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BGA242: TD242LP Evaluation Board User’s Guide TransDimension Inc. 135 Technology Drive Irvine, CA 92618 http://www.transdimension.com Phone: 949-727-2020 Fax: 949-727-3232 [email protected] [email protected] TDI Document Number: MU4006 Rev. 2.1: July 2005

BGA242: TD242LP Evaluation Board User’s · PDF fileBGA242: TD242LP Evaluation Board User’s Guide TransDimension Inc. 135 Technology Drive ... (Host Controller Driver), HNP

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BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. 135 Technology Drive

Irvine, CA 92618 http://www.transdimension.com

Phone: 949-727-2020 Fax: 949-727-3232

[email protected] [email protected]

TDI Document Number: MU4006

Rev. 2.1: July 2005

TransDimension Inc. BGA242:TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary

THE DEVICE AND ITS DOCUMENTATION ARE PROVIDED “AS IS”. TRANSDIMENSION HEREBY DISCLAIMS ALL WARRANTIES, EXPRESS, STATUTORY AND IMPLIED, APPLICABLE TO THE SOFTWARE AND ITS DOCUMENTATION AND ANY RELATED PRODUCTS, INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT OR FITNESS FOR A PARTICULAR PURPOSE. TRANSDIMENSION ASSUMES NO LIABILITY FOR ANY ACT OR OMISSION OF LICENSEE. IN NO EVENT SHALL TRANSDIMENSION BE LIABLE FOR DIRECT, SPECIAL, INDIRECT, INCIDENTAL, PUNITIVE, EXEMPLARY OR CONSEQUENTIAL DAMAGES, INCLUDING, WITHOUT LIMITATION, LOSS OF PROFITS OR REVENUE, LOSS OF PRODUCTS, DATA OR ANY ASSOCIATED EQUIPMENT, COST OF CAPITAL, COST OF SUBSTITUTED EQUIPMENT OR PARTS, FACILITIES OR SERVICES, DOWN-TIME OR LABOR COSTS, EVEN IF TRANSDIMENSION HAS BEEN ADVISED OF THE POSSIBILITY THEREOF. The device and any related products are not designed, authorized, or warranted to be suitable for use in life-support devices or systems or other critical applications. Any such use and subsequent liabilities that may arise from such use are totally the responsibilities of the Licensee. All product names are trademarks or registered trademarks of their respective owners. © 2005, TransDimension Inc., All rights reserved. .

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 1

Revision History

Version Release Date Author Note 0.1 2/13/2003 J Roeder Draft 1.0 4/17/2003 J Fung First release 1.1 4/20/2003 J Fung Added QFP schematic, notation 2.0 12/10/03 J Roeder Name change to TD242LP.

VBUS schematic changes. 2.1 7/21/2005 J Roeder Changed pin B2 of the BGA package

symbol in the schematics to AVDD2.5 from VDD2.5

Note: This document is subject to change without notice.

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 2

Contents

1 TD242LP: USB OTG Host/Function Controller ....................................................................3 1.1 Pin Assignments...................................................................................................5

2 Microprocessor Interface ........................................................................................................6

3 BGA242 Evaluation Board .....................................................................................................7 3.1 General Description .............................................................................................7 3.2 Board Operation Requirements............................................................................9

4 Hardware Description/Configuration......................................................................................9 4.1 Default Factory Settings – Standalone Configuration (BGA242S).....................9 4.2 Optional Configuration Installations....................................................................9 4.3 TD242LP Reset..................................................................................................10 4.4 DP/DM Signals ..................................................................................................10 4.5 LEDs ..................................................................................................................10 4.6 Oscillator Input ..................................................................................................10 4.7 Mounting Holes .................................................................................................10

5 Power Supply ........................................................................................................................10 5.1 5V Power Supply ...............................................................................................11 5.2 3.3V Power Supply ............................................................................................11 5.3 2.5V Core Power Supply ...................................................................................11 5.4 3.3V/2.5V Wide Range I/O Power Supply........................................................11

6 Test Points.............................................................................................................................11

7 References.............................................................................................................................12

8 Schematic..............................................................................................................................12 BGA242: Top Level ....................................................................................................13 BGA242: Test Headers ................................................................................................14 BGA242: TD242LP.....................................................................................................15 BGA242: PC104 Connectors.......................................................................................16 BGA242: Power Distribution ......................................................................................17 BGA242: System CPLD..............................................................................................18 BGA242: USB Ports ....................................................................................................19

