Background Statement for SEMI Draft Document 5357A Line ...downloads.semi.org/.../$FILE/ATTCEUXF.pdf · 2010 ACGIH TLVs and BEIs – Based on the Documentation of the Threshold Limit

Background Statement for SEMI Draft Document 5357A Line Item Revisions to SEMI S2-0712a, ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT (In Delayed Effective Date Format)

Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in

reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant

patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this

context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the

latter case, only publicly available information on the contents of the patent application is to be provided.

Background Statement

This task force was started to address various concerns with the non-ionizing radiation criteria in what is now

Appendix 3 of SEMI S2. As the criteria affected by this effort covers a wide range of frequencies with different

limit functions, the revision was initially split into 6 line items to attempt to pass parts as quickly as possible. The

criteria are in Appendix 3, where most of the non-ionizing radiation criteria are located; and Related Information 7,

which includes rationale for the criteria and changes.

Rationale for Line Item/Delayed Revision section 1

Previous ballots attempted to incorporate the optical radiation emission limits directly from the external optical

radiation exposure limits into SEMI S2. The last taskforce determined this method was too complex to likely ever

be acceptable, so this ballot returns to referencing the external criteria. This ballot does propose some changes by

providing additional measurement technique information and allows some flexibility on measurement distance and

time of exposure when justified. Additionally, as the committee decided with the last ballot that the 20% multiplier

of the referenced limit is not needed, and the S2 limit is the same as the external limit.

This ballot will be adjudicated during the week of 1st of April, 2013in San Jose, California at the SEMI NA Spring

standards meetings held at SEMI headquarters.

Please forward a courtesy copy of any comments or negatives against the ballot with your contact information to

John Visty at [email protected] and Sean Larsen at [email protected]. As this is a technical

ballot, all votes of reject must be accompanied by negatives and sent to SEMI staff or they will be considered

abstention votes.

Review and Adjudication Information

Task Force Review Committee Adjudication

Group: S2 Non-Ionizing Radiation TF NA EHS Committee

Date: Monday, 1 April 2013 (tentative) Thursday, 4 April 2013

Time & Timezone: 1:00 PM to 2:00 PM (tentative)

US Pacific Time

9:00 AM to 6:00 PM

US Pacific Time

Location: SEMI Headquarters

3081 Zanker Road

SEMI Headquarters

3081 Zanker Road

City, State/Country: San Jose, CA / USA San Jose, CA / USA

Leader(s): John Visty (Salus)

Sean Larsen (Lam Research AG)

Chris Evanston (Salus)

Sean Larsen (Lam Research AG)

Eric Sklar (Safety Guru, LLC)

Standards Staff: Paul Trio (SEMI NA)

408.943.7041

[email protected]

Paul Trio (SEMI NA)

408.943.7041

[email protected]

This meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Contact

the task force leaders or Standards staff for confirmation.

Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will

not be able to attend these meetings in person but would like to participate by telephone/web, please contact

Standards staff.

Safety Checklist for SEMI Draft Document #5357A

Title: Line item Revisions to SEMI S2-0712a, ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

Developing/Revising Body

Name/Type: S2 Non-Ionizing Radiation Task Force

Technical Committee: EHS

Region: North America

Leadership

Position Last First Affiliation

Leader Visty John Salus Engineering

Leader Larsen Sean Lam Research AG

Documents, Conflicts, and Consideration

Safety related codes, standards, and practices used in developing the safety guideline, and the manner in

which each item was considered by the technical committee # and Title Manner of Consideration

2010 ACGIH TLVs and BEIs – Based on the Documentation

of the Threshold Limit Values for Chemical Substances and

Physical Agents & Biological Exposure Indices

Looked for supporting criteria to reference

1999 ACGIH TLVs and BEIs – Threshold Limit Values for

Chemical Substances and Physical Agents, Biological

Exposure Indices

Looking for supporting evidence of some of the

differences between current S2 criteria and

criteria based upon current ACGIH version.

Directive 2006/25/EC on the minimum health and safety

requirements regarding the exposure of workers to the risks

arising from physical agents (artificial optical radiation)

Looked for supporting criteria to reference

Known inconsistencies between the safety guideline and any other safety related codes, standards, and practices

cited in the safety guideline

# and Title Inconsistency with This

Safety Guideline

2010 ACGIH TLVs and BEIs – Based on the Documentation of the Threshold

Limit Values for Chemical Substances and Physical Agents & Biological

Exposure Indices The limit values defined in

this ballot are generally a

fraction of the various limit

values that are referenced.

Directive 2006/25/EC on the minimum health and safety requirements regarding

the exposure of workers to the risks arising from physical agents (artificial optical

radiation)

Other conflicts with known codes, standards, and practices or with commonly accepted safety and health principles

to the extent practical

# and Title Nature of Conflict with This Safety Guideline

None

Participants and Contributors Last First Affiliation

Beasley James ISMI

Bogner Mark TUV-SUD

Crane Lauren KLA-Tencor

Crockett Alan KLA-Tencor

Desrosiers Bob IBM

Frankfurth Mark Cymer

Funk Rowland Salus Engineering

Galatis Ermias Tokyo Electron

Giles Andy Estec Solutions

Greenberg Cliff Nikon Precision

Guild Ed IBM

Ibuka Shigehito Tokyo Electron

Imamiya Ryosuke DNS

Kapur Ken KLA Tencor

Krauss Mark EHS2

Krov Alan Tokyo Electron

Kwon Bryan Applied Materials

Macklin Ron R. Macklin and Associates

Mashiro Supika Tokyo Electron

McDaid Raymond Lam Research AG

Mills Ken Estec Solutions

Moore Dale Texas Instruments

Mueller James Intel

Nishiguchi Naokatsu DNS

Planting Bert ASML

Sawyer Debbie Applied Materials

Sexton David TUV

Sklar Eric Safety Guru LLC

Wong Carl AKT

Yakimow Byron Cymer

The content requirements of this checklist are documented in Section 14.2 of the Regulations Governing SEMI Standards Committees.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 1 Doc. 5357A SEMI

Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943

LETTER (YELLOW) BALLOT

DRAFTDocument Number: 5357A

Date: 2/11/2013

SEMI Draft Document 5357A Line Item Revisions to SEMI S2-0712a, ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT Delayed Revisions Related to Optical Radiation Line Item 1 DELAYED REVISIONS X (Effective July 2015) REVISION TO OPTICAL RADIATION CRITERIA

DX-1 Revision to Appendix 4 (Exposure Criteria and Test Methods for Non-ionizing Radiation (Other than Laser) and Electromagnetic Fields) (OPTIONAL before Effective Date)

DX-1.1 Replace Table A3-3 with the material shown below.

Table A3-3 Optical Energy

Optical Energy Physical Quantity

Measured

(units)

Access Limit Testing Methods

Infrared Energy1

700 nm–1 mm

(e.g., heating

lamps)

Irradiance

W/m2

(See #1, #2, #3)

Radiance

W/m2 – sr

Wavelength dependent

20% of the applicable

exposure limits.

(See A4-5.1)

Thermocouple, thermopile, pyroelectric, photoelectric.

Direct measurements locating the maximum irradiance and

orientation of the energy at the closest approach to the view

port(s) or accessible leakage point(s).

Visible Light1

400–700 nm

(e.g., heating

lamps)

Irradiance

µW/cm2

(See #1, #2, #3)

Radiance

W/m2 – sr



exposure limits.

(See A4-5.1)


Direct measurement locating the maximum irradiance and

orientation of the light energy at the closest approach to

view port(s) or accessible leakage point(s).

Ultraviolet

Energy1

315–400 nm

(e.g., plasma,

stepper)

Irradiance

mW/cm2

(See #1, #2)

0.2 mW/cm2 Photoelectric detectors with filters and or controlled

phosphors.




Ultraviolet

Light1

180–315 nm

(e.g., plasma,

stepper)

Effective Irradiance

µW/cm2

(See #4)

0.02 µW/ cm2 Photoelectric detectors with filters and/or controlled

phosphors (See #5).




#1 “Irradiance” is essentially the same as “power density.”

#2 Lamp manufacturer data can sometimes be used to estimate and evaluate exposures using a spreadsheet.

#3 These guidelines cover visible, IR-A, and IR-B, and are frequency dependent. Separate evaluations may be needed for thermal or photo-chemical retinal hazards and infrared eye hazards.

#4 “Effective irradiance” is irradiance adjusted to account for the wavelength-dependent biological hazard. Permissible exposure time =

0.003 J/cm2 divided by the effective irradiance.

#5 Instrumentation is commercially available that accounts for the wavelength dependence of the standard and gives results in effective

irradiance.

A3-4 Optical Radiation

A3-4.1 There are multiple safety concerns related to the effects of optical radiation on the skin and multiple tissues

in the eyes. This document is not addressing skin concerns as there is very little exposed skin in a semiconductor






Date: 2/11/2013

fabrication cleanroom environment, and the eyes are more sensitive than the skin. The concerns and associated

wavelengths are listed in Table A3-3.

