Automated S l i LSelective Laser

Assembly System

Ray PrasadRay Prasad Consultancy Group

President, BeamWorks Inc,

(2000 - 2006) Spark 400

May 26, 2012 1

Note: BeamWorks Ltd, an Israeli Based Company filed for Liquidation in April 2012

All I O Same HereAll In One Same Here

S T l BeamWorksSuper Tool BeamWorksSuper ToolSpark 400Spark 400

DispensePaste

PlaceComponents

Laser Solder

Rework

2006 VISION AWARD WINNERMay 26, 2012 2

2006 VISION AWARD WINNER

Spark 400 for All your SMT NeedsFor One or All of Your SMT Process Steps

Flexibility

VersatilityVersatility

Reflow OvenPick & Place Rework

Spark 400: 2006 Vision Award Winner

Reflow OvenPick & Place Rework

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State of Our Industry: SMT* SMT is the predominant technology forSMT is the predominant technology for

assembly of today’s electronics products* Even though SMT has been in high volume g g

production since the mid 80’s, fewer than 10% of companies have first pass yield of over 90%.

* A th I i O I d t H l i l* Another Issue in Our Industry: How to selectivelyadd components to an already assembled board without impacting previously assembled p g p ycomponents. And do it in an automated manner and not manually

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Competitive AdvantagesOf k S k 400Of BeamWorks Spark 400

* Spark 400 addresses the automated selective assembly i f h i d O d l A dissues of the industry. One good example: Automated selective assembly of missing, planned or unplanned, components

S k 400 id bilit f t t d l ti di i– Spark 400 provides capability for automated selective dispensing, placement, and reflow without impacting the neighboring components

* Electronics products are getting smaller and lighter every p g g g yday by packing components on a board closer and closer together, so much so that it is almost impossible to rework these boards. – Cell phones, PDAs, laptops and even desktops are good examples

of tightly packed assemblies. – Rework in tight spacing is one of the key competitive advantages

of Spark 400 (Removal and replacement even in tight spaces, as

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of Spark 400 (Removal and replacement even in tight spaces, as low as 20 mils)

C titi Ad t OfCompetitive Advantages Of BeamWorks Spark 400

* The traditional SMT assembly, if done correctly, produces high quality assemblies at a very high speed.

* But when something goes wrong and something does go* But when something goes wrong - and something does go wrong and will go wrong as long as humans are involved -the same line will produce scrap at the same high speed.– In such cases you need a high volume automated rework– In such cases you need a high volume automated rework

system– Such a system has not been available, until now– Spark 400 is an ideal system for automated mass reworkSpark 400 is an ideal system for automated mass rework– There is simply no comparable system for automated mass

rework. Bar none.

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Competitive Advantages Of BeamWorks Spark 400

* Spark 400 is able to solder moisture sensitive components without baking resulting in faster cycle time a key concernwithout baking resulting in faster cycle time, a key concern in a production environment. This is an important advantage of the Spark 400.

* Spark 400 addresses not only today’s technologies but isSpark 400 addresses not only today s technologies but is poised to deal with emerging technologies:– Assembly of optoelectronic components where the component

cannot be subjected to reflow temperatures – Lead free soldering is another emerging technology. All lead free

solders have about 40 deg C higher melting point than that of tin lead (179 or 183 deg C)

– To implement lead free we need to use higher temperature boardTo implement lead free we need to use higher temperature board and component package materials that will be more expensive than the current materials being used. We may also need new equipment to accommodate these higher temperatures.Spark 400 will address these issues without the need for high

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– Spark 400 will address these issues without the need for high temperature circuit board material or need for any modification.

Competitive Advantages OfCompetitive Advantages Of BeamWorks Spark 400

* A current trend in the electronics industry is for most high volume manufacturing to move to low cost countries such as China

* Spark 400 is a beneficiary of this emerging trend since it is a perfect system for quick-turn prototype and engineering buildsy q p yp g g

* Spark 400 can be placed in any engineering lab where engineers can refine and debug their products before shipping them offshore for high volume manufacturing.

