B.E. IFirst Semester Course

Subjects: Applied Maths – 1 Applied Physics – 1 Engineering Drawing Fundamentals of Civil Engineering Material Science Workshops

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APPLIED MATHS – 1

UNIT 1: COMPLEX NUMBERS AND THEIR APPLICATIONSDefinition of a complex number, Properties of a complex numbers, Modulus and amplitude of a complex number, Geometric representation of a imaginary number, Geometric representation of complex number, De Moivre’s theorem, Roots of complex number, Expansion of sinnΦ, cosnΦ and tannΦ in powers of sinΦ, cosΦ and tanΦ, Expansion of sinmΦ, cosmΦ and sinmΦ.cosmΦ in a series of sines or cosines of multiples of Φ, Exponential function of a complex variable, Circular functions of a complex variable, Hyperbolic functions, Formulae of hyperbolic functions, Inverse hyperbolic functions, Real and imaginary parts of circular and hyperbolic functions, Logarithmic function of a complex variable, Summation of series i.e. Cos +i Sin.

UNIT 2: INFINITE SERIESIntroduction to Series and Sequences, Convergence and divergence of sequences, Bounded and Monotonic sequence, Series, Convergence, divergence and oscillation of a series, Geometric series, Series of positive and negative terms, Necessary condition for convergence, Comparison tests, D’Alembert’s ratio test, Alternating series and its definition, Leibnitz’s rule, Series of positive and negative terms, Absolutely convergent and Conditionally convergent series, Power series.

UNIT 3: DIFFERENTIAL EQUATIONS OF FIRST ORDERDefinition of differential equation, Ordinary differential equation, Partial differential equation, Order and Degree of a differential equation, Formation of differential equation, Solution of a differential equation, General and particular solution, Equation of first order and first degree, Method of solving differential equations like Variables separable method, Homogeneous equations, Equations reducible to homogeneous equations, Linear equations, Leibnitz’s linear equations, Bernoulli’s equation, Exact differential equations, Equations reducible to exact equations, Equations of first order and higher degree.

UNIT 4: APPLICATIONS OF DIFFERENTIAL EQUATIONS OF FIRST ORDERIntroduction, Kirchoff’s laws, Differential equations relating to R-L-C circuits, Newton’s law of cooling, Rate of decay of radio-active materials, Chemical reactions and solutions,

UNIT 5: LINEAR DIFFERENTIAL EQUATIONSDefinition of linear differential equation, Solution of linear differential equations consisting of complementary function and particular integral, Operator D, Rules for finding complementary function and particular integral, Inverse operator (1/D), Methods for finding particular integral like Method of variation of parameters and Method of undetermined coefficients, Simultaneous linear equations with constant coefficients.

UNIT 6: APPLICATIONS OF LINEAR DIFFERENTIAL EQUATIONSIntroduction, Applications of Linear Differential equation in finding solutions of problems related to Simple harmonic motion, Oscillations of spring like free oscillations, damped oscillations and forced oscillations, Simple pendulum and Oscillatory electrical circuit.

Reference:1) Higher Engineering Maths: Dr. B.S. Grewal (Khanna Publishers)2) Advanced Engineering Maths: Erwin Kreyzig (John Wiley and Sons)3) Advanced Engineering Mathematics: Wylie and Barret (McGraw Hill)

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APPLIED PHYSICS – 1

UNIT 1: INTERFERENCEPrinciple of superposition, Interference of light, Young’s experiment, Analytical treatment of interference, Theory of interference fringes, Conditions for interference of light like (1) Condition for sustained interference, (2) Condition for observation and (3) Conditions for good contrast, Types of interference like Division of amplitude and Division of amplitude, Fresnel’s biprism, White light fringes and location of zero order fringe in biprism experiment, Determination of the thickness of thin sheet of transparent material, Interference in thin films due to reflected light and due to transmitted light, Colours of thin films, Wedge shaped film, Necessity of extended source, Newton’s rings, Determination of wavelength of sodium light using Newton’s rings, Determination of refractive index of liquid, Newton’s rings formed by two curved surfaces, Newton’s rings with white light, Michelson interferometer, Types of fringes like (1) Circular fringes, (2) Localized fringes and (3) Localized white light fringes, Uses of Michelson’s interferometer like (1) Determination of wavelength of monochromatic light, (2) Determination of difference in wavelength and (3) Determination of thickness of a thin plate, Standardization of the meter, Interference filters.

UNIT 2: DIFFRACTION Diffraction, Two kinds of diffraction like Fresnel’s diffraction and Fraunhofer’s diffraction, Difference between interference and diffraction, Zone plate, Diffraction at straight edge, Resultant of n simple harmonic motions, Fraunhofer diffraction at single slit, Intensity distribution graph, Fraunhofer diffraction at a circular aperture, Plane diffraction grating, Formation of multiple spectra with grating, Maximum number of orders available with a grating, Absent spectra with a diffraction grating, Effect of increase in the width of ruled surface, Determination of wavelength using grating, Dispersive power of grating.

UNIT 3: POLARISATIONPolarization of light wave, Representation of various types of light like unpolarised light and plane polarized light, Plane of polarization, Polarization by reflection and Brewster’s law, Law of Malus, Geometry of Calcite crystal, Double refraction, Nicol’s prism, Huygen’s theory of double refraction, Quarter wave plate, Half wave plate, Elliptically and circularly polarized light, Production of circularly and elliptically polarized light, Conversion of elliptically polarized light and circularly polarized light, Analysis of polarized light of different kinds using (1) Rotating Nicol and (2) Quarter wave plate in front of a rotating Nicol, Optical activity, Specific rotation, Fresnel’s theory of optical rotation, Laurent’s half shade polarization, Photo elasticity.

UNIT 4: RESOLVING POWER OF OPTICAL INSTRUMENTSDefinition of resolving power, Rayleigh’s criterion of resolution, Resolving power of a grating, Resolving power of a prism, Resolving power of telescope, Resolving power of a microscope.

UNIT 5: ULTRASONICSUltrasonic waves, Production of ultrasonic waves by (1) Magnetostriction method and (2) Piezo-electric effect, Detection of ultrasonic waves using various methods like Piezo electric detector, Kundt’s tube method, Sensitive flame method and Thermal detector method, Properties of ultrasonic waves, Application of ultrasonic waves.

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UNIT 6: LASERLight amplification by stimulated emission of radiation (LASER), Types of emission like Spontaneous and stimulated emission, Population inversion, Pumping system, Active system, The Ruby laser, Uses of Laser.

UNIT 7: X-RAYSDiscovery of X-rays, Production of X-rays, Origin of X-rays, Properties of X-rays, Diffraction of X-rays, Bragg’s law, Bragg’s X-ray spectrometer, Bragg’s law and crystal structure, Crystallography by powder method, Practical application of X-rays which include Industrial applications, Engineering applications, Scientific research applications and Medical applications.

UNIT 8: RADIOACTIVITYNature of nuclear radiations, Characteristic properties of radioactive radiations, Properties of α-rays, β-rays and γ-rays, Natural and artificial radioactivity, Laws of radioactive disintegration, Half life period, Mean life time of radioactive elements, Measurement of rate of decay and half life, Isotopes and Isobars, Artificial radioactivity, Artificial transmutation or artificial disintegration, Nuclear reactions, Bohr’s theory of nuclear reactions, Transmutation equations and Q value of a nuclear reaction, Types of nuclear reactions.

UNIT 9: STRUCTURE OF THE NUCLEUS AND PARTICLE ACCELERATORSNuclear constituents, Proton-Neutron theory of nuclear composition, General properties of nucleus like mass, charge, radius, density, spin and quantum state, Atomic mass unit and mass energy equivalence, Mass defect and packing fraction, The mass difference and nuclear binding energy, Nuclear forces, Nuclear models like (1) Liquid drop model and (2) The shell model, The Lawrence cyclotron, The Betatron.

UNIT 10: NUCLEAR FISSION AND FUSIONNuclear fission, Theory of nuclear fission, Energy released in nuclear fission, The chain reaction and its types like Uncontrolled and Controlled chain reaction, Thermo-nuclear reactions or Nuclear fusion, Distinction between fission and fusion, Atom bomb or nuclear bomb, Stellar energy, The Proton-Proton cycle, The Carbon-Nitrogen cycle, Nuclear reactors and its components like (1) Reactor core, (2) Reactor reflector, (3) Reactor moderator, (4) Reactor coolant, (5) Reactor control and (6) Reactor shielding.

UNIT 11: THERMO-ELECTRICITYSeebeck effect, Variation of thermoelectric E.M.F. with temperature, Thermo-electric series, Measurement of thermoelectric E.M.F., Law of intermediate metals or law of successive contacts, Law of intermediate or successive temperatures, The Peltier effect, Thomson effect, Total E.M.F. in thermocouple, Thermoelectric power, Expression for Peltier and Thomson coefficients, Thermo-electric power, Application of thermo-electric effect like in thermopile, Thermometers.

UNIT 12: MAGNETIC FIELDThe Magnetic Field, Time Varying Magnetic Field, Betatron, Induction and Relative Motion, Diamagnetic materials, Paramagnetic Materials, Ferromagnetic materials, Properties of above materials, Nuclear Magnetism, The 3 magnetic vectors (B, H and M), Faraday’s law, The Hall effect.

Reference:1) Engineering Physics: R.K.Gaur and S.L. Gupta (Dhanpat Rai and Sons)2) Fundamentals of Physics: Halliday and Resnick (Wiley Eastern Limited)

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ENGINEERING DRAWING

UNIT 1: INTRODUCTIONIntroduction to the engineering drawing subject, Need of the subject, Drawing instruments like Drawing board, Drafter, Setsquares and Roller scale.

UNIT 2: LINES, LETTERING AND DIMENSIONINGLines and their thickness, Types of line, Outlines, Margins, Dimension lines, Projection lines, Section lines, Border lines, Hidden lines, Centre lines, Cutting plane lines, Types of lettering, Types of dimensioning, its terms and notations, Arrow head, Extension line, Placing of dimensions and its types.

UNIT 3: CURVES USED IN ENGINEERING PRACTICEIntroduction to various curves, Conic sections, Ellipse and its construction using various methods like Arcs of circle method, Concentric circle method, Loop of thread method, Oblong method and Trammel method, Methods of drawing normal and tangents to an ellipse, Parabola and its construction using various methods like Rectangle method, Tangent method and parallelogram method, Hyperbola and its construction.Cycloidal curves: Cycloid and its construction, Normal and tangent to a cycloid curve, Epicycloids, Hypocycloid and its construction, Normal and tangent to Epicycloids and Hypocycloid, Involutes of a circle, a square and a pentagon and their construction, Normal and tangent to an involute.

UNIT 4: PROJECTION OF POINTSIntroduction, Projection of point situated in (1) First quadrant, (2) Second quadrant, (3) Third quadrant and (4) Fourth quadrant.

UNIT 5: PROJECTIONS OF STRAIGHT LINESIntroduction, Projection of line (1) Parallel to one or both planes, (2) Perpendicular to one of the planes, (3) Inclined to one plane and parallel to other, (4) Inclined to both the planes and (5) Contained by a plane perpendicular to both planes, True lengths of straight line and its inclination with the planes, Traces of a line and methods of determining traces of a line, Traces of line projections which are perpendicular to xy, Position of traces of a line.

UNIT 6: PROJECTIONS OF PLANESTypes of planes like perpendicular planes and oblique planes, Traces of planes, Projections of planes parallel to one of the reference planes (1) when the plane is parallel to the horizontal plane, (2) when the plane is parallel to vertical plane, Projections of planes inclined to one reference plane and perpendicular to the other, Projections of planes inclined to one reference plane and perpendicular to other, Projections of oblique planes.

UNIT 7: ORTHOGRAPHIC PROJECTIONIntroduction, Principle of projection, Methods of projection like first angle projection and third angle projection, Orthographic projection, Planes of projection, Reference line, Symbols for methods of projection.

UNIT 8: ISOMETRIC PROJECTIONIntroduction, Isometric axes, Isometric lines and planes, Isometric scale, Isometric drawing or view, Isometric graph, Isometric drawings of plane figures, Isometric drawing of prisms and pyramids, Isometric drawing of cylinders, Isometric drawing of cones, Isometric drawing of sphere, Isometric drawing of complex blocks.

UNIT 9: SCREW THREADSDefinitions of various technical terms used in screw threads like Crest, Root, Flank, Angle, Depth, Nominal diameter, Major diameter, Minor diameter, Pitch, Lead, Different types of screw threads like Unified thread, Metric thread, Whitworth thread, British standard fine (B.S.F.), Sellers thread, British association (B.A.) thread, Square thread, Acme thread, Knuckle thread and Buttress thread,

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Conventional representation of internal and external threads, Multiple-start threads, Right-hand and Left-hand threads.

UNIT 10: SCREWED FASTENINGSTypes of nuts like hexagonal nut and square nut, Special nuts like Flanged nuts, Cap nut, Dome nut, Cylindrical or capstan nut, Ring nut and Wing nut, Washers, Types of stud like Simple stud, Square stud and Collar stud, Hexagonal headed bolt, Methods of preventing rotation of a bolt while screwing a nut on or off it using bolts like Square headed bolt, Square headed bolt with square neck, Cheese headed or Cylindrical bolt, Cup or round headed bolt, Cup headed bolt with square neck, T-headed bolt, Countersunk-headed bolt, Hook bolt, Headless taper bolt, Eye bolt, Lifting eye bolt, Tap bolt or cap-screw and Stud-bolt, Set screws and their types like Round or cup, Cylindrical or cheese, Fillister, Countersunk, Rounded countersunk, Socket head, Square head, Grub screw and Collar screw, Screw ends and their types like Oval, Conical, Flat, Cup, Half dog and Full dog, Locking arrangements for nut which includes Lock-nut or check nut, Split-pin, Slotted nut, Castle nut, Sawn nut or Wiles nut, Simmond’s lock nut, Penn or ring or grooved nut, Stop-plate or locking plate and using spring washer, Foundation bolts like Eye foundation bolt, Rag foundation bolt, Lewis foundation bolt and Cotter foundation bolt.

UNIT 11: INTRODUCTION TO RIVETED JOINTSIntroduction, Advantages and disadvantages of riveted joints, Different forms of rivet heads like Snap or cup head, Pan head, Conical head, Countersunk head, Rounded countersunk head and Ellipsoid head, Failures of riveted joints, Dimensioned of riveted joints, Types of riveted joints like Lap joint and Butt joint.

UNIT 12: COUPLINGS AND JOINTS AND KEYSBox or Muff coupling, Flange coupling, Protected type flanged coupling, Universal coupling, Cotter joint, Socket and spigot joint, Cotter joint with sleeve, Strap joint with gib and cotter, Pin or Knuckle joint, Gib headed key, Saddle key, Flat key, Peg key, Single and double headed key, Cone key, Methods of prevention of rotation of brasses like using brasses with snug and using brasses of square or hexagonal shape.

Reference:1) Engineering drawing: N.D.Bhatt, V.M. Panchal (Charotar Publishing Agency)2) Machine Drawing: N.D.Bhatt, V.M. Panchal (Charotar Publishing Agency)

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MATERIAL SCIENCE

UNIT 1: ENGINEERING REQUIREMENT OF MATERIALSCriteria for selecting a specific material from various available materials for various engineering applications on basis of mechanical properties.

UNIT 2: METALLIC MATERIALSProperties, Applications of imperfections in crystals, Elastic and Plastic deformation of metallic materials, Crystal structure and the types of crystal structures like Simple cubic, Body centre cubic, Face center cubic and Hexagonal close pack, Determination of Coordination number, Number of atoms in unit cell and Atomic packing factor for each and every crystal structure given above, Direction and plane of unit cell, Defects in crystal like (1) Point defects (Schottky defect, Frenkel defect, Interstitial defect and Vacancies like Mono-vacancy, Di-vacancy, Tri-vacancies and Poly-vacancies), Burger vector and closed burger circuit, Slip plane and slip direction, (2) Line defects or 1-Dimensional defects (Edge dislocations like Positive edge dislocations and negative edge dislocations and Screw dislocations like Right hand screw dislocations and Left hand screw dislocations) and (3) Area defects or 2-Dimensional defects (Stacking faults), Failure analysis of metallic components, Creep curve (Strain vs. Time), Creep failure investigation, Fracture failure investigation, Transition temperature range, Fatigue failure investigation, Fatigue test, Endurance limit.

UNIT 3: COLD WORKING AND ANNEALINGEffects of grain sizes on annealing, ASTM (American Standard Testing Method) Grain size number, Grain boundary and Grain size, Heat treatment of metals, Strain hardening, Various methods of heat treatment like Annealing, Normalizing and Hardening, Annealing phases like Recovery, Re-crystallization and Grain growth, Alloying elements and its treatment on properties of single and double phase, Permanent deformations using Forging process, Extrusion process, Rolling process and Drawing process, Properties found in materials like Ductility and Malleability, Ductile fracture and Brittle fracture.

UNIT 4: CERAMIC MATERIALSCeramic materials like brick, concrete, cement, refractories and glasses, Their structure and application, Classification of ceramic materials in terms of Oxides, Carbides, Nitrides, Borides, Sulphides and Phosphides, General characteristics of ceramic materials, Varieties of ceramic materials used for engineering purpose like Asbestos, Glass wool, Silicon carbide abrasives, Lubricants, Mosaic tiles and Glazed tiles, Types of glass like Silicon oxide glass and Vycor glass.

UNIT 5: ORGANIC MATERIALSMonomer, Polymer, Copolymer, Polymerization mechanisms like Addition polymerization and Condensation polymerization, Hydrocarbon polymers, Properties and applications of Plastic, Rubber, Resin and Wood, Thermo plastic, Thermosetting plastic, Aging and Vulcanization process, Chemical behavior (Oxidation, Scission, Degradation and Combustion) and electrical behavior (Conductivity, Dielectric constant) of organic materials, Cross linking and Branching in organic materials, Types of Polymers like Linear polymer, Frame work polymer, Allotropic transformation or polymorphism, Examples of crystalline carbon like graphite and diamond.

UNIT 6: COMPOSITE MATERIALSProperties of composite materials, Present status of composite materials in our country, Classification of composite materials like Microscopic composite material, Macroscopic composite material and Fiber reinforced composite material, Brief description of Metal Matrix composite (MMC), Polymer matrix composite (PMC) and Ceramic matrix composite (CMC), Elementary characteristics of composite materials, Typical examples of above composite

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materials and their uses, Characteristics and uses of Wood as a composite materials.

UNIT 7: ELECTRICAL AND MAGNETIC MATERIALSElectrical properties, Electrical conductivity, Band theory, Types of materials like Conductors, Insulators, Semiconductors, Intrinsic semiconductors, Extrinsic semiconductors and Super conductors, Applications of all materials described above, Magnetic behavior of a material, Soft and Hard Magnetic materials, Diamagnetic and paramagnetic materials, Dielectric properties of materials.

UNIT 8: STABILITY OF MATERIALS IN SERVICE ENVIRONMENTCorrosion, Oxidation, Thermal stability, Protection against corrosion using various techniques like Painting, Cathodic protection, Use of Inhibitors, Use of Proper design, Impressed voltage and Electroplating, Galvanic series, Types of corrosion like Uniform corrosion, Galvanic corrosion (Composition cell, Stress cell, Concentration cell) and Intergranular corrosion.

UNIT 9: NEW DEVELOPMENTS IN MATERIAL SCIENCELatest developments in material science like Superconducting materials, Metallic glasses, Glass fibers and Carbon fibers, Elementary characteristics and examples of above materials.

UNIT 10: MECHANICAL PROPERTIES OF MATERIALSDefinition of Stress, Strain and Young’s modulus of elasticity, Tensile test performance on Mild steel, Aluminium and Cast iron, Types of deformation like elastic and plastic deformation, Yield stress, Ultimate Tensile Stress (UTS), Breaking stress, Stress-strain curve, True stress, True strain, Engineering stress, Engineering strain, Toughness, Toughness or Impact tests like Charpy test and Izod test, Hardness tests like Brinell test, Rockwell test, Vicker test and Knoop hardness test, Poisson’s ratio, Modulus of shear, Bulk modulus.

UNIT 11: SOLUTIONSolid solution, Types of solid solution like Substitutional Solid Solution (SSS) and Interstitial Solid Solution (ISS), Ordered Solution, Humerothery rules for formation of substitutional solid solution.

Reference:1) Elements of Materials science and Engineering: Vanvlack (Prentice Hall India)

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FUNDAMENTALS OF CIVIL ENGINEERING

SECTION 1: SURVEYING, CHAINING AND STRUCTURESUNIT 1: MEASUREMENT OF A DISTANCE

Direct measurement, Instruments for measuring the distance like the Chains and tapes, Types of chains like Metric surveying chain, Steel band chain, Gunter’s chain, Revenue chain and the Engineer’s chain (for the measurement in feet), Testing and Adjusting the chain, Measurement using various types of tapes like the Cloth or Linen tape, Metric woven metallic tape, Metric steel tape and Invar tape, Instruments for marking stations like the Pegs, Ranging rods and Ranging poles, Methods of Ranging of survey line like Direct method (Ranging by eye and Ranging by Line ranger) and Indirect method, Chaining a line, Unfolding the chain, Method of chaining, Reading the chain, Folding the chain, Correction of distance and area measured, Errors in chaining like the Compensating errors and the Cumulative errors, Mistakes in chaining.

UNIT 2: CHAIN SURVEYINGLand Surveying and its purposes, Methods of land surveying like Triangulation survey and the Traversing, Chain surveying, Surveying stations, Selection of stations, Base line, Check line, Tie line, Offsets, Oblique offsets, Long offsets, Instructions for noting information in field book, Instruments for setting out right angles like Open cross staff, French cross staff, Adjustable cross staff, Prism square and Optical square, Methods of erecting perpendicular to a chain line from a point on it and from a point outside it, Methods of running a parallel line to an accessible line through a given point and to an inaccessible line through given point, Obstacles in chaining like (1) Chaining free but vision obstructed , (2) Chaining obstructed but vision free and (3) Chaining and vision both obstructed, The conventional symbols to be used in field notes.

UNIT 3: CHAIN AND COMPASS TRAVERSINGTraverse and its type like Closed traverse and Open traverse, The Prismatic compass, Method of using Prismatic compass and its centering, leveling and observing the bearings (readings), The surveyor’s compass, Bearings of lines like The True meridian and The Magnetic meridian, Designation of bearings in systems like the Whole circle bearings and Quadrantal system bearings, The reduced bearings, The fore and back bearings, Calculation of angles from bearings when whole circle bearings are given and when Reduced bearing are given, The included angles, The Local attraction, The closing error, Graphical adjustment of closing error in closed traverse, The magnetic needle, Dip of the needle, Magnetic declination, Precautions in using the compass, Errors in compass observations like the Instrumental errors, Errors in manipulation and sighting, Errors due to external influences, Testing the compass.

UNIT 4: LEVELLINGDefinitions of Level surface, A level line, Horizontal plane, Horizontal line, Vertical line, Vertical plane, Vertical angle, Datum surface, Elevation, Difference in elevation, Bench marks, Line of collimation, Axis of telescope, Backsight, Foresight, Intermediate sight, Change point, Height of instrument, Focusing and parallax, The Levels and its types like The Dumpy level, The Wye level, The modern level and the Automatic level, The Leveling staff, Folding type 4-meter leveling staff, Graduation of this staff, Invar precision leveling staff, Adjustments of level like temporary adjustments, Leg adjustment, Leveling up, Focusing of eye piece, Focusing of object glass, Bench marks and its types like the G.T.S (great trigonometrical survey) benchmarks, Permanent bench marks, Arbitrary bench marks and Temporary bench marks, Change points, Principles of leveling like the Simple leveling, Differential leveling, Reduction of levels using collimation system and the rise and fall system.

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UNIT 5: MINOR INSTRUMENTS USED IN SURVEYINGConstruction and use of minor instruments like the Box sextant, The Abney level and Clinometer.

UNIT 6: BUILDING CONSTRUCTIONFoundations and their requirements, Types of Foundations like Shallow foundations and Deep foundations, Shallow foundations like Spread footing, Combined footing, Strap footing and Mat footing, Deep foundations like Pile foundations, Pier foundations, Well foundations and Deep strip (square or rectangular) foundations, Various brick portions like Full brick, Half bat, Three Quarter bat, Beveled bat, Queen closer, King closer, Beveled closer and Mitred closer, Bonds in brick work like Stretcher bond, Header bond, English bond and Flemish bond, Different types of flooring like Mud flooring, Muram flooring, Brick flooring, Flagstone flooring, Cement Concrete flooring, Terrazzo flooring, Mosaic flooring, Tiled flooring, Timber flooring and Marble flooring, Definition of different terms like Batten, Hinge, Ledge, Frame, Holdfasts and Style, Types of Doors like (1) Battened and Ledged door, (2) Battened, ledged and braced door, (3) Battened, ledged and framed door, (4) Battened, ledged, braced and framed door, (5) Framed and paneled door, (6) Glazed or sash door, (7) Flush door, (8) Louvered door, (9) Wire gauged door, (10) Revolving door, (11) Sliding door, (12) Swing door, (13) Collapsible steel doors, (14) Rolling steel shutter door, (15) Mild steel sheet door, (16) Metal covered plywood doors and (17) Hollow metal door, Types of windows like (1) Fixed window, (2) Pivoted window, (3) Double hung window, (4) Sliding window, (5) Casement window, (6) Sash window, (7) Louvered window, (8) Metal window, (9) Bay window, (10) Clerestory window, (11) Corner window, (12) Dormer window, (13) Cable window, (14) Lantern window, (15) Skylights, (16) Ventilators and (17) Combined window and ventilator.