A3-4.2 All of the accessible limits are summation limit functions, meaning that they add up the relative

contributions of the various wavelengths of the optical energy source. Therefore, the optical source should be

evaluated to all of the limits that the optical energy source has significant emissions.

Table A3-3 Optical Radiation Concerns

Approximate

Wavelengths Safety / Tissue Concern Measurement

180 to 400 nm

(Broadband UV)

Corneal and lenticular hazard Effective (weighted by relative Spectral Effectiveness [S(λ)]

weighting function) irradiance weighted towards 255 to 295nm

315 to 400 nm

(UV-A)

Lenticular and retinal hazard Irradiance

300 to 700 nm

(“Blue light”, UV-A

and visible)

Photochemical retinal hazard Effective (weighted by blue light hazard [B(λ)] weighting

function) irradiance & radiance weighted towards 415 to

475nm

380 to 1400 nm

(visible and IR-A)

Thermal retinal hazard#1 Effective (weighted by retinal thermal hazard [R(λ)]

weighting function) radiance weighted towards 415 to 850nm

775 to 3000 nm

(IR-A and IR-B)

Thermal corneal and lenticular

hazard

Irradiance

#1 The thermal retinal hazard has different limit criteria depending on whether there is a significant visible light component to cause constriction of the pupil.

A3-4.3 The equipment emission limit for this document is the exposure limit value from the most recent version of

the American Conference of Governmental Industrial Hygienists (ACGIH) Threshold Limit Values (TLVs®) and

Biological Exposure Indices (BEIs®) book with the measurement distance from source and time considerations

given below.

NOTE 161: The European Union (EU) Worker Protection directive for artificial optical radiation (e.g., 2006/25/EC) provides

similar worker exposure criteria for the EU countries. There are some differences in the retinal thermal hazard weighting values

[R(λ)], further focusing the criteria towards 380 to 495nm energy.

A3-4.4 Measurement Techniques and Limit Value Guidance

A3-4.4.1 Meters and Measuring — There are two viable methods for measuring accessible emissions against the

limits.

A3-4.4.1.1 One can directly measure radiance or irradiance for the specific frequency bands directly, multiply the

irradiance by the weighting function value (see the referenced documents) and sum the exposure values for the

bands against the limit value per the functions, or

A3-4.4.1.2 Use a meter that has the specific weighting function built-in and taking the emission value directly from

the meter.

A3-4.4.1.3 While the former method can be more accurate in a controlled laboratory environment, the latter is much

more practical and is the recommended method in the evaluation setting that is typical for semiconductor equipment

evaluations.

A3-4.4.2 Measurement Distance from Source — As radiance [typical units being W/(m2sr)] is a characteristic of the

source and not of the target location, radiance measurements may be made at any convenient location. Irradiance

measurements (measurements of radiation striking the target, typical units being W/m2) (see Table A3-3 for which

concerns/wavelengths require radiance measurements) should be made at the accessible location closest to the

source (e.g., at the view window). If the exposure is reasonably foreseeable only as part of a maintenance or service

task, then the emissions should also be measured where the expected exposure will occur (e.g., the expected location

of the person performing the maintenance task) if the measurement at the closest location is near or above the

referenced accessible limits.

EXCEPTION: Accessible emission levels per § A3-4.4.2 for exposures that are only part of maintenance and

service tasks and meet the emission limits at the reasonably foreseeable exposure location, but not at locations closer

to the source are acceptable if:






Date: 2/11/2013

a) a good justification that personnel are either unable or have no viable reason to get closer to the emission source is

included in the S2 report,

b) the documents provided to the user describe the distance limit both in the general safety section or equivalent (e.g.,

a list of equipment locations with emissions that exceed the indicated limits) and in the task specific section(s)

where exposure is possible, and

c) the optical radiation hazard alert label (see ¶ 25.5) indicates the minimum distance requirement and this label is

visible before entering within the area that exceeds the emission limit.

A3-4.4.3 Time Considerations

A3-4.4.3.1 If exposure potential is generally present (for example, leakage from an optical radiation source that is

on whenever the equipment is energized), then the limit values calculated for an 8 hour exposure should be used.

This is also the recommendation for all potential optical radiation exposures.

A3-4.4.3.2 If the exposure period occurs during only a portion of the scheduled maintenance task being evaluated,

and the maintenance task foreseeably could be repeated during the work day, the total foreseeable exposure time can

be calculated adding the actual exposure times over the course of the shift, assuming the person is performing the

task repeatedly during the work shift.

A3-4.4.3.3 Service and unscheduled maintenance tasks (for example, replace when no longer meets the

specification) should be evaluated depending on how the task is likely to be completed. Many unscheduled or

service tasks (for example, part replacement upon failure) can reasonably be expected to occur no more than once

daily, and could be evaluated as shown in ¶ A3-4.4.4.2 with a number of tasks per day equal to 1. Equipment

upgrade tasks that can be repeated within a workday can be evaluated using the method of the previous paragraph.

A3-4.4.3.4 If an exposure time of less than 8 hours is used in the evaluation, the justification for the shorter

exposure time used for the evaluation should be clearly documented in the evaluation report. Additionally, if the

exposure rate exceeds the 8-hour exposure criteria, then a) the equipment manuals should describe the time of

exposure limit both in the general safety section (e.g., a list of locations with less than an 8-hour allowable exposure)

and in the task specific section(s) where exposure is possible, and b) the optical radiation hazard alert label (see

¶ 25.5) should indicate the maximum permissible exposure time.

DX-1.2 Revise the Appendix References section (which is currently A3-4, but becomes A3-5 when this line item is

implemented) as shown below.

A3-5.1 19962010 TLVs and BEIs Threshold Limit Values for Chemical Substances and Physical Agents Biological

Exposure Indices, ACGIH, Cincinnati, OH [republished annually]

A3-5.X Directive 2006/25/EC on the minimum health and safety requirements regarding exposure of workers to

risks arising from physical agents (artificial optical radiation), (5 April 2006), Official Journal of the European

Journal, (April 27, 2006): pages L 114/38 through 114/59

DX-2 Revision to Related Information 7 (DOCUMENTATION OF NON-IONIZING RADIATION (§ 25 AND APPENDIX 3) INCLUDING RATIONALE FOR CHANGES) (OPTIONAL before effective date)

DX-2.1 Add § R7-1.X at end of section R7-1 as shown below.

R7-1.X Optical Radiation Emissions

R7-1.X.1 This section was revised to

a) define the hazards of optical energy more clearly, as previous criteria seemed to focus on UV concerns,

b) provide additional measurement guidance on the different criteria,

c) align with revisions and additions to the various referenced criteria, and

d) delete the 20% multiplier of the external referenced limits.

R7-1.X.2 The new criteria allow for some flexibility on measurement distance and time of exposure when it can be

justified by the foreseen exposure scenarios and is adequately communicated.

< End of Ballot >






Date: 2/11/2013

The rest of this document is material that is called out in the procedure guide as part of a ballot, but is not part of the balloted change.

SEMI S2-0712a, ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

NOTICE: Per ¶ 3.4.3.3.1 of the SEMI Standards Procedure Guide, the purpose, scope, limitations, and terminology

sections of SEMI S2 are provided below.

1 Purpose

1.1 This Safety Guideline is intended as a set of performance-based environmental, health, and safety (EHS)

considerations for semiconductor manufacturing equipment.

2 Scope

2.1 Applicability — This guideline applies to equipment used to manufacture, measure, assemble, and test

semiconductor products.

2.2 Contents — This Document contains the following sections:

1. Purpose

2. Scope

3. Limitations

4. Referenced Standards and Documents

5. Terminology

6. Safety Philosophy

7. General Provisions

8. Evaluation Process

9. Documents Provided to User

10. Hazard Alert Labels

11. Safety Interlock Systems

12. Emergency Shutdown

13. Electrical Design

14. Fire Protection

15. Process Liquid Heating Systems

16. Ergonomics and Human Factors

17. Hazardous Energy Isolation

18. Mechanical Design

19. Seismic Protection

20. Automated Material Handlers

21. Environmental Considerations

22. Exhaust Ventilation






Date: 2/11/2013

23. Chemicals

24. Ionizing Radiation

25. Non-Ionizing Radiation and Fields

26. Lasers

27. Sound Pressure Level

28. Related Documents

Appendix 1 — Design Guidelines for Equipment Using Liquid Chemicals

Appendix 2 — Ionizing Radiation Test Validation

Appendix 3 — Non-Ionizing Radiation (Other than Laser) and Fields Test Validation

Appendix 4 — Fire Protection: Flowchart for Selecting Materials of Construction

Appendix 5 — Laser Data Sheet – SEMI S2

2.3 Precedence of Sectional Requirements — In the case of conflict between provisions in different sections of this

guideline, the section or subsection specifically addressing the technical issue takes precedence over the more

general section or subsection.

NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their

use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and

determine the applicability of regulatory or other limitations prior to use.

3 Limitations

NOTICE: Revisions to § 3 will be effective upon the July 2015 publication as shown in Delayed Revisions

Section 1. The global Environmental Health & Safety Technical Committee has voted that the revision is

OPTIONAL before the Effective Date.

3.1 This guideline is intended for use by supplier and user as a reference for EHS considerations. It is not intended

to be used to verify compliance with local regulatory requirements.

3.2 It is not the philosophy of this guideline to provide all of the detailed EHS design criteria that may be applied to

semiconductor manufacturing equipment. This guideline provides industry-specific criteria, and refers to some of

the many international codes, regulations, standards, and specifications that should be considered when designing

semiconductor manufacturing equipment.

3.3 Existing models and subsystems should continue to meet the provisions of SEMI S2-93A. Models with

redesigns that significantly affect the EHS aspects of the equipment should conform to the latest version of SEMI S2.

This guideline is not intended to be applied retroactively.

3.4 In many cases, references to standards have been incorporated into this guideline. These references do not imply

applicability of the entire standards, but only of the sections referenced.

4 Referenced Standards and Documents

4.1 SEMI Standards and Safety Guidelines

SEMI E6 — Guide for Semiconductor Equipment Installation Documentation

SEMI F5 — Guide for Gaseous Effluent Handling

SEMI F14 — Guide for the Design of Gas Source Equipment Enclosures

SEMI F15 — Test Method (SF6 Tracer Gas) for Enclosures Has Been Moved to SEMI S6

SEMI S1 — Safety Guideline for Equipment Safety Labels

SEMI S3 — Safety Guideline for Process Liquid Heating System

SEMI S6 — EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment






Date: 2/11/2013

SEMI S7 — Safety Guidelines for Environmental, Safety, and Health (ESH) Evaluation of Semiconductor

Manufacturing Equipment

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

SEMI S10 — Safety Guideline for Risk Assessment and Risk Evaluation Process

SEMI S12 — Guidelines for Equipment Decontamination

SEMI S13 — Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use

with Semiconductor Manufacturing Equipment

SEMI S14 — Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing

Equipment

SEMI S22 — Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment

4.2 ANSI Standards1

ANSI/RIA R15.06 — Industrial Robots and Robot Systems – Safety Requirements

ANSI/ISA S84.01 — Application of Safety Instrumented Systems for the Process Industry

4.3 CEN/CENELEC Standards2

CEN EN 775 — Manipulating Industrial Robots – Safety

CEN EN 1050 — Safety of Machinery – Principles of Risk Assessment

CEN EN 1127-1 — Explosive Atmospheres – Explosion Prevention and Protection – Part 1: Basic Concepts and

Methodology

4.4 DIN Standards3

DIN V VDE 0801 — Principles for Computers in Safety-Related Systems

4.5 IEC Standards4

IEC 60825-1 — Safety of Laser Products – Part 1: Equipment Classification, Requirements

IEC 61010-1 — Safety Requirements for Electrical Equipment for Measurement, Control, and Laboratory Use –

Part 1: General Requirements

IEC 61508 — Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems

4.6 IEEE Standards5

IEEE C95.1 — Standard for Safety Levels with Respect to Human Exposure to Radio Frequency Electromagnetic

Fields, 3 kHz to 300 GHz

4.7 ISO Standards6

ISO 10218-1 — Robots for Industrial Environments – Safety Requirements – Part 1: Robot

1 American National Standards Institute, 25 West 43rd Street, New York, NY 10036, USA; Telephone: 212.642.4900, Fax: 212.398.0023,

http://www.ansi.org 2 European Committee for Standardization, Avenue Marnix 17, B-1000 Brussels; Telephone: 32.2.550.08.11, Fax: 32.2.550.08.19,

http://www.cen.eu 3 Deutsches Institut für Normung e.V., Available from Beuth Verlag GmbH, Burggrafenstrasse 4-10, D-10787 Berlin, Germany;

http://www.din.de 4 International Electrotechnical Commission, 3 rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland; Telephone:

41.22.919.02.11, Fax: 41.22.919.03.00, http://www.iec.ch 5 Institute of Electrical and Electronics Engineers, 3 Park Avenue, 17th Floor, New York, NY 10016-5997, USA; Telephone 212.419.7900, Fax:

212.752.4929, http://www.ieee.org 6 International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland;

Telephone: 41.22.749.01.11, Fax: 41.22.733.34.30, http://www.iso.ch






Date: 2/11/2013

ISO 13849-1 — Safety of Machinery – Safety-Related Parts of Control Systems – Part 1: General Principles for

Design

4.8 NFPA Standards7

NFPA 12 — Standard on Carbon Dioxide Extinguishing Systems

NFPA 13 — Standard for Installation of Sprinkler Systems

NFPA 72 — National Fire Alarm Code

NFPA 497 — Recommended Practice for the Classification of Flammable Liquids, Gases, or Vapors and of

Hazardous (Classified) Locations for Electrical Installations in Chemical Process Areas

NFPA 704 — Standard System for the Identification of the Hazards of Materials for Emergency Response

NFPA 2001 — Standard on Clean Agent Fire Extinguishing Systems

4.9 Underwriters Laboratories Standard8

UL 508A — Industrial Control Panel

4.10 US Code of Federal Regulations9

21 CFR Parts 1000-1050 — Food and Drug Administration/Center for Devices and Radiological Health

(FDA/CDRH), Performance Standards for Electronic Products, Title 21 Code of Federal Regulations, Parts 1000-

1050

4.11 Other Standards and Documents

ACGIH, Industrial Ventilation Manual10

ASHRAE Standard 110 — Method of Testing Performance of Laboratory Fume Hoods11

Burton, D.J., Semiconductor Exhaust Ventilation Guidebook12

Uniform Building Code™

(UBC)13

Uniform Fire Code™14

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 ACGIH® — American Conference of Governmental Industrial Hygienists (ACGIH is a registered trademark

of the American Conference of Governmental Industrial Hygienists.)

5.1.2 ASHRAE — American Society of Heating, Refrigeration, and Air Conditioning Engineers

5.1.3 MPE — maximum permissible exposure

5.1.4 NOHD — nominal ocular hazard distance

5.2 Definitions

7 National Fire Protection Association, 1 Batterymarch Park, Quincy, MA 02269, USA; Telephone: 617.770.3000, Fax: 617.770.0700,

http://www.nfpa.org 8 Underwriters Laboratory, 2600 N.W. Lake Road, Camas, WA 98607-8542, USA; Telephone: 877.854.3577, Fax: 360.817.6278,

http://www.ul.com 9 United States Food and Drug Administration/ Center for Devices and Radiological Health (FDA/CDRH). Available from FDA/CDRH;

http://www.accessdata.fda.gov/scripts/cdrh/cfdocs/cfcfr/cfrsearch.cfm 10 ACGIH, 1330 Kemper Meadow Road, Cincinnati, OH 45240, USA. http://www.acgih.org 11 ASHRAE, 1791 Tullie Circle, NE, Atlanta, GE 30329, USA. http://www.ashrae.org 12 IVE, Inc., 2974 South Oakwood, Bountiful, UT 84010, USA. http://www.eburton.com 13 International Conference of Building Officials, 5360 Workman Mill Road, Whittier, CA 90601-2298, USA. http://www.icbo.org 14 International Fire Code Institute, 5360 Workman Mill Road, Whittier, CA 90601-2298, USA. http://www.ifci.org






Date: 2/11/2013

NOTE 1: Composite reports using portions of reports based upon earlier versions of SEMI S2 and SEMI S10 may require

understanding of the SEMI S2-0703 or SEMI S10-1296 definitions for the terms hazard, likelihood, mishap, severity, and risk.

5.2.1 abort switch — a switch that, when activated, interrupts the activation sequence of a fire detection or fire

suppression system.

5.2.2 accredited testing laboratory — an independent organization dedicated to the testing of components, devices,

or systems that is recognized by a governmental or regulatory body as competent to perform evaluations based on

established safety standards.

5.2.3 baseline — for the purposes of this Document, “baseline” refers to operating conditions, including process

chemistry, for which the equipment was designed and manufactured.

5.2.4 breathing zone — imaginary globe, of 600 mm (2 foot) radius, surrounding the head.

5.2.5 capture velocity — the air velocity that at any point in front of the exhausted hood or at the exhausted hood

opening is necessary to overcome opposing air currents and to capture the contaminated air at that point by causing

it to flow into the exhausted hood.

5.2.6 carcinogen — confirmed or suspected human cancer-causing agent as defined by the International Agency for

Research on Cancer (IARC) or other recognized entities.

