surfaces that provide enhanced heat transfer innucleate boilingpermanently are being manufactured

    and are available in the market.

    Heat transfer can be enhanced by a factor of up to 10

    during nucleate boiling, and the

    critical heat flux by a factor of 3.

    Thermoexcel-E

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    Condensation

    Condensation occurs when the temperature of

    a vapor is reduced below its saturation

    temperature.

    Only condensation on solid surfaces is

    considered in this chapter.

    Two forms of condensation:

    Film condensation,

    Dropwise condensation.

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    Film condensation

    The condensate wets thesurface and forms a liquid

    film. The surface is blanketed by

    a liquid film which serves asa resistance to heat transfer.

    Dropwise condensation

    The condensed vapor formsdroplets on the surface.

    The droplets slide downwhen they reach a certainsize.

    No liquid film to resist heat

    transfer. As a result, heat transfer

    rates that are more than 10times larger

    than with film

    condensation

    can be achieved.

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    Film Condensation on a Vertical Plate

    liquid film starts forming at the topof the plate and flows downwardunder the influence of gravity.

    dincreases in the flow directionx

    Heat in the amount hfgis releasedduring condensation and istransferredthrough the film to theplate surface.

    Tsmust be below the saturationtemperature for condensation.

    The temperature of the condensateis Tsat at the interface and decreasesgradually to Tsat the wall.

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    Vertical Plate Flow Regimes

    The dimensionless parametercontrolling the transition betweenregimes is the Reynolds numberdefined as:

    Three prime flow regimes:

    Re

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    Heat Transfer Correlations for Film

    Condensation Vertical wall

    Assumptions:1. Both the plate and the vapor are

    maintained at constant temperatures ofTsand Tsat, respectively, and the temperatureacross the liquid film varies linearly.

    2. Heat transfer across the liquid film is bypure conduction.

    3. The velocity of the vapor is low (or zero)so that it exerts no drag on the condensate(no viscous shear on the liquidvapor

    interface).4. The flow of the condensate islaminar(Re

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    Hydrodynamics

    Netwons second law of motion

    Weight=Viscous shear force +Buoyancy force

    or

    Canceling the plate width band solving for du/dy

    Integrating fromy=0 (u =0) toy (u=u(y))

    l l vdu

    g y bdx bdx g y bdxdy

    d d

    l v

    l

    g ydu

    dy

    d

    2( )

    2

    l v

    l

    g yu y y

    d

    (10-12)

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    0

    ( ) ( ) ( )l lA y

    m x u y dA u y bdy

    d

    (10-13)

    The mass flow rate of the condensate at a locationx is determined from

    Substituting u(y) from Eq. 1012 into Eq. 1013

    whose derivative with respect toxis

    3( )

    3

    l l v

    l

    gbm x

    d

    (10-14)

    2l l v

    l

    gbdm d

    dx dx

    d d

    (10-15)

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    Thermal Considerations

    The rate of heat transfer from the vapor to the plate

    through the liquid film

    sat s fg l

    l sat s

    fg

    T TdQ h dm k bdx

    k b T T dm

    dx h

    d

    d

    (10-16)

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    Equating Eqs. 1015 and 1016 and separating

    the variables give

    Integrating fromx=0 (d=0) tox (d=d(x)), the

    liquid film thickness atx is determined to be

    3 l l sat s

    l l v fg

    k T Td dx

    g h

    d d

    (10-17)

    1 4

    4( )

    l l sat s

    l l v fg

    k T T xx

    g h

    d

    (10-18)

    Si th h t t f th liq id film i m d t b b

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    Since the heat transfer across the liquid film is assumed to be by

    pure conduction, the heat transfer coefficient can be expressed

    throughNewtons law of cooling and Fourier law as

    Substituting d(x) from Eq. 1018, the local heat transfer coefficient

    is determined to be

    The average heat transfer coefficient over the entire plate is

    sat s l x x sat s l xT T kq h T T k hd d (10-19)

    1 43

    4

    l l v fg l

    x

    l sat s

    g h kh

    T T x

    (10-20)

    1 43

    0

    1 40.943

    3

    L l l v fg l

    x x L

    l sat s

    g h kh h dx h

    L T T L

    (10-21)

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    It is observed to underpredict heat transfer

    because it does not take into account the

    effects of the nonlinear temperature profile in

    the liquid film and the cooling of the liquid

    below the saturation temperature.

    Both of these effects can be accounted for by

    replacing hfgby modified h*fg to yield

    1 4* 3

    0

    1 4

    0.9433

    L l l v fg l

    x x L

    l sat s

    g h k

    h h dx h L T T L

    (10-22)

    0

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    Wavy Laminar Flow on Vertical

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    Wavy Laminar Flow on Vertical

    Plates

    The waves at the liquidvapor interface tend to

    increase heat transfer.

    Knowledge is based on experimental studies.

    The increase in heat transfer due to the wave effect is,on average, about 20 percent, but it can exceed 50

    percent.

    Based on his experimental studies, Kutateladze (1963)

    recommended the following relation

    1/3

    , v1.22 2

    Re;

    1.08Re 5.2

    lavg wavy l

    l

    k gh

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    Turbulent Flow on Vertical Plates

    Labuntsov (1957) proposed the following relation

    for the turbulent flow of condensate on vertical

    plates:

    The physical properties of the condensate are to be

    evaluated at the film temperature.

    1/3

    , 20.5 0.75

    Re

    8750 58Pr Re 253

    l

    avg turbulent

    l

    k g

    h

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    Dropwise Condensation

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    Dropwise Condensation

    One of the most effective mechanisms ofheat transfer,and extremely large heat transfer coefficients can beachieved.

    Small droplets grow as a result of continuedcondensation, coalesce into large droplets, and slidedown when they reach a certain size.

    Large heat transfer

    coefficients enable designers

    to achieve a specified heattransfer rate with a smaller

    surface area.

    i d i

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    Dropwise Condensation

    The challenge in dropwise condensation is not to

    achieve it, but rather, to sustain it for prolonged

    periods of time.

    Dropwise condensation has been studiedexperimentally for a number of surfacefluid

    combinations.

    Griffith (1983) recommends these simple

    correlations for dropwise condensation ofsteam oncopper surfaces:

    0 0

    0

    51,104 2044 22 100

    255,310 100

    sat sat

    sat

    T C T C hdropwise

    T C

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