SECTION 2: BUILDING MATERIALSUNIT 7: STONES

Classification of Rocks into three categories like (1) Geological rocks, (2) Physical rocks and (3) Chemical rocks, Types of geological rocks like Igneous rocks (Plutonic rocks, Hypabassal rocks and Volcanic rocks), Sedimentary rocks (Residual rocks, Sedimentary rocks, Chemical rocks and Organic rocks) and Metamorphic rocks (Thermal rocks, Cataclastic rocks, Dynamo-thermal rocks and Plutonic rocks), Types of Physical rocks like Stratified rocks, Unstratified rocks and Foliated rocks, Types of Chemical rocks like Siliceous rocks, Argillaceous rocks and Calcareous rocks, Sources of stones, Rock forming minerals like Augite, Chlorite, Felspar, Hornblende, Mica, Olivine, Plagioclase, Quartz, Serpentine, Calcite, Magnesite, Dolomite, Glauconite, Limonite, Gypsum and Anhydrate, Textures or structures of rocks like Compact Crystalline, Conglomerate, Foliated, Glassy, Granular crystalline, Pisolitic, Porous granular, Porphyritic and Vesicular, Fracture of rock like Earthy, Even, Fibrous, Hackly, Conchoidal and Uneven, Uses of stones like in Structures, Face-work, Paving and as Basic Material, Natural bed of stones and its importance, Test for stones like (1) Acid test, (2) Attrition test, (3) Crushing test, (4) Crystallization test, (5) Freezing and thawing test, (6) Hardness test, (7) Impact test, (8) Microscopic test, (9) Smith’s test and (10) Water absorption test, Qualities of a good building stone like its Crushing strength, Appearance, Durability, Facility of dressing, Fracture, Hardness, Percentage wear, Resistance to fire, Seasoning, Specific gravity, Texture, Toughness Index, Water absorption and Weathering, Stone quarrying, Quarrying using Hand tools (Digging, Heating and Wedging), Channeling machine and Blasts, Tools for blasting like Dipper, Jumper, Priming needle, Scraping spoon and Tamping bar, Materials for blasting like Detonators, Explosives and Fuses, Precautions to be kept while blasting, Dressing of stones

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and various finishes like (1) Axed finish, (2) Boasted or droved finish, (3) Chisel draughted margins, (4) Circular finish, (5) Dragged or combed finish, (6) Furrowed finish, (7) Moulded finish, (8) Hammer dressed finish, (9) Plain finish, (10) Polished finish, (11) Punched machine, (12) Reticulated finish, (13) Rubbed finish, (14) Scabbling finish, (15) Tooled finish, (16) Self-faced or rock-faced finish, (17) Sunk finish and (18) Vermiculated finish, Deterioration of stones due to Alternate wetting and drying, due to Frost, Impurities in atmosphere, Living organisms, Movements of chemicals, Rain water, Nature of mortar, Vegetable growth, Wind and Temperature variations, Methods for Retardation of decay of stones, Preservation of stones using Coal Tar, Linseed oil, Paint, Paraffin, Solution of alum and soap and Solution of Baryta, Types of Artificial stones and their advantages.

UNIT 8: BRICKSComparison of brickwork and stonework, Composition of good brick earth and its constituents like Alumina, Silica, Lime, Oxide of Iron and Magnesia, Harmful ingredients in brick earth like Lime, Iron pyrites, Alkalies, Pebbles, Vegetation and Organic matter, Classification of brick earth like (1) Loamy, mild or sandy clay, (2) Marls, chalky or calcareous clay and (3) Plastic, strong or pure clay, Steps in Manufacture of bricks like Clay preparation, Moulding, Drying and Burning, Clamps and Kilns for burning of bricks, Qualities of good bricks, Strength of bricks, Tests for bricks for determination of its (1) Absorption, (2) Crushing strength, (3) Hardness, (4) Presence of soluble salts, (5) Shape and size, (6) Soundness and (7) Structure, Classification of bricks as First class, Second class, Third class and Fourth class bricks, Uses of Bricks, Coloring of bricks using various methods, Size and weight of brick, Shape of bricks like (1) Bullnose, (2) Channel, (3) Coping, (4) Cownose, (5) Curved sector, (6) Hollow, (7) Paving, (8) Perforated and (9) Purpose-made bricks, Fire clays, Fire bricks like Acidic bricks, Basic bricks and Neutral bricks.

UNIT 9: LIMECalcination, Hydraulicity, Lime, Quick Lime, Settling, Slaked lime, Slaking, Classification of binding materials like Air binding, Hydraulic binding and Autoclave binding materials, Sources of lime, Constituents of limestone like Clay, Soluble silica, Magnesium carbonate, Alkalies, Metallic oxides, Sulphates, Iron and Pyrites, Classification of lime as Fat lime, Hydraulic lime and Poor lime, Manufacture of fat lime and related processes like Collection of limestone, Calcination of limestone and Staking of burnt lime, Manufacture of natural hydraulic lime using kankar, Manufacture of Artificial hydraulic lime, Conversion of soft limestone to artificial hydraulic lime, Conversion of hard limestone to artificial hydraulic lime, Precautions to be taken in handling lime like Fire hazard and Contact with water, Uses of lime, Tests for limestone to determine its various Physical properties.

UNIT 10: CEMENTComparison between Cement and lime, Composition of ordinary cement, Properties of cement, Cement ingredients like Lime, Silica, Alumina, Calcium Sulphate, Iron Oxide, Magnesia, Sulphur and Alkalies, Harmful constituents of cement like K2O, MgO and Na2O, Setting action of cement and related materials like Tri-calcium aluminate, Tetra calcium alumino ferrite, Tri-calcium silicate and Di-calcium silicate, Selection of site for cement factory depending upon Climatic conditions, Labour, Market, Power, Raw materials and Transport facilities, Manufacture of ordinary cement, Packing of cement, Types of cement manufacturing mills like Ball mills and Tube mills, Field tests for cement to determine its Colour, Physical properties, Presence of lumps and Strength, Laboratory tests for cement to determine its Fineness, Compressive strength, Chemical composition, Tensile strength, Consistency, Setting times and Soundness, Storage of cement and affecting parameters like Moisture, Period of

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storage, Piles, Quality of cement, Removal of cement and Storage sheds, Uses of cement, Varieties of cement like (1) Acid resistance cement, (2) Blast furnace cement, (3) Coloured cement, (4) Expanding cement, (5) High alumina cement, (6) Hydrophobic cement, (7) Low heat cement, (8) Puzzolana cement, (9) Quick setting cement, (10) Rapid hardening cement, (11) Sulphate resistant cement and (12) White cement.

UNIT 11: MORTARSand, Natural sources of sand like Pit sand, River sand and Sea sand, Classification of sand, Bulking of sand, Properties of good sand, Functions of sand in mortar like Setting of mortar, Shrinkage of mortar, Strength due to addition of sand and Increase in Surface area due to addition of sand, Tests for sand, Substitutes for sand, Classification of mortars depending on (1) Bulk density (Heavy and Lightweight mortar), (2) Kind of binding material (Lime, Surkhi, Cement, Gauged and Gypsum mortar), (3) Nature of application (Brick laying and Finishing mortar) and (4) Special mortars (Fire resistant, Light weight, Packing, Sound absorbing and X-ray shielding mortar), Properties of good mortar mix and mortar, Preparation of various mortars like Lime mortar, Surkhi mortar, Cement mortar and Gauged mortar, Uses of mortar, Precautions in using mortar like action of Sea water, Frost and Sprinkling of water, Workability of mortar, Selection of mortar, Tests for mortar for determining its Crushing strength, Tensile strength and Adhesiveness to building units.

UNIT 12: CEMENT CONCRETEProperties of cement concrete, Materials used in R.C.C. work like Cement, Aggregates, Steel and Water, Effect of sea water on Strength and Corrosion of reinforcement (Steel) of concrete, Proportioning of various ingredients of concrete using various methods like Arbitrary method, Fineness modulus method, Minimum void method, Maximum density method and Water-cement ratio method, Grading of aggregates, Water-cement ratio, Determination of workability of concrete using Slump test, Importance of bulking of sand in concrete preparation, Mixing, Transporting and Placing of concrete, Curing of concrete, Purpose of curing, Period of curing, Effects of improper curing, Methods of curing, Water proofing of cement concrete, Types of concrete like Coloured concrete, Lightweight concrete and No-fines concrete, Pre-cast concrete and its advantages and disadvantages.

UNIT 13: TIMBERStanding timber, Rough timber, Converted timber, Uses of timber, Classification of trees like Exogenous trees (Hard woods and Soft woods) and Endogenous trees, Macrostructure and Microstructure of trees, Felling of trees, Method and Season of felling of trees, Defects in timber due to (1) Conversion (Chip mark, Diagonal grain, Torn grain and Wane), (2) Fungi (Blue stain, Sap strain, Brown rot, Wet rot, White rot, Dry rot and Heart rot), (3) Insects (Beetles, Marine borers and Termites), (4) Natural forces (Burls, Callus, Chemical stain, Coarse grain, Dead wood, Druxiness, Foxiness, Knots, Rind galls, Shakes, Wind cracks, Twisted fibers, Upsets and Water stain), and (5) Seasoning (Bow, Honey combing, Cup, Warp, Twist, Split, Check, Collapse, Radial shakes and Case hardening), Qualities of good timber, Timber characteristics like (1) Appearance, (2) Colour, (3) Defects, (4) Durability, (5) Elasticity, (6) Fibers, (7) Fire resistance, (8) Hardness, (9) Mechanical wear, (10) Shape, (11) Smell, (12) Sound, (13) Strength, (14) Structure, (15) Toughness, (16) Water permeability, (17) Weathering effects, (18) Weight and (19) Working conditions, Decay of timber, Preservation of timber using various preservatives like Ascu treatment, Chemical salt, Coal tar, Creosote oil and Paints, Application of preservative using various methods like Brushing, Charring, Hot & Cold open tank, Spraying, Injecting under pressure, Dipping and Steeping, Requirements of good preservative, Fire-resistance of timber using special chemicals and using Sir Abel’s process, Seasoning of timber, Methods and

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Advantages of seasoning of timber, Free moisture and Bound moisture, Natural and Kiln seasoning, Storage of timber, Market forms of timber like (1) Batten, (2) Baulk, (3) Board, (4) Deal, (5) End, (6) Log, (7) Plank, (8) Pole, (9) Quartering and (10) Scantling, Industrial timber forms like (1) Veneers, (2) Plywood, (3) Fiberboards, (4) Impreg timbers and (5) Compreg timbers, Advantages of Plywood, Advantages of timber construction.

UNIT 14: STEELManufacture of steel using various processes like Bessemer process, Cementation process, Crucible steel process, Duplex process, Electric process and Open-hearth process, Uses of steel, Factors affecting physical properties of steel like its Carbon content, Presence of impurities and Heat treatment process, Magnetic properties of steel and effect of Carbon, Silicon, Sulphur, Phosphorous and Manganese on it, Defects in steel like (1) Cavities, (2) Cold shortness, (3) Red shortness and (4) Segregation, Market forms of steel like (1) Angle section, (2) Channel section, (3) Corrugated sheets, (4) Expanded metal, (5) Flat bars, (6) I sections, (7) Plates, (8) Ribbed-torsteel bars, (9) Round bars, (10) Square bars and (11) T sections, Mechanical treatment of steel like Drawing, Forging, Pressing and Rolling, Heat treatment processes like Annealing, Case hardening, Cementing, Cyaniding, Hardening, Nitriding, Normalizing and Tempering, Properties of Mild steel and Hard steel.

UNIT 15: GLASSClassification and Composition of glass, Properties of glass, Types of glass like Soda-lime glass, Potash-lime glass, Potash-lead glass and Common glass, Manufacture of glass, Treatment of glass like Bending, Cutting, Opaque making and Silvering, Coloured glass, Special varieties of glass like (1) Bullet-proof glass, (2) Fiber glass, (3) Float glass, (4) Foam glass, (5) Glass blocks, (6) Heat-excluding glass, (7) Obscured glass, (8) Perforated glass, (9) Safety glass, (10) Shielding glass, (11) Soluble glass, (12) Structural glass, (13) Ultra-violet ray glass and (14) Wired glass.

UNIT 16: PLASTICSPolymerization, Branched chain structures, Cross-linked structures, Linear structures, Networking structures, Addition polymerization, Condensation polymerization, Co-polymerization, Classification of plastics with respect to (1) Heating effects, (2) Structure and (3) Physical & Mechanical properties, Uses of plastics, Resins like Thermo-plastic and Thermo-setting resins, Moulding compounds like Catalysts, Fillers, Hardeners, Lubricants, Pigments, Plasticizers and Solvents, Fabrication methods which include Blowing, Calendaring, Casting, Laminating and Moulding, Properties of plastics like (1) Appearance, (2) Chemical resistance, (3) Dimensional stability, (4) Ductility, (5) Durability, (6) Electric insulation, (7) Finishing, (8) Fire-resistance, (9) Fixing, (10) Humidity, (11) Maintenance, (12) Melting point, (13) Optical property, (14) Recycling, (15) Sound absorption, (16) Strength, (17) Thermal property, (18) Weather resistance and (19) Weight, PVC pipes in buildings.

Reference:1) Building Construction: Bindra2) Surveying and Leveling: Kanitkar and Kulkarni (Pune Vidhyarthi Griha Prakashan)3) Text book of Building Construction: B.C. Punamia (Laxmi Publication)4) Engineering Materials: S. C. Rangwala (Charotar Publishing House)

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WORKSHOPS

UNIT 1: SMITHY WORKSHOPConverting a round bar into a square bar by heating it and then hammering it with hammer.

UNIT 2: CARPENTRY WORKSHOPConverting given pieces of wood into a wooden model which is provided by cutting, smoothening and fixing wooden pieces.

UNIT 3: MOULDING WORKSHOPUsing wet clay prepare a mould of given shape.

UNIT 4: DRILLING WORKSHOPConverting a given metal piece into a model provided, by cutting it, smoothening it and drilling it.

14

B.E. ISecond Semester Course

Subjects: Applied Maths – 2 Applied Physics – 2 Components and Devices Basic Electrical Engineering Engineering Mechanics Electrical Wiring & Drawing and Computer Fundamentals

15

APPLIED MATHS – 2

UNIT 1: MATRICESDefinition of a matrix, Special matrices like Row and Column matrices, Square matrix, Diagonal matrix, Singular and Non singular matrix, Unit matrix, Null matrix, Symmetric and Skew-symmetric matrix, Triangular matrix, Equality of matrices, Addition, Subtraction and Multiplication of matrices, Transpose of matrix, Adjoint of square matrix, Inverse of a matrix, Solution of linear system of equations by matrix inversion method, Rank of matrix, Elementary transformations of matrix, Gauss-Jordan method of finding matrix inverse, Normal form of matrix, Linear dependence, Consistency of linear system of equations, System of linear homogeneous equations, Linear and orthogonal transformation, Characteristic equation, Eigen vector and eigen values, Cayley Hamilton theorem, Complex matrix, Conjugate of a matrix, Hermitian matrix, Skew-hermitian matrix, Unitary matrix.

UNIT 2: ANALYTICAL GEOMETRYDirection ratios and direction cosines of a vector, Sphere: Definition of a sphere, Equation of sphere with given centre and radius, Equation of any sphere through the circle of intersection of sphere and a plane, Equation of tangent plane to a sphere, Orthogonal spheres.Cone: Definition of a cone, Vertex, Generator, Right circular cone, Equation of cone with given vertex and base circle, Semi vertical angle.Cylinder: Definition of a cylinder, Right circular cylinder, Equation of cylinder with given axis and base circle.

UNIT 3: PARTIAL DIFFERENTIATION AND ITS APPLICATIONSFunctions of two or more variables, Partial derivatives and its notations, Homogeneous functions, Euler’s theorem, Total derivative, Differentiation of implicit functions, Geometrical interpretation, Tangent plane to a surface, Normal to a surface, Change of variables, Jacobians, Taylor’s theorem for functions of two variables, Errors and approximations, Total differential, Maxima and minima of functions of two variables, Rules for finding maxima and minima values for function, Lagrange method of undetermined multipliers.

UNIT 4: VECTOR CALCULUSDifferentiation of vectors, Curves in space, Tangent and Normal to a plane, Velocity and acceleration, Scalar and vector point functions, Vector operator del, Del applied to scalar point functions i.e. Gradient, Geometrical interpretation of gradient, Directional derivative, Del applied to vector point function i.e. divergence (dot product) and Curl (cross product), Physical interpretation of divergence and curl, Del applied twice to point functions, Del applied to products of point functions.

UNIT 5: LAPLACE TRANSFORMSIntroduction to Laplace transforms, Definition of Laplace transform, Inverse Laplace transforms, First shifting theorem, Linearity property of Laplace transforms, Laplace transforms of derivatives, Solution of ordinary differential equations using Laplace transforms.

Reference:1) Higher Engg. Maths: Dr.B.S. Grewal (Khanna Publishers)2) Advanced Engg. Maths: Erwin Kreyzig (John Wiley and Sons)3) Advanced Engineering Mathematics: Wylie and Barret (McGraw Hill)

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APPLIED PHYSICS – 2

UNIT 1: WAVES AND PARTICLESWave and particle duality of radiation, Velocity of De-Broglie Waves and Wave velocity, Group velocity, Particle velocity, De-Broglie’s concept of matter waves, Properties of matter waves, Davisson and Germer’s electron diffraction experiment, G.P.Thomson experiment, Heisenberg’s uncertainty principle, Probability concept, Experimental illustration of uncertainty principle like Diffraction by single slit and Determination of position of particle by microscope, Equations of motion of matter waves, Schrödinger time independent wave equation, Schrödinger time dependent wave equation, Physical interpretation of wave function(Ψ), Solution of Schrödinger equation, Infinite square well, The free particle, Generation of infinite square well in three dimension, Particle in box, Energy levels of a particle enclosed in one dimensional potential box of infinite height, Penetration of potential barrier (tunneling in tunnel diode).

UNIT 2: STATISTICAL MECHANICSStudy and analysis of various statistics like Maxwell-Boltzmann Statistics, Bose-Einstein Statistics and Fermi-Dirac Statistics, Definition of Fermi Energy, Free electron theory of metals, Fermi energy for metals, Band theory of conduction electrons.

UNIT 3: CONDUCTIVITY OF METALSOhms law and relaxation time of electrons, Relaxation and collision time, Mean free path, Electron scattering and resistivity of metals, Superconductivity and applications.

UNIT 4: MECHANISM OF CONDUCTION IN SEMICONDUCTORS The Chemical bond in Silicon and Germanium and its consequences, The density of carriers in intrinsic semiconductors, The Energy gap, The conductivity of intrinsic semiconductors, Carrier density in N and P type semiconductors, Hall effect.

UNIT 5: MINORITY AND MAJORITY CARRIER DENSITIES IN SEMICONDUCTORSMinority and majority carrier densities in semiconductors, Types of current like Drift currents and diffusion currents, The Einstein relation between energy and mass, The Continuity equation for minority carriers.

UNIT 6: FIBRE OPTICSPrinciple types of Optical fibers, Advantages of Optical fibers over other communication methods, Structure of an Optical fiber, Types of Optical fibers like Step index fiber and Graded index fiber, Characteristics of fibers like Mode dispersion, Colour dispersion, Numerical aperture and Attenuation, Multimode and Monomode fibers, Communication line.

UNIT 7: LASERSPopulation inversion and Laser pumping, Two level and Three level Pumping system, Helium-Neon laser, Carbon dioxide laser, Ruby laser, Nd-YAG (Neodymium-Yttrium Aluminum Gas) laser and semiconductor laser, Argon ion laser, Applications of laser.

UNIT 8: THIN FILMSProduction of thin films, Vacuum evaporation technique and epitaxial growth, Vapour phase epitaxy, Liquid phase epitaxy and Molecular phase epitaxy, Applications like solar cell, Infrared detector, Thin film and Transistor, Photodiode.

UNIT 9: MOTION IN ELECTRIC FIELDForce acting on a charged particle, Equation of motion, The analogy between the motion of charged particles in electrostatic field and propagation of light beams in transparent media, Similarity law, Centered electron-optical system, The basic

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equation of electron optics for axially symmetric fields, Focusing in axially symmetric fields, The Helmholtz-Lagrange equation, The thin lens, Electron multiplier.

UNIT 10: MOTION IN A MAGNETIC FIELDMotion in uniform magnetic field, Axially symmetric magnetic fields, Short coil focusing, The Electron microscope, Motion in slowly varying magnetic field, Focusing in crossed electric and magnetic field, Strong focusing, Quadrupole lens.

UNIT 11: MOTION IN COMBINED FIELDSMotion of charged particles under effect of a uniform electric field and uniform magnetic field, General description of the motion of charged particles in combined fields, Electromagnetic separation of isotopes.

Reference:1) Introduction to atomic and nuclear physics: Arthur Baiser 2) Engineering Physics: R.K. Gaur and S.L. Gupta (Dhanpat Rai and Sons)3) Motion of charged particles in electric and magnetic fields: L.A. Antsimovich and S.Y.

Lukyanov, Mir Publishers, Russia4) Electrical Engineering materials: A.J. Dekkar5) Introduction to classical and modern optics: J.R. Meyer Arendt6) Introduction to atomic and nuclear physics: H. Semat and J.R.Albright Chapmann and

Hall

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COMPONENTS AND DEVICES

SECTION 1: COMPONENTSUNIT 1: PROPERTIES OF REAL WIRE AND CABLE

Conductivity of wire, Circular mils, Temperature effects and current capacity of wire, Insulation and voltage rating of wire, Arcing and ways to prevent it, Skin effect and stray inductance of wire, Proximity effect, Combating skin effect, Stray wiring capacitance.

UNIT 2: PROPERTIES OF REAL RESISTORSFixed resistor types like Carbon composition, Metal film and wire wound, Colour code for resistors, Resistor networks, Variable resistors types like Carbon composition potentiometer, Wire wound potentiometer, Multiturn potentiometer, Linear slider pots, Single turn trimmers, Gear actuated trimmers and Adjustable resistors, Resistor power ratings, Resistance tolerance and reliability ratings.

UNIT 3: PROPERTIES OF REAL CAPACITORSBasics of capacitor, Nonideal effects in capacitors like DC leakage, Dielectric loss, Dissipation factor, Tolerance, Temperature stability, Lead inductance and resonance, Real capacitor equivalent circuit, Calculation of capacitance, Capacitor construction, Mica and ceramic dielectric capacitors like Low-k ceramic and High-k ceramic capacitors, Temperature compensating ceramics, Paper and plastic-film capacitors, Electrolytic capacitors, Tantalum capacitors, Variable capacitors, Ganged capacitors, Trimmer and padder capacitors.

UNIT 4: PROPERTIES OF REAL INDUCTORSBasic inductance and reactance, Inductance, Reactance, Series and parallel reactances, Basic concepts of impedance, Real inductors like Air-core solenoid wound coils, Coils with open path magnetic cores, Coils with closed path magnetic cores, Toroidal inductors.

SECTION 2: DEVICESUNIT 5: TRANSDUCERS

Classification of transducers on basis of (1) Mathematical relationship, (2) Nature of element, (3) Electrical considerations and (4) Transduction process, Requirements of transducers like Opening range, Sensitivity, Resolution, High stability, Reliability, Good dynamic response and linearity, Strain and pressure gauges, Thermistors, Photoconductive transducers, Photovoltaic cell type transducers, Photoelectric type transducers, Linear variable differential transformer (LVDT).

UNIT 6: PRINTED CIRCUIT BOARDSWhere and why PCB’s are used, Type of material used for preparing PCB, Single sided PCB, Double sided PCB, Processes for making PCB like Layout drawing, Exposing, Developing, Etching, Cleaning, Tinning, Drilling and Soldering.

UNIT 7: SPEAKERS AND MICROPHONES (MICS)Principle of microphones, Carbon microphones, Capacitor microphones, Dynamic moving coil microphones and Fixed coil microphones, Moving coil loudspeakers like cone type and horn type loudspeakers.

UNIT 8: BATTERIESTypes of batteries like Primary batteries and Secondary batteries, Various types of secondary batteries like Lead-Acid batteries, Nickel-cadmium batteries, Dry batteries and Carbon-Zinc dry cell.

UNIT 9: CATHODE RAY OSCILLOSCOPE (CRO)Introduction to CRO, Basic principle, Basic block diagram of oscilloscope tube, Basic principle of signal display, Vertical amplifier, Horizontal deflecting system,

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Triggered sweep CRO, Trigger pulse circuit, Dual beam CRO, Lissageous patterns and measuring unknown frequency using Lissageous patterns.

UNIT 10: SPECIAL ELECTRONIC DEVICES AND THEIR CHARACTERISTICSLiquid crystal display, PN junction diode, I-V characteristics of PN junction diode, Tunnel diode and Zener diode with their band energy diagrams, Light emitting diode, Solar cell, Relays, Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Transfer characteristics of MOSFET in enhancement mode, Drain mode and depletion mode, Pinch off condition in FET, Junction Field Effect Transistor (JFET), Condition under which JFET serves as voltage controlled regulator.

Reference:1) Electrical Technology - 4: B.L. Theraja (S. Chand)2) Electronic devices and Instruments: H.S. Kalsi (Tata McGraw Hill)

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BASIC ELECTRICAL ENGINEERING

UNIT 1: NETWORK THEOREMSElectric circuits, Voltage divider method, Current divider method, Kirchoff’s law, Maxwell’s loop current method, Nodal Analysis, Nodal analysis with current source, Source conversion, Ideal constant voltage source, Ideal constant current source, Delta/Star and Star/Delta conversion, Various network theorems like Superposition theorem, Thevenin theorem, Reciprocity theorem, Norton’s theorem and Maximum power transfer theorem.

UNIT 2: CAPACITOR AND ITS CAPACITANCECurrent – voltage relationships in a capacitor, Charging of a capacitor, Time constant, Discharging of a capacitor.

UNIT 3: MAGNETISM AND ITS EFFECTSAbsolute and relative permeabilities of a medium, Laws of magnetic force, Field intensity, Magnetic potential, Flux per unit pole, Flux Density, Absolute and relative permeability, Intensity of magnetization, Susceptibility, Magnetic circuit, Composite magnetic circuit, Leakage flux, comparison between magnetic and electric circuits, Magnetization curves.

UNIT 4: ELECTROMAGNETIC INDUCTIONStatically induced E.M.F., Self-inductance and Coefficient of self-inductance, Mutual inductance and Coefficient of mutual inductance, Rise of current in an inductive circuit, Decay of current in an inductive circuit.

UNIT 5: A.C. FUNDAMENTALSGeneration of alternating voltages and currents, Equation of alternating voltages and currents, Simple and complex waveforms, Time period, Frequency, Amplitude, Different forms of E.M.F. equations, Phase and Phase difference, R.M.S. value of a complex wave, Average value, Form factor, Peak factor, R.M.S. and Average value of Half wave rectified alternating current, Vector representation of Alternating quantities, Analysis of A.C. through pure resistance alone, Analysis of A.C. through pure inductance alone, Analysis of A.C. through pure capacitance alone.

UNIT 6: SERIES A.C. CIRCUITSA.C. through resistance and inductance, Power factor, Active and Reactive components of circuit current, Types of power like Active, Reactive and Apparent power, Q-factor of coil, A.C. through resistance and capacitance, Resistance, Inductance and Capacitance (R-L-C) in series, Resonance in R-L-C circuits, Graphical representation of resonance, Resonance curve, Bandwidth of resonance curve.

UNIT 7: PARALLEL A.C. CIRCUITSMethods of solving parallel circuits like (1) Vector or phasor method, (2) Admittance method and (3) Complex or phasor algebra, Resonance in parallel circuits, Graphical representation of parallel resonance, Q-factor of parallel circuits.

UNIT 8: CIRCLE DIAGRAMSCircle diagrams of series circuits, Circle diagrams of circuits with Constant resistance but variable reactance, Circle diagram of circuits with Constant reactance and variable resistance.