5.2.7 chemical distribution system — the collection of subsystems and components used in a semiconductor

manufacturing facility to control and deliver process chemicals from source to point of use for wafer manufacturing

processes.

5.2.8 cleanroom — a room in which the concentration of airborne particles is controlled to specific limits.

5.2.9 combustible material — for the purpose of this guideline, a combustible material is any material that does

propagate flame (beyond the ignition zone with or without the continued application of the ignition source) and does

not meet the definition in this section for noncombustible material. See also the definition for noncombustible

material.

5.2.10 equipment — a specific piece of machinery, apparatus, process module, or device used to execute an

operation. The term “equipment” does not apply to any product (e.g., substrates, semiconductors) that may be

damaged as a result of equipment failure.

5.2.11 face velocity — velocity at the cross-sectional entrance to the exhausted hood.

5.2.12 facilitization — the provision of facilities or services.

5.2.13 fail-safe — designed so that a failure does not result in an increased risk.

NOTE 2: For example, a fail-safe temperature limiting device would indicate an out-of-control temperature if it were to fail. This

might interrupt a process, but would be preferable to the device indicating that the temperature is within the control limits,

regardless of the actual temperature, in case of a failure.

5.2.14 fail-to-safe equipment control system (FECS) — a safety-related programmable system of control circuits

designed and implemented for safety functions in accordance with recognized standards such as ISO 13849-1

(EN 954-1) or IEC 61508, ANSI SP 84. These systems (e.g., safety programmable logic controller (PLC), safety-

related input and output (I/O) modules) diagnose internal and external faults and react upon detected faults in a

controlled manner in order to bring the equipment to a safe state.

NOTE 3: A FECS is a subsystem to a programmable electronic system (PES) as defined in IEC 61508-4 Definitions.

NOTE 4: Related Information 13 provides additional information on applications of FECS design.

5.2.15 failure — the termination of the ability of an item to perform a required function. Failure is an event, as

distinguished from “fault,” which is a state.

5.2.16 fault — the state of an item characterized by inability to perform a required function, excluding the inability

during preventive maintenance or other planned actions, or due to lack of external resources.

5.2.17 fault-tolerant — designed so that a reasonably foreseeable single point failure does not result in an unsafe

condition.

5.2.18 flammable gas — any gas that forms an ignitable mixture in air at 20°C (68°F) and 101.3 kPa (14.7 psia).






Date: 2/11/2013

5.2.19 flammable liquid — a liquid having a flash point below 37.8°C (100°F).

5.2.20 flash point — the minimum temperature at which a liquid gives off sufficient vapor to form an ignitable

mixture with air near the surface of the liquid, or within the test vessel used.

5.2.21 gas cylinder cabinet — cabinet used for housing gas cylinders, and connected to gas distribution piping or to

equipment using the gas. Synonym: gas cabinet.

5.2.22 gas panel — an arrangement of fluid handling components (e.g., valves, filters, mass flow controllers) that

regulates the flow of fluids into the process. Synonyms: gas jungle, jungle, gas control valves, valve manifold.

5.2.23 gas panel enclosure — an enclosure designed to contain leaks from gas panel(s) within itself. Synonyms:

jungle enclosure, gas box, valve manifold box.

5.2.24 harm — physical injury or damage to health of people, or damage to equipment, buildings, or environments.

5.2.25 hazard — condition that has the potential to cause harm.

5.2.26 hazardous electrical power — power levels equal to or greater than 240VA.

5.2.27 hazardous production material (HPM) — a solid, liquid, or gas that has a degree-of-hazard rating in health,

flammability, or reactivity of class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory,

or production processes that have as their end product materials that are not hazardous.

5.2.28 hazardous voltage — unless otherwise defined by an appropriate international standard applicable to the

equipment, voltages greater than 30 volts rms, 42.4 volts peak, 60 volts dc are defined in this Document as

hazardous voltage.

NOTE 5: The specified levels are based on normal conditions in a dry location.

5.2.29 hinged load — a load supported by a hinge such that the hinge axis is not vertical.

5.2.30 hood — in the context of § 22 of this guideline, “hood” means a shaped inlet designed to capture

contaminated air and conduct it into an exhaust duct system.

5.2.31 incompatible — as applied to chemicals: in the context of § 23 of this guideline, describes chemicals that,

when combined unintentionally, may react violently or in an uncontrolled manner, releasing energy that may create

a hazardous condition.

5.2.32 intended reaction product — chemicals that are produced intentionally as a functional part of the

semiconductor manufacturing process.

5.2.33 interlock — a mechanical, electrical or other type of device or system, the purpose of which is to prevent or

interrupt the operation of specified machine elements under specified conditions.

5.2.34 ionizing radiation — alpha particles, beta particles, gamma rays, X-rays, neutrons, high-speed electrons,

high-speed protons, and other particles capable of producing ions in human tissue.

5.2.35 laser — any device that can be made to produce or amplify electromagnetic radiation in the wavelength

range from 180 nm to 1 mm primarily by the process of controlled stimulated emission.

5.2.36 laser product — any product or assembly of components that constitutes, incorporates, or is intended to

incorporate a laser or laser system (including laser diode), and that is not sold to another manufacturer for use as a

component (or replacement for such component) of an electronic product.

5.2.37 laser source — any device intended for use in conjunction with a laser to supply energy for the excitation of

electrons, ions, or molecules. General energy sources, such as electrical supply mains, should not be considered to

be laser energy sources.

5.2.38 laser system — a laser in combination with an appropriate laser energy source, with or without additional

incorporated components.

5.2.39 lifting accessory — a component (e.g., eyehook, shackle, hoist ring, wire rope, chain, or eyebolt) which is

part of a lifting fixture or is attached directly between the lifting device and the load in order to lift it.






Date: 2/11/2013

5.2.40 lifting device — a mechanical or electro-mechanical structure that is provided for the purpose of raising and

lowering a load during maintenance or service tasks, and may be capable of moving the load in one or more

horizontal directions.

5.2.41 lifting equipment — lifting devices, lifting fixtures and lifting accessories.

5.2.42 lifting fixture — a mechanical device or an assembly of lifting accessories (e.g., hoisting yoke, wire rope

sling, webbing sling, or chain assembly) placed between the lifting device (but not permanently attached to it) and

the load, in order to attach them to each other.

5.2.43 likelihood — the expected frequency with which harm will occur. Usually expressed as a rate (e.g., events

per year, per product, or per substrate processed).

5.2.44 local exhaust ventilation — local exhaust ventilation systems operate on the principle of capturing a

contaminant at or near its source and moving the contaminant to the external environment, usually through an air

cleaning or a destructive device. It is not to be confused with laminar flow ventilation. Synonyms: LEV, local

exhaust, main exhaust, extraction system, module exhaust, individual exhaust.

5.2.45 lower explosive limit — the minimum concentration of vapor in air at which propagation of flame will occur

in the presence of an ignition source. Synonyms: LEL, lower flammability limit (LFL).

5.2.46 maintenance — planned or unplanned activities intended to keep equipment in good working order. See also

the definition for service.

5.2.47 mass balance — a qualitative, and where possible, quantitative, specification of mass flow of input and

output streams (including chemicals, gases, water, de-ionized water, compressed air, nitrogen, and by-products), in

sufficient detail to determine the effluent characteristics and potential treatment options.

5.2.48 material safety data sheet (MSDS) — written or printed material concerning chemical elements and

compounds, including hazardous materials, prepared in accordance with applicable standards.

5.2.49 maximum permissible exposure (MPE) — level of laser radiation to which, under normal circumstances,

persons may be exposed without suffering adverse effects.

5.2.50 nominal ocular hazard distance (NOHD) — distance at which the beam irradiance or radiant exposure

equals the appropriate corneal maximum permissible exposure (MPE).

NOTE 6: Examples of such standards are USA government regulation 29 CFR 1910.1200, and Canadian WHMIS (Workplace

Hazardous Material Information System).

5.2.51 noncombustible material — a material that, in the form in which it is used and under the conditions

anticipated, will not ignite, burn, support combustion, or release flammable vapors when subjected to fire or heat.

Typical noncombustible materials are metals, ceramics, and silica materials (e.g., glass and quartz). See also the

definition for combustible material.

5.2.52 non-ionizing radiation — forms of electro-magnetic energy that do not possess sufficient energy to ionize

human tissue by means of the interaction of a single photon of any given frequency with human tissue. Non-ionizing

radiation is customarily identified by frequencies from zero hertz to 3 × 1015

hertz (wavelengths ranging from

infinite to 100 nm). This includes: static fields (frequencies of 0 hertz and infinite wavelengths); extremely low

frequency fields (ELF), which includes power frequencies; subradio-frequencies; radiofrequency/microwave energy;

and infrared, visible, and ultraviolet energies.

5.2.53 non-recycling, deadman-type abort switch — a type of abort switch that must be constantly held closed for

the abort of the fire detection or suppression system. In addition, it does not restart or interrupt any time delay

sequence for the detection or suppression system when it is activated.