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 3

Voltage Regulator

PLL OSC2 CLKW/ CLKCFG

OSC1 48 MHz 12 MHz

/RESET

/CS /WR /RD

A12:A1 D15:D0

INT

TEST

Memory Blocks

OTG Trans- ceiver

Host SIE &

Root Hub

µP Interface

USB Host Controller Registers

System Configuration

& Control

Registers

USB Function Controller Registers

USB Host

Control Logic

Function SIE

USB Trans- ceiver

DM2 DP2

DM1 DP1

/PO /OC

VBus Control Circuit

HNP/ SRP Logic ID

Test Control

ENVREG VREGOUT VBUS /EXVBO

PSH

USB Function Control Logic

H/F

PSFPSH

PSC

VBP

1 TD242LP: USB OTG Host/Function Controller TransDimension’s TD242LP (TDI part number: TDOTG242-000C 64 pin LQFP, and TDOTG242-00BC for 64 pin BGA) is the second controller in the family of integrated low-cost, high-performance, On-the-Go (OTG) controllers. The TD242LP is a combination of a standard USB host controller and an OTG dual-role device controller. Designed specifically for embedded applications with a non-PCI microprocessor interface, this 16-bit interface is ideal for low power mobile applications. It is USB Specification 2.0 compliant, operating at full speed (12Mb/s) and/or low speed (1.5Mb/s). The controller supports all four types of USB transfers: Control, Interrupt, Bulk, and Isochronous with highest data throughput, and lowest interrupt rate among all embedded host controllers on the market. In particular, isochronous performance is guaranteed. The pipe/transfer level programming makes the TD242LP very easy to use, ensuring shortest time-to-market. The block diagram of the TD242LP is shown in Figure 1-1. The TD242LP operational modes are given in Figure 1-2.

Figure 1-1: TD242LP OTG Host/Function Controller

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 4

The TD242LP chip can be configured by software to operate in any of four modes as described in Figure 1-2. Description Hardware HNP

• State machines for both the A-DEVICE and B-DEVICE are updated and tracked by the Hardware. • All timers are started and stopped by the Hardware events. • The OTG port can work either as a USB Host or USB Function, as determined by the automatic

negotiation with the connected remote device. Host Only Mode

• All the ports are USB Hosts. The HNP and Function are disabled. Function Host Mode

• The dual-role USB port operates as a USB Function. The other port will operate as USB Host. The HNP is disabled in this mode.

Software HNP • The TD242LP will allow Software to control the operation of the shared USB port. Software is

responsible for the timing, control of the external charge pump, tracking the HNP state and performing the HNP protocol.

• The shared OTG port can work either as a USB Host or USB Function, as determined by the Software negotiation with the connected remote device. Note: Software HNP is quite CPU intensive.

Figure 1-2: TD242LP Operating modes

The TD242LP is targeted towards embedded applications with low power requirements, especially mobile and post-PC products, including cellular phones, palm platforms, PDAs, STBs, home gateway systems, and Internet appliances. Peer-to-Peer communication is made simple with the TD242LP as USB connectivity is achieved without PC intervention. TransDimension, together with SoftConnex Inc, a wholly owned subsidiary, offer total solutions including controller chips, reference designs and development kits, firmware for microprocessor interfacing, HCD (Host Controller Driver), HNP (Host Negotiation Protocol), SRP (Session Request Protocol) as well as USB host and function stacks running under most real time operating systems.

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 5

1.1 Pin Assignments

A1 OSC2 C1 D10 E1 D15 G1 A1 A2 OSC1 C2 D11 E2 VDD2.5 G2 A3 A3 VSSA C3 D9 E3 /RD G3 A6 A4 D6 C4 D7 E4 VSS G4 A8 A5 VDDW C5 CLKCFG2 E5 VSS G5 A11 A6 VDD2.5 C6 D2 E6 VBP G6 /CS A7 D1 C7 VBUS E7 /PO G7 DP1 A8 TEST C8 VSSA E8 ID G8 DM1 B1 D8 D1 D12 F1 INT H1 A2 B2 VDD2.5A D2 D13 F2 /WR H2 A4 B3 VDD2.5A D3 D14 F3 A5 H3 VDDW B4 D5 D4 VSS F4 A7 H4 A9 B5 D4 D5 VSS F5 A10 H5 A12 B6 D3 D6 ENVREG F6 VDD3.3 H6 VDD2.5 B7 D0 D7 VDD3.3A F7 /OC H7 DP2 B8 /RESET D8 VREGOUT F8 /EXVBO H8 DM2

Figure 1-3: TD242LP pin assignment (64-pin BGA)

Figure 1-4 TD242LP BGA 64-pin package (top view)

TDOTG242

A1

B1

C1

D1

E1

F1

G1

H1

A2

B2

C2

D2

E2

F2

G2

H2

A3

B3

C3

D3

E3

F3

G3

H3

A4

B4

C4

D4

E4

F4

G4

H4

A5

B5

C5

D5

E5

F5

G5

H5

A6

B6

C6

D6

E6

F6

G6

H6

A7

B7

C7

D7

E7

F7

G7

H7

A8

B8

C8

D8

E8

F8

G8

H8

ABCDEFGH

1 2 3 4 5 6 7 8

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 6

TDOTG242LP

Figure 1-5 TD242LP BGA 64-pin package (top view) 2 Microprocessor Interface The TD242LP supports a 16-bit interface whether it be a microcontroller, a microprocessor, or a custom ASIC. Figure 2-1 shows a typical interface between the TD242LP and a microprocessor.

8 7 6 5 4 3 2 1

A B C D E F G H

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 7

Figure 2-1: A typical TD242LP interface to a microprocessor

3 BGA242 Evaluation Board 3.1 General Description The BGA242 (TDI part number TDOTG242-1010) evaluation board is designed for internal software development and customer evaluation of the TD242LP chip. Measured at 4.80 in. (121.9mm) by 3.00 in. (76.2mm), it can be employed to:

• Evaluate TransDimension's TD242LP USB OTG Host/Function Controller; • Run TD242LP demonstrations; • Develop user software for TD242LP based applications; and • Serve as a subassembly in an OEM's product to provide USB OTG Host/Function

Controller. With the block diagram of Figure 2-1, the BGA242 has the following features:

• Onboard TD242LP chip (64-pin, BGA package). • Onboard USB power distribution and over-current protection circuit for host applications. • One mini-AB OTG port and one Type A USB port.