Reference:1) Electrical technology, Part 1: B.L. Theraja (S. Chand)2) Electrical technology, Part 2: B.L. Theraja (S. Chand)

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ENGINEERING MECHANICS

SECTION 1: APPLIED MECHANICSUNIT 1: COMPOSITION AND RESOLUTION OF FORCES

Force, Characteristics of force like Point of application, Line of Action of force, Magnitude of force and Sense of force (Tensile or Compressive), Resolution of single force into components, Concurrent and Nonconcurrent Forces, Collinear and Non Collinear forces, Coplanar and Non Coplanar forces, Resultant force arising as a result of above types of forces, Law of Parallelogram of forces, Equilibrium and Equilibriant force, Analytical Conditions of equilibrium, Lami’s Theorem, Graphical method of determining the resultant of a system of coplanar forces, Moment about a point, Varignon’s Theorem, Types of Support like Simple support, Hinged support and Roller support, Types of loads like Uniform Distributed load (UDL) and Uniform Varying load (UVL), Determination of reaction at supports due to various force, Beams, Free Body diagrams of different systems.

UNIT 2: CENTRE OF GRAVITY AND CENTROIDCentroid of various geometrical shapes like Square, Rectangle, Triangle, Circle, Semicircle, Trapezium and Quarter circle, Centroid of built-up sections, Analytical and graphical methods of determining the Centroid, Moment of Inertia, Parallel Axes theorem, Polar Moment of inertia, Moment of inertial of various standard Sections.

UNIT 3: FRAMES AND TRUSSESDefinition of a perfect frame, Deficient frame, Redundant frame, Reactions at the supports, Analysis of a truss, Finding forces in members of frames using Method of joints and Method of sections, Graphical method of finding forces in members of frames, Finding Forces in various members of Plane Frames, Finding the direction of forces acting on each joint in Plane frames, Finding forces acting on different members of Space Frame.

SECTION 2: STRENGTH OF MATERIALSUNIT 4: STRESS AND STRAINS

Stress, Strain, Lateral Strain, Factor of safety, Volumetric strain, Hooke’s law, Bulk modulus, Poisson’s Ratio, Modulus of elasticity, Stress-Strain in case of bars with uniform cross sectional area, Stress-Strain in case of Composite bars (bars with variable cross sectional areas), Temperature stresses.

UNIT 5: TORSION IN CIRCULAR SHAFTTorque, Pure Torsion, Theory of Pure Torsion, Torsional Stresses and Strains, Shear stress, Torsional Section modulus, Torsional rigidity, Polar moment of inertia, Shear modulus, Power transmitted by a shaft, Stepped shafts (Shafts made by single material but with different cross sectional areas), Composite shafts (Shafts made by combination of different materials but constant cross sectional area for given material), Examples related to twisting moment in case of Solid shafts, Hollow shafts and shafts having varying diameter.

UNIT 6: CYLINDERS AND SPHERESDifference between Thin and Thick cylinders, Circumferential and Longitudinal stresses, Riveted cylindrical boilers, Radial pressure distribution, Thin spherical shells and Thick spherical shells.

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UNIT 7: RIVETED CONNECTIONSTypes of riveted joints like Lap and Butt joints, Failure of riveted joints, Tearing strength, Shearing strength, Bearing strength, Efficiency of a joint, Riveted joints in structural steel work, Chain riveting, Diamond riveting.

Reference:1) Engineering Mechanics - A textbook of Applied Mechanics: Ramamrutham (Dhanpat Rai

Publishers) 2) Mechanics of Structures: S.B. Junnarkar (Charotar Publishing House)3) Theory of Structures: R.S. Khurmi (S. Chand)4) Strength of Materials: Ramamrutham (Dhanpat Rai Publishers)

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ELECTRICAL WIRING AND COMPUTER FUNDAMENTALS

SECTION 1:UNIT 1: INTRODUCTION TO ELECTRICITY

Types of supply like AC supply and DC supply, Power stations like Thermal power station, Hydroelectric power station, Nuclear power plant, Gas turbine power plant, Wind power plant and Solar power plant, Transmission and Distribution of power, Transformers.

UNIT 2: TYPES OF WIRESTypes of wires based on conductors used like Copper conductor wire, Steel conductor wire, Aluminium conductor wire and Aluminium conductor with steel reinforcement wire, Types of wires based on Insulating materials used like Vulcanized Insulated Rubber (V.I.R.) wire, Tough Rubber Sheathed (T.R.S.) wire, Flexible wire, Weather proof wire, PVC wires and Lead Alloy Sheathed wire, Methods of measuring wire thickness like British standard wire gauge, American gauge and Standard wire gauge.

UNIT 3: WIRING SYSTEMSFactors to be considered while selecting a wiring system, Types of wiring systems like Wooden casing and capping wiring system, Wooden Batten wiring system, Cleat wiring system, Conduit wiring system and Lead sheath wiring.Various special wiring systems like Go-down wiring, Loop wiring, Staircase wiring and Tube light wiring,

UNIT 4: LIGHTING ACCESSORIESStudy of various lighting accessories like Fuse, Switches, Lamp holders, Fluorescent Tube holders, Ceiling Ross, Mounting block, Socket outlets and Plugs, Characteristics of fuse like max fusing current, fuse holder material and fusing element, Types of switches like Surface switch, Flush switch, Pull switch, Push button switch, Rotary switch, Quick break knife switch, Architrave switch, Iron clad water tight switch, Clad switch, Industrial iron clad switch, Types of lamp holders like Bayonet cap lamp holder, Goliath Edison screw lamp holder, Medium Edison screw lamp holder and Swivel lamp holder.

UNIT 5: EARTHING AND ITS TYPESWhy Earthing is required, Advantage of having Earthing, Definitions of various terms like Earthing conductor, Earthing lead, Sub main Earthing electrodes, Earthing continuity conductor, Rules related to Earthing defined by Indian Government, Types of Earthing like Earthing through water main, Pipe Earthing and Plate Earthing.

SECTION 2: COMPUTER FUNDAMENTALSUNIT 6: BASICS OF WINDOWS OS AND MICROSOFT OFFICE TOOLS

Overview of Windows operating system and various other related applications like Word pad, Notepad and Paint, Use of various functionalities of WordPad, Notepad and Paint, Overview of various MS office tools like MS word, MS excel and MS power point, Use of various functionalities of above tools.

UNIT 7: HTMLCreating a web page using Hyper Text Markup Language (HTML), Adding various effects to the web page created like colorful background, bold fonts, fonts with various sizes, etc., Creating links in web page.

24

B.E. IIFirst Semester Course

Subjects: Applied Maths – 3 Analog Electronics – 1 Computer Programming and Numerical Methods Electrical Machines – 1 Thermodynamics

25

APPLIED MATHS-3

UNIT 1: FOURIER SERIESIntroduction, Euler’s formulae, Expansion of a function in form of Fourier series, Conditions for a Fourier expansion (Dirichlet’s conditions), Functions which are piece wise continuous and their Fourier expansions, Even and odd functions and their Fourier expansions, Fourier expansions of even and odd periodic functions, Half range sine and cosine series.

UNIT 2: FUNCTIONS OF COMPLEX VARIABLEIntroduction to complex variables, Function of complex variable, Limit of a complex function, Continuity of a complex function, Derivative of complex functions, Cauchy-Riemann equations, Analytic functions, Necessary conditions for a function to be analytic, Harmonic functions, Orthogonal system, Complex integration, Line integral of complex function, Cauchy’s integral formula, Cauchy’s theorem and its inverse, An Arc, Simple arc, Simple closed curve, Simply connected domain, Multiply connected domain, Cauchey-Gomsat’s theorem, Derivative of Analytic function.

UNIT 3: INTEGRAL TRANSFORMSIntroduction, Definition of integral transforms, Fourier sine and cosine integrals, Complex form of Fourier integrals, Fourier integral representation of a function, Fourier transforms, Fourier sine and cosine transforms.

UNIT 4: MULTIPLE INTEGRALS AND ITS APPLICATIONSDouble integrals, Change of order of integration, Double integrals in polar and spherical co-ordinates, Triple integrals in polar, cylindrical and spherical coordinates, Application of multiple integrals in finding Area enclosed by plane curves, Volume of solids using double and triple integrals, Area of a curved surface, Calculation of mass, Centre of gravity of any plane surface and Moment of inertia of any surface.

UNIT 5: INDEFINITE INTEGRALSVarious functions like Beta functions, Gamma functions and Error functions, Relation between beta and gamma functions.

UNIT 6: VECTOR CALCULUSLine integral, Surface integral, Green’s theorem in plane, Stoke’s theorem, Volume integral, Divergence theorem, Solenoidal fields, Applications of Green’s, Stoke’s and Divergence theorem.

Reference:

1) Higher Engg. Maths: Dr. B.S. Grewal (Khanna Publishers)2) Advanced Engg. Maths: Erwin Kreyzig (John Wiley and Sons)3) Advanced Engineering Mathematics: Wylie and Barret (McGraw Hill)

26

ANALOG ELECTRONICS-1

UNIT 1: DIODES AND THEIR CHARACTERISTICSP-N Junction, Space charge region, Reverse and Forward bias, P-N Junction Diode, Currents in a diode like Forward conduction current, Reverse Saturation current and Electron diffusion current, Volt Ampere characteristics of diode, Cut-in voltage, Diode Resistance, Transition capacitance of a diode, Diffusion capacitance, Diode reverse recovery time, Zener and Avalanche breakdown, Zener diode, Tunnel Diode, Varacter diode, Photodiode, Light Emitting Diode (LED), Schottky diode and Step recovery diode, Applications of all above diodes.

UNIT 2: DIODE CIRCUITS, RECTIFIERS AND FILTERSLoad line, Dynamic characteristic, Transfer characteristic, Clipping circuits, Clamping circuits, Rectifiers like Half wave rectifier, Full wave rectifier and Full wave Bridge rectifier, Expressions of voltage (A.C. and D.C.), current (A.C. and D.C.), Regulation, Efficiency, Ripple factor, Peak inverse voltage and Transformer utilization factor for all above rectifiers, Filters and its need, Series inductor filter, Shunt capacitance filter, L-C filter, R-C filter, C-L-C or PI filter, Bleeder resistance and its importance, Zener diode shunt regulator, Transistor series voltage regulator, Half wave Voltage doublers, Full wave voltage doublers, Voltage tripler and quadrupler circuits.

UNIT 3: POWER AMPLIFIERSSeries fed Class A amplifiers, Transformer coupled Class A amplifier, Class B amplifiers like Push Pull Amplifiers, Transformer coupled push pull amplifiers, Complementary symmetry push pull amplifiers and Quasi complementary push pull amplifier, Power distribution in class A amplifiers, Power efficiency, Maximum AC power to load, Crossover distortion, Distortions in amplifier, Power Transistor heat sinking, Thermal analogy of power amplifier.

UNIT 4: FIELD EFFECT TRANSISTORS (FET)Junction FET, Terminals like Source, Drain and Gate, Channel, Construction and operation of FET, Various biasing configurations of FET like Fixed bias configuration, Self-bias configuration and Voltage Divider Biasing, Static characteristics of JFET, JFET Drain characteristics, JFET characteristics with external bias, Transfer characteristics of JFET, DC Biasing of JFET, Advantages of FET.

UNIT 5: SMALL SIGNAL ANALYSIS OF FET FET small signal model, Graphical determination of gm, The input and output impedance of FET, FET AC equivalent circuit, JFET Fixed bias configuration, JFET Self bias configuration, JFET voltage divider configuration.

UNIT 6: BIPOLAR JUNCTION TRANSISTORBipolar junction transistor (BJT), Terminals like Base, Emitter and collector, Transistor biasing, Transistor currents, Transistor circuit configurations, Common base configuration, common collector configuration, Common emitter configuration, Relation between α (Collector and Emitter current ratio) and β (Collector and base current ratio), Relation between transistor currents, Leakage currents in transistor, Thermal runaway, Common base static (Input and output and transfer) characteristics, Common emitter static characteristics, Cutoff and Saturation points, Load line, Active region, Cutoff region, Saturation region, Q point and maximum undistorted output, Need for biasing transistor, Stability factor, Different methods for transistor biasing like Fixed current bias, Emitter feedback bias, Collector feedback bias, Collector and Emitter feedback bias, Emitter bias with two supplies, Voltage divider bias, DC bias with voltage feedback.

UNIT 7: BJT AND JFET FREQUENCY RESPONSE

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Low frequency response of BJT amplifier and of FET amplifier, Capacitance that exists between input and output terminals of amplifier known as Miller effect capacitance, High frequency response of BJT amplifier and of FET amplifier.

UNIT 8: TRANSISTOR EQUIVALENT CIRCUITS AND MODELSHybrid model, h-parameters, How to find h-parameters, Typical values of transistor h-parameters, Interrelation between h-parameters of different transistor configurations.

UNIT 9: CATHODE RAY OSCILLOSCOPE (CRO)CRO-construction and principle, Operation of CRO and its block diagram, Cathode Ray Tube, Voltage sweep operation, The Sawtooth sweep signal, Synchronization and triggering, Multitrace operations like ALTERNATE mode and CHOP mode, Measurement of time period and amplitudes using CRO, Lissageous patterns and measurements of frequency using it.

Reference:1) Integrated Electronics: Jacob Millman and Christopher Halkias (Tata McGraw Hill)2) Electronic Devices and Circuit Theory: Robert Boylestead (Prentice Hall India)3) Electrical Technology - Part 4: B.L. Theraja (S. Chand)4) Principles of Electronics: V.K. Mehta (S. Chand)5) Electronic Principles: Malvino (Tata McGraw Hill)

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COMPUTER PROGRAMMING AND NUMERICAL METHODS

SECTION 1: COMPUTER PROGRAMMINGUNIT 1: OVERVIEW OF C

Introduction to programming, Importance of C language, Basic structure of C programs, Programming style, Execution of a programme written in C language.

UNIT 2: CONSTANTS, VARIABLES AND DATA TYPESCharacter set, C tokens, Keywords and identifiers, Constants, Variables, Data types, Declaration of variables, Assigning values to variables, Defining symbolic constants.

UNIT 3: OPERATORS AND EXPRESSIONSVarious operators used in C language like Arithmetic operators, Relational operators, Logical operators, Assignment operators, Increment and decrement operators, Conditional operator, Bitwise operator and Special operators, Arithmetic expressions, Evaluation of expressions, Precedence of arithmetic operators, Type conversion in expressions, Operator precedence and its associativity, Mathematical functions.

UNIT 4: MANAGING INPUT AND OUTPUT OPERATIONSIntroduction, Reading and Writing a character, Formatted output, Formatted output.

UNIT 5: DECISION MAKING AND BRANCHING AND RELATED OPERATORSDecision making with ‘IF’ statement, Simple IF statement, the IF...ELSE statement, Nesting of IF...ELSE statements, The ELSE IF ladder, The SWITCH statement, the (...?... :...) operator, The GOTO statement.

UNIT 6: DECISION MAKING AND LOOPING IN C PROGRAMMELooping in a C programme using (1) WHILE statement, (2) The DO… WHILE statement and (3) The FOR statement, Jumps in loop.

UNIT 7: ARRAYS IN C PROGRAMMINGDeclaration of arrays in C programme, 1-dimensional arrays, 2-dimensional arrays, Initializing of 1-dimensional and 2-dimensional arrays, Multidimensional arrays.

UNIT 8: HANDLING OF CHARACTER STRINGSDeclaring and initializing string variables, Reading strings from terminal, Writing strings to screen, Arithmetic operations on characters, putting strings together, Comparison of two strings, String handling functions, Table of strings.

UNIT 9: USER DEFINED FUNCTIONSNeed for used defined functions, A multi function program, The from of C function, Calling a function, Category of functions like (1) functions with No arguments and no return values, (2) functions with Arguments but no return values and (3) functions with Arguments with return values, Handling of non integer functions, Nesting of functions, Recursive function, Function with arrays, Scope and lifetime of variables in functions.

UNIT 10: STRUCTURES Structure definition, Giving values to members, Structure initialization, and comparison of structure variables, Arrays of structures, Arrays within structures, and Structures within structures, Structures and functions.

UNIT 11: POINTERSUnderstanding pointers, Accessing the address of a variable, Declaring and initializing pointers, Accessing a variable through its pointer, Pointer expressions, Pointer increments and scale factor, Pointers and arrays, Pointers and character strings, Pointers and functions, Pointers and structures.

SECTION 2: NUMERICAL METHODSUNIT 12: NUMERICAL METHODS

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Algorithms and C programs of following numerical methods: (1) Shipley inversion method, (2) Gauss elimination method, (3) Gauss Siedel method, (4) Gauss Jordan method, (5) L-U factorization method or triangularisation method, (6) Simpson’s 1/3 rule, (7) Simpson’s 3/8 rule, (8) Trapezoidal method and (9) Newton-Raphson method.

Reference:1) Programming in Ansi C: E Balagurusamy (Tata McGraw Hill)2) Numerical methods in C: E Balagurusamy (Tata McGraw Hill)3) Numerical methods: B.S. Grewal.4) Let Us C: Yashwant Kanitkar (BPB publications)

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ELECTRICAL MACHINES-1

SECTION 1: AC MACHINESUNIT 1: POLYPHASE CIRCUITS

Generation of polyphase voltages, Phase sequence, Interconnection of three phases in Star (Y) and Delta connection, Voltages and currents in star connection, Voltages and currents in delta connection, Balanced star to delta and delta to star conversion, Power measurements in 3-phase circuits, Three wattmeter method, Two wattmeter method (Balanced or unbalanced load), Variation in wattmeter readings, Leading power factor, Power factor under balanced load, Measurement of Reactive volt-amperes with two wattmeters and with one wattmeter.

UNIT 2: 1-PHASE TRANSFORMERWorking principle of transformer, Transformer construction, Types of transformers (Core type and shell type), Elementary theory of ideal transformer, E.M.F. Equation of transformer, Transformer on no load, Transformer on load, Transformer with winding resistance and leakage reactance, Equivalent circuit of transformer, Vector diagram of transformer, Total exact and approximate voltage drop in transformer, Transformer tests (Open circuit and Short circuit test), Regulation of transformer, Sumpner or Back to Back test, Losses in a transformer, Efficiency of transformer and condition for maximum efficiency, All day efficiency, Auto transformer, Conversion of two winding transformer into a auto transformer, Parallel operation of single phase transformer.

UNIT 3: 3-PHASE TRANSFORMERSIntroduction, Star-Star connection, Delta-Delta connection, Star-Delta connection, Delta-Y connection, Open delta (V-V) connection, Power supplied by V-V connection, Scott connection, T-T connection, Three phase to Two phase conversion and vice versa.

SECTION 2: DC MACHINESUNIT 4: D.C. GENERATORS

Generator principle, Simple loop generator, Practical generator, Parts of practical generator, Coil span, Pitch of winding, Back pitch, Front pitch, Resultant pitch, Types of winding like Lap winding and Wave winding, Types of generators like Separately excited generators, Self excited generators, Shunt wound generators, Series wound generators and Compound wound generators, E.M.F. equation of a generator, Iron losses in armature, Losses in a D.C. generator, the Mechanical efficiency, the Electrical efficiency, the Commercial efficiency, Conditions for maximum efficiency. Characteristics of a D.C. generator, Voltage build up of a shunt generator and its conditions, External and Internal characteristics of a D.C. generator.

UNIT 5: ARMATURE REACTION AND COMMUTATIONArmature reaction, Effects of Armature reaction, Demagnetizing and cross magnetizing conductors, Compensating windings, Interpoles.

UNIT 6: D.C. MOTORPrinciple of working of a Motor, Comparison of generator action and motor action, Back EM.F and its significance, Voltage equation of a motor, Condition for maximum power, Armature torque and Shaft torque of motor, Types of motors like series motors, shunt motors and compound motors (cumulative and differential), Characteristics of motors, Losses and efficiency of motors.

UNIT 7: SPEED CONTROL OF D.C. MOTORSFactors controlling motor speed, Speed control of shunt motors using Flux control method, Armature control method and Voltage control method, Speed control of series motors using flux control methods by (1) using Field diverters, Armature diverter, Tapped field control and Paralleling field coils, and (2) varying series

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resistance in series motors, Necessity of starter, Three point starter, Swinburne’s test and Back to Back test on motors.

Reference:1) Electrical Technology, Part 1, 2: B.L.Theraja (S Chand) 2) Electrical Machines: Parker and Smith

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THERMODYNAMICS

UNIT 1: BASIC CONCEPTSIntroduction to the subject, Working medium, Phase of a substance, Pure substance, System and surroundings, Properties of thermodynamic systems and its boundary, Isolated system, Closed system, Open system, Thermodynamic state, Process, Macroscopic and microscopic views, Continuum concept.

UNIT 2: ENERGYEnergy in storage, Mechanical energy, Internal energy, Energy in transition like Work, Compression and Expansion work, Heat and its mode of transfer like Conduction, Convection and Radiation, Enthalpy, Chemical energy, Nuclear energy.

UNIT 3: STATE PARAMETERSBasic parameters of the state like (1) Pressure, (Atmospheric or Barometric pressure, Normal pressure) and (2) Temperature, The Pressure Gauges, The Vacuum Gauges, The Liquid Manometers, Thermal equilibrium, Zeroth law of thermodynamics, Temperature scales, Thermodynamic equilibrium, Derived properties like the Specific heat, Flow work, Internal energy, Enthalpy and Entropy, Transport properties like Viscosity, Thermal conductivity and Diffusivity, Intensive and Extensive properties, Intrinsic and Extrinsic properties, State function (an exact differential).

UNIT 4: THERMODYNAMIC STATE EQUATIONSPerfect and quasi perfect gases, Basic laws and equations of state for perfect gas, The Isothermals, Liquids, Vapours and Real gases, Amagat’s isothermals, Kinetic theory of gases, Van der waal’s equation of state (volume correction and pressure correction), Thomson’s wave, Constants of Van der waal’s equation in terms of critical parameters, Compressibility factor, Compressibility chart, Generalized compressibility chart, Reduced Van der waal’s equation, Locus of minima of Van der waal’s isothermals on Amagat’s Diagram, Defects of Van der waal’s equation.

UNIT 5: THE FIRST LAW OF THERMODYNAMICSJoule’s experiment, The First Law of thermodynamics, Perpetual motion machine of First kind (PMMC1), Limitations of First law, Different types of energy equations like Specific heat equation, Non flow energy equation, Steady flow energy equation and Steady flow to non flow energy equation, Steady flow process where no external work is performed, Steady flow process with no heat transfer, Throttling.

UNIT 6: THE SECOND LAW OF THERMODYNAMICS AND ENTROPYReversibility and irreversibility, Types of irreversibility like Mechanical irreversibility, Chemical irreversibility and Thermal irreversibility, Different statements of Second law of thermodynamics, Heat engine, Kelvin-Plank statement, Perpetual motion machine of second kind (PMMC2), Ideal refrigerator, Heat pump, Practical refrigerator, Equivalence of Kelvin-Plank and Clausius statements, Carnot engine and Carnot refrigerator, Carnot theorem and corollaries, Temperatures on thermodynamic scale, The absolute zero of temperature, Entropy, Mathematical expression of the second law of thermodynamics in terms of entropy, Principle of increase of entropy, Entropy of universe, Temperature-Entropy diagrams, Characteristics of Entropy.

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UNIT 7: GENERAL THERMODYNAMIC RELATIONSHIPSThe Maxwell’s four energy relations, Specific heats Cp and Cv, Difference between specific heats Cp and Cv, Ratio of specific heats γ= Cp / Cv, Compressibility and Bulk modulus, The three T.ds equations.

UNIT 8: GAS PROCESSESIntroduction, Representation of gas processes on p-v and T-s diagrams, Constant volume or Isochoric process, Constant pressure or Isobaric process, Constant thermal or Isothermal process, Hyperbolic process, Adiabatic and Isentropic processes, Polytrophic processes, Free expansion, Throttling process.

UNIT 9: POWER PRODUCING SYSTEMSIntroduction, Carnot vapour cycle, Rankine cycle, Modified Rankine cycle, Mean effective power, Work done, Power, Different types of efficiencies, Internal combustion engine, Otto cycle (Constant volume) engine, Diesel cycle (Constant pressure) engine, Semi-diesel engine (Dual cycle engine), Joule Brayton cycle.

UNIT 10: POWER ABSORBING SYSTEMSIntroduction, Compressor, Reciprocating air compressors, Single stage air compressor neglecting clearance volume and work done in it, Capacity, Power, Efficiencies, Rotary Air compressors like the Centrifugal air compressor and the Axial flow compressor, Refrigerator and Refrigeration, refrigerating effects and units of refrigeration, Air refrigerating systems like the Reverse Carnot cycle, Bell Coleman cycle, Vapor compression refrigeration system.

Reference:1) Applied Thermodynamics-1: R.C. Patel (Acharya Book Depot)2) Engineering Thermodynamics: P.K. Nag (Tata McGraw Hill)

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B.E. IISecond Semester Course

Subjects: Applied Maths – 4 Analog Electronics – 2 Theory of Networks and Lines Electrical Machines – 2 Digital Systems

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APPLIED MATHS-4

UNIT 1: PARTIAL DIFFERENTIAL EQUATIONSIntroduction, Formation of partial differential equations, Linear equations of first order, Solution of Lagrange’s linear equations, Charpit’s method for solving non-linear partial differential equations, Homogeneous linear equations with constant coefficients, Rules for finding the complementary functions and the particular integral.

UNIT 2: APPLICATIONS OF PARTIAL DIFFERENTIAL EQUATIONS Applications of partial differential equations in solution of one-dimensional wave problems, one-dimensional heat flow problems and two-dimensional heat flow problems (Laplace’s equation).

UNIT 3: LAPLACE TRANSFORMSIntroduction, Definition of laplace and inverse laplace transforms, Laplace transforms of derivatives, Transforms of integrals, Transforms of functions having terms of n power of t i.e. tn, Transforms of functions which are divided by t, Convolution theorem, Laplace transforms using convolution theorem, First and second shifting property, Laplace transforms of Unit step function (Heaviside’s unit step function), Laplace transforms of Unit impulse function (Dirac delta function), Laplace transforms of Periodic functions, Applications of laplace transforms of above functions in solving ordinary and partial differential equations.

UNIT 4: DIFFERENCE EQUATIONSIntroduction to difference equations, Definition of a difference, Formation of a difference equation, Order of a difference equation, Linear difference equations, Rules for finding complementary function and particular function for a linear difference equation with constant coefficients.

UNIT 5: TRANSFORMATION AND CONFORMAL MAPPINGSTransformations like Translation (w=az+b), Rotation (w=az), Magnification (rotation with a>1), Contraction (rotation with a<1), Inversion (w=1/z) and Reflection, Bilinear transformation (az+b/cz+d), Fixed points of bilinear transformations, Conformal mapping, Transformation w=ez, Transformations like w=z2, w=sin z and w=cos z.