5.2.54 occupational exposure limits (OELs) — for the purpose of this Document, OELs are generally established on

the basis of an eight hour workday. Various terms are used to refer to OELs, such as permissible exposure levels,

Threshold Limit Values

, maximum acceptable concentrations, maximum exposure limits, and occupational

exposure standards. However, the criteria used in determining OELs can differ among the various countries that

have established values. Refer to the national bodies responsible for the establishment of OELs. (Threshold Limit

Value is a registered trademark of the American Conference of Governmental Industrial Hygienists.)






Date: 2/11/2013

5.2.55 operator — a person who interacts with the equipment only to the degree necessary for the equipment to

perform its intended function.

5.2.56 parts-cleaning hood — exhausted hood used for the purpose of cleaning parts or equipment. Synonym:

equipment cleaning hood.

5.2.57 placed on the market — made physically available, regardless of the legal aspects of the act of transfer (loan,

gift, sale, hire).

5.2.58 positive-opening — as applied to electromechanical control devices. The achievement of contact separation

as a direct result of a specified movement of the switch actuator through non-resilient members (i.e., contact

separation is not dependent upon springs).

5.2.59 potentially hazardous non-ionizing radiation emissions — for the purposes of this guideline, non-ionizing

radiation emissions outside the limits shown in Appendix 4 are considered potentially hazardous.

5.2.60 pyrophoric material — a chemical that will spontaneously ignite in air at or below a temperature of 54.4°C

(130°F).

5.2.61 radio frequency (rf) — electromagnetic energy with frequencies ranging from 3 kHz to 300 GHz.

Microwaves are a portion of rf extending from 300 MHz to 300 GHz.

5.2.62 readily accessible — capable of being reached quickly for operation or inspection, without requiring

climbing over or removing obstacles, or using portable ladders, chairs, etc.

5.2.63 recognized — as applied to standards; agreed to, accepted, and practiced by a substantial international

consensus.

5.2.64 rem — unit of dose equivalent. Most instruments used to measure ionizing radiation read in dose equivalent

(rems or sieverts). 1 rem = 0.01 sievert.

5.2.65 reproductive toxicants — chemicals that are confirmed or suspected to cause statistically significant

increased risk for teratogenicity, developmental effects, or adverse effects on embryo viability or on male or female

reproductive function at doses that are not considered otherwise maternally or paternally toxic.

5.2.66 residual — as applied to risks or hazards: that which remains after engineering, administrative, and work

practice controls have been implemented.

5.2.67 risk — the expected magnitude of losses from a hazard, expressed in terms of severity and likelihood.

5.2.68 safe shutdown condition — a condition in which all hazardous energy sources are removed or suitably

contained and hazardous production materials are removed or contained, unless this results in additional hazardous

conditions.

5.2.69 safety critical part — discrete device or component, such as used in a power or safety circuit, whose proper

operation is necessary to the safe performance of the system or circuit.

5.2.70 service — unplanned activities intended to return equipment that has failed to good working order. See also

the definition for maintenance.

5.2.71 severity — the extent of potential credible harm.

5.2.72 short circuit current rating — the maximum available current to which an equipment supply circuit is

intended, by the equipment manufacturer, to be connected.

NOTE 7: Short circuit current rating for an electrical system is typically based on the analysis of short circuit current ratings of

the components within the system. See UL 508A and Related Information 2 of SEMI S22 for methods of determining short

circuit rating.

5.2.73 sievert (Sv) — unit of dose equivalent. Most instruments used to measure ionizing radiation read in dose

equivalent (rems or sieverts). 1 Sv = 100 rems.

5.2.74 standard temperature and pressure — for ventilation measurements, either dry air at 21°C (70°F) and

760 mm (29.92 inches) Hg, or air at 50% relative humidity, 20°C (68°F), and 760 mm (29.92 inches) Hg.






Date: 2/11/2013

5.2.75 supervisory alarm — as applied to fire detection or suppression systems; an alarm indicating a supervisory

condition.

5.2.76 supervisory condition — as applied to fire detection or suppression systems; condition in which action or

maintenance is needed to restore or continue proper function.

5.2.77 supplemental exhaust — local exhaust ventilation that is used intermittently for a specific task of finite

duration.

5.2.78 supplier — party that provides equipment to, and directly communicates with, the user. A supplier may be a

manufacturer, an equipment distributor, or an equipment representative. See also the definition for user.

5.2.79 testing — the term “testing” is used to describe measurements or observations used to validate and

Document conformance to designated criteria.

5.2.80 trouble alarm — as applied to fire detection or suppression systems; an alarm indicating a trouble condition.

5.2.81 trouble condition — as applied to fire detection or suppression systems; a condition in which there is a fault

in a system, subsystem, or component that may interfere with proper function.

5.2.82 user — party that acquires equipment for the purpose of using it to manufacture semiconductors. See also the

definition for supplier.

5.2.83 velocity pressure (VP) — the pressure required to accelerate air from zero velocity to some velocity V.

Velocity pressure is proportional to the kinetic energy of the air stream. Associated equation:

VP = (V/4.043)2

(1)

where:

V = air velocity in m/s

VP = velocity pressure in mm water gauge (w.g.)

U.S. units: VP = (V/4005)2

(2)

where:

V = velocity in feet per second

VP = velocity pressure in inches water gauge (w.g.)

5.2.84 volumetric flow rate (Q) — in the context of § 22 of this guideline, Q = the volume of air exhausted per unit

time. Associated equation:

Q = VA (3)

where:

V = air flow velocity

A = the cross-sectional area of the duct or opening through which the air is flowing at standard conditions.

5.2.85 wet station — open surface tanks, enclosed in a housing, containing chemical materials used in the

manufacturing of semiconductor materials. Synonyms: wet sink, wet bench, wet deck.

5.2.86 yield strength — the stress at which a material exhibits a specified permanent deformation or set. This is the

stress at which, the strain departs from the linear portion of the stress-strain curve by an offset unit strain of 0.002.15

15 Roark’s Formulas for Stress and Strain, Seventh Edition, McGraw-Hill (2002): p. 826.






Date: 2/11/2013

6 Safety Philosophy

7 General Provisions

8 Evaluation Process

9 Documents Provided to User

10 Hazard Alert Labels

11 Safety Interlock Systems

12 Emergency Shutdown

13 Electrical Design

14 Fire Protection

15 Process Liquid Heating Systems

16 Ergonomics and Human Factors

17 Hazardous Energy Isolation

18 Mechanical Design

19 Seismic Protection

20 Automated Material Handlers

21 Environmental Considerations

22 Exhaust Ventilation

23 Chemicals

24 Ionizing Radiation

25 Non-Ionizing Radiation and Fields

25.1 This section covers equipment that produces non-ionizing radiation, except laser sources, in the following

categories:

• static electric and magnetic (0 Hz),

• sub-radio frequency electric and magnetic fields (<3 kHz),

• radio frequency (3 kHz to 300 GHz), and

• optical radiation (300 GHz to 1,670 THz) (wavelengths of 1mm to 180 nm).

25.2 Hazardous non-ionizing radiation emissions that are accessible to any personnel should be limited to the

lowest practical level. This criterion can be met by demonstrating that the accessible levels of non-ionizing radiation

are below the exposure limits set in Appendix 3. Medical device labeling levels are addressed in § 25.5.

25.2.1 When a partial body (for example, limb) exposure limit is used, the general limit should still be met at the

expected location of the head and torso of the person while performing the task. If compliance with both exposure

limits places restrictions on the body position for the task (for example, the static magnetic object must be held a

specified distance from the torso) then all of the following should be met:

• the restrictions on body position should be clearly described in the manuals both in the general safety or hazard

description section and in the specific task instructions, as appropriate (see § 25.6),

• the restrictions on body position should be clearly indicated in the hazard alert labels (see § 25.5),

• the restrictions on body position should be included in the ergonomic evaluation.






Date: 2/11/2013

25.3 Sources of potentially hazardous non-ionizing radiation should be identified in the operation and maintenance

manuals, and appropriate parameters listed. Parameters include frequency, wavelength, power levels, continuous

wave or pulsed (see also Appendix 3). If pulsed, parameters also include the pulse repetition rate, pulse duration,

and description of the pulse waveform.

EXCEPTION: Visible sources which are intended to be viewed or which provide illumination (e.g., display panels,

visible alarm indicators), and are not lasers, do not need to be identified.

NOTE 157: It is recommended that UV/IR generators that are part of fire protection test apparatus, and are provided with the

equipment, be considered as possible sources of potentially hazardous non-ionizing radiation.

25.4 Equipment should be designed to minimize access or exposure to non-ionizing radiation during normal

operation, maintenance, and service. Potential exposures should be controlled in the following order of preference:

25.4.1 engineering controls (e.g., enclosure, shielding, guarding, grounding, interlocks);

25.4.2 administrative controls (e.g., written warnings, standard operating procedures, labeling); and

25.4.3 personal protective equipment.

