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Atotech’s Solutions for MLB Production using Advanced Basematerials
Speaker:Jaime Peraza OrdazPMM Atotech Europemobile: +34 606 372 364email: [email protected]
Tobias SponholzGlobal Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80Email: [email protected]
Proprietary and Confidential
Agenda
Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO
Application Guide1
Vertical Electroless CopperPrintoganth PV (E)
3
Direct PlatingNeopactSeleo CP Plus
4
Horizontal Electroless CopperPrintoganth P Plus
2
Proprietary and Confidential
Application Guide
Proprietary and Confidential
PTH Process Overview Application and Pricing Guide
PTH PROCESS APPLICATION GUIDELINESegment Application/
TechnologyRecommended Process
Vertical Horizontal Direct Plating
IC Substrate
SAP (GX92, GX13, GX-T31, ..)
Printoganth MV Plus Printoganth SAP Plus n/a
MSAP, AMSAP (BT, BT PCF, ...)
Printoganth MV Plus Printoganth P Plus n/a
HDI & MLB
Advanced Materials (PTFE, BT, High Tg FR4,
Printoganth PV E Printoganth P Plus NeopactSeleo CP Plus
Standard Materials (standard FR4,…)
Noviganth LS Plus Printoganth U Plus or Printoganth U
Seleo CP Plus
Proprietary and Confidential
Horizontal Electroless CopperPrintoganth P Plus
Proprietary and Confidential
Market Introduction in Sept. 2009
Target Application Any production with advanced materials where
adhesion or blistering is an issue e.g. flex, rigid-flex, PTFE, BT, PI, etc.
HDI and AMSAP technology
Technical Benefits Extremely good non-blister behavior and coverage
performance Very good reliability Easily adjustable deposit rate 0.35 – 0.5µm / 4 min Enhanced bath stability
Printoganth P Plus enables highest flexibility in production mix
Printoganth P PlusFeatures & Benefits
Proprietary and Confidential
Printoganth UPrintoganth U
PlusPrintoganth H-DK Printoganth P Printoganth P Plus
Reliability + +++ ++ +++ +++
Deposition rate0.35 µm in 4 min
0.35 µm in 4 min
0.5 µm in 4 min
0.3 µm in 4 min
0.35-0.5 µm in 4 min
Non-blistering performance
fair on all standard base
materials
fair on all standard base
materials
fair on all standard base
materials
excellent even on challenging base
materials
excellent even on challenging base
materials
Bath Stability + ++ + +++ +++
CN-free No No No Yes Yes
Components excl. NaOH
4 5 4 4 4
CN-
Printoganth P Plus is Atotech’s most capable process for HDI manufacturing
Horizontal MLB and HDI ProcessesComparison
Proprietary and Confidential
Horizontal DesmearUniplate P
SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing.
Optimal desmear attack on a wide variety of base materials.
Process Sequence
Securiganth E Sweller
Securiganth P500
Reduction Cleaner Securiganth E or
Reduction Conditioner Securiganth P500
Sweller
Reducer
Permanganate Etch
Proprietary and Confidential
Horizontal Activation & E’less CuUniplate LB
Process Sequence
Cleaner Securiganth E
Securiganth SPS
Neoganth Pre-Dip B
Neoganth U Activator
Neoganth WA Reducer S
Printoganth P Plus
Etch Cleaning
E’less Copper
Activator
Pre Dip
Cleaning
Reducer
Neoganth 800
Proprietary and Confidential
Economic Activator Neoganth 800Features & Benefits
New Ionic activator system for horizontal application running at only 75ppm Pd
Activator U = 225 ppm
Enables significant savings in running costs by less consumed Pd
Fully compatible to established Atotech conditioning system easy drop in solution
Perfect coverage on a wide range of relevant base materials
Same excellent reliability results as Activator U
Robust & easy process
Wide working window
Activator 800 during Alpha site test
Proprietary and Confidential
relative strain
Printoganth P series
Z
X
Non-blistering performance is related to internal stress within deposited e’less Cu layer
Relevant factors for Cu deposit behavior Stabilizer type & concentration Stabilizer Co-deposits (e.g. Ni) Deposition temperature Baking after electroless Cu deposition
X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering!
