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ATLAS FP TRACKER PLANS. Steve Watts School of Physics and Astronomy University of Manchester. Well defined design in the FP420 Design Report Based on the FE-I3 ATLAS Pixel Readout chip. Design suitable for 220 but needs roughly double the number of - PowerPoint PPT Presentation
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ATLAS FP TRACKER PLANS
Steve WattsSchool of Physics and AstronomyUniversity of Manchester
• Well defined design in the FP420 Design Report Based on the FE-I3 ATLAS Pixel Readout chip.
• Design suitable for 220 but needs roughly double the number of sensors. Layout is more difficult and power dissipation is higher.
• Radiation level close to beam is very high. Implications for the readout chip. Sensor is good to 1-2 1016 charged hadrons cm-2 300-600 MRad
Consequence – New Design for the Tracker…… R&D is linked to 3D sensor developments for IBL and SLHC
220 m420 m
FE-I3 Lifetime issue 1015 charged particles per cm2 or ~30 MradSOLUTION A 3D sensor safe to 1-2 1016 charged hadrons per cm2
Dose highest in very narrow vertical band.
Move sensors up and down by 1-2 mm to even out the dose
Trick used with CCDs in NA32. Additional specification for mechanical design.Would give a factor 3.
• New FE-I4– Pixel size = 250 x 50 µm2
– Pixels = 80 x 336– Technology = 0.13µm– Power = 0.5 W/cm2
• FE-I4 Design Status– Contribution from 5 laboratories.– Main blocks MPW submitted in Spring
2008.– Full FE-I4 Review: 2/3/3009– Submission in Summer 2009
– Expect IBL modules late 2010
7.6mm
8mm active
2.8mm
FE-I3 74%
20.2mm
active16.8mm
~2mm
~200μm
FE-I4 ~89%
Char
tere
d re
ticul
e (2
4 x
32) IBM
retic
ule
~19 mm
FE-I3 - lifetime issueSolution B
Use FE-I4. Factor 5 more radiation tolerant than FE-I3. For IBL projectPlus - better matched to track hit distribution at 220. - Common module design for 220 and 420 - 2 x Fe-I4 each plane
NOTE: IMPROVED Y-Measurement. Consequence for physics ???NOTE2: Assumes hits distribution stable with time…..
FE-I3 versus FE-I4
• FE-I3 run had very poor yield. There will be another run in 2010.
• FE-I4 First run will produce chips in summer/Autumn 2010
ASIC designs always take more than one iteration.
FE-I4 3D sensor is larger and thus yields will be lower.
Conclusion
FE-I4 baseline. There will be 3D/FE-I4 detectors developed for IBL.
Mechanics/electronics engineers to look at FE-I4 design.
FE-I4 - common 220/420 mechanics design