25.5 Equipment utilizing or producing potentially hazardous non-ionizing radiation should be labeled.

25.5.1 Hazard alert labels should be provided by the manufacturer when emission levels are measured that may

impact implanted or wearable medical devices (e.g., cardiac pacemakers or insulin pumps) or implanted

ferromagnetic devices. These alert labels should be located where the emissions exceed the medical device labeling

limit (see Appendix 3 for medical device labeling levels and references). While “implanted medical devices” is the

more generic and preferred term, “pacemaker” is considered and equivalent term for use on the hazard alert labels.

25.6 The manufacturer should conduct an assessment to document conformance to the criteria specified in § 25.2.

Engineering calculations may be used as part of this assessment. All measurements should be taken using

recognized methods with documented sensitivities and accuracy. A report documenting the survey methods,

equipment operating parameters, instrumentation used, calibration data, source location(s), and discussion should be

provided in the evaluation report (see Appendix 3).

25.6.1 If supplemental administrative controls are recommended based on survey results or calculations, a

discussion should be provided in the operations and maintenance manuals describing the source location(s),

radiation levels, and recommended control measures.

25.6.2 Administrative control procedures recommended for operation, maintenance, or service activities should be

documented in the operations and maintenance manuals.

26 Lasers

27 Sound Pressure Level

28 Related Documents

Appendix 1 — Design Guidelines for Equipment Using Liquid Chemicals

Appendix 2 — Ionizing Radiation Test Validation

APPENDIX 3

EXPOSURE CRITERIA AND TEST METHODS FOR NON-IONIZING RADIATION (OTHER THAN LASER) AND ELECTROMAGNETIC FIELDS

NOTICE: The material in this appendix is an official part of SEMI S2 and was approved by full letter ballot

procedures on December 15, 1999 by the global Environmental Health & Safety Committee.






Date: 2/11/2013

A3-1 Introduction

A3-1.1 This appendix provides exposure criteria and test methods. The test methods are intended to be used for

evaluation by and for equipment manufacturers. This appendix is not attempting to provide field survey methods for

semiconductor device manufacturing facilities.

A3-1.2 This appendix provides specific technical information relating to § 25. In general, it provides exposure limit

criteria and test methods.

A3-1.3 This appendix is not intended to limit risk control strategies (e.g., design principles) employed by

manufacturers. Alternative methods are acceptable if they provide an equivalent level of risk control.

A3-2 Non-Ionizing Radiation Surveys

A3-2.1 Non-ionizing radiation surveys should be conducted at the maximum operational power level and at all

applicable frequencies (i.e., the frequencies of the non-ionizing emission sources that could approach the emission

limits in the following tables). If the limit criteria incorporate a time of exposure aspect that is affected by the

configurable process recipe of the equipment, the relevant recipe details should be documented in the evaluation

report.

A3-2.1.1 If the equipment has one operating power level for the non-ionizing emission source, then the maximum

operational power level is that level. Many types of non-ionizing emission sources on SME can be set at multiple

power levels depending on the desired process results on the substrate. The maximum operational power level

should then be chosen as the highest power level the equipment can run at, which is often set as a software limit to

avoid equipment damage.

A3-2.2 Measurements should be made using the Test Methods as indicated in Table A4-1, at the exterior surfaces of

the equipment and at locations in which maintenance and repair personnel could encounter emissions, whenever

practical (electric field measurements with paddle-shaped sensors may not be possible in some places due to the size

and shape of the sensor).

A3-2.3 Measurements to assess electromagnetic emissions from equipment for safety purposes against the criteria

in the following tables should be made in an environment that is reasonably free of energy of the

wavelengths/frequencies of interest (i.e., the tool emissions at frequencies that approach the limit values during the

measurements can be distinguished from the ambient environment), especially if the energy fluctuates in a manner

that is unpredictable. This should be determined by conducting surveys in the test area before the equipment to be

tested is set up and emitting for the planned measurements and preferably before the equipment is energized.

A3-2.4 Instruments used for the measurements described in this appendix should be calibrated at a facility capable

of calibrating such instruments using standards traceable to the National Institute of Standards and Technology

(NIST) in the USA or an equivalent standards agency elsewhere, and in accordance with the guidance of the

instrument manufacturer.

A3-2.5 Measurements taken for evaluation against the criteria of the following tables can be combined with

measurements taken to address electromagnetic interference concerns. The specific measurement locations may

differ between electromagnetic interference and safety-related measurements.






Date: 2/11/2013

Table A3-1 Non-Ionizing Radiation

Energy Category Physical

Quantity

Measured

(units)

Operator,

Maintenance- and

Service-Accessible

Limit

Medical

Device

Labeling

Level

Testing Methods

Static4

0 Hz.

(e.g., static

magnets in motors

or etch/implant

equipment)

Magnetic Flux

Density#1, #2

(Tesla or

Gauss)

Head and torso

200mT

(2000G)

Limbs

2T

(20,000G)#5

0.5 mT

(5 G)

Use a Hall effect probe at each location (use

three axis probe or make three mutually

orthogonal measurements at each location).

Measure field 2–3 cm (~1 inch) from the

exterior surfaces of equipment and at

maintenance and service locations. Locate 0.5

milliTesla line to place a medical device

hazard alert label and 3 milliTesla line to

identify where there is the risk flying objects

(for example, tools), and dislocations of

magnetizable prostheses.

Sub Radio-

frequency1

1 Hz to 3 kHz

(e.g., electro-

magnets in etch

equipment)

Electric Field

Strength#1

(V/m)

1–100 Hz

5 kV/m

1 kV/m Use a displacement sensor.

Determine the maximum field strength and

orientation 2-3 cm (~1 inch) from the surface

of the equipment.

Remove field perturbations by using a long

non-conductive handle extension or remote

fiber optic readout.

Locate 1 kV/m line to post medical device

warnings.

100 Hz – 3 kHz

= 500 [kV·Hz /m] / f

1 kV/m

Sub Radio-

frequency1, 4

1 Hz to 3 kHz

(e.g., electro-

magnets in etch

equipment)

Magnetic Flux

Density#1, #2

(T or G)

or

Magnetic

Field Strength

(A/m)

1–300 Hz

= 12 [mT·Hz] / f

0.1 mT

(1 G)

Use a loop sensor at each location (use three

axis probe or make three mutually orthogonal

measurements at each location). The sensor

should be 2-3 cm (~1 inch) from the equipment

surface.

Identify 0.1 milliTesla line to post medical

device warnings.

300 < 628.5 Hz

0.04mT (400mG)

0.1 mT

(1 G)

628.5 ≤ 820 Hz

= 25.14 [mT·Hz] / f

0.1 mT

(1 G)

820 Hz – 3 kHz

0.031 mT (310 mG)

0.1 mT

(1 G)

Radio-frequency

Field2

3 kHz to 100 kHz

(e.g., RF used to

generate plasma)

Induced

current #3

(mA)

both feet

= 400 [mA/MHz] × f

each foot

= 200 [mA/MHz] × f

NA Contact instrument vendor for suitable

instrument based on frequency and emission

characteristics.

Measurement of induced currents should be

made when the electric and magnetic field

measurements for these frequencies approach #4 the accessible limits.

Radio-frequency

Field2

3 kHz to 100 kHz

(e.g., RF used to

generate plasma)

Contact

current

(mA)

= 90 mA/MHz × f. NA Contact instrument vendor for suitable


characteristics.

Measurement of contact currents should be

made when the electric field approaches the

applicable electric field accessible limit.#4

Radio-frequency

Field2

100 kHz to

100 MHz

(e.g., RF used to

generate plasma)

Induced

current #3

(mA)

both feet = 40 mA

each foot = 20 mA

NA Contact instrument vendor for suitable


characteristics.

Measurement of induced currents should be

made when the electric and magnetic field

measurements for these frequencies approach

the accessible limits.






Date: 2/11/2013

Energy Category Physical

Quantity

Measured

(units)

Operator,

Maintenance- and

Service-Accessible

Limit

Medical

Device

Labeling

Level

Testing Methods

Radio-frequency

Field2

100 kHz to

100 MHz

(e.g., RF used to

generate plasma)

Contact

current

(mA)

9 mA NA Contact instrument vendor for suitable


characteristics.

Measurement of contact currents should be

made when the electric field approaches the

applicable electric field accessible limit.#4

#1 It is assumed that electric and magnetic fields exist separately at frequencies below 300 MHz. It is assumed that electric and magnetic fields exist as a combined entity (electromagnetic radiation) at higher frequencies. Two measurements are needed at frequencies <300 MHz and only

one (usually made by measuring the electric field) at higher frequencies.

#2 1 gauss (G) ≈79.55 amperes per meter (A/m). 1 tesla (T) = 10,000 G, 1 millitesla (mT) = 10 G.