* There are some technical key advantages of Spark 400 that are not* There are some technical key advantages of Spark 400 that are not available in any other system on the market today– Spark 400 can monitor and control body and lead temperatures of

components– Spark 400 provides not only unique profile for each component but

even unique profile for each lead

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Point and Click Programming

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Spark 400 Multi Process Assembly CapabilitySpark 400 Multi Process Assembly Capability

Multi Process Head:1 Pick & Place1. Pick & Place

Vacuum Nozzle

2. Dispensing

3. Laser Soldering

C t F di

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Components Feeding :Trays, Reels, Sticks

Head Assembly

Laser Window

X 4X 4

DiDown

Looking Camera

Dispenser(Solder Paste,

Flux)

Pick –Up

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Tool

F ll S L (T Vi )Full System Layout (Top View)

29 Reel FeedersAdjustable Feeders

Nozzle

jConveyor

Supporting Nozzle replacement Station & Up

Looking Camera

Plate

Automated Tray Feeder

Camera

Bottom Heater Controller

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Feeder Shuttle Option2 groups of 51 feeders

(8 mm) each.Total 102 feeders

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Selective Paste DispensingSelective Paste Dispensing

* P iti di l t* Positive displacement for controlled paste depositdeposit

* Accurate dispensing for discrete and finefor discrete and fine pitch components

* Consistent qualityq y

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Selective Component PlacementSelective Component Placement

* d* Up to 40 trays and 102 tape feeders

* Vision capability for accurateVision capability for accurate placement

* Good throughput* Accommodate small and large

boards (up to 16” X 20”)* CAD data input for* CAD data input for

programming * Extremely Short set up time

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y p

Unique Tray for Tape & Reel StripsUnique Tray for Tape & Reel Strips(Good for R/Cs on Short Strips)

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S l ti R flSelective Reflow

* 4 l ti* 4 lasers acting simultaneously for high throughputthroughput

* Not heating adjacent componentscomponents

* Getting the solder hot but keeping the board coolp g

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A tomated Dispensing Placement andAutomated Dispensing, Placement and Soldering of Resistors and Capacitors

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A tomated Dispensing Placement andAutomated Dispensing, Placement and Soldering of QFP

QFP Dispensing

QFP Placement

QFP Soldering

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NOTE: CLICK ON VIDEO CLIPS TO PLAY

Automated Dispensing, Placement and p g,Soldering of BGA

BGA Dispensing

BGA PlacementBGA Placement

BGA Soldering

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NOTE: CLICK ON VIDEO CLIPS TO PLAY

T i l T P fil f BGA225Typical Temp Profile for BGA225Soldering or Rework

4 Lasers controlled by 4 IR temp sensors acting simultaneously

4

T (Deg-C) 3

220

12120

1

20 5540 70Seconds

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Spark 400 Current MarketSpark 400 Current Market

* Low Volume General Applications– Small Subcontractors - small lot production– OEMs for New Product Introduction work– R&D Environments Pilot runs and Prototype work– Large Subcontractors - Auxiliary SMT line

* Hi h V l S i li d A li i* High Volume Specialized Applications– Large Sub-contractors, OEMs - selective assembly

of planned and un planned missing componentsof planned and un-planned missing components, automatic rework, SMT connector assembly, BGA assembly, Optical Component Soldering

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Approximate Assembly Cycle TimesApproximate Assembly Cycle TimesActual Time Will Depend on Boards & Components

(Time in Seconds)(Time in Seconds)Component type Removal dispense pick & place soldering

cap 0402 6 2 5 3

res 0603,0805 6 2 5 3

1206 6 3 5 3

SOT23 6 4 5 4

SO8 30 5 5 6

SO16 40 6 6 12

TSOP32 60 6 6 24

QFP100 120 10 6 40QFP100 120 10 6 40

PLCC52 80 12 6 20

Small BGA 300 mils 60 60 6 80

Medium BGA 700 mils 60-120 120 6 80-140

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Big BGA 1500 mils 120-180 180 6 140-200