/RESET

TEST

16

OSC1 OSC2

Crystal (Oscillator)

Circuit

GPIOR

A12:A1 D15:D0

12

/CS /WR/RD

INT /INTP

/CSK /WR /RD

A12:A1 D15:D0

Microprocessor

10K

3.3V

3.3V

10K x 4

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 8

• Onboard Dual footprint USB mini-AB OTG socket and a Dual footprint USB Type A socket for host operations.

• Onboard 6 MHz crystal. • Onboard test points for key signal probing. • Support for both self-powered and bus powered USB function. • Standard PC104 connector for interface to PC Motherboard or our PCI104 PCI adaptor

card. • 5V supply through the interfacing connector with LEDs indicating power conditions. • Support for both 2.5V and 3.3V I/O’s. • Low powered 2.5V core operating voltage.

5.0V to 3.3V DC Converter

2.5V Core

3.3V

2.5 or 3.3V I/O

PC104

CONNECTOR

5V

Mictor Test Header

(Optional)

5.0V to 2.5V Converter

Resistor

Port 1 Mini AB

Port 2 Type A

Processor Bus TD242LP

BGA64

VREGOUT

Crystal TPS2044

Figure 3-1 EVB242 Block Diagram

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 9

3.2 Board Operation Requirements The following items are required to operate the BGA242:

• A DC power source capable of supplying 5V±10%@1.5A through a power switch. Regulated power supply is required.

4 Hardware Description/Configuration The BGA242 was designed for either stand alone use or for use in a PCI bus configuration; the BGA242S for standalone and BGA242P for PCI. The PCE242 evaluation system is a combination of the BGA242P and a PCI104 bridge board. Switching in between the two configurations consists of either installing or removing a couple of resistors and moving a jumper. Please refer to the following check lists to see if you have the correct board configuration. 4.1 Default Factory Settings – Standalone Configuration (BGA242S) The default settings support the development of:

• an OTG Dual Role Device (Port 1) and a USB host (Port 2) simultaneously • a self powered or a bus powered USB function port (Port 1) and a USB Host (Port 2)

simultaneously Please double check the factory settings given below before using the board.

• R1, R13: (0 ohm) populated • R15: (0 ohm) populated • R19: (0 ohm) populated • R41 (10k ohm) populated • R44, R51: (10kohm, 100ohm) populated • R52: (0 ohm) populated • R53: (0 ohm) populated • J3: Pins 7 and 8 jumpered

4.2 Optional Configuration Installations To use the BGA242 as a USB Host on both ports (Port 1 and Port 2), make the following changes:

• R54: Install for Host Controller operation (R53 must be removed) To use different sources for the I/O Voltage supplies, do one of the following:

• R16: Install to use the Internal OTG_VREG for the 2.5V I/O (R15, R17 removed) • R17: Install to use the external 5V-to-2.5V regulator for the 2.5V I/O (R15, R16

removed) AND R42: Install to disable the Internal OTG_VREG (R41 is removed)

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 10

To use the external regulator as the 2.5V Core Voltage supplies, do the following:

• R18: Install to use the 5V-to-2.5V regulator for the 2.5V core (R19 removed) NOTE: OTG_VREG is the internal voltage regulator inside the TD242LP chip. The internal OTG_VREG can be disabled by installing R42 (R41 removed) and also removing R16 and R19. 4.3 TD242LP Reset The /RESET of the TD242LP is brought out to the PC104 connector. Users can control the /RESET through a GPIO of the MCU as depicted in Fig. 2-1. 4.4 DP/DM Signals Each of the DP/DM pairs has a 2-pin, 0.1” spacing, connector for attaching a differential probe. These traces are impedance controlled to 90 ohms + 10%. 4.5 LEDs The BGA242 board supplies several LEDs to check the normal operation of the board. These LEDs should be green for the functions that are working correctly: D14: 3.3V Power Rail Indicator D2: 2.5V Power Rail Indicator D3: VDDW Power Rail Indicator D4: 5.0V Power Rail Indicator D1: Type A VBUS Power Indicator D5: Mini-AB VBUS Power Indicator 4.6 Oscillator Input The TD242LP supports the use of a 6MHz crystal, or a crystal oscillator of 6, 12, 24 or 48MHz. The 12 or 24MHz crystal oscillator is supported only for the BGA package. A 6MHz crystal or a 6MHz crystal oscillator is recommended for lower EMI. The only footprint provided in the BGA242 board is the use of a 6MHz (default) crystal. 4.7 Mounting Holes The BGA242 board has four unplated standoff holes, one near each corner of the board. Each hole is 0.146” in diameter. The placement matches the PCI104 PCI board. 5 Power Supply Before using the BGA242, one must determine the way the power is applied to the board. Listed below are the configurations for both the core and I/O voltage supplies. The default

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 11

configuration assumes that the user will be using the internal voltage regulator (OTG_VREG) supply for the 2.5V core voltage and the 5V-to-3.3V converter for the 3.3V I/O supply. 5.1 5V Power Supply The BGA242 board will receive its 5V power from one of two sources. The source will be resistor selectable.