UNIT 6: SERIES EXPANSION AND RESIDUE THEORYTaylor’s series, Laurent’s series and expansion, Zeroes of analytic function, Poles of analytic function, Isolated point, Singular point, Isolated singular point, Essential singular point, Residues, Evaluation of complex integrals using residues, Evaluation of Real integrals using residue theory.

UNIT 7: SPECIAL FUNCTIONS (BESSEL’S AND LEGENDRE’S FUNCTION)Bessel’s functions, Properties and results related to Bessel’s functions, Generating function of Bessel’s functions.Legendre’s polynomial, Rodrigue’s formula, Generating function for Legendre’s polynomial, Properties and results related to Legendre’s functions.

Reference:1) Higher Engineering Maths: Dr. B.S. Grewal (Khanna Publishers)2) Advanced Engineering Mathematics: Wylie and Barret (McGraw Hill)

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ANALOG ELECTRONICS-2

UNIT 1: OSCILLATORSFundamental principle of oscillators, Working of oscillators, Barkhausan’s criteria, Types of oscillators like R-C Phase shift oscillator, Wein Bridge oscillator, Colpitts oscillator, Hartley oscillator and Tuned collector oscillator.

UNIT 2: CAPACITIVE RESISTIVE (CR) CIRCUITSIntroduction to RC circuits, RC Circuit operation, RC Circuit equations, Circuit time constant, Constant rate charging, Rise time and Fall time, Equation of voltage across the charging capacitor, Equation of charging current of a capacitor.

UNIT 3: TRANSISTOR SWITCHING AND INVERTERSIntroduction to transistors, Ideal Transistor Switch, Practical Transistor switch, Transistor switching times like On time (Delay time, Rise time) and Off time (Storage time, Fall time), Improving the switching times using speed up capacitor, Direct coupled inverter, Designing an inverter circuit with square wave input and for a given collector current and output amplitude, Capacitor coupled inverter circuits like Normally on inverter and Normally off inverter.

UNIT 4: SCHMITT TRIGGER CIRCUITSTransistor Schmitt trigger circuit, Designing the Schmitt trigger circuit for the Upper trigger point, Designing for both the Upper trigger point and the Lower trigger point, Analyzing Schmitt trigger circuits for Upper trigger point and Lower trigger point, Output input characteristics, Hysteresis in case of Schmitt trigger circuits.

UNIT 5: RAMP GENERATORSRC Ramp generator and its design, Constant current ramp generators like Bipolar transistor constant current ramp generator and its design, UJT Relaxation oscillators and its design, Transistor Bootstrap ramp generator and its design.

UNIT 6: MONOSTABLE AND ASTABLE MULTIVIBRATORSCollector coupled Monostable multivibrator, Triggering Monostable multivibrators, Astable multivibrators like Collector coupled Astable multivibrator and Emitter coupled Astable multivibrator.

UNIT 7: BISTABLE MULTIVIBRATORSTransistor collector coupled Bistable multivibrator and its design and analysis, Emitter coupled Bistable multivibrator, Bistable multivibrator triggering like Asymmetrical and Symmetrical collector triggering, Symmetrical, Asymmetrical and Collector-steered base triggering.

UNIT 8: FEEDBACK AMPLIFIERSTypes of Amplifiers like Voltage amplifiers, Current amplifiers, Trans-conductance amplifiers and Trans-resistance Amplifiers, Concept of feedback, Amplifier with and without feedback, Different circuits of feedback amplifiers like Mixer network, Sampling network and Feedback network, Gain of amplifier with and without feedback, Advantages of negative feedback, Types of feedback amplifiers like Voltage series feedback amplifiers, Current series feedback amplifiers, Voltage shunt feedback amplifiers and Current shunt feedback amplifiers, Sensitivity factor, Properties of negative feedback, Input and output resistance of feedback amplifier, Analysis of all above type of feedback amplifier.

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UNIT 9: STABILITY, SINGLE POLE, DOUBLE POLE AND THREE POLE TRANSFER FUNCTIONSTilt of a square wave, Single pole transfer function, Double pole transfer function, Root locus of two pole transfer function in complex plane, Damping factor, Response of an amplifier to a step input, Overshoot, Undershoot, Damped period, Settling time, Three pole system, Root locus of three pole transfer function, Analysis of multipole feedback amplifier, Dominant pole.

UNIT 10: HYBRID PI (π) MODELAnalysis of Voltage shunt feedback amplifier and Current series feedback amplifier using hybrid pi model.

UNIT 11: WIDEBAND AMPLIFIERSR-C coupled amplifiers and its low frequency equivalent model, High frequency model for a single common emitter R-C coupled amplifier, Frequency response of transistor stage and short circuit (load resistor is zero) common emitter current gain, Current gain with resistive load, Analysis of Transistor amplifier taking practical source (with some output impedance) into account, Gain bandwidth product, Transient response of a common emitter stage, Cascaded common emitter stages, Rise time of cascaded stages, Flat top response, Low frequency compensation and High frequency compensation.

UNIT 12: TUNED AMPLIFIERSClassification of tuned amplifiers, Capacitively coupled single tuned amplifier, Inductively coupled single tuned amplifier, Double tuned amplifier, Disadvantages of single tuned amplifier, Advantages of staggered tuned circuits.

Reference:1) Integrated Electronics: Jacob Millman and Christopher Halkias (Tata McGraw Hill)2) Solid State Pulse Circuits: David Bell (Prentice Hall India)3) Foundation of Electronics: G.K. Mithal (Khanna publishers)4) Pulse, Digital and Switching Waveforms: Jacob Millman and Herbert Taub (Tata

McGraw Hill)5) Foundations of Electronics: D Chattopadhyay, P.C. Rakshit, B. Saha, Purkait

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THEORY OF NETWORKS AND LINES

SECTION 1: NETWORKSUNIT 1: LOOP AND NODAL ANALYSIS

Simplifying and solving the complicated circuits using the loop and nodal analysis, Finding the loop currents using the loop analysis method, Finding the nodal voltages using the nodal analysis method.

UNIT 2: TWO PORT NETWORKDefinition of two port network and its parameters like h (hybrid) – Parameters, g (inverse hybrid) – Parameters, a (transmission) – Parameters, b (inverse transmission) – Parameters, z (impedance)-Parameters and y (conductance) – Parameters, Inter-conversion between these parameters, Reciprocal and symmetrical network, Input and output impedance in terms of all of the above parameters, Twin T network and its notch frequency, Bridge network, Lattice network, Ladder network, Finding all above parameters for all the different types of networks, T and PI network, Interconnection between these all networks, Bartlett’s bisection theorem, Image parameters.

UNIT 3: SERIES RESONANCE AND PARALLEL ANTIRESONANCESeries resonance, Phasor diagram of series R-L-C circuit, Reactance and impedance curves of a series R-L-C circuit, Variation of current and voltages with frequency in a series R-L-C circuits, Selectivity and bandwidth, Condition for maximum selectivity or least bandwidth, Quality factor or Q factor, Selectivity of series R-L-C circuit with frequency variable, Selectivity of series R-L-C circuit with capacitance variable, Selectivity of series R-L-C circuit with inductance variable.Parallel resonance or antiresonance, Impedance of parallel tuned circuit at resonance and at frequency near resonance, Selectivity and bandwidth of parallel tuned circuit, Maximum impedance with capacitance, inductance and frequency variable, Effect of source impedance on sharpness of resonance curve, Condition for maximum impedance, Currents in antiresonant circuits, Condition for least bandwidth or highest selectivity, Resonance for a circuit having resistance in both of its parallel branches, Reactance curves.

UNIT 4: IMPEDANCE TRANSFORMATION AND COUPLED CIRCUITSTransformation of impedances with tapped resonant circuit, Reactance L sections for impedance transformation, Image impedances, Reactance matching, Reactance T networks for impedance transformation.Coupled circuits, Mutual inductance, Coefficient of coupling, Equivalent T network for the magnetically coupled circuit, Ideal transformer, Air gap transformers.

UNIT 5: FILTERSThe Neper, The Decibel, Characteristic impedance of symmetrical networks, Propagation constant, Filter fundamentals, Types of filters like constant k type filters (low pass, high pass, band pass, band elimination) and m-derived filters (low pass, high pass, band pass, band elimination), Basic terms relating the filter like Cut off frequency, pass band and stop band, Behavior of characteristic impedance, Study and design of following filters (1) Constant k Low Pass filter, (2) Constant k High Pass filter, (3) Constant k Band Pass filter, (4) Constant k Band Elimination filter, (5) m-derived Low Pass filter, (6) m-derived High Pass filter, (7) m-derived Band Pass filter and (8) m-derived Band Elimination filter, Advantages of m-derived filter over the constant k filter, Composite filters and their design, Half terminating sections for constant characteristic impedance over whole pass band.

UNIT 6: ATTENUATORS Introduction to attenuators, Symmetrical and asymmetrical attenuators, Symmetrical attenuators like (1) Symmetrical T Attenuators, (2) Symmetrical Pi

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Attenuators, (3) Symmetrical Bridge-T Attenuators and (4) Symmetrical Lattice Attenuators, Design of all above symmetrical attenuators, Asymmetrical attenuators like (1) Asymmetrical T Attenuator, (2) Asymmetrical L Attenuators, (3) Asymmetrical Pi Attenuators and (4) Asymmetrical L attenuator working between two equal impedances with given loss, Design of all above asymmetrical attenuators.

UNIT 7: EQUALIZERSInverse network, Two terminal equalizers, Constant resistance equalizers, Full series equalizer, Bridge Attenuation equalizer, Bridged phase equalizer, Lattice attenuator and Phase equalizer

SECTION 2: TRANSMISSION LINESUNIT 8: INTRODUCTION TO TRANSMISSION LINES

Transmission line-introduction, Types of cables, Distributed parameters, Primary constants of a transmission line like series resistance, series inductance, shunt conductance and shunt capacitance, Characteristic impedance, Equivalent circuit of transmission line in terms of primary constants, Line of cascaded T sections, Propagation constant (γ) of a line, Velocity of propagation, General equation of a transmission line, Physical significance of the above equations of transmission line, Distortions in a transmission line like frequency or amplitude distortion (α) and Phase or delay distortion (β), The distortion less line and condition for a line to be distortion less, Line of low distortion, The telephone cable, Inductance loading of telephone cable to make it distortion less, Types of loading like uniform loading and lumped loading, Campbell’s equation for a loaded line.

UNIT 9: REFLECTIONS IN A TRANSMISSION LINEEquations of Line which is not terminated in characteristic impedance, Reflections in line not terminated in characteristic impedance, Reflection in open circuited line, Reflection in short circuited line, Reflection coefficient, Input impedance, Transfer impedance, Reflection factor, Reflection loss, Insertion loss.

UNIT 10: LINE AT RADIO FREQUENCIESConstants for a line of zero dissipation, Voltages and currents on a dissipation less line when the line is terminated by (1) Open circuit, (2) Short circuit, (3) Characteristic impedance, (4) Impedance greater than characteristic impedance and (5) Impedance smaller than characteristic impedance, Standing waves, Standing wave ratio (SWR), Input impedance of the dissipation less line, Input impedance of open and short circuited lines, Minimum and maximum values of resistive impedance in terms of standing wave ratio and characteristic impedance, Power and impedance measurement on lines, Reflections losses on the unmatched (not terminated in characteristic impedance) line, The eighth-wave line, The quarter-wave line, The half-wave line, The Exponential line for impedance transformation, Single stub impedance matching on a line, Smith chart for a transmission line and its applications, Single stub matching using smith chart, Constants for a line of small dissipation, Voltages and currents on a line with small dissipation, Open and short circuit impedances when considering dissipation, Quarter and half wave lines of small dissipation, Double stub impedance matching (no theory, only smith chart).

Reference:1) Networks, Lines and Fields: John D. Ryder (Prentice Hall of India)2) Network Analysis: G.K. Mithal (Khanna publishers)3) Network Analysis: Van Valkenberg (Prentice Hall of India)

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ELECTRICAL MACHINES-2

UNIT 1: INDUCTION MOTORInduction motor, General principle, Construction, Types of induction motors like Squirrel cage induction motor and Slip ring induction motor, Production of rotating magnetic field, Why does the rotor rotate, Slip, Frequency of Rotor current, Relation between torque and rotor power factor, Starting torque of squirrel cage and slip ring induction motor, Condition of maximum starting torque, Effect of change in supply voltage on starting torque, Rotor e.m.f. under running conditions, Torque under running conditions, Condition for maximum torque under running conditions, Rotor torque and breakdown torque, Relation between torque and slip, Effect of change in supply voltage on torque and speed, effect of changes in supply frequency on torque and speed, Ratio of full load torque and maximum torque, Ratio of starting torque and maximum torque, Torque speed curve and characteristics of induction motor, Power stages in an induction motor, Torque developed by an induction motor, Torque, mechanical power and rotor output, Induction motor Torque equation, Synchronous watts, variation in rotor current.

UNIT 2: STARTERS AND CIRCLE DIAGRAMS (INDUCTION MOTOR)No load test, Blocked rotor test, Construction of circle diagram, Maximum quantities, starting of induction motor with starters like Primary resistors starter, Star delta starter, Auto transformer starter (squirrel cage induction motor) and Rotor resistance starter (slip ring induction motor), Speed control of induction motor using various techniques like variation in number of poles, variation in frequency and variation in input voltage.

UNIT 3: ALTERNATORSBasic principle, Stationary armature, Details of construction, Types of Alternators like Salient pole type and Cylindrical rotor type, Rotor Damper windings, Speed and frequency, Armature windings, Concentric or Chain winding, Two layer winding, Wye and Delta connections, Short pitch winding, Pitch factor or Chording factor, Distribution or Breadth or Winding or Spread factor, Equation of induced E.M.F., Effect of harmonics on pitch and distribution factor, Factor affecting alternator size, Alternator on load, Synchronous reactance, Vector diagram of a loaded alternator, Voltage regulation, Determination of voltage regulation by synchronous impedance method, Synchronizing of alternators, Synchronizing current, Synchronizing power, Alternators connected to Infinite Bus Bars, Synchronizing Torque, Effect of load on synchronizing power, Parallel operation of two Alternators.

UNIT 4: SYNCHRONOUS MOTORSSynchronous motor, Principle of operation of synchronous motor, Method of starting a synchronous motor, Synchronous motor with different excitations, Synchronous motor on load with constant excitation, Effect of increased load with constant excitation, Power flow within synchronous motor, Effect of changing excitation with constant load, Different torques of a synchronous motor, Power developed by a synchronous motor, Various conditions for maxima, Effect of excitation on armature current and power factor, Hunting or surging, Comparison between synchronous and induction motor, Applications of synchronous motor.

Reference:1) Electrical Technology: B.L. Theraja (S Chand)

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DIGITAL SYSTEMS

UNIT 1: NUMBER SYSTEMSThe Decimal number system, The Binary number system, Counting in Binary, Binary to Decimal and Decimal to Binary conversion, Binary Addition, Binary subtraction, Representation of signed numbers, The Octal number system, Octal to binary and Binary to Octal conversion, Octal to Decimal and Decimal to Octal conversion, Octal addition, Octal subtraction, The Hexadecimal Number system, Binary to Hexadecimal and Hexadecimal to Binary conversion, Decimal to Hexadecimal and Hexadecimal to decimal conversion, Octal to hexadecimal and Hexadecimal to octal conversion, Hexadecimal Addition, Hexadecimal subtraction.

UNIT 2: BINARY CODESWeighted and Non weighted codes, The 8421 BCD code, The Excess-3 (XS-3) code, The Gray code, Binary to Gray and Gray to binary conversion, Error detecting codes, Error correcting codes, The 7-bit hamming code.

UNIT 3: LOGIC GATESThe AND gate, The OR gate, The NOT gate, Universal gates like NAND and NOR gates, The Exclusive-OR (X-OR) gate, The Exclusive-NOR (X-NOR) gate, Realization of various gates in term of universal gates.

UNIT 4: BOOLEAN ALGEBRALogic operations like AND, OR, NOT, NAND, NOR, X-OR and X-NOR operations, Axioms and laws of Boolean algebra, Commutative law, Associative law, Distributive law, De Morgan’s Theorem, Reduction of Boolean expressions, Converting AND/OR/NOT logic to NAND/NOR logic.

UNIT 5: KARNAUGH MAPExpansion of a Boolean expression to SOP form, Expansion of Boolean function to POS form, Mapping and Minimization of SOP and POS expressions, Two variable K-map, Three variable K-map and Four variable K-map, Reading of K-maps.

UNIT 6: COMBINATIONAL CIRCUITSThe Half Adder, The Full adder, The Half subtractor, The Full subtractor, Ripple Carry adder, The Look Ahead carry adder, Two’s complement addition and subtraction using parallel adders, BCD adder, 4 bit Binary Multiplier, Parity bit generators using logic gates, Code converters, Comparators, IC comparator, Decoders (3 to 8 line, 4 to 10 line), 4 to 16 decoder using two 3 to 8 decoders, BCD to Seven segment decoder, Encoders (Octal to Binary, Decimal to BCD), Keyboard encoders, Priority encoders, Decimal to BCD priority encoder, Octal to binary priority encoder, Multiplexers (2 input, 4 input, 8 input), The 16 input multiplexer using two 8 input multiplexers, Applications of Multiplexers (Logic function generator, Parallel to Serial data conversion, Multiplexing seven segment displays), Demultiplexer (1 to 4, 1 to 8).

UNIT 7: ANALOG TO DIGITAL AND DIGITAL TO ANALOG CONVERTERSParameters of Digital to analog converter, The R-2R ladder type DAC, The Weighted resistor type DAC, The Counter type A/D converter, The Tracking type A/D converter, The Flash type A/D converter, The Dual slope A/D converter, The successive approximation type ADC.

UNIT 8: FLIP FLOPS AND TIMING CIRCUITSLatch and Flip flops and difference between them, The S-R latch, Flip flops, The Edge triggered flip flops like S-R flip flop, D flip flop, J-K flip flop and T flip flop, The master slave (pulse triggered) flip flops like S-R flip flop, D flip flop, J-K flip flop, Applications of Flip flops like Counting, Serial to parallel and vice versa conversion and data storage.

UNIT 9: SHIFT REGISTERS

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Data transmission in shift registers, Serial in-serial out shift register, Serial in-parallel out shift register, Parallel in-serial out shift register, Parallel in-parallel out shift register, Bidirectional shift (shift left and shift right) register, Applications of shift registers like Ring counters, Serial to parallel and parallel to serial data conversion.

UNIT 10: COUNTERS AND OTHER SEQUENTIAL MACHINESAsynchronous counters, The Ripple up and Ripple down counter, Design of asynchronous counters, Synchronous counters, The synchronous up and down counters, Design of synchronous counters, The Ring counter and the Twisted ring counter, Serial Binary adder, The sequence detector, The Asynchronous sequential machine and its design.

UNIT 11: THE IC LOGIC FAMILIESThe transistor transistor logic (TTL), the Two input TTL NAND gate, the Totempole output, Open collector gates, Wired AND operation, Tristate TTL, The High speed Schottky TTL, The Emitter coupled logic (ECL), The Complementary metal oxide semiconductor (CMOS) logic.

UNIT 12: MEMORIESRole of memory in computer system, Read only Memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically erasable ROM (EEROM), Programmable logic array (PLA), Field programmable logic array (FPLA), Programmable array logic (PAL), PAL nomenclature.

Reference:1) Fundamentals of Digital Circuits: A. Anandkumar (Prentice Hall India)2) Computer architecture and Digital logic: Morris Mano (Prentice Hall India)3) Introduction to digital microelectronic circuits: Gopalan (Tata McGraw Hill)4) Digital Fundamentals: Floyd (Prentice Hall India)5) Digital Systems: Principles and Applications: Tocci (Prentice Hall India)

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B.E. IIIFirst Semester Course

Subjects: Higher Circuit Analysis Analog Electronics – 3 Electronic Measurement and Instruments Microprocessor - I Electromagnetic Waves and Radiating Systems

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HIGHER CIRCUIT ANALYSIS

UNIT 1: NETWORK ANALYSIS USING LAPLACE TRANSFORMSThe Laplace transformation, Basic theorems of laplace transformations, Step response of series R-L circuit, Step response of Series R-L circuit, Step response of Series R-L-c circuit, Step response of Parallel R-L-C circuit, Use of partial fractions in Analysis using laplace transformation, Response of Series of R-L circuit to exponential driving voltage, Response of Series R-C circuit to exponential driving voltage, Response of series R-L-C circuit to exponential driving voltage, Response of parallel R-L-C circuit to exponential driving current, Response of series R-L circuit to step sinusoidal driving voltage, Response of series R-C circuit to step sinusoidal driving voltage, Response of series R-L-C circuit to step sinusoidal driving voltage.

UNIT 2; LAPLACE TRANSFORMS OF SPECIAL SIGNAL WAVEFORMSThe different types of functions like Unit Step function, Ramp function, Unit doublet function and The Impulse function, Laplace transforms of Unit step functions, Shifting theorem, Pulse as a combination of two unit step functions, Pulse response of a series R-L circuit, Pulse response of series R-C circuit, Scaling Theorem, Laplace transforms of ramp functions and impulse functions, Laplace transform of unit impulse function, Synthesis of few typical waveforms and their laplace waveforms, Transform of Repetitive waveforms, Initial and Final value theorem, The Convolution theorem.

UNIT 3; FOURIER SERIES AND SIGNAL SPECTRUMFourier series, Fourier analysis, Alternative form of Fourier series, Evaluation of Fourier Coefficients, Waveforms symmetries as Even Functions, Odd functions and half wave symmetric functions, Exponential form of Fourier series.

UNIT 4: SYNTHESIS OF ONE PORT NETWORKSReactive networks, Common properties of expressions for driving point immitance, Separation property of reactive networks, Location of poles and zeros by inspection of network, Location of poles and zeroes from inspection of reactance function, Synthesis of One port L-C networks using Foster’s reactance theorems (the First and Second), Role and Nature of End elements in first and Second Foster form, Synthesis of one port L-C networks using Cauer’s 1st and 2nd

forms, The four different types of Cauer’s networks, Synthesis of one port R-C networks using Foster’s 1st and 2nd and Cauer’s 1st and 2nd forms, Synthesis of one port R-L networks using Foster’s 1st and 2nd and Cauer’s 1st and 2nd forms.

UNIT 5: GRAPH THEORYThe Graph of a network, Linear graph, Connected and unconnected graph, Definitions of terms like Branch, Node, Link, Twig, Tree, Forest and Coforest, Network variables, Loop current method, Node pair voltage method.

UNIT 6: BILINEAR TRANFER FUNCTIONS AND FREQUENCY RESPONSEBilinear functions like Ks, K(s+z), K/s, K/(s+p), Ks/(s+p), s2+as+b and 1/(s2+as+b), Determination of magnitude and phase responses of each of the above bilinear functions, Preparation of bode plots of above functions, Preparations of bode plots of any given functions by using the bode plots of above standard bilinear functions.

UNIT 7: THE BIQUAD CIRCUITDesign parameters like Q and ωo, the Biquad circuit with 3 op-amps, Frequency response of the biquad circuit, the Biquad circuit with 4 op-amps, and Phase response of the biquad circuit, Realization of all types of filters using 4 op-amp biquad circuit.

UNIT 8: BUTTERWORTH LOWPASS AND BANDPASS FILTERSThe ideal low pass filters, Butterworth response, Butterworth pole locations, Lowpass filter specifications, Sallen and key circuits, Resistive gain enhancement, Resistive gain reduction, Converting Lowpass filter into high pass filter using RC-

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CR transformation, Design of bandpass filters for Butterworth response using the Delynnias-Friend circuit.

UNIT 9: THE CHEBYSHEV FILTERS AND CHEBYSHEV RESPONSELissageous patterns, Chebyshev magnitude response, Locations of Chebyshev poles for given transfer function, Comparisons of the Butterworth and Chebyshev responses, Chebyshev filter design for lowpass filters.

UNIT 10: ACTIVE NETWORKSDifferences between the active and passive networks, The active networks like Voltage controlled voltage source/terminal (VCVS/VCVT), Voltage controlled current source/terminal (VCCS/VCCT), Current controlled voltage source/terminal (CCVS/CCVT) and Current controlled current source/terminal (CCCS/CCCT), The gyrator, The Antoniou’s generalized impedance converter (GIC), The Bruton’s Frequency dependent negative resistance (FDNR), The frequency dependent negative conductance (FDNC), The Capacitance multiplier, The Negative impedance converters (NIC) like voltage NIC and Current NIC, Simulation of inductor using resistors, capacitors and op-amps.

UNIT 11: INDEFINITE ADMITTANCE MATRIX (IAM)The Indefinite Admittance Matrix (IAM), Properties of an IAM, Reduction of any multipole network using (1) Contraction or (2) Suppression methods, Network solution using IAM, Determination of networks which are Parallel connected, IAM of a resistor, capacitor and inductor, Analysis of networks with ideal active elements, Modification of ideal active network by adding parasites, Analysis of networks with Operational amplifiers using methods like (1) Bridgman and Brennan method and (2) Nathan’s approach.

Reference:1) Network Analysis: G.K. Mithal (Khanna publishers)2) Analog filters Design: Van Valkenberg (Prentice Hall of India)

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ANALOG ELECTRONICS-3

UNIT 1: DIFFERENTIAL AMPLIFIERSDifferential amplifier, Differential amplifier with various circuit configurations, The DC and AC analysis of the four different types of differential amplifiers like (1) Dual input, Balanced output differential amplifier, (2) Dual input, Unbalanced output differential amplifier, (3) Single input, Balanced output differential amplifier and (4) Single input, Unbalanced output differential amplifier, The FET input differential amplifiers, Differential amplifiers with swamping amplifier, Constant current bias circuit, Current Mirror, Cascaded differential amplifier stages, Level translator.

UNIT 2: OPERATIONAL AMPLIFIERSThe operational amplifier, Block diagram representation of a typical Op-Amplifier, Types of Integrated Circuits, Different types of IC packages, The characteristics of ideal op-amp, Equivalent circuit of an op-amp, Open loop op-amp configuration, Definitions regarding op-amp like Input offset voltage, Input offset current, Input bias current, Differential input resistance, Input capacitance, Offset voltage adjustment range, Common mode Input voltage range, Common mode rejection ratio, Supply voltage rejection ratio, Output resistance, Slew rate and Gain-Bandwidth product.

UNIT 3: OP-AMP WITH NEGATIVE FEEDBACKBlock diagram representation of feedback configurations, Analysis of Voltage series feedback configurations like Closed loop voltage gain, Input resistance with feedback, Output resistance with feedback, Bandwidth with feedback, Total output offset voltage with feedback, Voltage follower, Analysis of voltage shunt feedback amplifier, Closed loop voltage gain, Input and output resistance with feedback, Bandwidth with feedback, Current to voltage converter, Inverter, Differential amplifiers with one op-amp, Differential amplifiers with two op-amps, Differential amplifiers with three op-amps.