Spark 400 Current Applications

* Missing components (“Skips”)Components not arriving on time create a major quality and delivery problem for both OEMs andquality and delivery problem for both OEMs and subcontractors since late components have to be either assembled by hand or the production is postponed waiting for arrival of missing components– Spark 400 not only allows automated assembly of

unplanned missing components but can be used to changeunplanned missing components but can be used to change production planning to allow use of planned missing components

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Opto Electronics ApplicationOpto-Electronics Application(Get the solder hot but keep the package Cool)

* Many components are temperature sensitive and require selective assembly without heating the package

* Mostly done manually Automation is required to reduceMostly done manually. Automation is required to reduce cost

* Spark 400 is well suited to replace manual soldering with automated reflow for both through hole and SMT opto-electronics components – Faster, cheaper process with consistent quality for Tx and RxFaster, cheaper process with consistent quality for Tx and Rx

optical modules & other optical devices (not operator dependent)– Dispense extra paste for gold plated leads to address brittle gold

intermetallic problems

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intermetallic problems– Thinner intermetallic layer for improved reliability (< 1 micron)

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Wi l A li iWireless Applications* For wireless applications minor customization is requiredFor wireless applications minor customization is required

to convert high volume generic assembly to custom assembly

* With the trend toward Bluetooth, most boards will require RF shields that are added after the boards are assembled

* S k 400 i i l iti d t t hi h* Spark 400 is uniquely positioned to convert a high volume generic assembly to custom assembly and to selectively assemble RF shieldsselectively assemble RF shields

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Laser Vs Hot Air for Rework* No need for hot air nozzles* No melting of solder joints of

neighboring components* ki ( f )

CSP REWORK

* No Baking (Except for BGAs) and No Popcorning

* No need for mini-stencils* R k i Ti ht S (15* Rework in Tight Spaces (15

mils Vs 150 mils for hot air)* Automated removal and

replacement (Dipping Process)replacement (Dipping Process)* Much faster than Hot air

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NOTE: CLICK ON VIDEO CLIPS TO PLAY

Reduce QFP Rework from 7 Steps to 4Reduce QFP Rework from 7 Steps to 4 Steps by Using ”Dipping” Process1. Apply heat to the QFP to be replaced2. When the solder joints melt, remove QFP3 Clean the site by removing solder on the QFP lands3. Clean the site by removing solder on the QFP lands4. Apply solder paste. Apply liquid flux5. Place QFP6. Apply heat to solder joints. Merge Steps 5 and 6 in one

step by picking up QFP and letting it hover over QFP pads while melting solder below and then gently pushing p g g y p gQFP in molten solder. Please see the attached video clip.

7. Clean and or brush off solder balls if present

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Vision Award Winning Unique ReworkVision Award Winning Unique Rework Process for QFP: Reduce Time & Damage

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Impact of Hot Air: Damage to AdjacentImpact of Hot Air: Damage to Adjacent Components

Damaged CapsBy Hot Air

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Impact of Hot Air: Shielding to Pre entImpact of Hot Air: Shielding to Prevent Damage to Adjacent Components

May 26, 2012 32Kapton Tapes to Protect Neighboring Components from Hot Air takes time and needs Space

L V H t Ai f R kLaser Vs Hot Air for Rework

* No need for hot air nozzles* No need for hot air nozzles* No melting of solder joints of neighboring

componentscomponents* No Pop-corning & No Baking (Except for BGAs)* No need for mini-stencils* Rework in Tight Spaces (15 mils Vs 150 mils

for hot air)* Automated removal and replacement* At least ten times faster than Hot air

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BeamWorks Spark 400All in One Assembly System

GET THE SOLDER HOTKEEP THE BOARD COOL

Spark 400

May 26, 2012 34