Non-Blistering PerformanceTheoretical Explanation
Proprietary and Confidential
Flex-Rigid Board FR4 Production Board
No Blistering due to excellent stress characteristics
Bright deposition color
Printoganth P PlusApplications
Proprietary and Confidential
Quick Via Pull test, 3-6 mil – all passed.
Solder Shock Test (6x 288°C, 10s floating) – No ICDs, passed.with THs and BMVs
Solder Shock Test (9x 326°C, 10s), THs & BMVs– few ICDs, ok.with THs and BMVs
IST (+150°C / RT @ 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed.
Various E-tests (daisy chains) – all passed.
Printoganth P Plus fulfills all reliability requirements for high-end HDI production.
ReliabilitySummary
Proprietary and Confidential
Customer Country Lines Capacity [Tm²/ yr]
Panel Type Remark
AT&S Austria 2 240 FR4
KCC Korea 5 1000 FR4, RCC
INTERFLEX Korea 3 700 PI
SI FLEX Korea / China 3 720 PI, Rigid-Flex R2R
LGIT Korea 3 640 BT, FR4 AMSAP
Youngpoon Korea 2 480 PI, Rigid-Flex
Daisho Japan 1 180 Rigid-Flex
Shennan China 1 180 BT, FR4 AMSAP
Founder China 1 240 FR4,..
Foxconn China 2 620 High Tg FR4
ASE Taiwan 1 120 BT AMSAP
Simmtech Korea 1 320
Unimicron Taiwan 1
TOTAL 26
Printoganth P PlusCustomer References
Proprietary and Confidential
Vertical Electroless CopperPrintoganth PV (E)
Proprietary and Confidential
ProductsTemp.
(°C)Time (min)
Securiganth Cleaner 902 60 4
SPS 30 1
Neoganth LS Pre Dip RT 1
Neoganth LS Activator Plus(75 ppm Pd)
40 4
Neoganth LS Reducer 30 3
Printoganth PV (E) 34 8-20
Etch Cleaning
E’less Copper
Activator
Pre Dip
Cleaning
Reducer
Desmear
Neoganth V8 (60 ppm) 50
Process SequenceActivation & E‘less Cu
Proprietary and Confidential
Ionic Activator for vertical application
Optimal coverage at low running cost (75ppm Pd)
Fine & homogeneous distribution of Pd particles
No tooling hole issues
Not corrosive
Improved robustness, no precipitations during manual replenishment
Easy handling, no premixing
100% compatible to established conditioning concept
Activator
Pre Dip
Reducer
Activation Series Neoganth LS PlusFeatures & Benefits
Proprietary and Confidential
New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd
Enables significant savings in running costs by less consumed Pd
Modified complexing agents Ensures good coverage despite low palladium content ‘Locking’ copper ions in a stable complex enhances bath lifetime
Less alkaline Improved bath stability by reduced carbonate formation
Perfect coverage on a wide range of relevant base materials
Fully compatible to established Atotech conditioning system Easy drop in solution
Robust & easy process No additional NaOH dosing required by optimized replenishment concept Wide working window
Activator Neoganth V8 – full power ionic activation at low cost
Economic Activator EXPT Neoganth V8Features & Benefits
Proprietary and Confidential
Etch Cleaning
E’less Copper
Activator
Pre Dip
Cleaning
Reducer
…Printoganth PV Printoganth PV E
Printoganth V Copper Printoganth V Copper E
Printoganth V Basic
Printoganth PV Stabilizer
Cu Reduction Solution
NaOH
Identical stabilizer system
Same bath performance
Different Cu source (CuSO4, CuCl) to be more flexible in supply chain
PV E potentially more cost-effective due to higher concentrated Cu additive
Printoganth PV vs PV EComparison
Proprietary and Confidential
Versatile vertical e’less Cu process for advanced MLB/HDI applications
Superior adhesion on most materials including PI, PTFE, BT... due to optimal internal stress characteristics of the copper deposit:
No blistering No pull away
Highly reliable process Fulfills all standard reliability requirements such as SST, IST, TCT No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as
9x 326ºC
Low to high build deposit possible Deposition speed 0.3 - 0.6µm in 10 min
Environmentally friendly Tartrate based Cyanide free
Printoganth PV (E)Features and Benefits
Proprietary and Confidential
Pos.1
Pos.2
Pos.3
Pos.4
Pos.5
Pos.6
Pos.7
Pos.8
Pos.9
Pos.10
Printoganth PV ECoverage in Through Holes
Proprietary and Confidential
Excellent BMV coverage despite strong glass fiber protrusion!