1. The PC104 Connector [Default setting]. 2. An external source connecting to a test pin. Protection circuitry is not provided. (remove

R1 and R13) 5.2 3.3V Power Supply The BGA242 board will receive its 3.3V power only from a voltage regulator.

1. The 5V-to-3.3V DC converter. 5.3 2.5V Core Power Supply The BGA242 board will receive its 2.5V core power from one of three sources. The source will be resistor selectable.

1. The TD242LP’s internal regulator output pin, VREGOUT [Default setting]. 2. The 5.0V-to-2.5V DC converter. 3. An external source connecting to a test pin (JP4, pin 3). Protection circuitry is not

provided. The power for the core voltage (VDD2.5 pins) is independent from the power for the I/O voltage, meaning you can drive the core from the internal regulator and drive the 2.5V I/O from the DC converter. 5.4 3.3V/2.5V Wide Range I/O Power Supply The BGA242 board will receive its power from one of three sources. The VDDW (VDD Wide-range) power source will be resistor selectable.

1. From the 3.3V supply directly (3.3V) [Default setting]. 2. The TD242LP’s internal regulator output pin, VREGOUT (2.5V). 3. The 5.0V-to-2.5V DC converter (2.5V). 4. An external source connecting to a test pin (JP3, pin 3). Protection circuitry is not

provided. 6 Test Points The following test points are furnished on the BGA242: Ground Test Points JP1, JP2, JP9 and JP10 VBUS, DP1, DM1, DP2, DM2, VREG_OUT, ID.

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 12

7 References • USB 2.0 Specification (www.usb.org) • USB On-The-Go Supplement to USB 2.0 Specification (www.usb.org) • TD242LP Technical Manual (TDI Document Number: MU4006) 8 Schematic The schematics of the BGA242 are presented on Pages 13-19 of this document. NOTE: The TD242LP also comes in an LQFP64 package which is not shown in the schematics.

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 13

BGA242: Top Level

PO_N

OTG_CSL

RESET_LOCALL

D[7:0]

A11

D6

GPIO8

A4

A7

D[15:0]

RESET_CONN

CPLD_READYL

A2

TD242LP

TD242LP

OTG_INTL

RESET_CONN

OTG_CSL

OTG_WRLOTG_RDL

OTG_D[15:0]

OTG_A[12:1]

OTG_DP1_ROTG_DM1_R

OTG_DP2_ROTG_DM2_R

OTG_ID

OTG_POLOTG_OCL

OTG_EXVBOL

OTG_VBP

OTG_VREG_OUT

OTG_VBUS

RESET_LOCALL

CPLD_CSL

OTG_WRLOTG_INTL

A19

GPIO7

A[19:0]

OTG_INTL

CPLD_READYL

D7 DP1_R

D5

A16

OTG_RDL

A17

Sy stem_CPLD

Sy stem_PLD

RESET_LOCALLRESET_CONN

OTG_RDLOTG_WRL

CPLD_CSL

OTG_CSLA[19:13]

D[7:0]

OTG_CSL_CONN

CPLD_READYLALEL

GPIO7GPIO8

A[3:0]

OTG_RDL

EXT_VBO_N

A9

OC_N

USB_PORTS

USB_PORTS

DP1_RDM1_R

DP2_RDM2_R

ID

PO_NOC_N

EXT_VBO_N

VBPVBUS

OTG_WRL

D4

A8

D1

A1

VBP

D0

OTG_CSL_CONN

DP2_R

A10

RESET_CONN

OTG_CSL

A0

OTG_INTL

A15

CPLD_CSL

VREG_OUT

ALEL

PC104_CONN

PC104_CONN

RESET

SD[15:0]

SA[19:0]

CS1L

/MEMRD/MEMWR

CS2L

OTG_INTL

READYLBALE

GPIO7GPIO8

GPIO7

GPIO8

A3

A[12:1]

RESET_LOCALL

A14

ALEL

OTG_WRL

A3

A5

A1

D3D2

RESET_CONN

A[19:0]

DM2_R

CPLD_READYL

VBUS

Power_Dist

Power_Dist

VREG_OUT

ALEL

OTG_CSL

OTG_CSL_CONN

A13

DM1_RD[15:0]

A18

GPIO8

A[3:0]

A12

BGA242 CARD TOP LEVEL

A[19:13]

A6

SC-OTG242-A2-001 2.1

BGA242 Card : TOP LEVEL

1 7Thursday , July 21, 2005

Title

Size Document Number Rev

Date: Sheet of

RESET_LOCALL

OTG_RDL

A2

D[15:0]

ID

GPIO7

A[19:0]

CPLD_CSLOTG_CSL_CONN

Rev2.1: 1. TD242LP pin B2 to AVDD2.5 from VDD2.5 2. Removed DNI pulldowns on DP/DM

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 14

BGA242: Test Headers

D10

MH's are to be .146" non-plated thru holesPlace one at each corner.

