ASHRAE 2012 IT Equipment Thermal Management and Controls_V1.0

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1 Introduction ....................................................................................................................................... 5

2 ITE Thermal Design .......................................................................................................................... 7

3 Component Power and Thermal Management Features ............................................................... 13

3.1 Component Power Management Features ......................... ......................... ...................... ......... 133.2 Component Thermal Management Features ...................... ......................... ...................... ......... 14

4 Thermal Management ..................................................................................................................... 17

4.1 Thermal Control Inputs Sensors ............................... ......................... ......................... ............ 184.2 Fan Speed Control and Design ......................... ......................... ...................... ......................... . 214.3 Configuration, Workload and Environment ......................... ......................... ...................... ......... 244.4 Management Controllers and Communication .............................. ......................... .................... 254.5 System Tuning and Configurability .................................... ......................... ...................... ......... 25

5 ITE-Room Cooling Interaction ........................................................................................................ 276 Summary ......................................................................................................................................... 31

Figure 1 System Thermal Management ................................ ......................... ....................... ................ 7

Figure 2 Example Component in a System and Rack ..................... ......................... ...................... ........ 8

Figure 3 Processor Package ..................... ......................... ....................... ......................... ................... 8

Figure 4 Processor Packaging and Reference Points ..................... ......................... ...................... ........ 9

Figure 5 Example Heat Sink Performance ..................... ......................... ...................... ....................... 10

Figure 6 Temperature Impact on Fan Power (Thermally Constrained Component) .............................. 10

Figure 7 Example Board Layouts ....................... ...................... ......................... ......................... ......... 11

Figure 8 System and Processor States ......................... ......................... ...................... ....................... 13

Figure 9 Processor Thermal Management ............................... ......................... ......................... ......... 15

Figure 10 Memory Thermal Management................... ...................... ......................... ......................... . 16

Figure 11 Boundaries for Thermal Management ........ ...................... ......................... ......................... . 17

Figure 12 Thermal Control Process ....................... ......................... ......................... ...................... ...... 18

Figure 13 Example 1U Volume Server Thermal Sensors ........................ ...................... ....................... 19Figure 14 Temperature Distribution on a CPU Die .................... ......................... ......................... ......... 20

Figure 15 Fan Zone Mapping ..................... ........................ ....................... ......................... ................. 22

Figure 16 Example Sensor Mapping ..................... ......................... ......................... ...................... ...... 23

Figure 17 Fan Speed vs. System Inlet Temperature ....................... ......................... ...................... ...... 24


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AHAE. (2012). A, GA, A: AHAE.

(2012). Retrieved from Advanced Configuration and Power Interface: http://www.acpi.info/ASHRAE. (2010). A Data Communication Protocol for Building Automation and Control Networks. ASHRAE

Standard 135-2010. ASHRAE.ASHRAE. (2012). Datacom Equipment Power Trends and Cooling Applications.Atlanta, GA, USA:

ASHRAE.ASHRAE. (2012). Thermal Guidelines for Data Processing Environments.Atlanta.

Documents

ASHRAE 2012 IT Equipment Thermal Management and Controls_V1.0