Basic Transreciver Staion

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BASIC

TRANSRECIVERSTAIONVIPIN MISHRA

08EI58

I.E.T. M.J.P. ROHILKHAND UNIVERSITY

BAREILLY


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ACKNOWLEDGEMENT

The satisfaction that accompanies the successful completion of any task would be

incomplete without the mention of the people who made it possible and whose

constant guidance and encouragement crown all the efforts with success.

It is my proud privilege to express deep sense of gratitude, regards an appreciation

to my guide Mr. SUDHIR SHARMA for his invaluable guidance, deep rooted

interest, inspiration and continuous encouragement throughout our summer

training which helped me to complete my project successfully. I am blissful to pay

my greatest regards to Mr. ANAND for her valuable guidance and advice during

the course of this project. I also wish to thankMr. ANUJ BISWAS for extending

their valuable guidance & help about logical aspects of all practical

implementations of design & support for literature, critical reviews and above all

moral support they provided to me at every stage of training.

I am grateful to those who have directly or indirectly helped me during the projectwork. Finally, I express my heartfelt gratefulness to my parents, teachers and

friends for their wishes and contributions towards carrying out this endeavor.


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Certificate

TO WHOM IT MAY CONCERN

This is to certified that Mr. VIPIN MISHRA, a 4th year(EI) student of Institute Of Engineering & Technology,

M.J.P.Rohilkhand University, Bareilly, has successfullycompleted his training/project on:

BTS:BASIC TRANRECEIVER SATION

in partial fulfilment of the requirement for the award of

Bachelor Of Technology (B.Tech) from ELECTRONICPRODUCT DIVISION,I.T.I LIMITED during the periodof Six weeks (45 Days).

CERTIFIED BY:

MR. M.P.SINGH

ASSTT. MANAGER(EDC)

I.T.I. LIMITEDRAI BARELI


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I.T.I. PROFILEThe Rae-Bareli Unit of ITI set up in 1973, has been

continuously upgrading to new technologies.

Today , the unit produces electronic and mechanical

equipments like :

GSM BTS (Collaboration with ALCATEL FRANCE)

Tower and Shelter for BSNL

Installation and commissioning of CDMA equipments

in Maharastra& Rajasthan.

Installation , commissioning and maintenance of GSM

network of BSNL in Maharastra, Gujrat and MP

&Chattisgarh.


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SURFACE MOUNT TECHNOLOGY

Surface mount technology (SMT) is the practice & method

of attaching leaded & nonleaded electrical components to

the surface of a conductive pattern that does not utilizes

leads in feed through holes. Surface mount technology is

the latest trend in electronics manufacturing. It started

way back in 1986 that has been more than a decade now.

Type of Surface Mount Devices

There are various types of Surface Mount

Components or SMD (Surface Mount Devices)

available in the industry

1. Chip components:These components are very

small size. These consist of resistors, capacitors,


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diodes, LEDs etc.They are available as small as 0.6(l)

x 0.3(w) mm .

.

2. SOTs:These are known as small outline transistors.

This category comprises of components like,

standard transistors, UJT, SCR, Triacs, Diacs, etc.


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3. SOICs:These are known as small outline Integrated

Circuits These are the ICs that can be directly

mounted on the board with no requirement of

insertion


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4. TSSOPs:These are known as Thin Shrink Small

outline Packages These are also ICs that can be

directly mounted on the board but the pitch between

pins very less of order 0.5mm & thickness of the ICs

very thin of order 1.5 mm..


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5. QFPs:These are known as Quad Flat Packages These

are also ICs that can be directly mounted on the boardbut the pitch between pins very less of order 0.5mm &

has pins on all four sides.


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6. PLCC:These are known as Plastic Leaded Chip Carrier

These are also ICs that can be directly mounted on the

board but these have J type leads ie. The leads are bend


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under the body of the IC. A PLCC has J-type leads on all 4

sides & if it has a J-leads on two sided then it is called SOJ

7. BGA:These are known as Ball Grid Array These are

also ICs that can be directly mounted on the board butthese have leads in the form of balls underneath the

body.These BGAs are the latest trend in the SMT. These

BGA have ball size as small as 0.25 mm. Therby reducing

the size of the component to a very minimum size.


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8. Surface Mount Connectors:These are the

connectors which can be directly mounted on the board.

The connectors include connectors in which PLCC, SOJ &

BGA can be mounted, as well as data bus & power cables

etc. can be connected


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SMT: INTRODUCTION

Europlacer Line 1 SMT shop was commissioned in July98.

Resources

Screen Printer : DEK 260 SA

Pick and Place : EP 400 & EP 600 (Europlacer)

Oven : ETS 2545B, USA

Line Speed : 10000 CPH (Max. Rated Speed)

Feeder Capacity : 144 of 8 mm Tape

Placement Capability : 20 mils Fine Pitch ICs

Europlacer Line 2 Screen Printer : DEK Horizon 02 i

Pick and Place : EP 400 & Xpress 50

Oven : XPM 820, VitronicsSoltec, USA

Line Speed : 54000 CPH

Feeder Capacity : 237 of 8 mm Tape + 30

trays

Europlacer Line 3 Screen Printer : DEK Horizon 02 i


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Pick and Place : XP143E & XP243E

Oven : MR 933, VitronicsSoltec, USA

Line Speed : 90000 CPH

Feeder Capacity : 440 of 8 mm Tape + 20 trays


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SMD ASSEMBLY PROCESS MAP

QC

Receipt of material

Kitting

Trolley loading andfeeder programming/

Preparation

Solder Paste

Pick & PlaceAssembly

Inspection and repair onstop conveyor

Reflow Solde

QC Check

Inspection and repair

Card Dispa

QC Check

QC Check

QC Check


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INTERNAL CKT. TESTING

The In circuit tester tests the components &determines the functionality of the components.