A14

D14

A12

D1

OTG_WRL

A9

A6V241

V261

RESET_CONN

RESET_CONN

TEST HEADERS

OTG_CSL

GPIO8

A1

D7

V20 1

A11

GPIO8

RESET_LOCALL

D5

OTG_CSL

A13

OTG_WRL

MH3

JP9

1X2

21

GROUND TEST POINTS

JP1

1X2

21

V211

A2

D15

V221

RESET_LOCALL

D0

A18

V12 1

Female Mictor ConnectorAMP 2-767004-2AMP 767054-1Emulation Tech CONMICFEM38SMT

A19

OTG_WRL

V19 1

GPIO7

D11

D[15:0]

A17MH2

V18 1

A7

D8

A10

OTG_CSL_CONN

MH1

V16 1

OTG_RDL

V251OTG_INTL

V231

RESET_LOCALL

Distribute the TestPointson top side near corners

GPIO7

MH4

D[15:0]

OTG_CSL

CPLD_CSL

OTG_RDL

ALEL

A4

CPLD_CSL

D[15:0]

A8

A5

CPLD_READYL CPLD_READYL

D13

OTG_RDL

D2

GPIO7

A0

ALEL

V17 1D9

JP2

1X2

21

JP10

1X2

21

A16

A[19:0]

A3

J4Mictor38

135791113151719212325272931333537

2468

101214161820222426283032343638

39 4041 42 43

D3

D12

CPLD_READYL

GPIO8

A15

OTG_INTL

SC-OTG242-A2-002 2.1

BGA242 Card : Headers

2 7Thursday , July 21, 2005

Title

Size Document Number Rev

Date: Sheet of

OTG_CSL_CONN

ALEL

A[19:0]

J5Mictor38

135791113151719212325272931333537

2468

101214161820222426283032343638

39 4041 42 43

OTG_CSL_CONN

D6

D4

A[19:0]

RESET_CONN

OTG_INTL

CPLD_CSL

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 15

BGA242: TD242LP

OSC2_R

C352200pF

OTG_VBP 7

OTG_TEST

OTG_CSL2,4

Place components as closeto the TD242LPas possible.

C19

0.1uF

C4110pF

OTG_D13

Install to disable theInternal OTG_VREG.

OTG_D5

OTG_DP1_R

C29

0.1uF

OTG_RESET_R

OTG_A5

OTG_A[12:1]2,3,4

SC-OTG242-A2-005 2.1

BGA242 Card : OTG242

C

5 7Thursday , July 21, 2005

Title

Size Document Number Rev

Date: Sheet of

OTG_A9

R6910K

RESET_LOCALL2,4

RESET_CONN2,3,4

R57DNI_10K

OTG_D1

OTG_DP1_R 7

C13

DNI_100pF

OTG_EXVBOL 7

Install to enable theInternal OTG_VREG.

3P3VCC

OTG_VREG_EN

OTG_VBP

OSC1

Y1

6.000MHz

1 2

C250.1uF

OTG_DP2_R 7

OTG_D8

R42DNI_100

R51100

OTG_D3

OTG_D12

OTG_VREG_OUT 6

OTG_OCL

C10

0.1uF

3P3VCC

OTG_RESETL

3P3VCC

R47DNI_10K

R58100

OTG_D2

OSC2

OTG_A1

TP4

C4010pF

C3422pF

R59 DNI_500K

C9

DNI_100pF

R4110K

R500

3P3VCC

OTG_A2

Install when CPLDis removed.

U2

OTG242_BGA64

B8

A2 A1

G6

E3F2

F1

G4F4G3F3H2G2H1

E1D3D2D1C2C1C3B1C4A4B4B5B6C6A7B7

A8

G8G7E8

F8

H8H7

F7E7

E5D5D4

F6

E4

A5

H6

E6

C7

E2

B2

H3

A6

B3

D7

C8A3

H4F5G5H5

G1

C5

D8

D6

RESET

OSC1 OSC2

CS

RDWR

INT

A8A7A6A5A4A3A2

D15D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0

TEST

DM1DP1

ID

EXVBO

DM2DP2

OCPO

VSSE5VSSD5VSSD4

VDD3_3_F6

VSSE4

VDDW_A5

VDD2_5_H6

VBP

VBUS

VDD2_5_E2

VDD2_5_B2

VDDW_H3

VDD2_5_A6

AVDD2_5_B3

AVDD3_3_D7

AVSSC8AVSSA3

A9A10A11A12

A1

CLK_CFG

VREG_OUT

VREG_ENR30DNI_82

CLK_CFG

OTG_D[15:0]2,3,4

C26

0.1uF

3P3VCC

OTG_VBUS

R46DNI_82

R39DNI_82

OTG_VREG_OUTOTG_WRL2,3,4

OTG_A10

OTG_DM2_R 7

OTG_D11

R49 130

R56DNI_10K

C27

0.1uF

OTG_VBP

OTG_A7

OTG_D4

R52 DNI_0

VDDW

Place components as close tothe TD242LP as possible.

Remove when CPLDis removed.