UNIT 4: PRACTICAL OP-AMPInput offset voltage, Input bias current, Total output offset voltage, Thermal drift, Effect of variation in power supply on offset voltage, Change in input offset voltage and input offset current with time, Common mode configuration and common mode rejection ratio.

UNIT 5: FREQUENCY RESPONSE OF AN OP-AMPFrequency response, compensating networks, Frequency response of internally compensated op-amps, High frequency op-amp equivalent circuits, Open loop voltage gain as a function of frequency, Closed loop frequency response, Slew rate and its causes, Equation of slew rate, Differences between Transient response, Bandwidth and Slew rate.

UNIT 6: INTEGRATED CIRCUIT TECHNOLOGYIntegrated Circuit Fabrication, Monolithic IC (Microelectronic) technology, The Planar processes like (1) Crystal growth of substrate, (2) Epitaxial growth, (3) Oxidation, (4) Photolithography, (5) Diffusion, (6) Ion implantation and (7) Metallization, Bipolar Junction Transistor (BJT) Fabrication, Buried Layer, pnp structure fabrication, Multiple emitter transistor, Schottky transistor, Super β transistor, Field Effect Transistor (FET) fabrication, NMOS enhancement FET fabrication, Self isolation, NMOS depletion FET fabrication, Gate length and width of FET, JFET fabrication, CMOS technology, Monolithic diode fabrication, Metal Semiconductor contact, IC resistors like Diffused resistor, Ion implanted resistor, Epitaxial resistor, Pinch resistor, MOS resistor and Thin film resistor, Sheet resistance, IC capacitors like Junction capacitor, MOS capacitor and Thin film capacitor.

UNIT 7: APPLICATION OF OPERATIONAL AMPPLIFIERS

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Inverting configuration, Non inverting configuration, Differential amplifier, Voltage follower (Buffer), Instrumentation amplifier, Bridge amplifier, Voltage to Current (Floating and Grounded load) and Current to voltage converter, Logarithmic and antilogarithmic amplifier, Waveform generators like Astable multivibrators and Monostable multivibrators, Triangular wave generator, Sawtooth wave generator, Precision rectifiers (Full wave and Half wave), Integrator, Differentiator, Clippers, Clampers, A.C. Amplifier with single power supply (Inverting), A.C. Amplifier with single power supply (Non inverting), Basic comparators, Comparator with hysteresis (Schmitt Trigger), Peak detector, Non inverting voltage level detector, Inverting voltage level detector, Window detector, Level detector.

UNIT 8: SPECIALIZED IC APPLICATIONSThe 555 Timer, Pin diagram and function of different terminals of 555 Timer, The 555 as an Astable Multivibrator, The 555 as a Monostable multivibrator, The 555 as an Free running ramp generator, The 565 Phase Locked Loop (PLL), Phase detectors like the EX-OR phase detector and the Edge triggered phase detector, Voltage controlled oscillator (VCO 566), Pin diagram and functions of various pins of 565 PLL, 565 PLL applications like Frequency multiplier, frequency divider, Frequency shift keying Demodulator.

UNIT 9: POWER SUPPLIER AND REGULATORSCharacteristics of ideal power supply, Linear Regulators (Series and Shunt type), IC 723 the General Purpose regulator, Current limit protection, Current foldback circuit, Over voltage protection using Crowbar circuit, IC 317 regulator (3 pin adjustable regulator), IC 78XX and 79XX series regulators (3 pin fixed), Dual power supplies, Switching Regulators, Buck type regulators, Boost type regulators.

UNIT 10: OTHER MINOR CIRCUITS AND DEVICESSample and Hold circuit, Terminology like the Aperture time, Aperture delay, Open loop and closed loop circuits, Acquisition time, Applications of Sample and hold circuits, Programmable Gain Data Amplifier (PGDA), Data acquisition system, Characteristics of ideal switch, Characteristics of an Inductor.

Reference:1) Op-amps and linear integrated circuits: Ramakant Gayakwad (Prentice Hall India)2) Analysis of linear ICs: D. Roy Chaudhari and Shail jain3) Microelectronics: Jacob Millman and Arvin Grabel (Tata McGraw Hill)4) Operational Amplifiers and Linear Integrated Circuits: Coughlin Drisscol (Prentice Hall

of India)

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ELECTRONIC MEASUREMENT AND INSTRUMENTS

UNIT 1: MEASUREMENT AND ERRORDefinitions of various terms like accuracy, precision, error, sensitivity and resolution, The difference between accuracy and precision, Significant figures in any reading, Types of error, The Gross errors, The Systematic errors and Random errors, Statistical analysis, The Arithmetic mean, Deviation from the mean, Average deviation, Standard deviation, Probability of errors, Normal distribution of errors, Probable errors, Limiting errors.

UNIT 2: SYSTEMS OF UNITS OF MEASUREMENTSVarious types of units like Fundamental and derived units, Systems of units, Electric and Magnetic units, International system of units, Various other systems of units, Conversion of units.

UNIT 3: STANDARDS OF MEASUREMENTClassification of standards as the International standards, Primary standards, Secondary standards and the Working standards, Standards for Mass and Length, Time and Frequency standards, Electrical standards like the Absolute ampere, the Resistance standards, the Voltage standards, Capacitance standards, Inductance standards, Standards of temperature, IEEE standards.

UNIT 4: ELECTROMECHANICAL INDICATING INSTRUMENTS (AC)Electrodynamometer, Thermo instruments, Electrodynamometer in AC wattmeter, The Watt Hour meter, The Power Factor meter, Instrument transformers.

UNIT 5: AC BRIDGESConditions required for bridge balance, The Maxwell bridge (for determining unknown inductor with 1<Q<10), The Hay bridge (for determining unknown inductor with Q>10), The Schering bridge (for determining unknown capacitor), The Wien bridge.

UNIT 6: ELECTRONIC INSTRUMENTS FOR MEASURING BASIC ELECTRICAL PARAMETERSDigital voltmeters (DVM), The Ramp type DVM, The Integrating DVM, The Successive approximation DVM, The quantizing error, The Q meter, Obtaining Q of a coil by (1) Direct method, (2) Series connection method and (3) Parallel connection method, Sources of errors like the Self capacitance of coil and the residual resistance, The Vector impedance meter, The Vector voltmeter, RF power and Voltage measurement.

UNIT 7: ELECTROMECHANICAL INDICATING INSTRUMENTS (DC)Suspension galvanometer, Torque and deflection of the galvanometer, Dynamic behavior of the galvanometer, Damping mechanisms, Permanent magnet moving coil mechanism (PMMC), D’Arsonval movement, DC Ammeters, Aryton shunt, DC voltmeters, Voltmeter sensitivity, Loading effect, Series type ohmmeter, Multimeter, Design of all above instruments, Calibration of DC voltmeter, DC Ammeter and DC Wattmeter.

UNIT 8: DC BRIDGESTypes of DC bridges like the Wheatstone bridge, the Kelvin bridge and the Kelvin Double bridge.

UNIT 9: ELECTRONIC INSTRUMENTS FOR MEASURING BASIC PARAMETERSAmplified DC meter, True RMS responding voltmeter.

UNIT 10: TRANSDUCERSClassification and types of transducers, Selecting a transducer, Strain gauges, Temperature measurements, Resistance thermometers, Thermocouples.

UNIT 11: CATHODE RAY OSCILLOSCOPE (CRO)Basic CRO operation, Block diagram of CRO consisting of Cathode Ray tube (CRT), Vertical amplifier, Delay line, Time base generator, Horizontal amplifier, Trigger circuit and Power supply, CRT operation, Electron gun assembly, Deflection plate assembly, Fluorescent screen, Glass envelope, Tube base, CRO

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front panel controls and their internal connections, Vertical deflection system consisting of CRO probe, Input selector, Input attenuator and Vertical amplifier, Delay line and its functions, Lumped parameter and Distributed parameter delay line, Horizontal deflection system consisting of Basic sweep generator (ramp generator), Synchronization of sweep, Triggered sweep and Horizontal amplifier, CRO probes like Passive voltage probes, Lissageous figures, Construction of Lissageous figures, Frequency determination and phase angle determination using Lissageous figures, Dual trace CRO, Dual beam CRO.

UNIT 12: POTENTIOMETERSBasic slide-wire potentiometer, Types of potentiometer like Single range potentiometer and Duo-range potentiometer, Potentiometric voltage measurements, Volt box, and Shunt box, Calibration of voltmeters and Ammeters.

Reference:1) Modern electronic instrumentation and measurement techniques: Albert Helfrick and

William cooper (Prentice Hall India)2) Electronic instrumentation and Measurement techniques: David Cooper (Prentice Hall of

India)3) Electronic Instrumentation: H.S. Kalsi (Tata McGraw Hill)

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MICROPROCESSORS – 1

UNIT 1: MICROPROCESSOR ARCHITECTURE AND MICROCOMPUTER SYSTEMSMachine Language, Assembly language, Writing and executing a program using assembly language, High level language, Architecture of Microprocessor, various bus present in Microprocessor 8085 like Data Bus, Control Bus and Address Bus, various Registers of microprocessor 8085, Uses of microprocessors in various fields, Various types of devices used along with microprocessor like Memory devices, Input devices, Output devices and Logic devices (for interfacing), various types of memory devices like Read/Write memory, Read Only Memory (ROM), Masked ROM, Programmable ROM (PROM), Erasable Programmable ROM (EPROM), Electrically Erasable and Programmable ROM (EEPROM) and Flash memory, Input output using Peripheral mapping and using Memory mapping,

UNIT 2: 8085 MICROPROCESSOR ARCHITECTURE, MEMORY INTERFACING AND INTERFACING INPUT-OUTPUT DEVICESThe 8085 Microprocessor unit (MPU) and its various modules, Generation of control signals, The 8085 Machine cycles and bus timings, Basic concepts of Memory interfacing like Address decoding, Decoding types like Absolute decoding and Linear decoding, Interfacing output displays, Interfacing input devices, Memory mapped input-output and I/O based input-output, Absolute decoding and Linear decoding of the address of the connected devices, Device selection and Data transfer after selection.

UNIT 3: 8085 INSTRUCTIONS AND PROGRAMMING TECHNIQUES8085 Programming model, Data transfer instructions, Arithmetic operations, Logic operations, Branch operations, Writing assembly language programs and executing them, Programming techniques like Looping, Branching, and Counting, Various types Looping and Branching (jumping) instructions, Additional data transfer instruction and 16 bit arithmetic instructions, Arithmetic operations related to memory, Logic operations like Rotate and Compare, Various addressing modes like Immediate addressing, Register addressing, Direct addressing and Indirect addressing.

UNIT 4: COUNTERS AND TIME DELAYSCounters, Timers, Time delays, Various methods of generating time delay like Using single register, Using register pair and Using nested loop, Generating pulse waveforms, Design of Hexadecimal counter and Modulus ten counter.

UNIT 5: STACK AND SUBROUTINESStack, Importance and use of instructions like PUSH and POP, Subroutines, The RET instruction, Various Conditional Call and Return instructions, Advanced subroutine concepts like nested subroutines and multiple ending subroutines.

UNIT 6: CODE CONVERSIONS, BCD ARITHMETIC AND 16 BIT DATA OPERATIONSPrograms based on code conversions like BCD to Binary conversion, Binary to BCD conversion, BCD to 7-segment LED code conversion using look up table, Binary to ASCII and ASCII to Binary code conversion, BCD addition and subtraction, 16 bit data transfer and data exchange instructions, Multiplication and subtraction with carry.

UNIT 7: INTERRUPTS8085 interrupts, Restart (RST) instructions, 8085 vectored interrupts (TRAP, RST 7.5, RST 6.5, and RST 5.5), and Pending interrupts, Priority of Interrupts, Sequence of events that occur internally in microprocessor on occurrence of an interrupt, Overview of the Programmable Interrupt Controller (8259).

UNIT 8: ADC AND DACDAC circuits and chips, Interfacing of DAC chips, ADC chips, Analog to Digital conversion using Successive Approximation method and Dual slope method, Interfacing ADC using status check and Interrupts.

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UNIT 9: GENERAL PURPOSE PROGRAMMABLE PERIPHERAL DEVICESThe 8212 I/O device, Bus contention, The 8255 Programmable Peripheral Interface (PPI) device and its block diagram, Its various operating modes, Interfacing ADC using 8255, Bidirectional data transfer between two computers, Interfacing keyboard and Seven – segment LED, the Key debounce technique and program to detect the key pressed in Matrix keyboard, The 8254 Timer and its block diagram, Various operating modes of 8254, The 8237 DMA controller and its block diagram, The 8279 Keyboard/Display controller.

UNIT 10: SERIAL I/O AND DATA COMMUNICATIONAsynchronous and synchronous transmission, Simplex and Duplex transmission, Baud rate, Error checks in Data Communication using Parity, CRC and Checksum, Software controlled Asynchronous serial I/O, Serial data transmission and reception, The 8085 serial I/O lines: SOD and SID, Block diagram of 8251 Programmable Communication interface.

Reference:1) Microprocessor Architecture, Programming and Application with 8085: Ramesh Gaonkar

(Penram International)2) Microprocessor 8085: Badri Ram

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ELECTROMAGNETIC WAVES AND RADIATING SYSTEMS

UNIT 1: RADIOWAVE PROPAGATIONDifferent types of wave existing in nature, An electromagnetic wave, Different types of modes of propagation, Ground wave propagation, Sky wave propagation (Tropospheric mode of propagation), Optical horizon, Radio horizon, Extended propagation in troposphere like the Tropospheric scattering and the Air Duct propagation, Space wave propagation (Ionospheric mode of propagation), Different types of Ionospheric layers, Phase and group velocities, Secant law and Maximum Usable Frequency (MUF), Virtual height of a layer, Single hop and Multi hop propagation, Limitation of hop propagation, Adverse effects of ionospheric propagation, Ionospheric irregularities like the Traveling Ionospheric Disturbances (TID), Sudden Ionospheric Disturbances (SID), Magnetic storms and Sporadic E layer.

UNIT 2: GUIDED WAVESBehavior of Electric and Magnetic field in between two perfectly conducting plates, Transverse Electric (TE) waves, Transverse Magnetic (TM) waves, Characteristics of Transverse Electric and Transverse Magnetic waves, The Cut off frequency, Transverse Electromagnetic (TEM) mode of propagation, Velocities of propagation, Losses in practical wave guide.

UNIT 3: RADIATING SYSTEMS AND ANTENNAEAntennae, Isotropic radiator, Radiation pattern, Elementary dipole, Horizontal and Vertical pattern, Resonant and Open terminated antennae, Directive gain and Directivity, Power gain, Centre fed Resonant Antennae, Non Resonant and Terminating antennae like V Antennae and Rhombic antennae, Antennae Arrays, 2-Element Antennae array, Broadside Array, Endfire array, Beam width of an antennae, Uniform Linear Array (ULA), Binomial array, Comparison of different types of arrays like Uniform linear array, Binomial array, Edge array and Dolph-Tbyscheff array, Multiplication of radiation patterns.

UNIT 4: MAXWELL’S EQUATIONElectromagnetic waves, Maxwell’s equation in free space, Maxwell’s contribution to Ampere’s law, Different forms of Maxwell’s equation like the Differential form and the Integral form, Conditions at boundary surface.

UNIT 5: PROPAGATION OF ELECTROMAGNETIC WAVES IN DIFFERENT MEDIUMSWave propagation in lossy dielectrics, Attenuation constant (α), Phase shift constant (β), Propagation constant (γ), Intrinsic impedance (η), Loss tangent (θη), Plane wave propagation in Lossless dielectrics, Plane wave propagation in free space, Plane wave propagation in good conductors, Skin depth (δ), Power and Poynting vector, Reflection of plane waves at Normal incidence, Reflection of plane waves at Oblique incidence with (1) Parallel polarization and (2) Perpendicular polarization.

UNIT 6: RADIATIONThe Retarded Potentials, Electric Scalar potential, Magnetic Vector potential, Hertzian dipole and Power radiated by Hertzian dipole, Half wave dipole and Power radiated by a Half wave dipole, Quarter wave monopole dipole.

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Reference: 1) Electromagnetic Communication: John Roody and Dennis Coolen (Prentice Hall of India)2) Electromagnetic waves and Radiating systems: Edward Jordan and Keith Balmain

(Prentice Hall of India)3) Elements of Electromagnetics: Matthew N.O. Sadiku (Oxford University Press)

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B.E. IIISecond Semester Course

Subjects: Microprocessors – II Radio and Television Engineering Communication Theory Control System Engineering Industrial Engineering

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RADIO AND TELEVISION ENGINEERING

SECTION 1: MODULATION TECHNIQUESUNIT 1: RECEIVERS

Tuned radio frequency receivers, Super heterodyne receivers, Tuning Range, Tracking, Sensitivity and gain, Image and Image rejection, Adjacent Channel selectivity, Automatic Gain Control, Double conversion, Electronically Tuned Receivers.

UNIT 2: AMPLITUDE MODULATIONModulation and its needs, Amplitude modulation (AM), Amplitude Modulation Index, Modulation for Sinusoidal AM, Frequency spectrum for Sinusoidal AM, Average power for sinusoidal AM, Effective voltage and current for sinusoidal AM, Non-sinusoidal modulation, Double sideband suppressed carrier (DSBSC) modulation, Amplitude modulator circuits, Amplitude Demodulator circuits, Distortions in demodulation like Diagonal and Negative peak clipping, Amplitude Modulated Transmitters, AM broadcast transmitters, AM Receiver using a Phase locked Loop.

UNIT 3: SINGLE SIDEBAND MODULATIONSingle sideband principles, Balanced Modulators, Integrated circuit Doubly balanced modulators, Diode mixer, Doubly balanced Diode Ring modulator, Single Side Band generation using methods like (1) Balanced Modulator-Filter method, (2) Phasing method and (3) Weaver’s method, Single side band reception, Pilot carrier Single Side band transmission and reception, Independent side band generation and transmission.

UNIT 4: PULSE MODULATIONVarious types of modulation like Pulse Amplitude Modulation (PAM), Pulse Code modulation (PCM), Delta Modulation, Pulse Frequency Modulation (PFM) and Pulse Time Modulation (PTM), Types of PTM like Pulse position modulation (PPM) and pulse width modulation (PWM), Quantization, PCM receivers, Differential PCM.

UNIT 5: ANGLE MODULATIONFrequency modulation (FM), Sinusoidal Frequency modulation, Peak frequency deviation constant, Modulation index for FM, Narrow band FM and Wide band FM, Effect of Modulation Index on Bandwidth of FM, Non-sinusoidal modulation, Deviation ratio, Phase modulation (PM), Equivalence between PM and FM, Sinusoidal phase modulation, Digital phase modulation, Angle modulator circuits like Varactor diode modulators and Transistor (JFET) modulators, FM transmission by methods like using (1) Reactance modulators and (2) Indirect methods like Armstrong method, FM Broadcast, Angle modulation detectors like the Foster Seeley discriminator, Ratio detector, Round Travis detector and Phase locked loop detector, Amplitude limiters, Automatic Frequency Control (AFC), Pre-emphasis and De-emphasis, FM Broadcast receivers.

SECTION 2: TELEVISION, FACSIMILE AND MOBILE COMMUNICATIONUNIT 6: ANALYSIS AND SYNTHESIS OF TELEVISION PICTURES AND

COMPOSITE VIDEO SIGNALGross Structure, Image continuity, Number of Scanning lines, Flicker, Fine structure, Video signal dimensions, Horizontal Sync details, Vertical Sync details, Brightness controls, Scanning Sequence details, Functions of vertical pulse train, Aspect Ratio, Optimum resolution, Interlaced Scanning,

UNIT 7: SIGNAL TRANSMISSION AND CHANNEL BANDWIDTHChannel bandwidth, Factors affecting Bandwidth in television, Vestigial Sideband Transmission, Complete channel bandwidth, Reception of vestigial side band, Merits and Demerits of Vestigial sideband transmission.

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UNIT 8: THE PICTURE TUBEMonochrome picture tube, Electron gun, Electrostatic focusing, Beam velocity, Beam deflection using electromagnetic techniques, Deflection angle, Picture tube circuit controls.

UNIT 9: TELEVISION RECEIVERSuper Heterodyne Receiver, Receiver sections, Block diagram of a monochrome TV receiver, Antenna system, RF section, IF amplifier section, Essential function of IF section, Vestigial side band correction, Choice of intermediate frequencies, Video detector, Video amplifier, Picture tube circuitry and controls, Sound signal separation, Sound section, Automatic Gain Control (AGC), Sync processing and AFC circuit, High Voltage supply (EHT).

UNIT 10: AUTOMATIC GAIN CONTROL, FREQUENCY CONTROL CIRCUITS AND SYNC SEPARATION CIRCUITSAdvantages of Automatic gain control (AGC), Gain control of transistor amplifiers, Types of AGC, Forward and Reverse AGC, Peak AGC system, Keyed AGC system, Merits of keyed AGC system, Delayed AGC, Sync separation-Basic principle, Transistor sync separator, Automatic frequency control circuit and its operation.

UNIT 11: ESSENTIALS OF COLOUR TELEVISION Compatibility between black & white TV and colour TV, Chrominance, Colour perception, Three colour theory, Grassmen’s law, Tristimulus values of spectral colours, Luminance, Hue, Saturation, Colour television camera, The Luminance signal, Colour voltage amplitude, Y signal amplitudes, Production of colour difference voltages, Values of Luminance and colour difference signals on colours, Polarity of the colour difference signals, Colour signal transmission, Frequency Interleaving, Bandwidth of colour signal transmission, Modulation of colour difference signals, Colour Burst signal.

UNIT 12: RECORDINGVideo tape recording, Audio range, Audio signal dynamic range, AC bias, Video frequencies, Video signal dynamic range, Scanning methods like Transverse (Quadruplex head) scanning and Helical scan recording.

UNIT 13: FACSIMILEFacsimile transmitter, Scanning spot, Cylindrical scanning method, Facsimile receiver, Synchronization, Phasing, Index of cooperation, Line transmission of Facsimile signals

UNIT 14: MOBILE COMMUNICATIONGrade of service, Advantages of Hexagonal cells, Cell sectoring, Cell splitting, Capacity increase by Cell splitting, Cell sectoring, Co-channel and Inter-channel interference, Frequency Reuse factor and Frequency Re-usage, Roaming facility

Reference:1) Electromagnetic Communications: Dennis Roddy and John Coolen (Prentice Hall-India)2) Monochrome and Colour Television: R.R. Gulati (Wiley Eastern Ltd)3) Mobile and Wireless Networks: Ulyss Black (Prentice Hall of India)4) Principles of Communication Engineering: Anokh Singh (S. Chand)5) Audio Video Systems: Principles, Practices and Troubleshooting: S.P. Bali and Rajeev

Bali (Khanna Book Publishing Co. Ltd.)

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COMMUNICATION THEORY

UNIT 1: SPECTRAL ANALYSISFourier Series, Exponential Form of the Fourier Series, Fourier Series of Periodic train of Impulses and of Pulses of fixed duration and given amplitude, Sampling Function, Response of Linear System, Normalized power, Normalized power in Fourier Expansion, Power Spectral Density, The Fourier Transform, Convolution, The Signum function and its Fourier Transform, The Parsevel’s theorem, Correlation between waveforms, Power and Cross Correlation, Auto correlation, Autocorrelation of periodic waveforms, The Orthogonal and Orthonormal functions, The Gram-Schmitt procedure to find the orthonormal components.

UNIT 2: RANDOM VARIABLES AND PROCESSESProbability, Mutually Exclusive events, Joint probability of Related and Independent events, Statistical Independence, Random variables, Cumulative Distributive Function (CDF), Probability Density Function (PDF), Relation between Probability and Probability Density, Joint Cumulative Distribution and Probability Density, Design of Optimum Receiver, Conditional Probability, A-Priori probability, A-Posteriori probability, Average value of random variable, Variance of a random variable, Tcebycheff’s inequality, The Gaussian Probability Density Function, The Error Function, The Probability of error in two level transmission line, The Rayleigh Probability Density, Mean and Variance of the Sum of Random Variables, Probability Density of sum of two random Gaussian variables, Correlation between Random variables, The Central Limit Theorem.

UNIT 3: MODULATION SYSTEMSPulse Modulation Systems, The Sampling Theorem for the Low-pass signals and the Band-pass signals, Pulse Amplitude Modulation (PAM), Natural and Flat top sampling, Signal Recovery through Holding, Quantization of signals, Quantization Error, Pulse code modulation (PCM), Electrical representation of binary digits.

UNIT 4: NOISE IN PULSE CODE MODULATION SYSTEMSThe PCM system, PCM transmission, Calculation of Quantization noise, Output signal power, Thermal Noise, Error due to thermal noise, Output signal to noise ratio in PCM.

UNIT 5: MATHEMATICAL REPRESENTATION OF NOISESources of noise like (1) External noise (Manmade noise, Atmospheric noise, Sky noise and Thermal noise due to Heated atmosphere & earth surface) and (2) Internal noise (Thermal noise due to resistance and Shot noise due to active devices), Types of noise like Deterministic noise and Random noise, White Noise, Frequency domain representation of noise, Spectral components of noise, Power spectral density, Response of a narrow band filter to noise, Effect of filter on the power spectral density of noise, Stationery Noise, Superposition of noises, Mixing involving noise, Linear filtering, Calculation of output Noise in case of Ideal Low-pass filter, Ideal High-pass filter, Ideal Band-pass filter, Integrating filter, Practical and Ideal Differentiating filter, Noise Bandwidth, Quadrature components of noise.

UNIT 6: NOISE IN AMPLITUDE MODULATED SYSTEMSAmplitude modulation receiver, Synchronous Demodulator, Advantages of super-heterodyne receiver, Single sideband suppressed carrier (SSB-SC), Double sideband suppressed carrier (DSB-SC), Double sideband with carrier, Square law demodulator, Envelope detector, Calculation Output signal power and Output Signal to Noise Ratio (SNR) in case of each of the above systems.

UNIT 7: NOISE AND THRESHOLD IN FREQUENCY MODULATION SYSTEMSAn FM demodulator of Frequency discriminator type, Carson’s rule to find Bandwidth in FM systems, Calculation of output signal and output noise powers, Comparison of AM and FM with respect to their figure of merit, Threshold in FM

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systems, Occurrence of spikes and its effect on output noise power, Spike characteristics, Introduction to Phase Locked Loop Demodulator.

UNIT 8: COMMUNICATION SYSTEMSIdeal Communication System, Information Theory, Theory of coding, Equi-probable messages, Entropy, Average Information, Condition for average information to be maximum, Rate of transmission, The Transmitter and its Entropy, The Receiver and its Entropy, Joint entropy of both The Transmitter and Receiver, Conditional Entropy of Transmitter and Receiver, Symmetric Channel, Shannon’s Theorem for Channel Capacity, Shannon-Hartley law, Coding of message, Various coding techniques like Shannon-Fano code, Huffman code, Algebraic Code, Efficiency and Redundancy of each coding technique, Hamming Distance, Ideal coding, Comparison of various communication systems like SSB, DSB-SC, DSB-FC, AM, FM with respect to their input and output SNR.