#3 Limit values are given for one and both feet as a) the reference standards provide similar limits and b) different types of induced current test

equipment measure using both methods.

#4 See ¶ 25.2.X for limitations on using the partial body exposure limit.

A3-3 RF Emission Limits

A3-3.1 The equipment RF emission limits are given in Table A3-2.

Table A3-2 Radiofrequency Emission Limits

Frequency Radiofrequency Emission Limits

E-Field (V/m)#1 H-Field (A/m)#2 S#3 (W/m2)#4

3 kHz – 65 kHz 122.8 24.4

65 kHz – 3 MHz 122.8 = 1.6 [A·MHz /m] / f

3 MHz – 10 MHz = 368.4 [V·MHz /m] / f = 1.6 [A·MHz /m] / f

10 MHz – 20.375 MHz = 368.4 [V·MHz /m] / f 0.16

20.375 MHz – 30MHz = 368.4 [V·MHz /m] / f = 3.26 [A·MHz /m] / f

30 MHz – 100 MHz 12.28 = 3.26 [A·MHz /m] / f

100 MHz – 300 MHz 12.28 0.0326

300 MHz – 400 MHz 12.28 0.0326 2

400 MHz – 2 GHz = f / (200 [m2·MHz /W])

2 GHz – 100 GHz 10

100 GHz – 122.22 GHz = ((9 [W/GHz]) f -700 [W])/20

m2

122.22 GHz – 300 GHz 20

#1 E-field criteria are derived from the IEEE C95.1-1999 controlled environment criteria. A 20% multiplier has been continued from previous

versions of this standard. The 1999 revision was used as it still provides emission criteria for the frequency band between 3 and 100kHz, which is not provided in the 2005 revision.

#2 H-field criteria are derived from a combination of 2004/40/EC EU Worker Protection Directive for Electromagnetic fields and IEEE C95.1-

1999 controlled environment criteria, continuing the previously used 20% multiplier for the IEEE criteria. The 1999 revision was used as it still provides emission criteria for the frequency band between 3 and 100kHz, which is not provided in the 2005 revision.

#3 Power Density (S) criteria are derived from the IEEE C95.1-2005 uncontrolled environment (a.k.a. general public) criteria below 122.22 GHz

and continuing the 20% multiplier of the IEEE C95.1-2005 controlled environment criteria above 122.22 GHz.

#4 At higher frequencies and thus shorter wavelengths, the RF emissions are in the far field, and can be measured in W/m2. This measures the

power density of the RF emissions.

A3-3.1.1 It is recommended that these limit values be used as ceiling values, however, it is acceptable to use these

values as average values if adequate documentation of how the average value is calculated is provided in the finding

justification. When these are used as average values, the averaging time used should be taken from the Action level

/ general public / uncontrolled environment table in ANSI/IEEE C95.1.






Date: 2/11/2013

NOTE 158: Most RF monitoring equipment does not provide an average reading but a relatively instantaneous reading,

therefore, the method used to generate these averaged values would need to be documented along with the update frequency of

the monitoring equipment and expected time variations of the RF field (for example due to equipment process recipe changes in

RF generator output power).

A3-3.2 Measurement Techniques

A3-3.2.1 Near-field vs. Far Field — The cost of semiconductor manufacturing cleanroom space forces the

equipment to be installed as close as possible to other equipment. Therefore, to accurately measure the potential

exposure to personnel within a cleanroom environment for frequencies below 300 MHz, most of the measurements

must be made within the near-field or transition zone between the near and far-field. In the far field, the relationship

between the E-field and H-field is constant, allowing for one measurement for both fields. In the near field, the

relationship between the E and H-fields is not constant, therefore each must be measured. Additionally, the field

strength in the near field is more likely to vary significantly within small distances than it does in the far field.

A3-3.2.2 Many meters designed to measure RF emissions reduce cost by including only the capability to measure

one field and assume that the measurements are made in the far field to provide the other values based on the

constant relationship. Such meters are not generally acceptable for use for measurements of frequencies below 300

MHz against these criteria, unless it can be shown that for the measurements under consideration, the measurement

is fully in the far-field (generally considered to be beyond 2 wavelengths) and thus the constant relationship

assumptions are valid.

A3-3.2.3 As much as possible, test the equipment in an environment that is relatively free of other RF emissions in

the same frequency bands.

A3-3.2.4 Measurement distance from the edge of the equipment should in general be at least 20 cm (8 inches).

Maintenance and service exposure should be evaluated at the locations where the personnel will perform the

maintenance and service on the equipment (as can be best approximated with the size of the probe).

NOTE 159: The distance is to avoid capacitive coupling of the measurement probe with the source distorting the measurements.

A3-3.2.5 For test personnel safety and to evaluate the highly variable near field region adequately, the measurement

probe should be powered on at a distance from the equipment and the fields should be evaluated for variations in

three cardinal directions (towards and away from the equipment, laterally and vertically along the equipment)

looking for the highest values. This will help both to avoid unsafe levels of RF energy for the test personnel and to

determine if there are RF leaks at connections, enclosures or cabling that need to be fixed, as these can cause very

localized or strangely-shaped RF fields within and around the equipment.

NOTE 160: For equipment using RF generated plasma to etch or deposit materials on the substrate, it is likely that the process

requirements for consistent plasma will drive RF control much more stringently than is required to meet the personnel safety

criteria. In such cases, this sampling may detect emissions only very close to the equipment or when the equipment is having

problems processing the substrates consistently (possibly indicating a bad connection or impedance mismatch in the RF delivery

path). The concerns of paragraph 0are most relevant when the use of the RF energy is not as strictly controlled as it is in etch or

plasma deposition equipment.

A3-3.2.6 For complex testing conditions or where significant harmonics are foreseen (e.g., when the RF cables are

warm), it is recommended to conduct the equipment EMC radiated emissions testing (e.g., with an antenna and

oscilloscope or spectrum analyzer) to identify the appropriate frequencies to evaluate before doing field strength

testing.

A3-3.2.7 For complex testing conditions or additional information, see IEEE C95.3 (as indicated in the references

section) for additional information.






Date: 2/11/2013

Material being revised

Table A3-3 Optical Energy

Optical Energy Physical Quantity

Measured

(units)

Access Limit Testing Methods

Infrared Energy1

700 nm–1 mm

(e.g., heating

lamps)

Irradiance

W/m2

(See #1, #2, #3)

Radiance

W/m2 – sr



exposure limits.

(See A4-5.1)





Visible Light1

400–700 nm

(e.g., heating

lamps)

Irradiance

µW/cm2

(See #1, #2, #3)

Radiance

W/m2 – sr



exposure limits.

(See A4-5.1)


Direct measurement locating the maximum irradiance and

orientation of the light energy at the closest approach to

view port(s) or accessible leakage point(s).

Ultraviolet

Energy1

315–400 nm

(e.g., plasma,

stepper)

Irradiance

mW/cm2

(See #1, #2)

0.2 mW/cm2 Photoelectric detectors with filters and or controlled

phosphors.




Ultraviolet

Light1

180–315 nm

(e.g., plasma,

stepper)

Effective Irradiance

µW/cm2

(See #4)

0.02 µW/ cm2 Photoelectric detectors with filters and/or controlled

phosphors (See #5).




#1 “Irradiance” is essentially the same as “power density.”

#2 Lamp manufacturer data can sometimes be used to estimate and evaluate exposures using a spreadsheet.

#3 These guidelines cover visible, IR-A, and IR-B, and are frequency dependent. Separate evaluations may be needed for thermal or photo-

chemical retinal hazards and infrared eye hazards.

#4 “Effective irradiance” is irradiance adjusted to account for the wavelength-dependent biological hazard. Permissible exposure time = 0.003 J/cm2 divided by the effective irradiance.

#5 Instrumentation is commercially available that accounts for the wavelength dependence of the standard and gives results in effective

irradiance.

A3-4 References

A3-4.1 1996 TLVs and BEIs Threshold Limit Values for Chemical Substances and Physical Agents Biological

Exposure Indices, ACGIH, Cincinnati, OH.

A3-4.2 IEEE C95.1-1999 — Standard for Safety Levels with Respect to Human Exposure to Radio Frequency

Electro-magnetic Fields, 3 kHz–300 GHz

A3-4.3 Guidelines on Limits of Exposure to Broad-Band Incoherent Optical Radiation (0.38–3 µM), Health Physics

Vol. 73, No. 3 (September 1997): pp. 539–554.

A3-4.4 Directive 2004/40/EC on the minimum health and safety requirements regarding the exposure of workers to

the risks arising from physical agents (electromagnetic fields), (30 April 2004), Official Journal of the European

Journal, (April 27, 2006): pages L 184/1 through L 184/9.

A3-4.5 IEEE C95.1-2005 — IEEE Standard for Safety Levels with Respect to Human Exposure to Radio

Frequency Electro-magnetic Fields, 3 kHz–300 GHz.