OTG_DM1_RC20

DNI_100pF

R48 0

OTG_D14

Decoupling Capacitors

OTG_A6

OTG_POL

C28

0.1uF

2P5VDD

OTG_ID

OTG_POL 7

OTG_D0

OTG_D6

3P3VCC

OTG_ID 7

OTG_INTL2,3

C11

0.1uF

OTG_D9

OTG_EXVBOL

OTG_A3

OTG_DM1_R 7

R4410K

+C244.7uFOTG_A11

2P5VDD

OTG_D10

OTG_D7

OTG_A4

VBP CLK_CFG

OTG_A8

OTG_DM2_ROTG_D15

OTG_RDL2,3,4

6MHz 0 012MHz 0 124MHz 1 148MHz 1 0

R43DNI_10K

OTG_VBUS 7

C18

0.1uF

C12

0.1uF

OTG_DP2_R

OTG_A12

OTG_OCL 7

3P3VCC

VDDW

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 16

BGA242: PC104 Connectors

VDDW

SA14

GPIO7_R

R1 0_1206R_1206

SD15

AEN

SD7

CS3L

SD[15:0]2,4,5

V111IRQ7

SD[15:0]

R3210K x 4

1 2 3 45678

V41

VDDW

SA0

IRQ5

GPIO8_R

SA11

SC-OTG242-A2-003 2.1

BGA242 Card : PC104 Connectors

B

3 7Wednesday , July 20, 2005

Title

Size Document Number Rev

Date: Sheet of

SD0

SA12

V91

VDDW

+C66.8uF

R24DNI_10K

SA10

SD14

SA6

IRQ10

SA10

VDDW

V2 1

SD3

SD1

IRQ5

Male headers placed per the PC104 specFor Customer Evaluation, placed on top side.For PC104 or PCI, placed on bottom side.

SA13

3P3VCC

SD4

GPIO7 2,4

SD8

SA7

IRQ3

V81

R410K x 4

1 2 3 45678

Install only one jumperat a time

SD11

SA[19:0]

SA18

V11

VDDW

R210K

VDDW

IRQ6SA8

C70.1uF

VDDW

V5 1

VDDW

IRQ7

SD0

IOCS16L

SA9

R3510K x 4

1 2 3 45678

5P0VCC_1

UCLK

MEMCS16L

SD6

SD13

SA17

SA6

R3410K x 4

1 2 3 45678

SA16

SA12

R510K x 4

1 2 3 45678

R11DNI_10K

J1 PC104-40

C0C1C2C3C4C5C6C7C8C9C10C11C12C13C14C15C16C17C18C19

D0D1D2D3D4D5D6D7D8D9

D10D11D12D13D14D15D16D17D18D19 VDDW

5P0VCC_CONN

V7 1RESET 2,4,5

/MEMWR 2,4,5

SA[19:0]2,4,5

SD14

SA7SA3

V61

SA5

SA19

SD2

IRQ10

SD12

READYL

SA16

SD3

TP1

V31

5P0VCC

SA14

R13 0_1206R_1206

R9 DNI_0

READYL 2,4

IOCHCHKL

IOR

J31 23 45 67 8

SD7

SA0

V151

KEY2

SD10

SA2

SD8

SD4

Remove to use external5V power supply. SD5

V141

SD6SD5

VDDW

SA3

R710K

SA5

R12DNI_10K

3P3VCC

SA4

R2310K x 4

1 2 3 45678

OTG_INTL 2,5

VDDW

IRQ4

SA18

SA9

V131

SA15

SA8

SA15

SD9

IRQ3

R10 DNI_0

SA17

SD12

GPIO8 2,4

SD10

SA4

IRQ9 - GPIO7 - SPAREIRQ11 - GPIO8 - SPAREIRQ12 - CS3L - SPAREIRQ15 - CS1L - OTG242IRQ14 - CS2L - CPLD

IOW

SD13

SD2

SA2

J2 PC104-64

A1A2A3A4A5A6A7A8A9A10A11A12A13A14A15A16A17A18A19A20A21A22A23A24A25A26A27A28A29A30A31A32

B1B2B3B4B5B6B7B8B9

B10B11B12B13B14B15B16B17B18B19B20B21B22B23B24B25B26B27B28B29B30B31B32

SD15MASTERL

R810K

SD1

BALE 2,4

R310K x 4

1 2 3 45678

CS2L 2,4CS1L 2,4

OSC

V101

R610K x 4

1 2 3 45678

SA11

SA19

R3310K x 4

1 2 3 45678

ENDXFRL

SD11

SD9

SA1

SA1

R21DNI_10K

VDDW VDDW

SA13

/MEMRD 2,4,5

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 17

BGA242: Power Distribution

D4GREEN

2 1

+ C56.8uF

3P3VCC

R20 130

Install for 3.3V IO

SC-OTG242-A2-006 2.1

BGA242 Card : Power Distribution

B

6 7Wednesday , July 20, 2005

Title

Size Document Number Rev

Date: Sheet of

D14GREEN

2 1

+ C236.8uF

U1 LT1963AEST-2.5

1

2

3

4

VIN

GN

D

VOUT

TAB

JP7

321

3P3VCC

TP2

Only one resistor may beinstalled at a time.

Power Indicators

VDDW

2P5VDD

D2GREEN

2 1

2P5VCC

VD2P5_1

R16DNI_0_1206

R_1206

R17DNI_0_1206

R_1206

3P3VCC

Install resistor to use the 5V-to-2.5Vregulator for the 2.5V Core

VD3P3

C40.1uF

VDDW

JP11

321

VREG_OUT5

5P0VCC_1

2P5VDDJP3

321

+ C26.8uF

R70 150

C38120uF

VDDW

R36 330

C330.1uF

R15 0_1206

R_1206

R19 0_1206

R_1206

Install resistor to use the InternalOTG_VREG for the 2.5V Core

5V to 3.3V Voltage Conversion

2P5VDD

5P0VCC

+ C426.8uF

LT1587CM-3.3

R26 150

5P0VCC

3.3V Output

VD2P5_2

C30.1uF

3P3VCC

Install to use the 5V-to-2.5Vregulator for the 2.5V IO

Power Headers

IO Voltage

2.5V Core

VD5P0

Install to use the InternalOTG_VREG for the 2.5V IO

C320.1uF

5P0VCC

D3GREEN

2 1

Only one resistor may beinstalled at a time.