UNIT 9: NOISE IN COMMUNICATION SYSTEMSNoise insertion in the system due to resistor, Antenna noise, Noise Temperature, Effective input noise temperature, Noise Figure, Effective output noise in case of Cascaded networks.

Reference:1) Principles of Communication: Taub and Schilling (Tata McGraw Hill)2) Elements of Analog and Digital Communication: B.P.Lathi (Wylie and Sons)

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CONTROL SYSTEMS ENGINEERING

UNIT 1: DYNAMIC MODELS AND DYNAMIC RESPONSEState variable models, Impulse response models, Transfer functions Models, Models of Disturbances and standard Test signals, Dynamic response, Characteristic Parameters of First and Second order Models, Models of Mechanical systems, Models of Electrical systems.

UNIT 2: MODELS OF INDUSTRIAL CONTROL DEVICES AND SYSTEMSTypes of control systems like Linear & Non-linear systems, Time variant & Time invariant systems, Continuous data & Discrete data systems and Open loop & Close loop systems, Generalized block diagram of a feedback system, Block diagram manipulations, Signal flow graphs and the Mason’s gain rule, Mechanical systems like Translational motion systems and Rotational motion systems, DC and AC motors in control systems like DC servomotors, Stepper motors and AC servomotors, Comparison of Mechanical and Electrical systems w.r.t. their various subtypes like (1) Mechanical Rotational systems, (2) Mechanical Translational systems, (3) Electrical Voltage systems and (4) Electrical Current systems, Motion control systems like Geared drives, Electronic Amplifiers (Tacheogenerators, Potentiometers, Linear Variable Differential Transformer, Synchros), Block diagram representation of each of the above control elements.

UNIT 3: BASIC PRINCIPLES OF FEEDBACK CONTROLControl objectives like Stability, Disturbance rejection and Sensitivity, ON-OFF mode of feedback control, Proportional mode of feedback, Integral mode of feedback control and Derivative mode of feedback control.

UNIT 4: CONCEPTS OF STABILITY AND ROUTH STABILITY CRITERIONBounded Input Bounded Output (BIBO) stability, Routh-Hurwitz stability criterion and its special cases like (1) A row of all zeroes and (2) A zero pivot element but the entire row is not all zero, Finding stability range for a parameter using Routh stability criterion.

UNIT 5: COMPENSATOR DESIGN USING ROOT LOCUS PLOTSRoot locus concept, Methods of sketching root loci, Effect of Lag compensation, Effect of Lead compensation, Reshaping the root loci using Cascade lead method and Cascade lag method.

UNIT 6: PERFORMANCE OF FEEDBACK SYSTEMSThe performance specifications like Transient Response and Steady state response, Response of a standard second Order system to Step input, Ramp input and Parabolic input, Peak overshoot, Peak time, Rise time, Steady state error, Damping ratio and its selection, Over-damped, Under-damped and Critically damped systems, Effects of an additional Zero and an additional pole, Dominant poles, Desired close loop pole locations and the dominance condition, Steady state error constants and systems like Type-0, Type-1 and Type-2 systems, Steady State error analysis, The Error series, Derivative error compensation, Integral error compensation.

UNIT 7: NYQUIST STABILITY CRITERION AND STABILITY MARGINSPrinciple of argument, The Nyquist contour, The Nyquist plot, The Nyquist Criterion, Gain Crossover point and Gain Crossover frequency, Phase Crossover point and Phase Crossover frequency, Stability margins like the Gain margin and Phase margin, The Bode plots, Stability margins on the bode plots.

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UNIT 8: PERFORMANCE BASED ON THE FREQUENCY RESPONSECorrelation between frequency domain and time domain specifications like Damping ratio, Phase margin, Gain crossover frequency, Resonance peak, Response speed, Resonance frequency, Response speed and Bandwidth, The Nichols chart.

UNIT 9: COMPENSATOR DESIGN USING BODE PLOTSReshaping the bode plots, Applying lead compensation and lag compensation to the bode plots, Cascade lead compensation, Cascade lag compensation, Implementation of Lead compensator and Lag compensator using Resistor-Capacitor network.

Reference:1) Control systems – Principles and Design: M Gopal (Tata McGraw Hill)2) Control system engineering: Nagrath and Gopal (John Wiley)3) Automatic Control systems: B.C. Kuo (Prentice Hall of India)

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INDUSTRIAL ENGINEERING

UNIT 1: ERGONOMICSDefinition of Ergonomics, Psycho-Physiological data, Anthropometric and Functional Anatomy data, Normal and Maximum working Area, Ergonomic consideration applied to the Location of Control knobs and Location of Visual Displays, Fatigue in industry, Environmental requirements for efficient performance of worker, Effect of Illumination, Noise, Temperature and Humidity on efficiency of working of human, Ergonomics consideration applied to the design of Control members like Push Buttons, Knobs, Toggles, Cranks, Levers, Rotary levers, Star wheels and Hand-wheels, Compatibility in the Design of Control Members.

UNIT 2: PLANT MAINTENANCEObjectives of Plant Maintenance, Importance of Plant Maintenance, Duties, Functions and Responsibilities of Plant Maintenance Department like (1) Inspection, (2) Engineering, (3) Maintenance, (4) Repair, (5) Overhaul, (6) Construction, (7) Salvage, (8) Clerical Jobs, (9) Power generation and distribution, (10) Insurance administration, (11) House keeping and (12) Pollution and noise reduction measures, Organization of maintenance department, Types of Maintenance like Corrective or Breakdown maintenance, Scheduled Maintenance, Preventive maintenance and Predictive maintenance, Advantages of each of the above different types of maintenance.

UNIT 3: INDUSTRIAL LAWSImportance and necessity of Labor Legislation, Principles of Labor Legislation, Trade Unions and Labor Unions, Types of Industrial Disputes, Strikes, Causes, Effects & Forms of Strikes, Lock-out, Picketing, Gherao, Types of Labor laws like (1) The Factories Act (1948) – Objective, Scope, Various Provisions made in this Act related to Health, Safety, Employee Welfare and Working hours, Provision for Annual leave with wages, Special provisions like Notice of accidents and disease, Penalties and Procedures, (2) The Payment of Wages Act (1936) – Aim, Provisions made in this act related to the Payment of wages, Time of payment of wages and Deductions from wages, The Inspector’s duty under this Act, Penalties for Offences under this Act, (3) The Minimum Wages Act (1948) – Objectives, Important aspects of this Act, Provisions for Payment of minimum wages, Maintenance of records, Claims, Inspectors and their powers, Offences and penalties, (4) The Workmen’s Compensation Act (1923) – Main features of this Act, Provisions like Employer’s Liability for Compensation, Liability in case of Occupational Diseases, Distribution of Compensation, Medical Examination, Appointment of Commissioner and (5) The Industrial Dispute Act (1947) – Importance Aspect of the Act, Authorities under this Act, Labor Court, Industrial Tribunals, National Tribunals, Strikes and Lockout, Penalties.

UNIT 4: INDUSTRIAL SAFETYCauses of Accident and related factors like Mechanical factors, Environmental factors, Unsafe Act from Employee and Unsafe Personal Factors, Prime sources of Accidents according to the Psychologists, Accident control, Job Safety Analysis (JSA) i.e. removal of hazards from the job, Implementation of Safety Programs, Objectives and activities of Safety Program, Effects of Accident on part of Factory, Employee and Society, Duties of Plant Safety Inspector, Duties of Plant Supervisor, Electric Hazards, Preventive steps for Electric Hazards and Fires due to Electricity, Treatment for Electric shock, Safe Workplace layout and improvement of working conditions, Safety devices in machines like Interlocks, Automatic locks, Guards, and Limit switches, Fire Prevention and Protection, Fire Safety Planning, Classification of Fires like Class A fires, Class B fires, Class C fires, Fire Extinguishment, Types of Extinguishers like Soda-Acid, Foam, Vaporizing liquid, Carbon Dioxide and Dry chemicals, Applications of each of the

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above Fire Extinguishers, General Safety rules, First Aid and First Aid box, Relation between Safety and Productivity.

UNIT 5: WORK SIMPLIFICATION (METHOD STUDY)Definition of Work Study, Basic Procedure for Work Simplification, Selection of job, Design considerations, Production considerations and Human considerations, Process Charts like (1) Operation Process Chart, (2) Flow Process Chart, (3) Flow Diagram, (4) String Diagram, (5) Man and Machine Process chart, (6) Two handed Process Chart, (7) Multiple Activity Chart and (8) Gang Process Chart, Motion Economy and its rules given by Gilbreth regarding (1) Use of Human body – Classification of movement, (2) Arrangement of Work Place – Various working Areas like Maximum working area, Normal working area, Common working area and No working area and (3) Design of Tools and Equipment, Therbligs and its definition.

UNIT 6: PRODUCTIVITYDefinition of Productivity, Productivity and Efficiency, Difference between Production and Productivity, Need for and Advantages of higher Productivity, Factors that help in increasing of productivity and Factors influencing productivity like Layout of plant, Use of Raw materials, Nature and quality of Raw materials, Manufacturing process, Working condition, Management policy, Power utilization, Utilization of plant-building area, Material handling techniques, Employee’s job performance, Worker’s moral & Job safety, Maintenance of plant, tools, equipments and machines, etc., Reasons for low productivity, Basic work content and factors affecting it like Design defects, Improper selection of process and Role of management and workers, Total Work Content, Basic Work content, Excess time, Ineffective time, Benefits of Increase in Productivity.

UNIT 7: WORK MEASUREMENT (TIME STUDY)Definition of Time Study, Objectives and Uses of Time Study, Techniques of Work Measurement, Time study equipments like Stop Watches, Study Board, Observation Sheet, Digital Photo-camera and Calculator, Basic procedure for time study and its steps like Approach to study, Selection of operator for time study, Recording of information, Breaking of an operation into elements and Measurement of operations, Reason for Breaking the operation into elements, Definition of Work Element, Types of elements like (1) Repetitive elements, (2) Occasional elements, (3) Variable elements, (4) Constant elements, (5) Manual elements, (6) Machine elements, (7) Governing elements and (8) Foreign elements, Performance rating and Factors affecting it, Types of Performance Rating Techniques like (1) Speed Rating technique, (2) Synthetic rating technique, (3) Objective Rating Technique and (4) Psychological evaluation, Allowances and their types like (1) Contingency Allowances, (2) Relaxation allowances (Constant allowances and Variable allowances) and (3) Special allowances (Process Allowances and Policy allowances), Problems based on Computation of Standard time for given operation.

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UNIT 8: PLANT LOCATION AND LAYOUTImportance of Plant location, Need for Selecting a suitable Location, Advantages and Disadvantages of Urban, Rural and Sub-Urban Locations, Factors influencing Plant location like Availability of raw materials, Nearness to market, Transportation and communication facilities, Availability of labors, Availability of fuel, water and power, Social and Recreational facilities and Existence of Ancillary industries in nearby location, Definition of Plant Layout, Objectives of Plant layout, Plant layout procedure, Considerations to be taken during Plant layout like Nature of Manufacturing process, Future Expansion, Lighting, Employee Facilities, Heating, Ventilating, Air-conditioning, Flexibility and Service Facilities, Types and advantages of factory buildings like Single Storied and Multi Storied, Types of plant layout like (1) Line or Product Layout, (2) Function Layout or Process Layout, (3) Fixed position layout and (4) Group Layout, Advantages and Disadvantages of above layouts, Flow patterns like Horizontal flow patterns (I flow, L flow, U flow, S flow and O flow) and Vertical flow patterns (Up-down, Single-Multi flow and Unidirectional-Retractional), Line Balancing of Process.

UNIT 9: MATERIAL HANDLINGPlanning the material handling system, Functions of Materials Handling, Principle of Unit Load, Principles of Material Handling like Reduction in Handling, Reduction in Time, Increase in Productivity, Safety, Flexibility, Standby facility and Avoiding interference of material movement with Production line, Devices used for material handling used Block-Tackle, Winches, Hoists, Elevators, Pillar-Crane, Overhead-Crane, Trucks, Wheel Barrows, Industrial Narrow gauge railways, Tractors, Pipelines, Conveyors (Roller, Belt, Chain, Slat, Wheel and Screw conveyors), Hoists with Trolleys, Fork lift trucks, Crane trucks, Spiral Chutes and Spiral rollers, Concept of Pelletization and Containerization, Points to be thought while doing selection of Material Handling Devices like Material to be Transported, Size and shape of product, Production rate of plant, Distance to be covered, Frequency of usage, Type of container, Initial cost and future maintenance, Need of persons either skilled or unskilled for its operation, Depreciation and maintenance rate and Safety factor.

UNIT 10: INDUSTRIAL PSYCHOLOGYDefinition of Industrial Psychology, Scope of Industrial Psychology, Individual and Group, Human behavior like (1) Group behavior - (a) Formal group behavior and (b) Informal group behavior, (2) Individual behavior - (a) Individual behavior, (b) Social behavior and (c) Situational behavior, Factors affecting the Human behavior, Aims and Objectives of Industrial Psychology like Increasing productivity, Finding skilled employee, Effective utilization of human resources and Increasing efficiency of people at work, Theory X (The Conventional theory or Traditional theory) and Theory Y (The Modern theory or Non-conventional theory) for Motivation or The Mac Gregor Theory for Motivation.

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Reference:1) Introduction to Work study: Industrial Labor Organization2) Industrial Engineering and Management: O.P. Khanna (S. Chand)3) Work Study: R. C. Patel (Acharya Publishers)4) Industrial Engineering: Mahajan5) Motion Study: Benjamin6) Industrial Engineering and Production Techniques: Telsang7) Industrial Engineering and Production Techniques: Ralph M. Barnes (John Wiley and

Sons)8) Motion and Time study – Design and Measurement of work: Ralph M. Barnes (John

Wiley and Sons)

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MICROPROCESSORS-2

SECTION 1: MICROCONTROLLER 8051UNIT 1: 8051 MICROCONTROLLER HARDWARE

Block diagram of 8051 Microcontroller, Pin diagram of 8051, The 8051 Oscillator and clock, Various registers like Program counter (PC), Data pointer (DPTR), A and B registers, Flag register, Program status word, Internal memory organization of 8051, Stack and Stack Pointer (SP), Special Function Registers (SFR), Internal ROM, Input/Output pins, ports and circuits, Connecting External memory, Counters and Timers and their various modes, Serial data Input/Output and their various modes, Interrupts and their types, Interrupt priorities.

UNIT 2: 8051 PROGRAMMING INSTRUCTIONSAddressing modes, Data moving instructions (External memory moves, Code memory read only data moves, Stack moves, Inter-register exchanges and moves), Logical instructions (Byte level operations, Bit level operations, Rotate and Swap), Arithmetic operations (Incrementing and Decrementing, Addition, Subtraction, Multiplication, Division, Decimal Arithmetic), Jump and Call instructions, Types of jumps like Bit jumps, Byte jumps and Unconditional jumps, Calls and Subroutines, Interrupts and Interrupt Routines.

UNIT 3: 8051 APPLICATION BASED PROGRAMS Timing subroutines using Software delay, Lookup tables for 8051 and its access using Program counter and using Data pointer, Keyboard scanning program for a 10 lead keyboard, Interrupt driven program for scanning small keyboards, Program for scanning a 64 key Matrix keyboard, Programs for displays using LCD and 7-segment LED display, Measuring Pulse width using a 8051 Microcontroller, Measuring frequency using a 8051 Microcontroller.

SECTION 2: MICROPROCESSOR 8086 AND COPROCESSOR 8087UNIT 4: ARCHITECTURE OF MICROPROCESSOR 8086

8086 Internal Architecture, Various units like Bus Interface Unit and Execution Unit, Instruction queue, Segment registers, Instruction pointer (IP), Flag register, General purpose registers, Stack pointer register, Pointers and Index registers, The Physical address and Effective address of the memory location, Addressing modes of instruction used to program 8086, Assembler directives like Data definition directives (DB-define byte, DW-define word, DD-define double word), Value returning attribute directives (LENGTH, OFFSET), Procedure definition directives (PROC-procedure start, ENDP-End of procedure), Macro definition directives (EQU-equate, MACRO-macro begins, ENDM-end of macro).

UNIT 5: 8086 INSTRUCTIONS SETData transfer instructions, Shift and Rotate instructions, Arithmetic instructions, Logical instructions, Branch instructions, Processor control instructions and String operations instructions.

UNIT 6: INTERRUPTS AND INTERRUPT SERVICE ROUTINESOverview of Hardware and Software interrupts of 8086, How does an interrupt work?, Hardware interrupts like TYPE-00 Interrupt (Divide by zero), TYPE-01 Interrupt (Single Step Execution), TYPE-02 Interrupt (Non-maskable interrupt), TYPE-03 Interrupt (Break Point interrupt), Software interrupts like DOS interrupts (INT 21H, Function 01H, 02H, 06H, 07H, 08H, 09H, 0AH, 2AH, 2BH, 2CH, 2DH) and BIOS interrupts (INT 10H, Function 02H, 06H, 07H), Priority of interrupts, Sequence of events occurring when interrupt occurs.

UNIT 7: BASIC 8086 CONFIGURATIONSOverview, Basic 8086 configurations like Maximum mode and Minimum mode, Minimum Mode and its pin configurations, Connection of 8282 Latches, 8284 Clock generator and 8284 Transceivers with 8086 in minimum mode, Maximum

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mode and its pin configurations, Connection of 8282 Latches, 8284 Clock generator, 8284 Transceivers, 8288 Bus controller and 8259 Priority Interrupt controller (PIC) with the 8086 in maximum mode, System bus timing, Interrupt priority management using single 8259 and using multiple 8259 PICs, Working and Internal architecture of 8259 PIC.

UNIT 8: 8087 COPROCESSORInternal Architecture of 8087 Numeric Coprocessor, Control Unit, Numeric Execution Unit, Control word, Status word of 8087, Data types of Numeric Coprocessor 8087, Instructions of 8087 Coprocessor like Data Transfer Instructions, Arithmetic Instructions (Addition, Subtraction, Reverse Subtraction, Multiplication, Division and Reverse Division), Complex Arithmetic instructions and Compare instructions.

UNIT 9: MULTIPROCESSOR CONFIGURATIONSQueue status and Lock Facility, 8086 based multiprocessor systems like (a) Coprocessor configuration, (b) Closely coupled configuration and (c) Loosely coupled configuration, Bus control and management in loosely coupled configuration using techniques like Daisy chaining, Polling and Independent Requesting.

Reference:1) Microcomputer systems: The 8086/8088 Family: Yu-Cheng Liu and Glenn A. Gibson

(Prentice Hall India)2) Microprocessor x86 Programming: K.R. Venugopal and Rajkumar (BPB publications)3) Microprocessors and Interfacing: Programming and Hardware: Douglas V. Hall (Tata

McGraw Hill)4) The 8051 Microcontroller: Architecture, Programming and Applications: Kenneth J.

Ayala (Penram International)

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B.E. IVFirst Semester Course

Subjects: VLSI Design Digital Signal Processing Computer Hardware Industrial Electronics Transducers and Measurement OR Microwave Theory

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VERY LARGE SCALE INTEGRATION (VLSI)

SECTION 1: VHSIC HARDWARE DESCRIPTION LANGUAGEUNIT 1: INTRODUCTION TO VHDL

General rules of VHDL programming, Various modules of VHDL like Entity, Architecture, Packages and Configurations, Binding between entity and architecture, Model analysis, The Simulation process.

UNIT 2: BASIC LANGUAGE ELEMENTSIdentifiers, Data objects like Constants, Variables, Signals and Files, Data types like Scalar types (Enumeration, Integer, Floating, Physical) and Composite types (Array, Record), Operators like Logical operators, Relational operators, Shift operators, Adding operators, Multiplication operators and miscellaneous operators.

UNIT 3: BEHAVIORAL MODELLINGEntity declaration, Types of port modes, Architecture body, Process statement, Sequential statements, Variable assignment statement, Signal assignment statement, Delta delay, Wait statements (Wait on, Wait for, Wait until), If….elsif statement, Case statement, Null statement, Loop statement, Exit statement, Null statement, Inertial delay on signal assignment, Transport delay on signal assignment, Signal drivers, Effect of Inertial and Transport delay on Signal drivers, Multiple processes.

UNIT 4: DATAFLOW MODELLINGArchitecture of Dataflow modeling, Concurrent Signal assignment statement, Concurrent versus Sequential signal assignment, Multiple drivers for concurrent assigned signal, Conditional signal assignment statement (when….else), Selected signal assignment statement (with….select….when).

UNIT 5: STRUCTURAL MODELLINGArchitecture of program based on Structural modeling, Component Declaration, Component Instantiation, Binding of component instantiation with corresponding component declaration using positional mapping and Named mapping.

UNIT 6: GENERICS AND CONFIGURATIONSGenerics and their use, Generic declaration, Configurations and their use, Configuration specification, Configuration Declaration, Default configuration, the “Use” clause and “For” clause, Binding using Entity and configurations.

UNIT 7: PACKAGES, LIBRARIES AND ATTRIBUTES Package declaration, Package Body, Deferred constants, Subprogram declaration and body, Design file, Design Libraries, Implicit and Explicit visibility, Library clause, Predefined Attributes and their use, Predefined attributes like (1) Value attributes (LEFT, RIGHT, HIGH, LOW, ASCENDING, LENGTH), (2) Function attributes (POS, VAL, SUCC, PRED, LEFTOF, RIGHTOF), (3) Signal attributes (EVENT, LAST_EVENT, ACTIVE, LAST_ACTIVE, LAST_VALUE), (4) Type attributes (STRUCTURE, BEHAVIOUR) and (5) Range attributes (RANGE, REV_RANGE).

UNIT 8: HARDWARE MODELLING Modeling of Synchronous and Asynchronous machines, Design of Flip-Flops and Logic Gates, State Machine Modeling, Design of Binary multiplier, Interacting State Machines, Modeling a Moore FSM, Modeling a Mealy FSM, Design of Sequence Detector.

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SECTION 2: METAL OXIDE SEMICONDUCTER FIELD EFFECT TRANSISTORS (MOSFET)

UNIT 9: INTRODUCTION TO MOSFETAdvantages of MOSFETs over BJTs, Structure and operation of MOSFETs, Enhancement type MOSFETs (N-type and P-type), Depletion type MOSFETs (N-type and P-type), Physical operation of above MOSFETs, The Channel-length modulation, Derivation of the equation for the Drain current of the MOSFET, The V-I characteristics of MOSFETs, The Body effect and the Body effect coefficient, Derivation of the equation for the Threshold Voltage of MOSFET, Analysis of MOSFET Inverters using (1) Resistive load, (2) Saturated E-NMOSFET load, (3) Linear E-NMOSFET load and (4) Depletion type load, Design of Logic gates using NMOS, MOSFET scaling techniques like (1) Full scaling (Constant field scaling) and (2) Constant Voltage Scaling, MOSFET capacitances.

UNIT 10: COMPLEMENTARY MOSFET (CMOS)Structure and Operation of CMOS, Transfer characteristics of CMOS, The Geometry ratio and the Aspect ratio, Input protection and Latch up in CMOS, Design of Logic gates using CMOS.

UNIT 11: PROCESSING TECHNIQUESVLSI Design flow, The Y chart, The Design Hierarchy, Concepts of Regularity, Modularity and Locality, Layout Design Rules, Full-Custom mask layout design, Design for Manufacturability, Design for Testability, Fault types likes Opens, Shorts, Defects in substrate, Oxide defects, Process variations, Mask scratches and Photolithographic defects.

Reference:1) A VHDL Primer: J. Bhasker (Pearson Education)2) VHDL: Perry (Prentice Hall of India)3) VDHL for Programmable Logic: Kevin Skahill (Addison Wesley Longman)4) Introduction to Digital Microelectronic Circuits: Gopalan (Tata McGraw Hill)5) Microelectronics: Kang and Liu6) Sudhakar Yelemencheli

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DIGITAL SIGNAL PROCESSING

UNIT 1: INTRODUCTION TO DIGITAL SIGNAL PROCESSINGSignals, Systems and Signal processing, Advantages of Digital Signal processing over Analog Signal processing, Classification of Signals as Multi-channel and Multidimensional signals, as Continuous-Time and Discrete-Time signals, as Continuous-Valued and Discrete Valued signals, as Deterministic and Random signals, Concept of Frequency in Continuous-Time and Discrete-Time signals, Continuous Time and Discrete Time Sinusoidal signals, Analog signal to Digital signal conversion via Discrete time signal and Discrete Value signal, Sampling of signal, Sampling Theorem.

UNIT 2: DISCRETE TIME SIGNALS AND SYSTEMSDiscrete Time signals, Classification of Discrete signals as The Energy signal and The Power signal, The Periodic signal and The Aperiodic signal, The Symmetric (Even) and The Asymmetric Signal (Odd), Simple manipulations of Discrete Signals like Folding, Delaying, Adding, Multiplication and Scaling, Input-Output description of Discrete systems, Block Diagram representation of Discrete Time Systems using blocks of Adder, Constant Multiplier, Signal Multiplier, Unit delay element, Unit advance element, Classification of Discrete Time systems like Static and Dynamic systems, Time-variant and Time-Invariant systems, Linear and Non-linear systems, Causal and Non-causal systems, Stable and Unstable systems, Analysis of Discrete time Linear Time-Invariant (LTI) systems using method of Resolution of a discrete time signal into impulses and also using technique of Convolution, Stability of LTI systems, Discrete time systems described by Difference equations, Recursive and Non-recursive Discrete time systems, LTI systems characterized by Constant Coefficient Difference equations, Solution of Linear Constant Coefficient Difference Equations in terms of Homogeneous and Particular Solution, Impulse response of LTI Recursive system, Implementation of Discrete Time systems using Structures like Direct Form-I and Direct Form-II, Decomposition of complex systems in Parallel form and Cascade form, Lattice structure for design of Discrete time systems, Correlations of Discrete Time signals, Cross-Correlation and Auto-Correlation, Properties of Cross-Correlation and Auto-Correlation, Correlation of Periodic sequences.

UNIT 3: THE Z-TRANSFORM AND ITS APPLICATION TO THE ANALYSIS OF LTI SYSTEMSThe Direct Z-Transform and the Region of Convergence (ROC), Comparison of ROC of Z-transform of Finite Duration Signals (Causal, Anticausal, Two-sided) with those of Infinite Duration Signals (Causal, Anticausal, Two-sided), Properties of Z-transform like Linearity, Time shifting, Scaling in Z-domain and Time reversal, Relation of Z-transform with Correlation of signals and with Convolution of signals, Pole locations and time domain behavior for Causal signals, The System Function of a LTI system, The All Pole system and All Zero system, Inverse Z-transform using Long division method and Partial Fraction method, The One-Sided Z-transform and its properties like Time Delay and Time Advance, Analysis of LTI systems in the Z-domain, Response of Systems with Rational System Functions, Response of Pole-Zero systems with Nonzero Initial conditions, Transient and Steady-state response, Causality and Stability, The Schur-Cohn stability test, Stability of Second order systems and Stability Triangle.