A3-4.6 IEEE C95.3-2002 — IEEE Recommended Practice for Measurements and Computations of Radio

Frequency Electromagnetic Fields With Respect to Human Exposure to Such Fields, 100 kHz—300 GHz.

Appendix 4 — Fire Protection: Flowchart for Selecting Materials of Construction






Date: 2/11/2013

Appendix 5 — Laser Data Sheet — SEMI S2

Related Information 1 — Equipment/Product Safety Program

Related Information 2 — Additional Standards That May Be Helpful

Related Information 3 — EMO Reach Considerations

Related Information 4 — Seismic Protection

Related Information 5 — Continuous Hazardous Gas Detection

Related Information 6 — Documentation of Ionizing Radiation (§ 24 and Appendix 2) Including Rationale for Changes

RELATED INFORMATION 7

DOCUMENTATION OF NON-IONIZING RADIATION (§ 25 AND APPENDIX 3) INCLUDING RATIONALE FOR CHANGES

R7-1 Rationale for Revisions Made in 2011 and 2012

R7-1.1 General Goals of the Revision

R7-1.1.1 The primary purpose of this revision was to update the published criteria to reflect:

• revisions of the referenced standards since initial publication

• standards and regulatory limits published since the initial publication of this criteria such as the EU Worker

Protection Directives, and

• lessons learned and problems found in using the published criteria.

R7-1.1.2 With bay and chase style facilities becoming less common and open ballroom style facilities becoming

more common, the distinction between potential operator and maintenance/service exposure became much harder to

define and justify. Therefore this revision defines a single emission limit value or function.

R7-1.2 Static Magnetic Emissions — The criteria were revised upward and measurement technique clarified as the

task force could find no referenced standard to justify keeping the values at the existing published level. The levels

were set to the EU WP directive action level as these are significantly more stringent than any other published

standard we could find. Since the higher allowable levels made the possibility that the 30mT tool movement

concern to be more likely, the labeling requirement for this concern was clarified/expanded.

R7-1.3 Sub Radiofrequency Emissions

R7-1.3.1 The power frequency criteria that were provided as deviations from the rest of the sub radiofrequency

criteria in the original criteria were eliminated as the agency that recommended them (International Commission on

Non-Ionizing Radiation Protection (ICNIRP)) no longer includes the lower recommended values, and no other limits

(e.g., ACGIH, EU Worker Protection directives) have adopted these lower limits.

R7-1.3.2 The Electric (E) field criteria were left the same as previously published (20% of the ACGIH values).

R7-1.3.3 The Magnetic (H) field criteria were reduced above 682.5 Hz in order to align with the EU Worker

Protection Directive action levels. Below 682.5 Hz, the values were left at the previously published values (20% of

the ACGIH values).

R7-1.4 Induced and Contact Current

R7-1.4.1 The primary changes were to reduce to a single criteria for both operators and maintainers and to clarify

the criteria as the previous criteria had some aspects that allowed differing interpretations.

R7-1.4.2 The induced current criteria were set at the previous maintenance and service criteria, which is 20% of the

IEEE C95.1 controlled environment value.






Date: 2/11/2013

R7-1.4.3 The contact current criteria were set at the previously published operators level as the applicable criteria

have been decreasing in all of the referenced standards. The new criteria are between 50% of the C95.1-2005

general population values and 25% of the 2010 ACGIH values.

R7-1.5 Radio Frequency Electric (E) and Magnetic (H) Field and Power Density (S) Emissions

R7-1.5.1 In addition to the general drivers for the revision for this effort, RF frequency (3 kHz to 300 GHz) criteria

had another driver, providing criteria that will not become invalid by a revision of the referenced standard (as was

done by the 2005 revision of C95.1 that moved the criteria to different tables than those specified in the previous S2

criteria).

R7-1.5.2 The electric (E) field criteria are derived from the 1999 C95.1 values as the 2005 revision deleted criteria

from 3 to 100kHz. The criteria are the same as the previously published Maintenance and Service criteria (20% of

the controlled environment criteria).

R7-1.5.3 The magnetic (H) field criteria were significantly modified (lowered) to align with the EU worker

protection directive for EM fields (2004/40/EC) (which hadn’t been published when the S2 criteria were originally

written) up to 20.375 MHz. Above 20.375 MHz, the criteria align with the previously published S2 Maintenance

and Service criteria (20% of the C95.1 controlled environment criteria).

R7-1.5.4 The power density (S) criteria were modified as they are based upon the C95.1 uncontrolled environment

or general population limit which was significantly reduced with the 2005 revision for frequencies below 122.22

GHz. Above 122.22 GHz, the values remain at the previously published S2 Maintenance and Service criteria (20%

of the C95.1 controlled environment criteria).

R7-2 Rationale for Initial Publication of Criteria

R7-2.1 The user of this table is responsible for obtaining the current revision of the standards cited for Occupational

Exposure Limits (OEL).

R7-2.2 The emission values in Appendix 3 that are not to be exceeded were chosen based on a review of all known

international standards as well as a consideration for best available control technology (i.e., lowest values currently

achievable for each radiation type). Where a general public limit existed, 20% of this value was selected. Where

there was no public limit, the value selected is generally 20% of the OEL value (instantaneous field strength

measurement peak). The latter case would have the occupational and general public levels the same. Where there

was an occupational exposure limit specified in a standard, the maintenance emission limit was set at 20% of this

level.

R7-2.3 Most health standards differentiate between “occupational” and “general public” exposure criteria.

IEEE C95.1 differentiates between “controlled access” and “uncontrolled access” exposures. According to

IEEE C95.1 “controlled access” environments are those where “locations where there is exposure that may be

incurred by persons who are aware of the potential for exposure as a concomitant of employment, by other cognizant

persons, or as the incidental result of transient passage through areas where analysis shows the exposure levels may

be above those shown in Table 2 but do not exceed those of Table 1, and where the induced currents may exceed the

values in Table 2, Part B, but do not exceed the values of Table 1, Part B.” According to IEEE C95.1, “uncontrolled

access” environments are “locations where there is the exposure of individuals who have no knowledge or control of

their exposure. The exposure may occur in living quarters or workplaces where there are no expectations that the

exposure levels may exceed those shown in Table 2 and where induced currents do not exceed those in Table 2, Part

B.” Task force members advise that IEEE C95.1 “controlled access” and other “occupational exposure” standards

should be applied to personnel performing maintenance and service of equipment and that “uncontrolled access” or

other “general public” standards should be applied to equipment operators during routine work and to other

locations. These IEEE definitions are particularly relevant to broadcast facilities as well as normal industrial

environments such as fabs. Task force members recommend that uncontrolled access limits be applied to fetal

exposure.

R7-2.4 As with the rationale in the Ionizing section, the operator is considered a member of the general public or to

be in an uncontrolled area. Maintenance or service technicians should be trained to know how to control the

hazardous energy and protect themselves from the hazard and its adverse effects.






Date: 2/11/2013

R7-2.5 References

R7-2.5.1 1996 TLVs and BEIs Threshold Limit Values for Chemical Substances and Physical Agents Biological

Exposure Indices, ACGIH, Cincinnati, OH

R7-2.5.2 Guidelines on Limits of Exposure to Broad-Band Incoherent Optical Radiation (0.38–3 M), Health

Physics Vol. 73, No. 3 (September 1997): pp.539-554

R7-2.5.3 ICNIRP 1994 “Guidelines on Limits of Exposure to Static Magnetic Fields,” Health Physics Vol 66 (1)

(January 1994): pp. 100–106

R7-2.5.4 IEEE C95.1-1991 — Standard for Safety Levels with Respect to Human Exposure to Radio Frequency

Electromagnetic Fields, 3 kHz–300 GHz

R7-2.5.5 Interim Guidelines on the Limits of Exposure to 50/60 Hz Electric and Magnetic Fields, IRPA/ICNIRP

Guidelines, Health Physics Vol. 58, No. 1(January 1990): pp. 113–122

Related Information 8 — Laser Equipment Safety Features

Related Information 9 — Laser Certification Requirements by Region of Use

Related Information 10 — Other Requirements by Region of Use

Related Information 11 — Light Tower Color and Audible Alert Codes

Related Information 12 — Surface Temperature Documentation

Related Information 13 — Recommendations for Designing and Selecting Fail-to-Safe Equipment Control Systems (FECS) With Solid State Interlocks and EMO

Related Information 14 — Additional Considerations for Fire Suppression Systems

Related Information 15 — Remote Operations

Related Information 16 — Design Principles and Test Methods for Evaluating Equipment Exhaust Ventilation — Design and Test Method Supplement Intended for Internal and Third Party Evaluation Use

NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as

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determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are

cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature,

respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change

without notice.

By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent

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and the risk of infringement of such rights are entirely their own responsibility.