R18DNI_0_1206

R_1206

U4 LMS1587IS-3.3

3

1

24VIN

GN

D

VOUTTAB

JP4

321

5.0V to 2.5V Voltage Conversion

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 18

BGA242: System CPLD

ADDR_DECODE2

Place diodes in 2rows of four

C140.1uF

R2510K x 4

1 2 3 45678

RESET_LOCALL 2,5

R67 150

V311

R66 150

U3

LC4064V_75T100C

3

54

689

10

1415161719202122

28

34

47

293031

353637

41424344

25 45

7 18 26124

52

274

8938

13 33

32 46 51 57 68 76 82 96

11

63 75 83 95

484950

5354555658596061

6465666769707172

7879808184858687

91929394979899100

122327

3988

40

627377

90

I/O_3

I/O_5I/O_4

I/O_6I/O_8I/O_9I/O_10

I/O_14I/O_15I/O_16I/O_17I/O_19I/O_20I/O_21I/O_22

I/O_28

I/O_34

I/O_47

I/O_29I/O_30I/O_31

I/O_35I/O_36I/O_37

I/O_41I/O_42I/O_43I/O_44

VC

C_2

5

VC

C_4

5

GN

D_7

GN

D_1

8G

ND

_26

GN

D_1

TCK

TMS

TDITDO

CLK0/In0CLK1/In1

VC

C_1

3

VC

C_3

3

GN

D_3

2G

ND

_46

GN

D_5

1G

ND

_57

GN

D_6

8G

ND

_76

GN

D_8

2G

ND

_96

I/O_11

VC

C_6

3V

CC

_75

VC

C_8

3

VC

C_9

5

I/O_48I/O_49I/O_50

I/O_53I/O_54I/O_55I/O_56I/O_58I/O_59I/O_60I/O_61

I/O_64I/O_65I/O_66I/O_67I/O_69I/O_70I/O_71I/O_72

I/O_78I/O_79I/O_80I/O_81I/O_84I/O_85I/O_86

I/O_87_GOE1

I/O_91_GOE0I/O_92I/O_93I/O_94I/O_97I/O_98I/O_99

I/O_100

I_12I_23I_27

CLK2/In2CLK3/In3

VC

C_4

0

I_62I_73I_77

VC

C_9

0

V391

V29 1

ISP_TDI

C300.1uF

OTG_WRL2,3,5

LED6R61 150

SC-OTG242-A2-004 2.1

BGA242 Card : Sy stem CPLD

C

4 7Wednesday , July 20, 2005

Title

Size Document Number Rev

Date: Sheet of

LED1_R

R60 150

V371

VCCSDO/TDOSDI/TDIispEN#NC/TRSTMODE/TMSGNDSCLK/TCK

0.01uF

J9

ispDOWNLOAD

12345678

A[3:0]2,3,5

3P3VCC

C360.1uF

LED3

V51 1

ADDR_DECODE0

LED7_R

V581

3P3VCC

ISP_TDO

A16

V30 1

V491

ADDR_DECODE3

V43 1

3P3VCC

LED0

A18

S1

SW DIP-4

1234

8765

OTG_CSL 2,5

D1

D6 GREEN2 1

ISP PROGRAMMINGCABLE CONNECTOR

A1

V481

3P3VCC

V36 1

V341

C220.1uF

V321

R65 150

JP621OTG_CSL_CONN2,3

ISP_TCK

R62 150

C210.1uF

D12 GREEN2 1

C310.1uF

V331

V551

R64 150

D4

V27 1

LED7

LED3_R

A0

R63 150

V411

V38 1

D3

V561

V471D6

LED2

ISP_TMS

V44 1GPIO72,3

V531

D13 GREEN2 1

D7

V571

LED0_R

V40 1V35 1

A13

D7 GREEN2 1

D10 GREEN2 1

D2

A19

V541

RESET_CONN2,3,5

C150.1uF

A[19:13]2,3

A3

GPIO82,3

OTG_RDL2,3,5

LED1

A2

LED6_R

D5

LED4_R

LED2_R

A14

V421

D[7:0]2,3,5

System_CPLD

D8 GREEN2 1

LED5

A17

OTG_CSL

D9 GREEN2 1

D11 GREEN2 1

ALEL2,3

CPLD_CSL2,3

V521

V501

V45 1

A15

LED4

V28 1

Install for PCI Bridge board.Remove for PC104.