UNIT 4: THE DISCRETE FOURIER TRANSFORM AND ITS PROPERTIES AND APPLICATIONSFrequency Domain Sampling and the Discrete Fourier Transform (DFT), The DFT as linear transform, Properties of DFT like Periodicity, Linearity and Symmetry, Multiplication of Two DFTs and Circular Convolution, Use of DFT in Linear Filtering, Filtering of Long Data Sequences using Overlap-Save method and Overlap-Add method, Concept of DFT leakage.

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UNIT 5: EFFICIENT COMPUTATION OF THE DFT USING FAST FOURIER TRANSFORM (FFT) ALGORITHMSFFT algorithms like Divide and Conquer Approach and Radix-2 Algorithm to compute the DFT of two signals efficiently and rapidly, Comparison of the Direct method of finding DFT with the methods described above and finding the most efficient method, Use of “Decimation in Time” algorithm and “Decimation in Frequency” algorithm in Radix-2 method of computation of DFT.

UNIT 6: SPECTRUM ANALYSIS Spectrum Analysis at a single point in Z-Plane, Types of signals like Finite point signals and Infinite point signals, Types of Finite point signals like signals with (a) Frequency variable and Amplitude constant equal to 1, (b) Frequency varying and Amplitude constant but not equal to 1 and (c) Frequency varying and Amplitude also varying as function of frequency, Types of Infinite point signals like signals with (a) Frequency variable and Amplitude constant equal to 1, (b) Frequency varying and Amplitude constant but not equal to 1 and (c) Frequency varying and Amplitude also varying as function of frequency, Representation of Spectral Sequence in terms of structure consisting of delays and constant multipliers, Moving or Sliding Spectral Series, Spectrum arising when the Number of points in DFT is (a) Equal to the number of Samples, (b) Greater than the number of Samples and (c) Less than the number of Samples, Finite Word length Errors like Overflow error and Quantization noise and methods to reduce them.

UNIT 7: LINEAR TIME INVARIANT SYSTEMS AS FREQUENCY SELECTIVE FILTERS Ideal Filter characteristics, Low-pass Filter, Band-pass Filter, Band-stop Filter, High-pass Filter, Low-pass to High-pass Filter transformation, Digital Resonators, Notch filters, Comb Filters, All Pass Filter, Digital Oscillator, Minimum Phase, Maximum Phase and Mixed Phase systems, Decomposition of Non-minimum Phase into Minimum phase and All pass filter.

UNIT 8: DESIGN OF DIGITAL FILTERSCausality and its implications, Comparison of Ideal Filter Characteristics with Practical Filter characteristics, Parameters required to describe the Practical Filters, Design of Finite Impulse Response (FIR) filters using methods like (1) Window method (Rectangular window, Hamming window, Hanning window, Blackman window), (2) Frequency Sampling method and (3) Optimal method or CAD (Computer Aided Design) method, Alternation theorem, Remez algorithm, Symmetric and Anti-symmetric FIR filters, Linear Phase FIR filters, Four types of Linear phase FIR filter with (1) Symmetric unit sample response with ODD length (2) Symmetric unit sample response with EVEN length, (3) Anti-symmetric unit sample response with ODD length and (4) Anti-symmetric unit sample response with EVEN length, Design of Infinite Impulse Response (IIR) filters from Analog filters, Conditions required to design a stable Digital Filter from Analog filter, Design of IIR filter using methods like (1) Design by approximation of Derivatives, (2) Impulse Invariance method and (3) Bilinear Transformation, Frequency transformations in Analog domain.

UNIT 9: DIGITAL SIGNAL PROCESSORSComparison of Digital signal Processors with General processors, Concept of Von Neumann and Harvard Architecture, Concept of Pipelining, Architecture of Digital signal processors developed by Texas Instruments like TMS320C25 and TMS320C30.

Reference:1) Digital Signal Processing: Principles, Algorithms and Applications: John G. Proakis and

Dimitris G. Manolakis (Prentice Hall India)2) Digital Signal Processing: A Computer Based approach: Sanjit K. Mitra (Tata McGraw

Hill)

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3) Discrete-Time Signal Processing: A.V. Oppenheim and R.S. Schafer (Prentice Hall India)4) Theory and application of Digital Signal Processing: Rabiner and Gold (Prentice Hall of

India)5) Digital Signal Processing: Iffeachor and Jervis (Prentice Hall India)

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COMPUTER HARDWARE

UNIT 1: REGISTER TRANSFER LOGICTypes of micro-operations, Inter-register transfer using multiplexers, decoders and Bus systems, Memory transfer, Arithmetic micro-operations, Logic micro-operations, Shift micro-operations, Conditional control statements, Fixed point binary data (Signed magnitude, 1’s complement, 2’s complement) representation, Overflow, Arithmetic shifts, Decimal data, Floating point data, Nonnumeric data, Instruction codes and their formats, Macro-operations and micro-operations, Design of simple computer using Instruction fetch cycle and Execute cycle.

UNIT 2: PROCESSOR LOGIC DESIGNProcessor organization, Bus organization, Scratch pad memory, Accumulator register, Arithmetic logic unit, Design of individual arithmetic circuit, Effect of various operations on output carry, Design of individual logic circuit, Design of combined arithmetic logic unit, Status register, Design of shifter, Processor unit, Design of accumulator for various operations like ADD, AND, SHIFT RIGHT, SHIFT LEFT, CLEAR, COMPLEMENT, INCREMENT, ZERO CHECK, OR and EX-OR.

UNIT 3: TYPES OF MEMORY AND MEMORY ORGANIZATIONMemory hierarchy, Associative memory and its read and write operations, Cache memory and its mapping types like (1) Associative mapping, (2) Direct mapping and (3) Set-Associative mapping, Cache initialization, Virtual memory, Address space and Memory space, Virtual memory mapping using (1) Address mapping using pages and (2) Associative memory page table, Translation Look-aside Buffer (TLB), Page replacement algorithms like FIFO (First In First Out), and LRU (Least Recently Used), Memory management hardware using segmented mapping, Multiprocessing systems like Loosely coupled systems and Tightly coupled systems, Cache coherence and its hardware solution like Snoopy Cache controller.

UNIT 4: CONTROL LOGIC DESIGNControl organization and various methods to implement it like (1) One Flip-Flop per state method, (2) Sequence register and decoder method, (3) PLA control and (4) Micro-program control, Design of Adder-Subtracter using method no. 1 and method no. 4, General micro-program control setup for a processor unit, Design of a system that counts no of 1’s in a given register using the method no. 4, Design of a multiplier using method no. 2 and method no. 3, Micro-program sequencer.

UNIT 5: COMPUTER DESIGNSystem configuration and various registers of a digital computer like Memory address register (MAR), Memory buffer register (MBR), Program counter (PC), Accumulator, Instruction register (IR), Sequence register, Input/Output registers and various flip-flops like E, S, F, Computer instructions and their various formats like Register reference instructions, Memory reference instruction and Input/Output instructions, Timing and Control, Execution of all of the above instructions using Fetch cycle and Execute cycle, Design of Computer registers, Design of control using PLA control and Micro-program control methods individually.

UNIT 6: RISC AND IMPLEMENTATION OF PIPELININGReduced Instruction Set Computers (RISC), Complex Instruction Set Computers (CISC), Characteristics of RISC and CISC, Implementation of Overlapped Register Windows in RISC, Parallel Processing, Flynn’s classification of computers based on their control techniques like (SIMD-Single Instruction Multiple data, MIMD – Multiple instruction multiple data, SISD – Single instruction single data, MISD – Multiple instruction single data), Pipelining, Arithmetic and Instruction pipeline, Pipeline conflicts like Resource conflicts, Data dependency and Branch instructions, Methods to prevent pipeline conflicts

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like Delayed load, Hardware interlocks and Operand forwarding for Data dependency and Delayed branch, Loop buffer, Branch prediction, Branch target buffer and Pre-fetch target instruction techniques for Branch instructions, RISC pipeline, Vector processors, Technique of memory interleaving, Super computers, Array processors like Attached Array processor and SIMD array processor.

Reference:1) Digital Logic and Computer Design: M Morris Mano (Prentice Hall India)2) Computer Hardware: M Morris Mano (Prentice Hall India)3) Computer Organization and Architecture: William Stallings (Prentice Hall India)

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INDUSTRIAL ELECTRONICS

UNIT 1: VARIOUS POWER ELECTRONICS DEVICESPower Diodes, Power Transistors (Power BJT), Silicon controlled Rectifiers (Thyristor or SCR), Gate Turn off Thyristor (GTO), Insulated Gate Bipolar Transistor (IGBT), Power Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Internal Structure of every device, Switching characteristics, Transfer characteristics and Output characteristics of each and every device, Comparison of Safe Operating Areas of various above devices, Applications of every device, MOS-Controlled Thyristor (MCT), Advantages of using Silicon instead of Germanium or Gallium-Arsenide for manufacturing of Semiconductor device.

UNIT 2: THYRISTORSTerminal characteristics of a Thyristor, Static V-I characteristic of a Thyristor which includes Reverse Blocking mode, Forward blocking mode and Forward conduction mode, Thyristor Turn On methods like (1) Forward Triggering method, (2) Gate triggering, (3) dv/dt triggering, (4) Temperature triggering and (5) Light triggering, Switching characteristic of Thyristor during Turn-On and during Turn-Off, Thyristor Gate characteristics, Two transistor model of Thyristor, Various Thyristor ratings like Anode voltage ratings and Current ratings, Snubber circuit protection for Thyristor and its design, Series and Parallel operation of Thyristors, Study of other Thyristor family members like Programmable Unijunction Transistor (PUT), Silicon Control switch (SCS), Silicon unilateral switch (SUS), Static Induction Thyristors (SITH), Diode for AC (DIAC), Triode for AC (TRIAC), Firing circuits for Thyristors like Resistance firing, Resistance-Capacitance firing, Unijunction Transistor(UJT) firing, Synchronized UJT triggering(Ramp triggering) and Ramp and pedestal triggering, Firing circuits for SCR using PUT and advantages of PUT firing over UJT firing circuits, Firing circuit for Triac with and without Diac.

UNIT 3: THYRISTOR COMMUTATION TECHNIQUESVarious types of Thyristor communication techniques like Load commutation (Class A), Current commutation (Resonant pulse or Class B), Complementary commutation (Class C), Voltage commutation (Impulse commutation or Class D), External Pulse commutation (Class E) and Line commutation (Class F).

UNIT 4: AC VOLTAGE CONTROLLERSPrinciple of AC Voltage control, Types of AC voltage controllers, Integral cycle control method (ON-OFF control, Cycle syncopation, Cycle selection, Zero-voltage switching or Burst firing), Single-phase voltage control method with R load and RL load.

UNIT 5: CYCLOCONVERTERS (FREQUENCY CHANGERS)Principle of Cycloconverter operation, Single phase to Single phase step-up cycloconverters like midpoint and bridge converters, Single phase to single phase circuit step-down converters like midpoint converters and bridge converters for continuous and discontinuous load current.

UNIT 6: PHASE CONTROLLED RECTIFIERSPrinciple of phase control, Single phase half wave circuit with RL load with and without freewheeling diode, Single phase half wave circuit with RLE load, Single phase full wave midpoint converter, Full bridge converters and Semiconverters, All above configurations with continuous and discontinuous currents, Three phase converters using diodes and Thyristors like Full converters and Semiconverters for Continuous as well as discontinuous currents, Effect of source impedance on the performance of single phase and three phase converters.

UNIT 7: CHOPPERSPrinciple of Chopper operation, Control strategies like Constant Frequency system and Variable frequency system, Step up choppers, Types of chopper circuits like (1) First quadrant or Type A chopper, (2) Second quadrant or Type B chopper, (3)

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Two quadrant Type A chopper or Type C chopper, (4) Two quadrant Type B chopper or Type D chopper and (5) Four quadrant chopper or Type E chopper, Steady state time domain analysis of Type A chopper to find Steady state ripple, Limit of continuous conduction and Extinction time, Thyristor chopper circuits like Forced commutated, Voltage commutated and Current commutated which includes (1) Voltage commutated chopper (Heumann’s chopper or Parallel capacitor turn off chopper or impulse commutated chopper or classical chopper), (2) Current commutated chopper (Resonant pulse chopper) and (3) Load commutated chopper, Design consideration of each and every chopper listed above.

UNIT 8: INVERTERSPrinciple of Inverter operation, Single phase bridge inverters with R load, RL load and RLC load (overdamped and underdamped), Force commutated thyristor inverters like Modified McMurray Half-bridge inverter, Three phase bridge inverters with 180 conduction mode and 120 conduction mode with R load, Voltage control in single phase inverters with three methods (1) External control of AC output voltage (AC voltage control and Series inverter control methods), (2) External control of DC input voltage using choppers, AC voltage controllers, controlled and uncontrolled rectifiers and (3) Internal control of inverter using Pulse width modulation techniques like Single pulse modulation, Multiple pulse modulation and Sinusoidal pulse modulation.

UNIT 9: SPECIAL APPLICATIONS OF POWER ELECTRONICSSwitched mode power supply (SMPS) configurations like (1) Flyback converter, (2) Push-Pull configuration, (3) Half bridge converter and (4) Full bridge converter, Uninterrupted power supplies (UPS) configurations like Short break UPS and No break UPS, Speed control of DC motor using various controllers.

Reference:1) Power Electronics: P.S. Bhimbhra (Khanna Publishers)2) Power Electronics: J.S. Katre (Technova publications)3) Power Electronics – Circuits, Devices and applications: M.H. Rashid (Prentice Hall India)4) Modern Power Electronics: P.C. Sen (Tata McGraw Hill)5) Thyristorised Power Controllers: G.K. Dubey (Wiley Eastern Ltd.) 6) Power Electronics: Ned mohan (John Wiley and Sons)7) Power Electronics: Jamail Ashgar

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TRANSDUCERS AND MEASUREMENT

UNIT 1: MECHANICAL SENSORSPotentiometric Sensors, Capacitive sensors, Inductive sensors, Variable reluctance sensor, Level sensors, Load cells, Pressure sensors like Diaphragm, Bourdon tubes, Bellows and Solid state Pressure sensors for pressure above atmospheric pressure and sensors like Pirani gauge, thermocouple and Ionization gauge for pressure below atmospheric pressure, Flow sensors like Rota-meter, Magnetic flow meter and Pitot tube, Angular position detectors like Shaft encoders (Absolute Encoders, Incremental Encoders), Synchros and Resolver, Displacement sensors using Potentiometers, using LVDT (Linear Variable Displacement Transducer) and using Inductosyn, Level measurement using Capacitive sensors.

UNIT 2: OPTICAL SENSORSLight properties like Intensity, Divergence, Spectrum, Chromaticity and Coherency, Photometry, Photo detector, Photo-conductive (Photo-resistive) detectors, Photovoltaic cell, Photo-diodes and Photo-transistors, Photo-emissive detectors, Pyrometry (Radiometry), Broadband pyrometer, Narrowband pyrometer, Photo-multiplier tube, Optical sources like Incandescent sources (Electric Bulb) and LASER (Light Amplification by Simulated Emission of Radiation), Properties of LASER, Optical devices like Light Emitting Diode (LED) and Liquid Crystal Display (LCD).

UNIT 3: FINAL CONTROL AND ELEMENTS USED FOR FINAL CONTROLFinal control operation, Actuators, Control elements, Pneumatic signals, Nozzle/flapper system for generation of pressure signal from current signal (I to V converter), Actuators like Electrical Actuators (Relays, Solenoid, AC motor, DC motor, Stepper motor-Permanent Magnetic type, Variable Reluctance type and Hybrid type), Pneumatic actuators and Hydraulic Actuators, Force Balance system for Pneumatic Application, Fluid control valves like (1) ON/OFF Valve, (2) Linear Valve and (3) Equal percentage valve, Range-ability of Valve, Valve Coefficient, Valve Discharge Coefficient, Parameters of Good Valve, Parameters used to decide the type of valve to be used for given application.

UNIT 4: PROGRAMMABLE LOGIC CONTROLLERSContinuous control, Discrete-State control, Discrete/Continuous Control, Relay controllers, Physical and Logical Ladder diagrams, Ladder diagram elements like Motors, Solenoids, Relays, Lights and Switches, Programmable Logic Controller (PLC) design, Input modules and Output modules of PLC, PLC operation and its modes like I/O Scan mode and Execution mode, Timers and Counters in PLC.

UNIT 5: CONTROLLER PRINCIPLESProcess Equation, Process Load, Process Lag, Control system parameters like Error, Variable range, Control parameter range, Control lag and Cycling, Types of controller modes like (1) Discontinuous mode and (2) Continuous mode, Types of Discontinuous modes like Two-Position mode, Multi-position mode and Floating-Control mode, Types of Continuous modes like Proportional Control mode, Integral Control mode, Derivative Control mode, Proportional-Integral Control Mode, Proportional-Derivative control mode and Proportional-Derivative-Integral Control mode, Terms like Proportional Band, Repeats per minute, Rate gain, Direct/Reverse Action.

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UNIT 6: DESIGN OF ANALOG CONTROLLERSDesign of analog controllers for Two-position controller, Three position controller, Floating controller, Proportional Controller, Integral Controller, Derivative Controller, Proportional-Integral Controller, Proportional-Derivative Controller and Proportional-Integral-Derivative Controller using Op-Amps, Tuning of Analog Controller using (1) Reaction Curve method and (2) Cyclic method, Integral Square Error as Figure of Merit.

UNIT 7: CONTROL SYSTEMS AND COMMUNICATION STANDARDSMeasurement, Monitoring and Controlling of parameters, SCADA (Supervisory Control and Data Acquisition), Transducers and Sensors, Signal Conditioners, Signal transmissions using (1) Current loop, Advantages of Current loop, Range of transmission, (2) IEEE 488 bus (HPIB-Hewlett Packard Interface Bus, GPIB-General Purpose Interface Bus), Star Connection, Bus Connection, Ring Connection, IEEE 488 – 24 pin connecter, and (3) CAN (Control Area Network), Frame structure used for Data Transmission in CAN, Features of CAN, Working of CAN, Non-Return to Zero coding of data and Bus Redundancy of CAN, PC based Instrumentation, PC based communication modes like RS-232 interface, Parallel port interface, USB interface, PC ADD ON Cards and IR communication, etc., Types of Transducers like Active and Passive, Two-port and Three-port, Input and Output, Primary and Secondary etc., DCS (Distributed Control System), Manchester Bi-phase coding of data, Hierarchy of DCS, Philosophy behind DCS, Functions of DCS, Mean Time Between Failure (MTBF), Mean Time To Repair (MTTR), Probability of Non Function and Availability of System.

UNIT 8: ULTRASONICS AND FIBER OPTICSDefinition of Ultrasonic and Supersonics, Ultrasonic applications, Ultrasonic flow-meters like Transit time flow-meter and Doppler shift flow-meter, Flaw detection in material samples using Ultrasonic, Compression and Shear modes of Ultrasonic, Velocity and hence minimum flaw dimension that can be detected using Ultrasonic, A-scan, B-scan and C-scan displays used in Flaw detection using ultrasonic, Generation of Ultrasonic and the probes used for it like Single Crystal probe (Transmitter or Receiver) and Twin crystal probe (Transceiver), Compression Probes, Shear Probes, Focused Probe, Variable Angle Probe, Mosaic Probe and Angled Compression Probe, Fiber optic as Intrinsic and as Extrinsic sensor, Parameters of Fiber optic as Light intensity, Phase, Transmission time and Transmission loss, Polarization and Wavelength, Applications of Fiber optic as Proximity sensor, Displacement sensor, pH sensor, Smoke detector, Optical micro-switch, Pressure switch, Force sensor (Roller Chain sensor), Cryogenic leakage detector, Oil leakage detector and Level sensing using Laser along with Fiber optic.

UNIT 9: STRAINFactors affecting strain measurements, Types of strain gauges (Mechanical, Optical and Electrical strain gauges), Theory of operation of strain gauges, Types of electrical strain gauges like Wire gauges, Bonded gauges, Un-bonded gauges, Foil gauges, Semiconductor gauges and Thin film gauges, Strain gauge circuits, Temperature compensation, Applications of strain gauges.

UNIT 10: VIBRATIONCharacteristics of vibration, Analysis of vibration sensing devices and measurement of Absolute Displacement, Absolute Velocity and Absolute Acceleration w.r.t. Relative displacement, Velocity transducers, Bonded Strain Gauge Accelerometer, Solid cylinder Accelerometer, Piezoelectric Accelerometer, Servo Accelerometer, Digital Accelerometer, Vibration sensing devices, Signal conditioning for vibration sensing devices like use of Charge Amplifier and Voltage amplifier.

UNIT 11: PRESSURE

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Units of pressure, Pressure sensing devices like Diaphragms, Bellows, Bourdon tubes and Capsules, Transduction methods using Variable Reluctance Sensor, Variable Capacitance Sensor and LVDT type Transducer, Force-balance transducer, Solid state devices, Thin film pressure transducers, Piezoelectric pressure transducer, Pressure Multiplexer.

UNIT 12: FLOWClassification of flow meters, Head type flow meters, Bernoulli’s Equation, Orifice meter, Venturi tube, Pitot tube, Rota-meter, Electromagnetic Flow meter, Mechanical flow meter like Turbine Flow meter, Hot wire anemometer, Ultrasonic flow meter.

UNIT 13: TEMPERATURETemperature scales, Mechanical Temperature sensors, Resistance type Temperature Sensors, Platinum Resistance thermometers and its sensitivity, Range Response time, Construction and Signal conditioning, Thermistors and its sensitivity, Construction, Range Response time, Thermocouples and its sensitivity, Construction, Range, Time response, Signal conditioning, Reference compensation, Solid state sensors, Temperature measurement by radiation methods, Optical pyrometer.

Reference:1) Process Control Instrumentation Technology: Curtis D. Johnson (Prentice Hall India)2) Instrumentation: Devices and Systems: Rangan, Mani and Sarma (Tata McGraw Hill)3) Principle of Measurement and Instrumentation: Alan Morris (Prentice Hall India)4) Programmable Logic Controllers: John Weib and Ronald Reis (Prentice Hall India)

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MICROWAVE THEORY

UNIT 1: MICROWAVE TRANSISTORS AND TUNNEL DIODESIntroduction to microwave devices, Microwave bipolar transistors, Physical structure of Microwave bipolar transistors, Bipolar transistor configurations, Principles of operation of transistor, Power-Frequency limitations, Physical structures of Hetero-junction Bipolar Transistors (HBT), Principles of operation of Microwave Tunnel diode, Microwave characteristics.

UNIT 2: MICROWAVE FIELD EFFECT TRANSISTORSJunction Field Effect Transistors (JFET), Physical structure and Principles of operation of JFET, Current-Voltage (I-V) characteristics of JFET, Metal Semiconductor Field Effect Transistors (MESFET), Physical structure of MESFET, Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Physical structure of MOSFET, Electronic mechanism, Modes of operation of MOSFET, Overview of MOS transistors and Memory devices, Charge Coupled Devices (CCD), Operational mechanism of CCDs.

UNIT 3: TRANSFERRED ELECTRON DEVICES (TED)Gunn Effect Diodes (GaAs diodes), Background in discovery of Gunn Diodes, Gunn effect, Ridley-Watkins-Hilsum (RWH) theory, Differential Negative Resistance, Two-Valley Model theory, Modes of operation of Gunn diodes, Criterion for Classifying the modes of operation, Various operating modes like Limited-Space-Accumulation (LSA) mode and Stable Amplification Mode, Limited Space-charge Accumulation (LSA) Diodes.

UNIT 4: AVALANCHE TRANSIT-TIME DEVICESRead Diode, Physical Description of Read diode, Avalanche multiplication, IMPATT diodes, Physical structure of IMPATT diodes, Negative resistance, Power output and efficiency, TRAPATT diodes, Physical structure and principles of operation of TRAPATT diodes, BARITT diodes, Physical structure and principles of operation of BARITT diodes.

UNIT 5: STRIP LINESMicrostrip lines, Characteristic impedance of Microstrip lines, Losses in Microstrip lines, Quality (Q) factor of Microstrip lines, Parallel strip lines, Distributed parameters of strip lines, Characteristic impedance of Parallel strip lines, Attenuation losses, Co-planer strip lines, Shielded strip lines.

UNIT 6: WAVEGUIDE AND COAXIAL LINE COMPONENTSCoupling probes, Coupling of wave-guide with coaxial cable, progress of Electric field from coaxial line into wave-guide, Impedance transformer for matching coaxial line to wave-guide, Coupling loops, Coaxial line stubs and Line stretchers, Coaxial line slug tuners, Wave-guide impedance matching elements, Inductive windows and its types like symmetrical and asymmetrical windows, Capacitive windows and its types like symmetrical and asymmetrical windows, Resonant windows, Tuning screws, Wave-guide phase shifters, Wave-guide tees and their types like E-plane (series) tee and H-plane (shunt) tee, The magic tee, Hybrid rings, Wave-guide corners, bends and twists, Coaxial line attenuators, Wave-guide attenuators, Wave-guide mode suppressors, Directional couplers, Types of directional couplers like Two-hole directional coupler, Long-slot directional coupler, Bethe-hole directional coupler and Capacitance loop directional coupler, Wave-meters, Types of wave-meters like Transmission type wave-meter, Reaction type wave-meter, Cavity wave-meter and Coaxial wave-meter, Microwave filters, Terminations (loads).

UNIT 7: FUNDAMENTALS OF MICROWAVE AMPLIFIERS AND OSCILLATORSBeam coupling, Power transfer from alternating gap field to density modulated beam, Beam loading, Electronic and circuit efficiencies.

UNIT 8: TRIODE AND TETRODE MICROWAVE AMPLIFIERS AND OSCILLATORS

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Frequency limit of conventional tubes, Factors affecting frequency limit of tubes like physical structure of tube, skin effect, I2R losses, dielectric losses and electron transit time, Trans-admittance of Microwave tubes, Input admittance of microwave tubes, Output gain and Figure of merit of triodes and tetrodes, Acorn and Door-knob tubes, Lighthouse tubes, Pencil triodes.

