Beam Services, Inc.Beam Services, Inc.

September 27, 2010

Beam Services, Inc.Beam Services, Inc.

Mobile electrostatic carrier technology

Rigid carrier that utilizes electrostatic force for the bonding to an ultra thin substrate Thin opaque electrostatic carrier for the processing of transparent substrates

Clean and “Green”Reduced damage during de‐bond>2000 charge cycle capabilitySimple carrier re‐charge for extended processesSingle tool set for bond and de‐bond processMultiple automated integration solutions

Beam Services, Inc.Beam Services, Inc.

Objective: Beam Services is focused on the commercialization of mobile and non‐

mobile electrostatic handling systems for automated high volume manufacturing.

1.) Fully and semi automated ES 1.) Fully and semi automated ES temporary bond and detemporary bond and de--bond bond systems for the handling of systems for the handling of ultra thin substratesultra thin substrates

2.) Tools and applications 2.) Tools and applications engineering for customer engineering for customer specific handling requirementsspecific handling requirements

Beam Services, Inc.Beam Services, Inc.

1.1. Thin substrate and ESC Thin substrate and ESC are separatedare separated

2.2. Thin substrate and ESC Thin substrate and ESC are placed in close are placed in close contactcontact

3.3. Thin substarte is Thin substarte is chucked by the chucked by the electrostatic field electrostatic field generated by ESCgenerated by ESC

ESC layersESC layers

Thin substrateThin substrate

Thin substrateThin substrate

Thin substrateThin substrate

++-- ++ --

Electrostatic Carrier Electrostatic Carrier

ESC layersESC layers

ESC fieldESC field

Electrostatic Carrier Electrostatic Carrier

Electrostatic Carrier Electrostatic Carrier

Beam Services, Inc.Beam Services, Inc.

Cover foilCover foil

WaferWafer

UU00

UU00 /2/2

A plane A/2A plane A/2

CC++ CC--BipolarBipolar

Power electrodes can hold the wafer without Power electrodes can hold the wafer without the presence of a grounding electrodethe presence of a grounding electrode

-- --++

++ ---- -- --++++++ ESCESC

MultiMulti--Cell Electrostatic fieldCell Electrostatic field

-- --++-- --++ -- --++-- --++ -- --++ESCESC

Beam Services, Inc.Beam Services, Inc.

••MaterialsMaterials••Semiconductor waferSemiconductor wafer••Semiconductor solar cellsSemiconductor solar cells••Metal masksMetal masks••Glass substrates Glass substrates ••Non conductive substrates with Non conductive substrates with conductive layerconductive layer••MEMSMEMS••Substrate pieces Substrate pieces

••Substrates typical dimensionsSubstrates typical dimensions••Thickness (any kind): typical 10Thickness (any kind): typical 10µµm m –– 750750µµmm••Size (any kind): typical 1Size (any kind): typical 1”” to 12to 12””••Shape (any kind): circle, square, rectangular Shape (any kind): circle, square, rectangular

ApplicationsApplications

Beam Services, Inc.Beam Services, Inc.

Easily integrated charging units, all communication  protocols supported (USB, 232, etc.)

Operating with “IntelliCharge®”fully heuristic intelligent charging technology. Patent Pending

In house design, hardware, software capability

Volume manufacturing at low cost in the US

Highly experienced team with multi‐market background

Beam Services, Inc.Beam Services, Inc.

APACHEAPACHEBOLTS Charging BOLTS Charging StationStation

APACHEAPACHEIntegrated Charging Integrated Charging StationStation

APACHEAPACHETable Top Charging Table Top Charging StationStation

APACHE 2100APACHE 2100ESC Charging ESC Charging

ControllerController

APACHEAPACHEAutomated Charging Automated Charging StationStation

BiBi--polar polar ESCsESCs

Beam Services, Inc.Beam Services, Inc.

150 mm, 200 mm, and 300 mm mobile ES carrier capability

Integrated real time voltage monitoring for process testing

Vacuum ESC hold down and contact pin actuation 

Contact pin assembly design allows for increased rotational tolerance

Integrated touch screen user interface

In house customization options