SEM picture
Printoganth PV ECoverage in Blind Micro Via
Proprietary and Confidential
Base material Tg °C phenolic Halogen-free
Lead-free compatible
Poly-imide
Backlight PV E
Backlight PV
Isola Duraver 104
135 x D8 D9
Matsushita R1566
150 x x D7-8 D7-8
Hitachi MCL-BE-67G
150 x x x D9-10 D9-10
DuPont Pyralux AP
195 x D8-9 D8-9
Isola Duraver 114
150 D8 D8
Isola Duraver 117
170 D9 D8
Nan-Ya NP-175-TL
170 x D10
PIC DF-170 170 x x D7-8 D7
standard pth process without 902 Flex Cleaner or Reduction Conditioner
Printoganth PV ECoverage
Proprietary and Confidential
Excellent adhesion on exposed polyimide
Outstanding adhesion with Printoganth PV E !
Printoganth PV ESurface Adhesion
Proprietary and Confidential
Korean Customer for military application
Fe oxide pow-der
EPDM Rubber
Final Product
Printoganth PV EProduction Example – Exotic Materials
Proprietary and Confidential
Solder dip conditions ICDInspected Inner layer % ICD
6 x 10 sec @288°C 0 203 0%
9 x 10 sec @288°C 0 202 0%
12 x 10 sec @288°C 0 182 0%
15 x 10 sec @288°C 0 102 0%
18 x 10 sec @288°C 1 99 1%
Printoganth PV E fulfills highest reliability requirements
Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)
Printoganth PV ESolder Shock Results
Proprietary and Confidential
6x IR reflow + 1x solder shock
no pull away
no ICD
Solder shock tests
Test conditions ICD Inspected Inner layer % ICD
6 x 10 sec @288°C 0 36 0%
10 x 10 sec @288°C 0 36 0%
14 x 10 sec @288°C 0 34 0%
18 x 10 sec @288°C 0 34 0%
customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC)
Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)
Printoganth PV ESolder Shock Results
Proprietary and Confidentialstatus 2012-10
Customer Country Lines Capacity Base Materials ApplicationBoardtek Taiwan 4 650.000 High Tg FR4, Teflon high frequency
New Flex Korea 1 120.000 PI, FR-4 PC Chipset, Graphic chipset, Mobile
Jiang Nan Institute China 1 100.000 FR4, RCC, HTg military
ChangSung Korea 1 60.000 Special military
ACB Europe 1 25.000 FR4, HTG, PI, PTFE Military, automotive
Exception Europe 1 23.000 FR4, HighTg, BT, various
Others - 4 30.000 various various
Customer Country Lines Capacity [m²/year]
Base Materials Application
Sonic India 1 72.000 FR4
Arktron India 1 15.000 FR4
Meadville (DMC) China 1 400.000 FR-4 High Tg, High-layer MLB
Meadville (MAS) China 1 350,000 FR-4 High Tg, HF
MEIKO China 1 760.000 FR-4, HF HDI
Mutual-Tek Taiwan 1 240.000 FR4, PI Flex-Rigid
Printoganth PV E and PVReferences
Proprietary and Confidential
Printoganth PV (E) vertical e’less Cu process for MLB/HDI applications outstanding non-blistering performance
on any kind of base materials highly reliable
Optimal performance in conjunction with Securiganth BLG desmear Neoganth LS Plus activation
Outlook Neoganth V8 Activator for lower running cost
Deposit structure of Printoganth PV E
Plated BMV with Printoganth PV E
Printoganth PV (E)Summary