UNIT 9: KLYSTRONSBunching of velocity modulation, Two cavity klystron and its structure, Velocity diagram for two cavity klystron, Small signal theory of bunching in Two cavity klystron, Power required to bunch the electron beam, Fourier expansion of electron beam current, Effect of grid interception, De-bunching, Effect of bunching within the Input gap, Effect of large input-gap signal amplitude, Trans-admittance of two cavity klystron, Performance of two cavity klystron amplifiers, Cascade amplifier klystron, Klystron frequency multipliers, Performance of two resonators klystron oscillators, Reflex klystron structure, Velocity modulation diagram for reflex klystron, Mathematical theory of bunching in reflex klystrons, Power delivered to the resonator of a reflex klystron, Effect of repeller voltage upon power delivered to the resonator, Electronic admittance of the reflex klystron, Reflex klystron admittance diagram.

UNIT 10: MAGNETRONSTypes of magnetrons like Negative – resistance magnetron, Cyclotron – frequency magnetron and Traveling wave magnetron, Analysis of plane magnetron with steady anode voltage, Energy transfer by electrons when the anode voltage contains an alternating component, Cylindrical cyclotron frequency magnetron, Structure of multi-cavity magnetron, Theoretical relations between electric and magnetic fields for oscillation.

UNIT 11: TRAVELING-WAVE AND ELECTRON-WAVE TUBESDescription of a traveling wave tube, Helix traveling tube, Amplification process, Analysis of Motion of an electron traveling with an electromagnetic wave.

Reference:1) Microwave Principles: Herbert J. Reich (East-West Press)2) Microwave Devices and Circuits: Samuel Y. Liao (Prentice Hall of India)

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B.E. IVSecond Semester Course

Subjects: Digital Communication Process Instrumentation OR Communication Engineering Elective 1 – Very Large Scale Integration (VLSI) Elective 2 – Biomedical Engineering Elective 3 – Digital Communications Project

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DIGITAL COMMUNICATIONS

UNIT 1: PULSE CODE MODULATIONThe PCM system, The PCM encoder, The PCM decoder, Multiplexing PCM signals, The T1 system, Details of Bit-rate, Bits/frame and synchronizing signals, Channel noise and Error probability, Quantization noise, Idle channel noise, Robust quantizer, Variance of quantization error, Companding in PCM and its various types like -law companding and A-law companding, Differential PCM (DPCM), DPCM transmitter and DPCM receiver, Predictor, Delta Modulation (DM), DM transmitter and DM receiver, Slope overload in Delta Modulation, Maximum output SNR for sinusoidal modulation using DM, Adaptive Delta modulation (ADM), ADM transmitter and ADM receiver, Continuously variable Slope Delta Modulator (CVSD), Adaptive differential Pulse-code modulation (ADPCM), ADPCM with forward estimation, ADPCM with backward estimation, Digital multiplexers, The T1 system, The M12 multiplexer, Voice Coders (Vocoders), Voice model, Channel Vocoder, Linear Predictive coder.

UNIT 2: DIGITAL MODULATION TECHNIQUESCoherent binary modulation techniques, Coherent Binary Phase Shift Keying (BPSK), Reception of Binary Phase shift keyed signal, Spectrum of BPSK, Signal space diagram for BPSK system, Geometrical representation of BPSK signals, Differential Phase Shift Keying (DPSK), Means of generating DPSK signal, Differentially encoded PSK (DEPSK), Coherent Quadrature Phase Shift Keying (QPSK), QPSK transmitter and QPSK receiver, Phasor diagram for QPSK system, Minimum shift keying, Signal space diagram for MSK system, MSK transmitter and receiver, M-ary PSK, M-ary transmitter and M-ary receiver, Quadrature Amplitude Shift Keying (QASK), Geometrical representation of 16 signals in a QASK system, Bandwidth of QASK signal, QASK receiver, M-ary Quadrature Amplitude Modulation (M-ary QAM), Coherent Binary Frequency Shift Keying (BFSK), Receiver of BFSK, Signal space diagram for BFSK, M-ary FSK, Power spectra of Binary PSK and FAK signals, Power spectra of QPSK and MSK signals, Power spectra of M-ary signals, Tamed FM, Tamed FM encoder.

UNIT 3: ERROR CONTROLAutomatic Repeat Request (ARQ), Types of ARQ systems like (1) Go-back N ARQ, (2) Stop and Wait ARQ and (3) Selective repeat ARQ, Analysis of performance of each of the above mentioned ARQ systems by determining the Probability of error in each system and Throughput of each ARQ system.

UNIT 4: SPREAD SPECTRUM MODULATIONConcept of spread spectrum, Advantages of spread spectrum, Use of spread spectrum with Code Division Multiplexing Access (CDMA) technology, Pseudo Noise (PN) sequences, Generation and characteristics of PN sequences like Sequence length, Independence of sequences and Number of 1’s and 0’s in a maximal sequence, Probability of error in spread spectrum modulation, The Processing Gain (PG), Types of Spread spectrum techniques like Direct sequence Spread spectrum and Frequency Hopping spread spectrum, Slow Frequency hopping and Fast frequency hopping.

UNIT 5: DETECTION AND ESTIMATIONWiener filter for waveform estimation, The Weiner-Hopf equations, Principle of orthogonality, Linear Prediction, Prediction-error filter, Inverse filter, Linear predictive Vocoders, Model of speech production process, Linear predictive Vocoder transmitter and receiver, Adaptive filters using Least Mean Square algorithm.

UNIT 6: BASEBAND SHAPING FOR DATA TRANSMISSIONDiscrete PAM signals, Power spectra of discrete PAM signals, Various coding formats like NRZ unipolar format, NRZ polar format, NRZ bipolar format and Manchester format, Power spectra of above mentioned different binary data

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formats, Inter-symbol interference, Nyquist’s criterion for distortionless baseband binary transmission, Ideal solution and Practical solution for Nyquist’s criterion, Correlative coding, Duobinary signaling, Duobinary encoder and decoder, Modified Duobinary technique, Generalized form of correlative coding, Baseband M-ary PAM systems, Adaptive equalization for data transmission, Adaptive equalizer.

UNIT 7: DATA NETWORKSCommunication networks, Circuit switching, Ring network, Mesh network, Bus connections, Star networks, Layered architecture of network, The OSI model, Details of the OSI layers like Physical layer, Data Link layer, Network layer, Transport layer, Session layer, Presentation layer and Application layer, Packet networks, Routing, Packet switched network access protocol like X.25 protocol, The ALOHA and slotted ALOHA, Packet radio networks, Local area networks (LAN), Wireless area networks (WAN),

Reference:1) Digital Communications: Herbert Taub and Donald Schilling (Tata McGraw Hill)2) Computer Networks: Andrew Tanenbaum3) Digital Communications: Simon Haykins (John Wiley and sons)

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PROCESS INSTRUMENTATION

UNIT 1: VISIBLE AND ULTRAVIOLET ABSORPTION INSTRUMENTATIONDefinition of Photometer, Spectrometer and Spectrophotometer, Block diagram of optical Absorption instruments, Radiation sources like Mercury arc lamp, Deuterium arc lamp and Xenon arc lamp, Optical filters like Absorption filters (Glass, Cellophane and Gelatin filters) and Interference filters, Monochromators like Prism monochromators and Diffraction gratings, The Czerny-Turner mounting, The Ebert mounting, The Littrow mounting, Beam Splitters, Monochromators performance analysis using its Dispersion, Resolution, Optical speed and Spectral Purity, Photosensitive detectors like Barrier layer cell (Photovoltaic cell), Photoemissive cell and Photomultiplier tubes, Colorimeters, Single beam filter photometers, Double beam filter photometer, Single beam Spectrophotometers, Single beam Null type spectrophotometers,

UNIT 2: INFRARED SPECTROPHOTOMETERSInfrared spectroscopy, Molecular Vibrations like (1) Stretching, (2) Wagging, (3) Rocking, (4) Twisting and (5) Scissoring, Basic components of infrared spectrophotometers like Radiation sources, Monochromators and Detectors, Types of radiation sources like Globar rod, Nernst Filament and Nichrome wire, Types of detectors like Bolometer, Photoconductive cells, Thermocouples, Golay detectors and Pyroelectric detectors, Process Analyzers, Infrared Probe

UNIT 3: FLAME PHOTOMETRY AND ATOMIC ABSORPTION SPECTROPHTOMETRYPrinciple of Flame photometry, Constructional details of flame photometers and of atomic absorption spectrophotometers, Emission system consisting of Flow meters, Fuel supply, Oxygen supply, Air supply, Atomizer, Nebulizer Burner (Premixed or Laminar flow burner and Turbulent or Sprayer burner) and Flame, Radiation sources like Hollow Cathode lamp, Optical system consisting of Filters and Monochromators, Single beam direct reading flame photometer, Optical detectors, Process of Nebulization, Spectral interference, Physical interference.

UNIT 4: MASS SPECTROMETERSBasic mass spectrometer principle, Magnetic deflection mass spectrometer, Components of mass spectrometer like The Sample Inlet system, The Ion sources and The Electrostatic Accelerating system, Ionization sources like (1) Electron Impact Ionization, (2) Knudsen cell, (3) Laser Microprobe, (4) Field Ionization, (5) Spark source Ionization and (6) Chemical Ionization, Ion Collection systems like Electron multiplier phototube and photographic plate, Interfaces between Gas Chromatograph and Mass spectrometer like Effluent Splitter, Jet-orifice and Molecular Separator, The Neir 60˚ sector mass spectrometer, The Dempster 180˚ mass spectrometer, The Time of Flight mass spectrometer, Double Focusing Spectrometers.

UNIT 5: NUCLEAR MAGNETIC RESONANCE (NMR) SPECTROMETERPrinciple of NMR, Nuclear spin, Nuclear energy levels, Resonance spectra, The Free Induction Decay, Constructional details of NMR spectrometer, The Magnetic field, The Radio-frequency transmitter, The Sample holder, Continuous wave NMR spectrometer, Pulsed wave NMR spectrometer, Fourier Transform NMR spectrometer.

UNIT 6: RAMAN SPECTROMETERThe Raman Effect, The Stokes and The Antistokes lines, Raman spectrometer and its related instrumentation like the Source, Sample chamber and the detector, Sample illumination and handling.

UNIT 7: GAS CHROMATOGRAPHYChromatography, Basic parts of gas chromatograph like Chromatographic column, Thermal component and Detection system, Carrier gas supply, Sample

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injection systems for Liquid, Gas and Solid samples, Types of chromatographic columns like Packed column and Capillary column, Detection systems like Thermal conductivity meter and Flame Ionization detector (FID).

UNIT 8: pH METERSpH and its meaning, Principle of pH measurement, Electrodes for pH measurements like the (1) Hydrogen electrode, (2) Glass or Active electrode and (3) Calomel or Reference electrode, The Salt Bridge, The Asymmetry potential, Buffer solutions, Requirements that pH meters should satisfy, Null Detector type pH meters, Direct reading pH meters, Chopper amplifier type pH meter, Vibrating condenser type pH meter, Digital readout pH meter.

UNIT 9: INDUSTRIAL GAS ANALYSERSTypes of gas analysers like Paramagnetic Oxygen analyser, Null detection type Oxygen analyser, Magnetic Wind oxygen analyser, Infrared gas analysers and Thermal conductivity gas analysers like CO2 analysers.

Reference:1) Handbook of Analytical Instruments: R.S. Khandpur (Tata McGraw Hill) 2) Instrumental Method of Analysis: John Dean and Hobart Willard (D Van Norstrand

Company Inc.)3) Industrial Instrumentation Fundamentals: Austin Frebance (Tata McGraw Hill)

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COMMUNICATION ENGINEERING

UNIT 1: RADAR SYSTEMSBasic principles, Basic Radar system, Double range echoes, Pulse repetition time (PRT), Pulse repetition frequency (PRF), Pulse repetition rate (PRR), Development of radar, Frequencies and powers used in radar, Radar performance factors, Radar range equation, Factors influencing maximum range of radar, Noise Figure, Effects of noise on maximum range of radar, Block diagram of basic Pulsed radar which consists of IF section, Local oscillator, Mixer, Detector, Duplexer etc, Maximum power and maximum range equations of pulsed radar, Radar modulators, Radar receiver bandwidth requirements, Characteristics of pulse required in pulse radar, Factors governing pulse characteristics, Types of antennas and types of scanning like Horizontal scanning, Nodding, Helical scanning and Spiral scanning, Types of tracking like Lobe switching (sequential lobbing) and Conical scanning, Feed arrangements for Monopole tracking, Types of display like Plan Position indicator (PPI) and A scope display, Automatic target detection, Types of pulsed radar systems like Track while scan (TWS) radar system, Search and Track radar system, Moving Target Indicator (MTI), Fundamentals of MTI, Block diagram of coherent MTI radar having Duplexer, Klystron amplifier, Modulator, Stable Local oscillator, Mixer, IF section, Coherent oscillator, Phase detector, Delay line, Adder etc., Working of MTI radars, Delay lines and their use in MTI, Blind speeds, Simple Continuous wave (CW) Doppler radar, CW Doppler radar with IF amplification, Advantages and limitations of CW Doppler radar, Frequency modulated CW radar, Phased array radars, Planar array radars.

UNIT 2: BASICS OF COMMUNICATION AND SWITCHING SYSTEMSLine Communication, Elements of phone system, Central switching, traffic load and service grades, hierarchy of switching offices, two and four wire connections.

UNIT 3: TYPES OF ANTENNASVHF and Microwave Communications, VHF and UHF antennas, Secondary sources and aperture antennas.

UNIT 4: MICROWAVE LINK REPEATERSProperties of microwaves, Applications of microwaves, Advantages and disadvantages of using microwaves as part of communication, Microwave relay links as part of satellite communications, Directivity, Frequency reuse concept, Various bands of frequency used in satellite communication, Frequency Division Multiple Access (FDMA) concept, Pre-assigned FDMA, Demand-assigned FDMA, Single Channel Per Carrier (SCPC) and Multiple Channels Per Carrier (MCPC) concepts, SCPC PCM multiple Access Demand assignment Equipment (SPADE), Common Channel Signaling (CCS) concept, Time Division Multiple Access (TDMA) concept, Satellite Switched TDMA (SS-TDMA), Code Division Multiple Access (CDMA) concept, Advantages of CDMA.

UNIT 5: LASERS AND MASERSParametric amplifiers, Applications and Basics of Maser, Applications and Basics of Laser.

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UNIT 6: NAVIGATION SYSTEMS Difference between Navigation and Radar concept, Loop antenna, Advantages and Disadvantages of Loop antenna, Adcock antenna, Advantages and disadvantages of Adcock antenna, LORAN (Long Range Navigation), VOR (VHF Omni-directional Range), DME (Distance Measurement Equipment), ILS (Instrument Landing system), Global Positioning System (GPS), Beacon and Beacon frequency, GCA (Ground Controlled Approach).

Reference:1) Communication systems: Kennedy and Davis (Tata McGraw Hill)2) Antenna Engineering: Weeks3) Principles of Communication Engineering: Anokh Singh4) Communication Engineering: Timothy Pratt and Bostian5) Tomasi

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BIOMEDICAL ENGINEERING

UNIT 1: CELL POTENTIALCells and cell structure, Transport of ions through the cell membrane, Charge gradient, Concentration gradient, Sodium pump, Absolute refractory period, Relative refractory period, Goldman’s equation, Resting and Action potential, Characteristics of Resting Potential, Effect of increase and decrease of concentration of various ions in a cell on the human body, Bioelectric potentials.

UNIT 2: BIOPOTENTIAL ELECTRODESDefinition of electrode, Half Cell potential (Electrode potential), Types of electrodes like Perfectly polarizable electrodes (Non reversible electrodes) and Perfectly nonpolarizable electrodes (Reversible electrodes), Offset potential, Surface electrode equivalent circuit, Electrode paste and its importance, Electrode material, The Double layer, Electrodes like (1) Microelectrode (Metallic and Non-metallic), (2) Depth and Needle electrodes and (3) Surface electrodes (Suction cup, Metal plates, Adhesive type, Multipoint electrode and Floating electrode), Indwelling electrodes, Chemical electrodes like The Hydrogen electrode (Reference electrode), The Ag-AgCl electrode (Reference electrode), The pH electrode, The Clark’s electrode (for measuring pO2) and the Sovering Hous electrode (for measuring pCO2).

UNIT 3: BIOPOTENTIAL RECORDERSCharacteristics of a good Recording system, Electrocardiography (ECG), Origin of Cardiac Action potential, Systole, Diastole, The Sino-Atrial node and the Atrio-Ventricular node, Typical ECG waveform, ECG lead configurations like (1) Bipolar limb leads (L1, L2 and L3), (2) Augmented Unipolar limb leads (aVR, aVF and aVL) and (3) Chest leads, ECG recording setup and 12 lead ECG recorder, Vectorcardiography (VCG), Phonocardiography (PCG), Types of Heart sounds like Valve opening and closing sounds, Ventricular filling sound and Extra cardiac sounds, First Heart sound, Second Heart sound, Third heart sound, Fourth heart sound, Murmurs, Recording setup for PCG, Types of microphones, Role of PCG in medical diagnostics, Echocardiography, A-mode display, B-mode display, M-mode display, Electroencephalography (EEG), Action potentials of brain, Graded potentials, Evoked potentials, Anatomy of brain, Brain waves like α waves, β waves, γ waves and δ waves along with their amplitude, frequency and originating region, Placement of electrode on Scalp for measurement of EEG (The 10-20 lead system), EEG recording setup, Role of EEG in medical diagnostics, Electromyography (EMG), Conduction velocities in motor nerves, Electroretinography (ERG), Electrooculography (EOG).

UNIT 4: PHYSIOLOGICAL ASSIST DEVICESPacemakers, Energy requirements to excite heart muscles, Differences between Internal and External pacemakers, Different types of pacemakers like (1) Ventricular Asynchronous pacemaker (Fixed rate pacemaker), (2) Ventricular Synchronous pacemaker (Stand-by pacemaker), (3) Ventricular Inhibited pacemaker (On-demand pacemaker), (4) Atrial Synchronous pacemaker and (5) Atrial Sequential Ventricular Inhibited pacemaker, Defibrillators, Internal and External Defibrillators, Special electrodes for Defibrillators, Types of Defibrillators like (1) A.C. Defibrillators, (2) D.C. Defibrillators, (3) Synchronized D.C. Defibrillators, (4) Square pulse Defibrillator, (5) Double square pulse Defibrillator and (6) Biphase D.C. Defibrillator, Heart Lung machine, Mechanical functions of heart, Complete cardiovascular circulation, Model of heart lung machine, Oxygenators like Bubble oxygenators, Film oxygenators and Membrane oxygenators, Blood pumps like pulsatile and non-pulsatile pumps, Traps and filters, Heat exchangers.

UNIT 5: OPERATION THEATER EQUIPMENT

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Surgical diathermy, Electro-surgery generators, Electro surgery techniques like Fulguration, Desiccation, Electrotomy, Coagulation and Blending, Block diagram of electrosurgical diathermy unit, Short wave diathermy using capacitive field and inductive field, Microwave diathermy, Ultrasonic diathermy, Therapeutic effect of heat, Flowmeters like Ultrasonic blood flowmeter (Transit time and Doppler type) and Laser based Doppler blood flowmeter, Cardiac output measurement using (1) Fick’s method, (2) Indicator dilution method, (3) Thermo dilution method and (4) Impedance change method, Pulmonary function analyzers to determine Ventilation, Distribution and Diffusion, Lung Volumes and Capacities, Spirometers, Pnuemotachometers, Blood gas analyzer, Plethysmography.

UNIT 6: SPECIALISED MEDICAL EQUIPMENTSErythrocytes, Leucocytes, Thrombocytes, Blood Cell counter using conductivity meter, Laser based blood cell counter, Definitions like (1) Mean Cell Volume, (2) Mean Cell Hemoglobin, (3) Mean Cell Hemoglobin Concentration, (4) Mean Platelet Volume, (5) Red Cell Distribution Width and (6) Platelet Distribution Width, Audiometer, Anatomy of Human ear, Pure tone and Speech audiometers, Bakesy audiometer, Stethoscope, Skin Contact impedance and instrument measuring it, Pulse sensors like photoelectric pulse transducers and Strain gauge pulse transducer.

UNIT 7: ADVANCE TECHNOLOGIES IN BIOMEDICAL INSTRUMENTATIONX-Rays and their properties, Production of X-rays, Units of X-rays, Block diagram of a X-ray machine, X-ray image intensifier tube, Rotating Anode tube X-ray, Stationary Anode tube X-ray, Different types of X-rays like (1) Diagnostic Still picture X-ray, (2) Diagnostic Continuous Picture X-ray (Fluoroscopy), (3) Diagnostic Motion Picture X-ray (Angiography), (4) Diagnostic Still Picture X-ray Scan (Computer Aided Tomography-CAT) and (5) Theuraptic X-ray, Computer Axial Tomography (CAT scan), Block diagram of CAT scanner, Hounsfield number, Back propagation theorem, Nuclear Imaging Techniques and use of Nuclear Magnetic Resonance (NMR) in Magnetic Resonance Imaging (MRI), Principle of MRI, Magnetic moment, Larmor Frequency, Free Induction decay (FID), MRI parameters like Spin density, Spin-lattice relaxation time (Longitudinal time - T1) and Spin-spin relaxation time (Transverse time - T2), MRI instrumentation, Types of Magnets, RF transmitting and detecting system, Gradient magnetic field and its generation, Detection system in MRI, Advantages of MRI over CT, Positron Emission tomography (PET).

UNIT 8: VARIOUS TYPES OF ISOLATIONS, BIOMEDICAL AMPLIFIERS AND SAFETY INSTRUMENTATIONWhat is Isolation, Isolation amplifiers, Various types of isolation like (1) Use of Battery powered devices, (2) Use of Carrier modulation techniques, (3) Optical isolation and (4) Current loading type method, Biomedical amplifier requirements, AC coupled amplifiers, Chopper stabilized amplifiers, Elimination of input capacitances of amplifier using guarding input circuits and shielded cables, Grounding and Interference rejection, Radiation safety instrumentation, Definitions of Curie, Roentgen, RAD (Radiation Absorbed Dose), REM (Roentgen Equivalent Man), Gray, Sievert and MLD (Mean Lethal Dose), Effects of radiation exposure, Radiation monitoring instruments like Pocket Dosimeters, Pocket Radiation Alarms, Film dosimeter and Thermo luminescence dosimeter, Physiological effects due to current passage through the body, Micro-shock and Macro-shock, Leakage currents like Patient leakage current, Enclosure leakage current and Earth leakage current, Methods to reduce leakage current, Device used to measure leakage current, Patient signal Amplifier, Devices like the Ground Fault Interrupter (GFI) and Isolation transformer used to protect patient against electrical hazards.

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Reference:1) Biomedical Instrumentation: M. Arumugam (Anuradha Agency Publishers)2) Medical Instrumentation – Application and Design: Webster (John Wiley and Sons)3) Biomedical Instruments and Measurements: Chromwell (Prentice Hall of India)4) Introduction to Biomedical Equipments and Technologies: Joseph Carr and Brown

(Prentice Hall of India)5) Textbook of Medical Physiology: Arthur Guyton and John Hall (Harcourt Brace and

Company)6) Handbook of Biomedical Instrumentation: R.S. Khandpur (Tata McGraw Hill)

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Elective: EMBEDDED SYSTEM

UNIT 1: Introduction to Embedded Systems, Characteristics of embedded systems, applications, common design metrics and design challenges.

UNIT 2 : Processors : Single purpose and general purpose processors, their basic architecture, operations, Superscalar and VLIW architectures, application specific instruction set processors (ASIPs), Digital Signal processors (DSPs), ARM processors, SHARC processors, microcontrollers

UNIT 3 : Data acquisition systems, DAS designUNIT 4 : RTOs properties, RTOs in embedded systems, RTOs architecture, Kernel, task,

enrolment and scheduling, task prioritization, context switching, multitasking, preemptive and cooperative inter task communication, event management, locking mechanism, interrupt handling, watchdog timer, exceptions, criteria for choosing RTOs Introduction to commercial RTOs like QNX, VxWorks from WindRiver, ThreadX from Express Logic, eCos from RedHat, HardHat from MontVista, Embeddix. From Lineo, Embedded Linux, Nucleus from ATI, WinCE, Embedded NT from Microsoft

UNIT 5 : Device drivers, their architecture, types, implementations (Presentation)UNIT 6 : Networks for embedded systems, network processors their basic architecture. 12C

Bus, CAN bus.

Reference Books :

1. Embedded System Design : A Unified hardware / software introduction, Frank Vahid, Tony Givargis

(Wiley Publishers)2. Computers as Components Principles of embedded computing system design, Wayne Wolf (Morgan Kaufmann Pub).3. Embedded Microcomputer Systems Real Time Interfacing, Jonnathan W. Valvano (Thomson Learning).

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MOBILE COMMUNICATION

Theory : 100 Marks Pr/TW/Viva: 50 Marks Total : 150 Marks

UNIT 1: Propagation Environment for Mobile Communication: Multipath, reflection, scattering, fading, shadowing, Doppler effects.

UNIT 2: Introduction to Cellular Mobile Systems: Hexagonal cell and concept of frequency reuse, Distance to frequency reuse ratio, channel & co-channel interference reduction factor, hand off mechanisms ,Hard, Soft & forced handoffs, Cell splitting, Umbrella Cell Concept, Cell Sectoring, S/I ratio consideration, Minimum Co- channel and Adjacent interference.

UNIT 3: Frequency and Access Management: Spectrum utilization, setup channel, access channel, fixed Channel assignment, Intra system hand off mechanisms, Integration with landline systems, Digital modulation methods.

UNIT 4: Multiple Access Techniques: TDMA, FDMA, TDMA, CDMA, OFDM.UNIT 5: Digital Cellular Systems: GSM cellular standard, service aspects, reference architecture and functioning

partitioning, typical call flow sequence.IS-95 CDMA standard, service aspects, network reference model radio aspects and distinctive features.

UNIT 6: Multimedia and Data Communication Over Mobile Networks: Packet radio service ,GPRS,EDGE,3G and 4G features,IMT-2000 service aspects, network reference model, radio aspects and distinctive features, PCS , Wireless LAN.

UNIT 7: Recent Trends in Satellite mobile.

Practical/TW: Practical /Term Work [8 experiments based on above topics.]

Reference:1) Wireless communications, principles and practices, by Theodore S.Rappaport, Pearson Education.2) Mobile cellular Telecommunication Analog and digital system(second edition) William C.Y.Lee MC Graw –

Hill.3) Mobile and personal Communication system and serveices by Rajpandya, IEEE press(PHI).4) Wireless digital communications by Dr. Kamilo Feher PHI.

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PROJECT

The project work consists of about 3 months in 7 th semester and 4 months in 8th, the final semester. Students have to prepare some working model based on electronic principles. Students have to incorporate some software part and some hardware part into their working model. If there is no software portion and model is based simply on electronic circuitry it is fine, but a model without hardware portion is generally not allowed.

Students are encouraged to get some projects from industry, so that they come to know and have hands on the latest technology that is being prevailing in the industry. This helps the students to get job too in the concerned industry after completing the project.

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