But this testing is done in a particular sequence so

that whole circuitry is not effected due to a faulty

component or an improper joint. The sequence is

as mentioned below.

n Preshort Test: The tester prepares & initializes for

testing. During this process the tester verifies thatthe fixture & board are properly mounted on the

tester. It checks that the probes of the fixtures sits

on the board smoothly.

n Short: It checks for unexpected shorts & Opens in

the circuit ot make sure that the components are not

missing & if not missing then it checks that the

components are not short due to any manufacturing

process. If it finds any short it gives alarm & stops

the testing, in order to avoid the failure of the

circuitry.

n Analog In circuit: During this process first the

analog components are checked unpowered then

powered testing is done as explained earlier.n Digital In Circuit: During this process the digital

components are checked as described earlier.


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Functional Testing

This is the type of testing which is done to check the

functionality of whole of the circuitry. During this testing

all the power supplies inputs & output processors are

connected to the board. Then the input processors giveinput to the circuit & output processor reads output &

analyzes how the circuit is behaving according to the

input.

This process is performed after all the types of

Inspection & testing discussed earlier.This is the final

testing to check if the board is good or not. The boards

which are passed through this are marked Tested OK. &

then are shipped.

As we have seen that the inspection has some

limitations so has the testing. So we can say that the

inspection & testing process can be combined together so

that the board can be 100% inspected for all type of

possible defects. The next page shows the types of faultsthat may be present in a board & capability of the

inspection & testing process to diagnose it.


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BTS: BASIC TRANRECIEVER

STATIONThe BTS provides two-way radio communication between thePSTN, andMobile Stations located in a single GSM cell. It also provides a similarlink between the Mobile Stations and the rest of the PLMN. via the TC.The BTS thus interfaces the digital baseband signals used by the land-

based networks and the GSM radio signals used by Mobile Stations.

TYPE OF BTS

INDOOR (AC,DC) OUTDOOR (AC,DC)

(mbi5)(mbo2)
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Various card used in MBI5 cabinet are as given below:

SUMAprovides the central management and control of all the

BTS A9100 modules. It has responsibility for the following

functional areas:

Digital transmission

Timing and clock generation

Management of the BTS internal digital interfaces

O&M functions

RI

Control of the AC/DC converters and check of the

battries.


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TRE combines digital baseband and analog RF functionality in

one module. The architecture is split into three functional blocks:

Digital part TRED

Analog part TREA

(TRED and TREA are realized on TREDA)


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Power amplifier TEPA.

Power supply TREPS.


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ANC provides the intermediate RF stage between the TREs and

the antenna. On the downlink, the ANC connects two TRE

transmitters to two antennas. On the uplink, it splits the received

signals and passes them to the TRE receivers.

FACB monitors the fans and provides power and digital speed

control of the FANUs. A FANU consists of a moulded-plastic


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frame containing two fan blowers. Three FANUs are controlled by

one FACB.


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RACK / CABINET DESCRIPTION ofBTS

EVOLIUM BTS A9100 INDOOR MBI5


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Quality of MBI5 BTS

1. Very high radio performances, in particular.

RACK -one

SUB-RACK -

five

CONNECTION AREA -

one

DIMENSIONS AND

WEIGHT

HIGHT -

1940mm(6.36)

WIDTH -

600mm(1.96)

DEPTH -

450mm(1.47 )

WEIGHT - 270 kg

(595p)


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* Reception sensitivity, -111 dBm,

* Improved Output Power, (Standard 45 W).

2. Radio (synthesizer) Frequency Hopping,

3. Antenna Diversity (as standards option),

4. Minimum Service Interruption

5. Very High BTS availability

*Due to Module Reliability

*Due to System Architecture,

6. Optimized software release migration.

Flexibility of MBI5 BTS

1. Wide possibilities of extensions and sectorization,

within the same cabinet, e.g., the MBO2 cabinet can


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accommodate up to six sectors with a twelve-TRX

total capacity,

2. Outdoor BTS modularity provides flexibility for other

equipments (Transmission Equipment, Batteries,

Microwave, DDF etc.),

3. System Architecture and Cabinet for GSM 850, GSM

900, GSM 1800 and GSM 1900 remains the same,

4.High modularity,

5. Reduced set of modules and a common interface.

Future Proof BTS

1.GPRS Ready


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2.EDGE Ready by add TRE operation

3.UMTS Ready: the MBI5 and MBO2 outdoor

cabinet allow mixed configurations GSM + UMTS.

GPRS: GENERAL PACKET RADIO SERVICE

EDGE: ENHANCED DATA FOR GSM EVOLUTION

UMTS:UNIVERSAL MOBILE TELICOMMUNICATIONSYSTEM

IMT INTERNATIONAL MOBILE TELECOMMUNICATION.


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ABREVIATION:

1. MBI5 MULTISTANDARD BTS INDOOR WITH 5SUBRACK

2. SMT SURFACE MOUNT TECHNOLOGY

3.SOIC SMALL OUTLINE IC

4. SOT SMALL OUTLINE TRANSISTOR

5. SSOP SHRINK SMALL OUTLINE PACKAGE

6.QFP QUAD FLAT PACK IC

7. PLCC PLASTIC LEADED CHIP CARRIER

8. BGA BALL GRID ARRAY

9.FANU FAN UNIT

10.FACB FAN CONTROL BOARD11.BTSRI BTS REMOTE INVETOR

12.XIBM EXTERNAL ALARM INPUT BOARD

MULTISTANDARD

13.TRE TRANS RECEIVE EQUIPMENT

14.ANC ANTENNA NETWORK COMBINER

15.SUMA STATION UNIT MODULE ADVANCED

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Basic Transreciver Staion