C370.1uF

D0

ADDR_DECODE1

CPLD_READYL 2,3

LED5_R

V591

V461

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 19

BGA242: USB Ports

5P0VCC

USB_5V_P2

OC4_N

R27 0

J7

Dual-USB-Mini-AB

321

54

6

D+D-+5V

GNDID

SHLD

PO_N5

JP5

DNI_1X2

21

V611

R37 33x212 3

4DM2_R5

Q1ZXM61P02F

1

23

DM1

VDVBUS1

VBUS5

SC-OTG242-A2-007 2.1

BGA242 Card : USB Ports

C

7 7Thursday , July 21, 2005

Title

Size Document Number Rev

Date: Sheet of

U6

TPS2044

3

4

7

8

16

13

12

9

10111415

26

51

EN1

EN2

EN3

EN4

OC1

OC2

OC3

OC4

OU

T4O

UT3

OU

T2O

UT1

IN1IN2

GND5GND1

ID5

Place resistors at TD242LP

R28 DNI_0

R9082K

B

L11 2

EN3_N

DP2DP2_R5

VBP5

DM1_R5 DM1_R

R40330

C390.1uF

VBP_LS

D5GREEN

2 10.1" spacing forthe differentialprobe connectors

C440.1uF

USB_5V_P1

B

L61 2

DP1

R5510K

This FET is requiredfor the slow turnofftime of the TPS2044

Dual-USB-Ty pe-A

J6

321

45

D+D-+5V

GNDSHD

C160.1uF

DM2

R681K

5P0VCC

B

L31 2

B

L4

1 2

B

L51 2

Install for Host operation.

U90

74AHC1G08

41

2

53

P3_OUT

DP1_R

+ C1120uF

+ C174.7uF

R14330

+ C4333uF

V60 1

33x2R4512 3

4

Install for OTG operation.

5P0VCC

TP3

B

L71 2

VDVBUS2

5P0VCC

P1_OUT

DP2_R

Q90ZXM61P02F

1

23

B

L2

1 2

NOTE:R90 required topass USB ComplianceTesting

VBUS

R53 0

+ C45120uF

DM2_R

DP1_R5

TP6

C80.1uF

EXT_VBO_N_LS

D1GREEN

2 1

R54 DNI_0

U5

74AHC1G08

41

2

53

JP8

DNI_1X2

21

R22 DNI_0

TP5

R29 0

OC3_NV62 1

EXT_VBO_N5

P4_OUT

C900.1uF

NOTE:For USB Host, need >120uF per hub.For USB Function, need <10uF per port.For OTG Dual-Role Device, need 1uF<cap <6.9uF.

OC_N5

TransDimension Inc. BGA242: TD242LP Evaluation Board User’s Guide

TransDimension Inc. – Proprietary 20

For additional information, contact your TransDimension Sales Representative or the following: INTERNET: http://www.transdimension.com EMAIL: [email protected], [email protected] Headquarters: TransDimension Inc., 135 Technology Drive, Irvine, CA 92618. Tel. (949) 727-2020, FAX (949) 727-3232 Pete Todd, VP of Worldwide Sales, [email protected] Americas TransDimension Inc., 135 Technology Drive, Irvine, CA 92618. Tel. (949) 727-2020, FAX (949) 727-3232 Larry Hayden, e-mail: [email protected] Japan: TransDimension Inc., OYA Bldg. 5, 3 Chome-9-6, Nishishinjuku, Shinjuku-ku, Tokyo, Japan. Tel. +81 (3) 5308 7525, FAX

+81 (3) 5308 7526 Masanori Sugane, e-mail: [email protected] Europe: TransDimension Inc., 7 The Orchard, Hilton, Derbyshire, UK, DE65 5JF. Tel. +44 1283 730045, FAX +44 1283 730651 Neil Huntingdon, e-mail: [email protected] Asia (excluding Japan): TransDimension Inc., 3 Ubi Ave. 3, #05-01, Crocodile House, Singapore, 408857 Tel: +65 6743 9179, Fax: +65 6741 4393 T.L. Nge, e-mail: [email protected] ________________________________________________________________________________________________________________________

THE DEVICE AND ITS DOCUMENTATION ARE PROVIDED “AS IS”. TRANSDIMENSION HEREBY DISCLAIMS ALL WARRANTIES, EXPRESS, STATUTORY AND IMPLIED, APPLICABLE TO THE SOFTWARE AND ITS DOCUMENTATION AND ANY RELATED PRODUCTS, INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT OR FITNESS FOR A PARTICULAR PURPOSE. TRANSDIMENSION ASSUMES NO LIABILITY FOR ANY ACT OR OMISSION OF LICENSEE. IN NO EVENT SHALL TRANSDIMENSION BE LIABLE FOR DIRECT, SPECIAL, INDIRECT, INCIDENTAL, PUNITIVE, EXEMPLARY OR CONSEQUENTIAL DAMAGES, INCLUDING, WITHOUT LIMITATION, LOSS OF PROFITS OR REVENUE, LOSS OF PRODUCTS, DATA OR ANY ASSOCIATED EQUIPMENT, COST OF CAPITAL, COST OF SUBSTITUTED EQUIPMENT OR PARTS, FACILITIES OR SERVICES, DOWN-TIME OR LABOR COSTS, EVEN IF TRANSDIMENSION HAS BEEN ADVISED OF THE POSSIBILITY THEREOF. The device and any related products are not designed, authorized, or warranted to be suitable for use in life-support devices or systems or other critical applications. Any such use and subsequent liabilities that may arise from such use are totally the responsibilities of the Licensee. Copyright © 2003, TransDimension Inc., All rights reserved. All product names are trademarks or registered trademarks of their respective owners. This document is subject to change without notice.

_____________________________________________________________________________________________________________________________________ © 2003, TransDimension Inc. All Rights Reserved Printed in USA July, 2005 MU4006, Rev. 2.1